CN218483141U - Inverter heat dissipation structure and energy storage power supply - Google Patents

Abstract

The utility model relates to the technical field of energy storage power supply, in particular to an inverter cooling structure and energy storage power supply. The heat dissipation structure of the inverter mainly includes an inverter body, a support component and a heat dissipation component. Wherein, the support assembly is used to support the inverter body, and the support assembly is in thermal communication with the inverter body; the heat dissipation assembly is in heat conduction communication with the inverter body and/or the support assembly, and the heat dissipation assembly and support assembly are different from those of the housing surface thermally connected. The heat dissipation structure of the inverter can reduce noise generation, improve heat dissipation efficiency, and save costs. The energy storage power supply includes the above inverter heat dissipation structure, thereby prolonging the service life of the energy storage power supply.

Description

An inverter heat dissipation structure and energy storage power supply

technical field

The utility model relates to the technical field of energy storage power supplies, in particular to an inverter cooling structure and an energy storage power supply.

Background technique

With the development of economy and the progress of science and technology, portable energy storage power supply is favored by more and more people. The energy storage power supply can store electrical energy, and can output electrical energy to supply power for equipment in outdoor scenarios without electricity, which can effectively meet the needs of today's electrical equipment and electronic equipment for outdoor operations at any time. Strong convenience and wide application scenarios.

Based on the portability of the portable energy storage power supply, the overall internal space of the energy storage power supply is usually limited and relatively closed, the internal heat source distribution is relatively concentrated, the heat flux density is large, and the thermal diffusion performance is poor. Component overheating problem. In order to solve the over-temperature problem, in the prior art, a fan is usually installed inside the energy storage power supply and a ventilation flow channel is used, and the heat exchange measures of forced air cooling are used to dissipate heat, but it is also accompanied by the problem of excessive noise generated by the fan, resulting in Noise pollution reduces the service life of the energy storage power supply. Moreover, "airflow dead zone" is likely to be generated in the air flow channel, which reduces the heat dissipation efficiency of the energy storage power supply.

Therefore, it is urgent to design an inverter cooling structure and energy storage power supply to solve the technical problems in the prior art.

Utility model content

The first purpose of the present utility model is to provide an inverter heat dissipation structure, which can reduce noise generation, improve heat dissipation efficiency, and prolong its service life.

For this purpose, the utility model adopts the following technical solutions:

The utility model provides an inverter cooling structure, comprising:

Inverter body;

a support assembly, the support assembly is used to support the inverter body, and the support assembly is in thermal communication with the inverter body;

The heat dissipation component is in thermal communication with the inverter body and/or the support component, and the heat dissipation component and the support component are respectively in thermal communication with different surfaces of the casing.

As an optional technical solution for the heat dissipation structure of the inverter, the support assembly is "I-shaped", and along the height direction of the inverter body, the height of the inverter body is lower than the Support the upper face of the assembly.

As an optional technical solution of the heat dissipation structure of the inverter, the heat dissipation assembly includes a first heat dissipation device, and the first heat dissipation device communicates with the housing through a first heat conduction pad.

As an optional technical solution of the heat dissipation structure of the inverter, the heat dissipation assembly includes a second heat dissipation device, the second heat dissipation device is arranged on the side end surface of the support assembly, and the second heat dissipation device is connected to the The side end surfaces of the support components are in heat conduction communication.

As an optional technical solution of the heat dissipation structure of the inverter, the second heat dissipation device includes a heat dissipation fin and a heat dissipation plate, the heat dissipation fin is connected to the heat dissipation plate by heat conduction, and the heat dissipation fin and the heat dissipation plate The heat dissipation plate defines heat dissipation through holes.

As an optional technical solution for the heat dissipation structure of the inverter, the heat dissipation fins are arranged in multiples, and the plurality of heat dissipation fins are arranged at equal intervals, so that the plurality of heat dissipation fins and the heat dissipation plate define A plurality of said thermal vias are provided.

As an optional technical solution for the heat dissipation structure of the inverter, the second heat dissipation device further includes a second heat conduction gasket, a groove is provided on the heat dissipation plate, and the second heat conduction gasket is arranged in the recess In the slot, and the second heat conduction gasket connects the heat dissipation plate with the housing through heat conduction.

As an optional technical solution of the heat dissipation structure of the inverter, the first heat dissipation device and the second heat dissipation device are thermally isolated from each other.

As an optional technical solution for the heat dissipation structure of the inverter, both the heat dissipation component and the support component are made of aluminum.

The second purpose of the utility model is to provide an energy storage power supply, which has a simple structure, can reduce noise generation, save costs, and prolong the service life of the energy storage power supply.

For this purpose, the utility model adopts the following technical solutions:

The utility model provides an energy storage power supply, and the energy storage power supply includes the inverter heat dissipation structure described above.

The beneficial effects of the utility model at least include:

The utility model provides an inverter heat dissipation structure, which mainly includes an inverter body, a support assembly and a heat dissipation assembly. Wherein, the support assembly is used to support the inverter body, and the support assembly is in heat conduction communication with the inverter body; the heat dissipation assembly is in heat conduction communication with the inverter body and/or the support assembly, and the heat dissipation assembly and support assembly are respectively different from those surface thermally connected. The heat dissipation structure of the inverter can realize the heat dissipation of the inverter body to the surface of the casing without using the fan or fan in the traditional technology, thereby realizing the heat dissipation of the inverter body and reducing the noise generation, improve heat dissipation efficiency and prolong its service life.

The utility model also provides an energy storage power supply, which has a simple structure, can reduce noise generation, improve heat dissipation efficiency, save costs, and prolong the service life of the energy storage power supply.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings that need to be used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only the illustrations of the present invention. For some embodiments, those of ordinary skill in the art can also obtain other drawings according to the content of the embodiments of the present invention and these drawings without any creative effort.

Fig. 1 is a schematic structural view of a housing provided by an embodiment of the present invention;

Fig. 2 is a schematic structural diagram of the energy storage power supply provided by the embodiment of the present invention after removing the housing;

Fig. 3 is a structural schematic diagram of the heat dissipation structure of the inverter provided by the embodiment of the present invention;

Fig. 4 is a structural schematic diagram of a PV panel heat dissipation structure provided by an embodiment of the present invention;

Fig. 5 is a structural schematic diagram of the heat dissipation structure of the battery module provided by the embodiment of the present invention;

Fig. 6 is a front view of the heat dissipation structure of the battery module provided by the embodiment of the present invention.

reference sign

100, shell; 110, inner shell; 120, outer shell; 1201, aluminum fins; 1202, heat shield; 1203, bending part;

200. Inverter heat dissipation structure; 210. Inverter body; 220. Support assembly; 230. First heat dissipation device; 240. Second heat dissipation device; 2401. Heat dissipation fin; 2402. Heat dissipation plate; 2403. Second heat conduction Gasket;

300. PV plate heat dissipation structure; 310. Thermal diffusion aluminum plate; 320. PV radiator;

400, battery module heat dissipation structure; 410, heat dissipation aluminum sheet; 420, extended section; 430, heat dissipation section; 440, battery module heat sink; 450, external aluminum plate.

Detailed ways

In order to make the technical problem solved by the utility model, the adopted technical solution and the achieved technical effect clearer, the technical solution of the utility model will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

In the description of the present utility model, unless otherwise clearly stipulated and limited, the terms "connected", "connected" and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or a Integral; it can be mechanically or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present utility model in specific situations.

In the present invention, unless otherwise clearly specified and limited, a first feature being "on" or "below" a second feature may include direct contact between the first and second features, and may also include the first and second features being in direct contact with each other. The features are not in direct contact but through another feature between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

In the description of this embodiment, the terms "up", "down", "left", "right" and other orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operations. It does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in description, and have no special meaning.

As shown in Figures 1-3, this embodiment provides an energy storage power supply, which includes a housing 100, and the inside of the housing 100 is provided with an inverter heat dissipation structure 200, a PV panel heat dissipation structure 300, and a battery module. Set heat dissipation structure 400 and other electronic components. Wherein, the inverter heat dissipation structure 200 mainly includes an inverter body 210 , a support assembly 220 and a heat dissipation assembly. Wherein, the support assembly 220 is used to support the inverter body 210, and the support assembly 220 is in thermal communication with the inverter body 210; the heat dissipation assembly is in heat conduction communication with the inverter body 210 and/or the support assembly 220, and the heat dissipation assembly and the support assembly 220 are in heat conduction communication with different surfaces of the housing 100 respectively.

Based on the above design, in this embodiment, both the heat dissipation assembly and the support assembly 220 are made of aluminum, that is to say, both the heat dissipation assembly and the support assembly 220 are made of metal aluminum, which not only reduces the weight of the energy storage power supply, It is easy to carry and transport; at the same time, it can also improve the heat conduction efficiency of the inverter body 210, so that the heat can be exported in time. Specifically, the inverter body 210 is provided with inductors, capacitors, transformers and mos transistors, wherein the mos transistors are usually arranged on the edge of the inverter body 210 , and the rest of the components are usually arranged in the middle of the inverter body 210 . When the inverter body 210 is working normally, the heat generated by the electronic components on the inverter body 210, wherein the heat generated by the MOS transistor can be transferred to the heat dissipation assembly through the support assembly 220, and then transferred to the housing 100 by the heat dissipation assembly. On one surface of the housing 100, the heat is dissipated by convection with the outside air; the heat generated by electronic components such as inductors, capacitors, and transformers is directly transferred to the heat dissipation assembly, and then transferred to the other surface of the housing 100 by the heat dissipation assembly. Realize the convection heat dissipation between the casing 100 and the outside air. Further, the heat dissipation of the inverter body 210 is realized, and the heat dissipation efficiency is improved.

Compared with the prior art, the heat dissipation structure 200 of the inverter provided by the present invention can conduct the heat of the inverter body 210 to the surface of the housing 100 without using parts such as fans or blowers in the traditional art On the other hand, the heat dissipation of the inverter body 210 can be realized, the generation of noise can be reduced, the heat dissipation efficiency can be improved, and the service life can be extended.

As shown in FIG. 3 , in this embodiment, the support assembly 220 is "I-shaped", and along the height direction of the inverter body 210 , the height of the inverter body 210 is lower than the upper surface of the support assembly 220 . Exemplarily, there are two support assemblies 220, and the inverter body 210 is arranged between the support assemblies 220. The arrangement of the support assemblies 220 can improve the reliability and stability of the inverter body 210, and avoid occurrence of The phenomenon of shaking and instability.

As shown in FIG. 3, in this embodiment, the heat dissipation assembly includes a first heat dissipation device 230, and the first heat dissipation device 230 is in thermal communication with the housing 100 through a first heat conduction pad, and the first heat conduction pad communicates with the inductor, capacitor, and transformer. and other electronic components are thermally connected, so that the heat generated by electronic components such as inductors, capacitors, and transformers is transferred to the first heat sink 230 after passing through the first heat conduction pad, and finally transferred to the housing 100 through the first heat sink 230 the top surface for heat dissipation.

Further, in this embodiment, the heat dissipation assembly includes a second heat dissipation device 240 , the second heat dissipation device 240 is disposed on the side end surface of the support assembly 220 , and the second heat dissipation device 240 is in thermal communication with the side end surface of the support assembly 220 . In this way, the heat generated by the mos transistor can be transferred to the support assembly 220 first, then transferred to the second heat sink 240 by the support assembly 220 , and finally transferred to the side of the housing 100 through the second heat sink 240 for heat dissipation.

Specifically, the second heat dissipation device 240 includes heat dissipation fins 2401 and heat dissipation plates 2402 , the heat dissipation fins 2401 are thermally connected to the heat dissipation plates 2402 , and the heat dissipation fins 2401 and the heat dissipation plates 2402 define heat dissipation through holes. The arrangement of the heat dissipation through holes can increase the heat dissipation area of the second heat dissipation device 240 , thereby improving the heat dissipation efficiency. In addition, the arrangement of the heat dissipation fins 2401 and the heat dissipation plate 2402 can improve the buffering effect on the inverter body 210, that is, when the inverter body 210 is hit by the outside, it can play a certain role in the inverter body 210. protection and prolong its lifespan.

