CN213718481U - A PCB board heat dissipation structure - Google Patents
A PCB board heat dissipation structure Download PDFInfo
- Publication number
- CN213718481U CN213718481U CN202022713115.9U CN202022713115U CN213718481U CN 213718481 U CN213718481 U CN 213718481U CN 202022713115 U CN202022713115 U CN 202022713115U CN 213718481 U CN213718481 U CN 213718481U
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- CN
- China
- Prior art keywords
- pcb board
- heat dissipation
- heat
- pcb
- dissipation structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 32
- 238000005192 partition Methods 0.000 claims abstract description 22
- 238000009434 installation Methods 0.000 claims description 14
- 238000009423 ventilation Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 5
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型提出一种PCB板散热结构，包括散热板、PCB板以及隔板，所述PCB板设置于隔板的一侧，所述散热板设置于隔板的另一侧，所述隔板上设置有窗口，所述窗口位置与PCB板高热部分对应，所述散热板上设置有向PCB板高热部分凸出的导热部分，所述高热部分的热量向导热部分传递，所述PCB板和散热板绝缘，在PCB板上方空间有限的情况下设置有整板的散热板来散热，降低了PCB板温升，提高了PCB板的寿命。
The utility model proposes a heat dissipation structure of a PCB board, which comprises a heat dissipation plate, a PCB board and a partition plate, the PCB board is arranged on one side of the partition plate, the heat dissipation plate is arranged on the other side of the partition plate, and the partition plate There is a window on it, and the position of the window corresponds to the high-heat part of the PCB board. The heat dissipation plate is insulated. In the case of limited space above the PCB board, a heat dissipation plate of the entire board is provided to dissipate heat, which reduces the temperature rise of the PCB board and improves the life of the PCB board.
Description
Technical Field
The utility model relates to a PCB board heat radiation structure.
Background
When the existing electric equipment is used, local high heat of a PCB (printed circuit board) often occurs, particularly an IPM (intelligent power module), a CPU (central processing unit) module and an IGBT (insulated gate bipolar transistor) module, and when the IPM module, the CPU module and the IGBT module are partially high heat, circuit problems are easily caused, and the service life of a circuit is influenced.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problem, the utility model provides a PCB board heat radiation structure aims at solving PCB board heat dissipation problem.
The utility model provides a PCB board heat radiation structure, including heating panel, PCB board and baffle, the PCB board sets up in one side of baffle, the heating panel sets up in the opposite side of baffle, be provided with the window on the baffle, the window position corresponds with PCB board high heat portion, be provided with the convex heat conduction part to PCB board high heat portion on the heating panel, the heat of high heat portion transmits to heat conduction part, PCB board and heating panel are insulating, are provided with the heating panel of whole board under the limited condition in PCB board top space and dispel the heat, have reduced the PCB board temperature rise, have improved the life-span of PCB board.
In one or more embodiments, a heat conducting silica gel pad is arranged between the heat conducting part and the high heat part, so that heat can be conducted between the PCB and the heat dissipation plate, insulation is achieved, and the problem of short circuit is avoided.
In one or more embodiments, the partition board is provided with a mounting cavity and a mounting space, the PCB is mounted on the mounting cavity, the heat dissipation plate is mounted on the mounting space, and the mounting cavity and the mounting space are formed by the partition board to insulate the PCB at intervals.
In one or more embodiments, the left side and the right side of one end of the installation cavity are provided with the installation enclosure frame for installing the end pins of the PCB so as to reduce the installation of screws, improve the installation efficiency, reduce the material inventory and reduce the production cost.
In one or more embodiments, the mounting enclosure forms a triangle.
In one or more embodiments, a support member is further disposed on the mounting cavity, and the PCB is mounted on the support member and forms a ventilation and heat dissipation space with the partition plate so as to facilitate heat dissipation of the PCB.
In one or more embodiments, the partition plate is provided with a connection screw hole so that the PCB, the partition plate, and the heat dissipation plate are connected together.
The utility model has the advantages that: the heat dissipation plate of the whole PCB is arranged to dissipate heat under the condition that the space above the PCB is limited, so that the temperature rise of the PCB is reduced, and the service life of the PCB is prolonged.
Drawings
Fig. 1 is a schematic diagram of a heat dissipation structure of a PCB.
Fig. 2 is a schematic diagram of a PCB heat dissipation structure.
Detailed Description
The application scheme is further described below with reference to the accompanying drawings:
referring to fig. 1-2, a PCB heat dissipation structure includes a heat dissipation plate 3, a PCB 1 and a partition plate 2, wherein the PCB 1 is disposed on one side of the partition plate 2, the heat dissipation plate 3 is disposed on the other side of the partition plate 2, a window 21 is disposed on the partition plate 2, the window 21 corresponds to a high heat portion 11 of the PCB 1, a heat conduction portion 31 protruding toward the high heat portion 11 of the PCB 1 is disposed on the heat dissipation plate 3, heat of the high heat portion 11 is transferred to the heat conduction portion 31, and the PCB 1 and the heat dissipation plate 3 are insulated from each other.
Further, a thermally conductive silicone pad 4 is disposed between the thermally conductive portion 31 and the high heat portion 11.
Further, the partition board 2 is provided with an installation cavity 22 and an installation space 23, the PCB board 1 is installed on the installation cavity 22, and the heat dissipation plate 3 is installed on the installation space 23.
Further, a mounting enclosure frame 24 is disposed on the left and right sides of one end of the mounting cavity 22 for mounting the terminal pin of the PCB board 1.
Further, the mounting enclosure 24 forms a triangle.
Further, a support member 25 is further disposed on the mounting cavity 22, and the PCB board 1 is mounted on the support member 25 and forms a ventilation and heat dissipation interval with the partition board 2.
Further, the partition board 2 is provided with a connection screw hole 26 so that the PCB board 1, the partition board 2 and the heat dissipation plate 3 are connected together by a screw.
The above preferred embodiments should be considered as examples of the embodiments of the present application, and technical deductions, substitutions, improvements and the like similar to, similar to or based on the embodiments of the present application should be considered as the protection scope of the present patent.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022713115.9U CN213718481U (en) | 2020-11-19 | 2020-11-19 | A PCB board heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022713115.9U CN213718481U (en) | 2020-11-19 | 2020-11-19 | A PCB board heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213718481U true CN213718481U (en) | 2021-07-16 |
Family
ID=76783592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022713115.9U Active CN213718481U (en) | 2020-11-19 | 2020-11-19 | A PCB board heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213718481U (en) |
-
2020
- 2020-11-19 CN CN202022713115.9U patent/CN213718481U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |