CN201450460U - Small and medium power inverted power supply with good heat dissipation - Google Patents
Small and medium power inverted power supply with good heat dissipation Download PDFInfo
- Publication number
- CN201450460U CN201450460U CN200920062094XU CN200920062094U CN201450460U CN 201450460 U CN201450460 U CN 201450460U CN 200920062094X U CN200920062094X U CN 200920062094XU CN 200920062094 U CN200920062094 U CN 200920062094U CN 201450460 U CN201450460 U CN 201450460U
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- radiator
- heater members
- high heater
- high heating
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Abstract
The utility model discloses a small and medium power inverted power supply with good heat dissipation, which comprises a printed circuit board component, and a high heating device and a radiator component that are electrically connected with the printed circuit board component, wherein the high heating device is arranged on the radiator component, and the radiator component consists of a plurality of independent and insulated radiators. In the utility model, as the radiator component consists of the plurality of independent and insulated radiators, the high heating device can choose to be arranged on the radiators with different volumes according to the quantity and heating situation of the high heating device, thus being beneficial to the heat dissipation of the high heating device and leading the high heating device to have good heat dissipation; the electrical insulation among the high heating devices is more reliable because of the assembling structure; and the copular high heating devices are fixed on the same radiator to lead the heat dissipation of the high heating devices to be better, thus leading the performance of the inverted power supply to be more stable and the service life thereof to be longer. The inverted power supply has the advantages of compact structure, reliable connection, simple assembly, good heat dissipation and the like.
Description
Technical field
The utility model relates to a kind of power supply, the middle low power inverter that particularly a kind of thermal diffusivity is good.
Background technology
At present, domestic middle low power type has the inverter of radiator, generally comprise printed circuit-board assembly, high heater members (as: MOSFET pipe or IGBT pipe) and radiator, and in order to solve the heat dissipation problem of high heater members effectively, usually adopt pad one deck heat conductive insulating rubber cushion between high heater members and radiator, but during owing under higher occasion of ambient temperature or high capacity water holdup state, work, the heat-transfer effect meeting variation of heat conductive insulating rubber cushion, thereby cause the radiating effect variation between high heater members and the radiator, make temperature rise bigger, the components from being damaged probit value has just raise like this.And radiator is a monoblock, high heater members all installs thereon, and the heating situation of each high heater members is all inequality, will make the heat radiation between high heater members and the radiator inhomogeneous like this, thereby cause the heat dispersion between high heater members and the radiator poor, high heater members is damaged easily, and be easy to generate interference between the adjacent high heater members, and the use that causes power supply is stable inadequately, useful life is short.
Summary of the invention
The purpose of this utility model is at above-mentioned existing problems and deficiency, provides a kind of and is provided with the heat-conducting silicone grease layer and thermal diffusivity is good between radiator and high heater members, and connect reliable, the simple middle low power inverter of assembling.On this basis, the utility model further purpose provides a kind of heat sink assembly and is made up of the radiator of some independences and mutually insulated, can independently control the heat radiation situation, and do not disturb each other, compact conformation and the better middle low power inverter of thermal diffusivity.
The technical solution of the utility model is achieved in that
The middle low power inverter that thermal diffusivity described in the utility model is good, comprise printed circuit-board assembly, the high heater members and the heat sink assembly that are electrically connected with printed circuit-board assembly, wherein said high heater members device is characterized in that described heat sink assembly is made up of the radiator of some independences and mutually insulated on heat sink assembly.
For the radiating effect that makes high heater members better, being fixed on the same module radiator of above-mentioned high heater members copolar.
In order to make the thermal conductivity between high heater members and the heat sink assembly good, be provided with the heat-conducting silicone grease layer between above-mentioned high heater members and the radiator.
The utility model is owing to adopt heat sink assembly to be set to be made up of the radiator of some independences and mutually insulated, make high heater members come choice device on the radiator of different volumes according to its quantity and heating situation, so both helped the heat radiation of thermal device occurred frequently, make its thermal diffusivity good, help the reasonable resources utilization again, and the electric insulation between it becomes more reliable because of the cause of package assembly, simultaneously, the high heater members of copolar is fixed on the same module radiator, can make its radiating effect better, and it can not produce interference each other, thereby make the performance of inverter more stable, long service life. in addition, owing between high heater members and radiator, be provided with the heat-conducting silicone grease layer, make between high heater members and the radiator and realized high efficiencies of heat transfer, so just truly reached better heat radiating effect, thereby improved the cyclic duration factor of inverter widely, make the longer service life of high heater members. the utlity model has compact conformation, connect reliable, assembling simply reaches advantages such as good heat dissipation effect, has improved the reliability that inverter uses effectively.
Below in conjunction with accompanying drawing the utility model is further described.
Description of drawings
Fig. 1 is the perspective view of IGBT pipe for the high heater members of the utility model;
Fig. 2 is the cross-sectional view of Fig. 1 at the A-A place;
Fig. 3 is the perspective view of MOSFET pipe for the high heater members of the utility model.
Embodiment
As shown in Figure 1-Figure 3, the middle low power inverter that thermal diffusivity described in the utility model is good, high heater members 2 that comprises printed circuit-board assembly 1, is electrically connected and heat sink assembly 3 with printed circuit-board assembly, wherein said high heater members 2 devices are on heat sink assembly 3, in order to improve the heat dispersion of heat sink assembly 3 in the inverter, described heat sink assembly 3 is made up of the radiator 31 of some independences and mutually insulated.High like this heater members 2 just can come choice device on the radiator 31 of different volumes according to its quantity and heating situation, thereby help its heat radiation, make its thermal diffusivity good, but also help the reasonable resources utilization, and the electric insulation between it becomes more reliable because of the cause of package assembly.Because the heating situation difference of the high heater members 2 of opposed polarity, if the high heater members 2 of opposed polarity is fixed on the same module radiator, it is inhomogeneous to cause like this dispelling the heat, thereby influenced the radiating effect of high heater members 2, therefore in order to make high heater members 2 radiating effects better, being fixed on the same module radiator 31 of above-mentioned high heater members 2 copolars, promptly the high heater members 2 of copolar is placed on same group, then one group of device of copolar to same module radiator 31, can also prevent that so high heater members 2 from producing interference each other, thereby make the performance of inverter more stable, long service life.And in order to make heat sink assembly 3 can reach best radiating effect, above-mentioned heat sink assembly 3 is made up of the radiator 31 of three independences and mutually insulated, and is divided into three groups by the high heater members 2 with copolar and is individually fixed on described three module radiators 31.Wherein, radiator 31 is a rectangle, and its upper surface is a plane, and the below on plane is provided with some parallel and equidistant grooves, helps the circulation of air like this, makes the radiating effect of radiator 31 better.And high heater members 2 can install between printed circuit-board assembly 1 and radiator 31 or install on the side of radiator 31.In order to make the thermal conductivity between high heater members 2 and the radiator 31 good, be provided with heat-conducting silicone grease layer 4 between above-mentioned high heater members 2 and the radiator 31.And this heat-conducting silicone grease layer 4 is arranged on the heat-radiating substrate 21 of high heater members 2, and described high heater members 2 is connected with above-mentioned radiator 31 by heat-conducting silicone grease layer 4.Heat-conducting silicone grease layer 4 is a skim, with respect to the heat conductive insulating rubber cushion that used in the past, can lower the use height of high heater members 2 like this, thus the overall volume that helps dwindling inverter.The connection of printed circuit-board assembly 1 for convenience, above-mentioned heat sink assembly 3 is provided with support 5, above-mentioned printed circuit-board assembly 1 passes through described support 5 unsettled devices on above-mentioned heat sink assembly 3, and above-mentioned some radiators 31 are assembled into one by described printed circuit-board assembly 1.And support 5 is made up of some double-screw bolts, and double-screw bolt stretches out the certain length of radiator upper surface, and printed circuit-board assembly 1 was fixedly connected on the heat sink assembly 3 by screw and being connected of double-screw bolt.In addition, be connected with some electric capacity and other electric elements on the printed circuit-board assembly 1, and the pin of high heater members 2 is connected with printed circuit-board assembly 1.And above-mentioned high heater members 2 is MOSFET pipe or IGBT pipe.And MOSFET pipe or IGBT pipe are for having the pipe of the D utmost point or the C utmost point, and the D utmost point or the C utmost point communicate with heat-radiating substrate 21, and the D utmost point altogether or the pipe that is total to the C utmost point are fixed on the same module radiator 31.The utlity model has compact conformation, connect reliably, assemble advantages such as simple and good heat dissipation effect, improved the reliability of inverter effectively.