Furthermore, the heat dissipation fins 2401 in this embodiment are arranged in multiples, and the plurality of heat dissipation fins 2401 are arranged at equal intervals, so that the plurality of heat dissipation fins 2401 and the heat dissipation plate 2402 define a plurality of heat dissipation through holes, thereby improving Uniformity and reliability of force applied to the second heat sink 240 .

As shown in FIG. 3 , in this embodiment, the second heat sink 240 also includes a second heat conduction pad 2403 , a groove (not shown in the figure) is arranged on the heat sink 2402 , and the second heat conduction pad 2403 is arranged on The second thermal pad 2403 connects the cooling plate 2402 with the housing 100 through thermal conduction. The setting of the second thermal pad 2403 can fill the pores on the side of the housing 100 to prevent dust or other foreign matter from entering the inverter body 210 internal.

In order to prevent the heat on the first heat sink 230 and the second heat sink 240 from being transferred to each other and affect the heat dissipation effect of each other, the first heat sink 230 and the second heat sink 240 in this embodiment are thermally isolated from each other. Operators can use glass fiber material to arrange between the first heat dissipation device 230 and the second heat dissipation device 240 to achieve thermal isolation from each other.

As shown in Figures 4-6, in this embodiment, in addition to the inverter heat dissipation structure 200 in the energy storage power supply, a corresponding heat dissipation structure is also provided on the housing 100, and a PV panel heat dissipation structure 300 is arranged inside the energy storage power supply and a heat dissipation structure 400 for the battery module.

Exemplarily, in this embodiment, the housing 100 can be made of aluminum alloy, or can be made of hard engineering plastics. Of course, part of the housing 100 can be made of aluminum alloy according to actual needs. Made by processing, part of the surface is made of engineering plastic material. The casing 100 in this embodiment is set in the shape of a cube or a cuboid, and the six sides of the casing 100 are surrounded by a chamber that is sealed against the outside world, and components such as the inverter body 210 and the power supply are arranged in the chamber.

Exemplarily, the top and bottom surfaces of the casing 100 in this embodiment are made of aluminum alloy metal, and the rest of the surface is made of engineering plastics. The inverter body 210 is in thermal communication with the top surface of the casing 100 to facilitate The heat of the body 210 is exported.

As shown in FIG. 1 , the casing 100 in this embodiment includes an inner casing 110 and an outer casing 120 , and the outer casing 120 is socketed and covers the outer side of the inner casing 110 . The inner shell 110 is in thermal communication with the PV panel heat dissipation structure 300 , the battery module heat dissipation structure 400 and the inverter heat dissipation structure 200 . Aluminum fins 1201 are disposed on the shell 120 , and the length of the aluminum fins 1201 is equal to the shell 120 . A layer of heat shield 1202 is arranged above the aluminum fin 1201 as a whole. The heat shield 1202 is made of engineering plastics. That is to say, the heat shield 1202 can completely cover the upper area of the casing 120 and the aluminum fins 1201 on the casing 120, so that the heat of the inverter body 210 inside the energy storage power supply is transferred to the aluminum fins 1201, and then Dispersing the heat to the aluminum fins 1201 can prevent users from being burned due to the high temperature of the top surface of the casing 120 caused by the heat generated by the inverter body 210 . In this embodiment, the inner shell 110 and the outer shell 120 can be directly sleeved, and the inner surface of the outer shell 120 can be attached to the outer surface of the inner shell 110, or a support can be provided between the inner surface of the outer shell 120 and the outer surface of the inner shell 110. components, so that the inner shell 110 and the outer shell 120 are in thermal communication.

Further, the aluminum fins 1201 in this embodiment are provided in multiples, and the multiple aluminum fins 1201 are arranged at equal intervals. The arrangement of the aluminum fins 1201 can not only speed up the heat dissipation efficiency of the inverter body 210, but also The sheet 1201 has a certain strength, which can improve the mechanical load resistance of the casing 100, thereby prolonging the service life. Of course, the operator can arrange the aluminum fins 1201 at any position on other surfaces of the casing 120 according to actual needs, and the number of the aluminum fins 1201 is not specifically limited.

Optionally, the thickness of the heat shield 1202 in this embodiment is set between 1.5mm-2mm, and the height is set between 3mm-5mm. The height of the aluminum fins 1201 is between 3 mm and 5 mm, and the distance between two adjacent aluminum fins 1201 is between 2 cm and 5 cm.

As shown in FIG. 1 , in this embodiment, the opposite two side end surfaces of the heat shield 1202 are bent to form a bent portion 1203 , and the bent portion 1203 is buckled on the side of the casing 120 , and the bent portion 1203 is connected to the casing 120 The length is equal, and the width of the bent portion 1203 is between 3 mm and 8 mm. The setting of the bent part 1203 covers the local upper area of the side of the housing 120, on the one hand, it can increase the heat insulation area of the heat shield 1202, avoid the upper area of the peripheral side of the housing 120 from being burned, and improve the safety performance; on the other hand The bent portion 1203 can facilitate the fixing of the heat shield 1202 on the aluminum fin 1201 , improve the stability of the heat shield 1202 , and prevent the heat shield 1202 from falling off during use.

Optionally, in this embodiment, a rounded corner is provided between the bent portion 1203 and the heat insulation board 1202, and the angle of the rounded corner is 80°-100°. The setting of rounded corners can protect the user to a certain extent and avoid scratching the user.

Optionally, in this embodiment, both the heat insulating plate 1202 and the bent portion 1203 are made of engineering plastics or both are made of silicone.

Compared with the prior art, in this embodiment, by covering the outer peripheral side of the inner shell 110 with the outer shell 120, the heat of the electronic components can be conducted to the inner shell 110, and then the inner shell 110 is conducted to the outer shell 120 for heat dissipation In this way, on the one hand, the heat transfer area is increased, so that the temperature of the heat conducted to the housing 120 is lowered; In the corresponding area, the risk of scalding the user due to the high temperature of the casing 120 caused by the heat concentration of the electronic components can be prevented, and the safety performance of the energy storage power supply can be improved.

As shown in FIG. 4 , in this embodiment, the PV panel heat dissipation structure 300 is arranged below the housing 100 and close to the front plastic sealing plate, and the PV panel heat dissipation structure 300 is in thermal communication with the bottom surface of the housing 100 . In the area corresponding to the PV board, the plastic sealing plate on the front face is thinned and filled with a layer of thermal diffusion aluminum plate 310, which can provide heat dissipation for the PV board as a whole. performance. The PCB board on the PV board mainly includes electronic components such as inductors, capacitors, and mos transistors, wherein the mos transistors and inductors have a relatively large heat flux density. Therefore, in this embodiment, a PV radiator 320 is added above the mos transistors as a whole. A gasket with heat conduction function is added above the inductor, and is in communication with the PV radiator 320 through heat conduction, thereby facilitating the timely conduction of heat.

During the heating process of the electronic components on the PV board, the heat of the MOS transistor conducts heat to the thermal diffusion aluminum plate 310 through the PV heat sink 320 , and the inductor also conducts heat to the thermal diffusion aluminum plate 310 through the thermal pad. The thermal diffusion aluminum plate 310 conducts the heat to the front plastic sealing plate and the bottom surface of the housing 100 respectively to realize heat dissipation.

As shown in FIGS. 5-6 , in this embodiment, the battery module is arranged in multiple layers, that is, the battery module as a whole is formed by stacking multiple layers of cell packaging modules. The battery module package is mainly composed of a top cover, a bottom cover and a battery cell. The top cover and the bottom cover are provided with holes matching the shape of the battery cell to meet the positioning of the battery cell. The heat dissipation structure 400 of the battery module is as follows: each layer of the battery module is provided with a layer of heat-conducting potting glue with a suitable thickness, and in the heat-conducting potting glue, heat-dissipating aluminum sheets 410 are arranged adjacent to the cells. One side of the heat dissipation aluminum sheet 410 is a small extension section 420, which is used to extend into the heat conduction potting compound to transmit heat flow; the other side of the heat dissipation aluminum sheet 410 is a heat dissipation section 430, and the geometric shape of the heat dissipation section 430 is multi-layered. The number of layers of the cooling section 430 is the same as that of the battery module, and the last layer of cooling section 430 communicates with the heat conduction of the battery module radiator 440 through thermal conductive glue. The top of the battery module radiator 440 is in contact with the plastic sealing plate on the front face. Cut off the plastic material on the corresponding area of the plastic sealing plate on the front face and replace it with an external aluminum plate 450, and the external aluminum plate 450 and the sealing plate are hermetically bonded.

