CN219437211U - Circuit main board heat radiation structure - Google Patents
Circuit main board heat radiation structure Download PDFInfo
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- CN219437211U CN219437211U CN202222881402.XU CN202222881402U CN219437211U CN 219437211 U CN219437211 U CN 219437211U CN 202222881402 U CN202222881402 U CN 202222881402U CN 219437211 U CN219437211 U CN 219437211U
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- China
- Prior art keywords
- main board
- chip
- cavity
- flat plate
- heat dissipation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation structure of a circuit main board, which comprises: the main board and the chip are arranged at the central position of the lower surface of the main board, the circular current cavity plate filled with the phase change medium is annular and wraps the main board, the bottom of the circular current cavity plate is adhered to the lower surface of the chip, the circular current cavity plate further comprises a flat plate part, a fitting part, a left connecting part and a right connecting part, the flat plate part is located above the main board and forms a ventilation cavity with the upper surface of the main board, the fitting part is located below the chip, the top wall is in a ladder-shaped structure, the fitting part is adhered to the left side wall and the bottom of the chip, the left connecting part and the right connecting part are respectively connected with the two ends of the fitting part and the flat plate part, and a left air cavity, a right air cavity and a right air cavity are formed between the left connecting part and the lower surface of the main board. The circuit main board heat dissipation structure can transfer heat generated by the chip and is beneficial to air flowing above and below the main board, so that the overall heat dissipation efficiency is improved.
Description
Technical Field
The utility model relates to the technical field of heat dissipation of a main board, in particular to a heat dissipation structure of a circuit main board.
Background
The heat dissipation mode of the circuit board can be divided into passive heat dissipation and active heat dissipation. The passive heat dissipation is to naturally dissipate the heat generated by the chip of the circuit board into the air through the heat sink. Because the heat is naturally emitted, the effect is not very good, and the heat dissipation effect is in direct proportion to the size of the radiating fins. But has the greatest advantages of no extra power consumption and no worry about the risk of fan failure. Such heat dissipation is often used in military or professional equipment where space is not a particular requirement. The active heat dissipation is to forcedly take away the heat emitted by the heat radiating fins through heat radiating devices such as fans and the like, and is characterized by high heat radiating efficiency and small equipment volume.
At present, in the design of a circuit main board, a main control chip is often arranged at the middle part of the circuit main board, and low-power-consumption components are often arranged at the position between the middle part and the edge of the circuit main board, however, the chips and the components positioned at the same side are piled up together by heat generated during working, and the heat dissipation of the chips and the components is affected.
Disclosure of Invention
The utility model aims to provide a circuit main board radiating structure which can transfer heat generated by a chip, avoid the situation that heat generated by the chip is accumulated on one side of the main board to affect the radiation of other devices, and is beneficial to the air flowing above and below the main board, so that the overall radiating efficiency is improved.
In order to achieve the above purpose, the utility model adopts the following technical scheme: a circuit motherboard heat dissipation structure, comprising: the device comprises a main board and a chip, wherein the chip is arranged in the central position of the lower surface of the main board, a circular current cavity plate filled with phase change media is in an annular shape and wraps the main board, and the bottom of the circular current cavity plate is adhered to the lower surface of the chip;
the circulation cavity plate further comprises a flat plate part, a fitting part, a left connecting part and a right connecting part, wherein the flat plate part is positioned above the main plate and forms a ventilation cavity with the upper surface of the main plate, the fitting part is positioned below the chip, the top wall is formed by fitting and bonding the fitting part with the left side wall and the bottom of the chip in a stepped structure, the two sides of the fitting part are respectively connected with the flat plate part by the left connecting part and the right connecting part, and a left air cavity, a right air cavity and a right air cavity are formed between the left connecting part and the lower surface of the main plate.
The further improved scheme in the technical scheme is as follows:
1. in the scheme, the left connecting part and the right connecting part are of a strip-shaped structure or a trapezoid structure.