The utility model is described by embodiment, but the utility model is not construed as limiting, with reference to description of the present utility model, other variations of the disclosed embodiments, expect easily that as professional person such variation should belong within the utility model claim restricted portion for this area.
Claims (6)
1. middle low power inverter that thermal diffusivity is good, high heater members (2) that comprises printed circuit-board assembly (1), is electrically connected and heat sink assembly (3) with printed circuit-board assembly, wherein said high heater members (2) device is characterized in that described heat sink assembly (3) is made up of the radiator (31) of some independences and mutually insulated on heat sink assembly (3).
2. the middle low power inverter good according to the described thermal diffusivity of claim 1 is characterized in that being fixed on the same module radiator (31) of above-mentioned high heater members (2) copolar.
3. the middle low power inverter good according to the described thermal diffusivity of claim 1 is characterized in that being provided with heat-conducting silicone grease layer (4) between above-mentioned high heater members (2) and the radiator (31).
4. the middle low power inverter good according to the described thermal diffusivity of claim 3, it is characterized in that above-mentioned heat-conducting silicone grease layer (4) is arranged on the heat-radiating substrate (21) of high heater members (2), described high heater members (2) is connected with above-mentioned radiator (31) by heat-conducting silicone grease layer (4).
5. the middle low power inverter good according to the described thermal diffusivity of claim 1, it is characterized in that above-mentioned heat sink assembly (3) is provided with support (5), above-mentioned printed circuit-board assembly (1) passes through the unsettled device of described support (5) on above-mentioned heat sink assembly (3), and above-mentioned some radiators (31) are assembled into one by described printed circuit-board assembly (1).
6. the middle low power inverter good according to the described thermal diffusivity of claim 1 is characterized in that above-mentioned high heater members (2) is MOSFET pipe or IGBT pipe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN200920062094XU CN201450460U (en) | 2009-08-10 | 2009-08-10 | Small and medium power inverted power supply with good heat dissipation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN200920062094XU CN201450460U (en) | 2009-08-10 | 2009-08-10 | Small and medium power inverted power supply with good heat dissipation |
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CN201450460U true CN201450460U (en) | 2010-05-05 |
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CN200920062094XU Expired - Lifetime CN201450460U (en) | 2009-08-10 | 2009-08-10 | Small and medium power inverted power supply with good heat dissipation |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102469752A (en) * | 2010-10-28 | 2012-05-23 | 三星电机株式会社 | Heat dissipation device for power conversion module |
WO2012130063A1 (en) * | 2011-03-29 | 2012-10-04 | 华为技术有限公司 | Power supply module and electronic device utilizing the power supply module |
CN103227572A (en) * | 2013-05-22 | 2013-07-31 | 株洲南车时代电气股份有限公司 | Subway auxiliary converter IGBT (insulated gate bipolar transistor) contravariant module |
CN103415189A (en) * | 2013-08-09 | 2013-11-27 | 曾震 | Power supply heat dissipation processing mode |
CN111200915A (en) * | 2020-01-21 | 2020-05-26 | 西安中车永电电气有限公司 | Hoisting combined type power unit frame |
-
2009
- 2009-08-10 CN CN200920062094XU patent/CN201450460U/en not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102469752A (en) * | 2010-10-28 | 2012-05-23 | 三星电机株式会社 | Heat dissipation device for power conversion module |
CN102469752B (en) * | 2010-10-28 | 2015-11-25 | 三星电机株式会社 | The heat abstractor of power conversion module |
WO2012130063A1 (en) * | 2011-03-29 | 2012-10-04 | 华为技术有限公司 | Power supply module and electronic device utilizing the power supply module |
CN103227572A (en) * | 2013-05-22 | 2013-07-31 | 株洲南车时代电气股份有限公司 | Subway auxiliary converter IGBT (insulated gate bipolar transistor) contravariant module |
CN103415189A (en) * | 2013-08-09 | 2013-11-27 | 曾震 | Power supply heat dissipation processing mode |
CN111200915A (en) * | 2020-01-21 | 2020-05-26 | 西安中车永电电气有限公司 | Hoisting combined type power unit frame |
CN111200915B (en) * | 2020-01-21 | 2021-06-01 | 西安中车永电电气有限公司 | Hoisting combined type power unit frame |
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Granted publication date: 20100505 |
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CX01 | Expiry of patent term |