CN219499614U

CN219499614U - Heat dissipation type PCB circuit board

Info

Publication number: CN219499614U
Application number: CN202223173827.1U
Authority: CN
Inventors: 潘爱芳
Original assignee: Shantou Yuedong Lianfeng Electronic Industry Co ltd
Current assignee: Shantou Yuedong Lianfeng Electronic Industry Co ltd
Priority date: 2022-11-29
Filing date: 2022-11-29
Publication date: 2023-08-08
Anticipated expiration: 2032-11-29

Abstract

The utility model belongs to the technical field of circuit boards, in particular to a heat dissipation type PCB circuit board, which comprises a substrate, wherein the bottom of the inner wall of the substrate is fixedly connected with a heat dissipation plate, the top of the heat dissipation plate is fixedly connected with a circuit connection plate through a heat conduction silica gel connection layer, the top of the circuit connection plate is provided with an insulating plate, and the top of the circuit connection plate is fixedly connected with an electronic element through an electric conductor; according to the utility model, the circuit connection plate, the heat conducting silica gel connection layer, the heat radiating holes, the heat radiating plate, the heat radiating blocks and the heat radiating stripes are arranged, so that when the PCB circuit board is used, heat can be transmitted to the heat radiating plate through the heat conducting silica gel connection layer, heat generated by the PCB can be radiated through the heat radiating plate and the heat radiating holes, the temperature rise in the equipment is avoided, the heat is radiated in time, the performance degradation of the electronic equipment caused by overheat of the device is avoided, and the normal use of people can be ensured.

Description

Heat dissipation type PCB circuit board

Technical Field

The utility model belongs to the technical field of circuit boards, and particularly relates to a heat dissipation type PCB circuit board.

Background

The PCB circuit board is also called a printed circuit board, is an important electronic component, is a support body of the electronic component, is a carrier for electric connection of the electronic component, is called a 'printed' circuit board because the PCB circuit board is manufactured by adopting an electronic printing technology, and the existing multi-PCB circuit board has no heat dissipation function, so that the internal temperature of equipment is increased due to heat which is often generated when the PCB circuit board works, if the heat is not timely emitted out, the equipment is continuously heated, and the reliability of the electronic equipment is reduced due to failure caused by overheating, so that the normal use of people is affected.

Disclosure of Invention

To solve the problems set forth in the background art. The utility model provides a heat dissipation type PCB circuit board which has the characteristic of good heat dissipation performance.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a heat dissipation type PCB circuit board, includes the base plate, base plate inner wall bottom fixedly connected with heating panel, heat conduction silica gel articulamentum fixedly connected with circuit connection board is passed through at the top of heating panel, circuit connection board's top is provided with the insulation board, electric conductor fixedly connected with electronic component is passed through at circuit connection board's top, electronic component's bottom and the top fixed connection of insulation board, the electric conductor is located the inside of insulation board, the bottom fixedly connected with of base plate a plurality of radiating blocks, the bottom fixedly connected with heat dissipation stripe of radiating block.

Preferably, a plurality of heat dissipation holes are formed in the heat dissipation plate, and the heat dissipation holes are uniformly distributed in the heat dissipation plate.

Preferably, a plurality of positioning holes are formed in the substrate, and the positioning holes are symmetrical with respect to the center of the substrate.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, the circuit connection plate, the heat conducting silica gel connection layer, the heat radiating holes, the heat radiating plate, the heat radiating blocks and the heat radiating stripes are arranged, so that when the PCB circuit board is used, heat can be transmitted to the heat radiating plate through the heat conducting silica gel connection layer, heat generated by the PCB can be radiated through the heat radiating plate and the heat radiating holes, the temperature rise in the equipment is avoided, the heat is radiated in time, the performance degradation of the electronic equipment caused by overheat of the device is avoided, and the normal use of people can be ensured.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:

FIG. 1 is a schematic cross-sectional view of the present utility model;