During the heating process of the battery module, the heat generated can be preferentially absorbed by the heat-conducting potting compound. The heat-conducting potting compound further conducts the heat flow through the heat-dissipating aluminum sheet 410 and diffuses it to the surroundings at the same time, and finally reaches the external aluminum plate 450. The environment dissipates heat from the external aluminum plate 450 to realize the heat dissipation of the battery module. The heat dissipation structure 400 of the battery module has a large heat capacity and excellent heat conduction performance, which can not only ensure that the battery core does not overheat during the heating process, but also shorten the cooling time of the battery core when standing still.

This embodiment also provides an energy storage power supply, which includes the above inverter cooling structure 200 . The energy storage power supply has a simple structure, can reduce noise generation, improve heat dissipation efficiency, save costs, and prolong the service life of the energy storage power supply.

Apparently, the above are only the preferred embodiments of the present invention and the applied technical principles. Those skilled in the art will understand that the utility model is not limited to the specific embodiments here, and various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the utility model. Therefore, although the utility model has been described in detail through the above embodiments, the utility model is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the utility model. The scope of the present invention is determined by the appended claims.

Note that in the description of this specification, descriptions referring to the terms "some embodiments", "other embodiments" and the like mean that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one aspect of the present invention. In an embodiment or example. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Claims (10)

1. An inverter heat dissipation structure, comprising:

an inverter body (210);

a support assembly (220), the support assembly (220) for supporting the inverter body (210), and the support assembly (220) in thermally conductive communication with the inverter body (210);

a heat sink assembly in thermally conductive communication with the inverter body (210) and/or the support assembly (220), and the heat sink assembly and the support assembly (220) are in thermally conductive communication with different faces of the housing (100), respectively.

2. The inverter heat dissipation structure according to claim 1, wherein the support assembly (220) has an "i-shape", and a height of the inverter body (210) is lower than an upper end surface of the support assembly (220) in a height direction along the inverter body (210).

3. The inverter heat dissipation structure of claim 2, wherein the heat dissipation assembly comprises a first heat sink (230), the first heat sink (230) being in thermally conductive communication with the housing (100) through a first thermally conductive gasket.

4. The inverter heat dissipation structure according to claim 3, wherein the heat dissipation assembly includes a second heat dissipation device (240), the second heat dissipation device (240) is disposed at a side end surface of the support assembly (220), and the second heat dissipation device (240) is in heat conductive communication with the side end surface of the support assembly (220).

5. The inverter heat dissipation structure according to claim 4, wherein the second heat dissipation device (240) includes a heat dissipation fin (2401) and a heat dissipation plate (2402), the heat dissipation fin (2401) is thermally connected to the heat dissipation plate (2402), and the heat dissipation fin (2401) and the heat dissipation plate (2402) define a heat dissipation through hole.

6. The inverter heat dissipation structure according to claim 5, wherein the heat dissipation fins (2401) are provided in plurality, and the plurality of heat dissipation fins (2401) are provided at equal intervals so that the plurality of heat dissipation fins (2401) and the heat dissipation plate (2402) define the plurality of heat dissipation through holes.

7. The inverter heat dissipation structure according to claim 5, wherein the second heat sink (240) further comprises a second heat conductive gasket (2403), the heat dissipation plate (2402) is provided with a groove, the second heat conductive gasket (2403) is disposed in the groove, and the second heat conductive gasket (2403) thermally connects the heat dissipation plate (2402) and the case (100).

8. The inverter heat dissipation structure according to claim 4, wherein the first heat sink (230) and the second heat sink (240) are thermally isolated from each other.

9. The inverter heat dissipation structure according to any one of claims 1 to 8, wherein the heat dissipation member and the support member (220) are each an aluminum member.

10. An energy storage power supply characterized by comprising the inverter heat dissipation structure of any one of claims 1 to 9.

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