2. In the scheme, the width of the flat plate part is 4-6 times of the width of the left connecting part.
3. In the above scheme, the ventilation cavity is internally provided with a support column.
Due to the application of the technical scheme, compared with the prior art, the utility model has the following advantages:
according to the circuit main board radiating structure, the circular current cavity plate filled with the phase change medium inside of the circuit main board radiating structure is in an annular shape to wrap the main board, the bottom of the circular current cavity plate is adhered to the lower surface of the chip, the flat plate is positioned above the main board, a ventilation cavity is formed between the circular current cavity plate and the upper surface of the main board, the junction part is positioned below the chip, the junction part of the top wall is in a ladder-shaped structure and is adhered to the left side wall and the bottom of the chip, the left connecting part and the right connecting part are respectively used for connecting two sides of the junction part with the flat plate, a left air cavity is formed between the left connecting part and the lower surface of the main board, a right air cavity is formed between the right connecting part and the lower surface of the main board, and the phase change medium inside the circular current cavity plate continuously generates mutual conversion between the gaseous state and the liquid state in the circulating process, so that most heat generated by the chip is transferred to the other side of the main board to radiate, the situation that heat generated by the chip is accumulated on one side of the main board to affect the radiation of other devices is avoided, and the air flows above and below the main board is facilitated, and the whole radiating efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a motherboard heat dissipation structure of the present utility model;
fig. 2 is a cross-sectional view of a motherboard heat dissipation structure of the present utility model.
In the above figures: 1. a main board; 2. a chip; 3. a circulation cavity plate; 31. a flat plate portion; 32. a fitting portion; 33. a left connecting part; 34. a right connecting part; 4. a ventilation chamber; 51. a left wind cavity; 52. a right wind chamber; 6. and (5) supporting the column.
Detailed Description
In the description of this patent, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element in question must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the utility model; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in this patent will be understood by those of ordinary skill in the art in a specific context.
The utility model is further described below with reference to examples:
example 1: a circuit motherboard heat dissipation structure, comprising: the chip 2 is arranged at the central position of the lower surface of the main board 1, a circular current cavity plate 3 filled with phase change media is in a ring shape and wraps the main board 1, and the bottom of the circular current cavity plate 3 is adhered to the lower surface of the chip 2;
meanwhile, a circulation cavity plate 3 with a phase change medium inside is fixedly arranged around the circuit main board, the phase change medium of the circulation cavity plate 3 is continuously converted between a gaseous state and a liquid state in the circulation process, so that heat of a chip is brought to one side of the circuit main board, most of the heat is transferred, and most of the heat generated by the chip is transferred and radiated;
the circulation cavity plate 3 further comprises a flat plate portion 31, a fitting portion 32, a left connecting portion 33 and a right connecting portion 34, the flat plate portion 31 is located above the main board 1, a ventilation cavity 4 is formed between the flat plate portion and the upper surface of the main board 1, the fitting portion 32 is located below the chip 2, the fitting portion 32 with the top wall being of a ladder-shaped structure is adhered to the left side wall and the bottom of the chip 2, the left connecting portion 33 and the right connecting portion 34 are respectively used for connecting two sides of the fitting portion 32 with the flat plate portion 31, and a left air cavity 51 is formed between the left connecting portion 33 and the lower surface of the main board 1, and a right air cavity 52 is formed between the right connecting portion 34 and the lower surface of the main board 1.
The left and right connecting parts 33 and 34 are bar-shaped; the inner cavity of the left connecting portion 33 is larger than the inner cavity of the right connecting portion 34.
The circulation cavity plate 3 is adhered to the chip 2 through heat conduction paste.
The left air chamber 51 is smaller than the right air chamber 52.
The phase-change medium is acetone.
The width of the flat plate portion 31 is 4 times the width of the left connecting portion 33.
Example 2: a circuit motherboard heat dissipation structure, comprising: the chip 2 is arranged at the central position of the lower surface of the main board 1, a circular current cavity plate 3 filled with phase change media is in a ring shape and wraps the main board 1, and the bottom of the circular current cavity plate 3 is adhered to the lower surface of the chip 2;
the phase-change medium is diethyl ether;
the circulation cavity plate 3 further comprises a flat plate part 31, a fitting part 32, a left connecting part 33 and a right connecting part 34, wherein the flat plate part 31 is positioned above the main plate 1, and a ventilation cavity 4 is formed between the flat plate part 31 and the upper surface of the main plate 1;
when diethyl ether evaporates and absorbs heat at the position of the chip 2, gaseous diethyl ether flows along the direction of the flat plate part 31 inside the left connecting part 33, a ventilation cavity 4 is arranged between the flat plate part 31 and the main board 1, the gaseous diethyl ether flows to the flat plate part 31 above the main board 1 to condense and release heat, and liquefied diethyl ether flows back to the position of the chip 2 from the right connecting part under the gravity to form diethyl ether circulation.
The engaging portion 32 is located below the chip 2, the engaging portion 32 with a stepped top wall is adhered to the left side wall and the bottom of the chip 2, the left connecting portion 33 and the right connecting portion 34 respectively connect two sides of the engaging portion 32 with the flat plate portion 31, a left air cavity 51 is formed between the left connecting portion 33 and the lower surface of the main board 1, and a right air cavity 52 is formed between the right connecting portion 34 and the lower surface of the main board 1; the left air chamber 51 is smaller than the right air chamber 52.
The left and right connection portions 33 and 34 have a trapezoidal structure, and have a short side near the chip 2 and a long side near the flat plate portion 31.
The width of the flat plate portion 31 is 6 times the width of the left connecting portion 33.
The ventilation cavity 4 is internally provided with a support column 6.
The circulation cavity plate 3 is in a negative pressure environment, and the circulation cavity plate 3 is in a negative pressure environment, so that the phase change medium in the circulation cavity plate 3 is easier to evaporate, and the heat dissipation capacity of the chip 2 is further enhanced.
The working principle of the utility model is as follows: when the phase-change medium evaporation heat absorption device is used, when the phase-change medium at the position of the chip 2 evaporates and absorbs heat, the gaseous phase-change medium flows along the direction of the flat plate part 31 inside the left connecting part 33, a ventilation cavity 4 is arranged between the flat plate part 31 and the main board 1, the gaseous phase-change medium flows to the flat plate part 31 above the main board 1 to condense and release heat, the liquefied phase-change medium flows back to the position of the chip 2 from the right connecting part under the action of gravity, the circulation of the phase-change medium is formed, and a large amount of heat generated by the chip 2 can be taken away in the circulation process of the phase-change medium.
When the circuit main board radiating structure is adopted, most of heat generated by the chip can be transferred to the other side of the main board to radiate, so that the heat generated by the chip is prevented from accumulating on one side of the main board to influence the radiating condition of other devices, and air is facilitated to flow above and below the main board, thereby improving the overall radiating efficiency.
The above embodiments are provided to illustrate the technical concept and features of the present utility model and are intended to enable those skilled in the art to understand the content of the present utility model and implement the same, and are not intended to limit the scope of the present utility model. All equivalent changes or modifications made in accordance with the spirit of the present utility model should be construed to be included in the scope of the present utility model.
Claims (4)
1. A circuit motherboard heat dissipation structure, comprising: mainboard (1), chip (2), its characterized in that: the chip (2) is arranged at the central position of the lower surface of the main board (1), a circulation cavity plate (3) filled with phase change media is annular and wraps the main board (1), and the bottom of the circulation cavity plate (3) is adhered to the lower surface of the chip (2);
the circulation cavity plate (3) further comprises a flat plate portion (31), a fitting portion (32), a left connecting portion (33) and a right connecting portion (34), the flat plate portion (31) is located above the main plate (1) and forms a ventilation cavity (4) with the upper surface of the main plate (1), the fitting portion (32) is located below the chip (2), the top wall is of a stepped structure, the fitting portion (32) is adhered to the left side wall and the bottom of the chip (2), the left connecting portion (33) and the right connecting portion (34) are respectively connected with the two sides of the fitting portion (32) and the flat plate portion (31), and a left air cavity (51), a right air cavity (52) is formed between the left connecting portion (33) and the lower surface of the main plate (1).
2. The circuit board heat dissipation structure as defined in claim 1, wherein: the left connecting part (33) and the right connecting part (34) are of a strip-shaped structure or a trapezoid structure.
3. The circuit board heat dissipation structure as defined in claim 1, wherein: the width of the flat plate part (31) is 4-6 times of the width of the left connecting part (33).
4. The circuit board heat dissipation structure as defined in claim 1, wherein: a support column (6) is arranged in the ventilation cavity (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222881402.XU CN219437211U (en) | 2022-10-31 | 2022-10-31 | Circuit main board heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222881402.XU CN219437211U (en) | 2022-10-31 | 2022-10-31 | Circuit main board heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219437211U true CN219437211U (en) | 2023-07-28 |
Family
ID=87345845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222881402.XU Active CN219437211U (en) | 2022-10-31 | 2022-10-31 | Circuit main board heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219437211U (en) |
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2022
- 2022-10-31 CN CN202222881402.XU patent/CN219437211U/en active Active
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