FIG. 2 is a schematic top view of the present utility model;

in the figure: 1. a substrate; 2. an electric conductor; 3. an electronic component; 4. an insulating plate; 5. a line connection board; 6. a thermally conductive silica gel connection layer; 7. a heat radiation hole; 8. a heat dissipation plate; 9. a heat dissipation block; 10. heat radiation stripes; 11. and positioning holes.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Examples

Referring to fig. 1-2, the present utility model provides the following technical solutions: the utility model relates to a heat dissipation type PCB circuit board, which comprises a substrate 1, the bottom fixedly connected with heating panel 8 of 1 inner wall bottom of base plate, the top of heating panel 8 is through heat conduction silica gel tie layer 6 fixedly connected with circuit connection board 5, the top of circuit connection board 5 is provided with insulation board 4, the top of circuit connection board 5 is through electric conductor 2 fixedly connected with electronic component 3, the bottom of electronic component 3 and the top fixedly connected with insulation board 4, electric conductor 2 is located the inside of insulation board 4, the bottom fixedly connected with a plurality of radiating blocks 9 of base plate 1, the bottom fixedly connected with heat dissipation stripe 10 of radiating block 9, the utility model through setting up circuit connection board 5, heat conduction silica gel tie layer 6, louvre 7, heating panel 8, radiating block 9 and heat dissipation stripe 10, when using the PCB circuit board, so as to pass through heat transfer to 8 through heat dissipation board through heat conduction silica gel tie layer 6, so as to dispel the heat that the PCB board produced can be passed through heating panel 8 and louvre 7, avoid the inside temperature to rise of equipment, in time distribute this heat, avoid the device overheated and consequently lead to electronic equipment's performance to decline, thereby can guarantee that normal use.

Specifically, a plurality of louvres 7 have been seted up to the inside of heating panel 8, louvre 7 evenly distributed is in the inside of heating panel 8, through setting up louvre 7 and heating panel 8 to the convenience is discharged the inside heat of PCB circuit board.

Specifically, a plurality of positioning holes 11 are formed in the substrate 1, the positioning holes 11 are symmetrical with respect to the center of the substrate 1, and the positioning holes 11 are formed, so that the position of the PCB is conveniently fixed.

The working principle and the using flow of the utility model are as follows: when the PCB circuit board is used, the position of the PCB circuit board is fixed through the positioning holes 11, and when the PCB circuit board generates heat, the heat can be transferred to the heat dissipation plate 8 through the heat conduction silica gel connecting layer 6, so that the heat generated by the PCB circuit board can be dissipated through the heat dissipation plate 8 and the heat dissipation holes 7, the heat dissipation of the PCB circuit board can be facilitated through the heat dissipation blocks 9 and the heat dissipation stripes 10, the temperature rise in equipment is avoided, the heat is dissipated in time, and the performance degradation of electronic equipment caused by overheat of devices is avoided, so that normal use of people can be ensured.

Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The utility model provides a heat dissipation type PCB circuit board, includes base plate (1), its characterized in that: the utility model discloses a circuit board, including base plate (1), heat dissipation plate, circuit board (5), electric conductor (2), insulator (3), insulator (4) and heat dissipation strip, base plate (1) inner wall bottom fixedly connected with heating panel (8), heat dissipation plate (8) top is through heat conduction silica gel tie layer (6) fixedly connected with circuit connection board (5), circuit connection board (5) top is through electric conductor (2) fixedly connected with electronic component (3), the bottom of electronic component (3) and insulator plate (4) top fixed connection, electric conductor (2) are located the inside of insulator plate (4), base plate (1) bottom fixedly connected with a plurality of heat dissipation pieces (9), the bottom fixedly connected with heat dissipation strip (10) of heat dissipation piece (9).

2. The heat dissipation type PCB of claim 1, wherein: a plurality of radiating holes (7) are formed in the radiating plate (8), and the radiating holes (7) are uniformly distributed in the radiating plate (8).

3. The heat dissipation type PCB of claim 1, wherein: a plurality of positioning holes (11) are formed in the substrate (1), and the positioning holes (11) are symmetrical with respect to the center of the substrate (1).