CN213718481U

CN213718481U - PCB heat radiation structure

Info

Publication number: CN213718481U
Application number: CN202022713115.9U
Authority: CN
Inventors: 申相桦
Original assignee: Zhongshan Tulin Electronic Technology Co ltd
Current assignee: Zhongshan Tulin Electronic Technology Co ltd
Priority date: 2020-11-19
Filing date: 2020-11-19
Publication date: 2021-07-16
Anticipated expiration: 2030-11-19

Abstract

The utility model provides a PCB board heat radiation structure, including heating panel, PCB board and baffle, the PCB board sets up in one side of baffle, the heating panel sets up in the opposite side of baffle, be provided with the window on the baffle, the window position corresponds with PCB board high heat portion, be provided with the convex heat conduction part to PCB board high heat portion on the heating panel, the heat of high heat portion transmits to heat conduction part, PCB board and heating panel are insulating, are provided with the heating panel of whole board under the limited condition in PCB board top space and dispel the heat, have reduced the PCB board temperature rise, have improved the life-span of PCB board.

Description

PCB heat radiation structure

Technical Field

The utility model relates to a PCB board heat radiation structure.

Background

When the existing electric equipment is used, local high heat of a PCB (printed circuit board) often occurs, particularly an IPM (intelligent power module), a CPU (central processing unit) module and an IGBT (insulated gate bipolar transistor) module, and when the IPM module, the CPU module and the IGBT module are partially high heat, circuit problems are easily caused, and the service life of a circuit is influenced.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problem, the utility model provides a PCB board heat radiation structure aims at solving PCB board heat dissipation problem.

In one or more embodiments, a heat conducting silica gel pad is arranged between the heat conducting part and the high heat part, so that heat can be conducted between the PCB and the heat dissipation plate, insulation is achieved, and the problem of short circuit is avoided.

In one or more embodiments, the partition board is provided with a mounting cavity and a mounting space, the PCB is mounted on the mounting cavity, the heat dissipation plate is mounted on the mounting space, and the mounting cavity and the mounting space are formed by the partition board to insulate the PCB at intervals.

In one or more embodiments, the left side and the right side of one end of the installation cavity are provided with the installation enclosure frame for installing the end pins of the PCB so as to reduce the installation of screws, improve the installation efficiency, reduce the material inventory and reduce the production cost.

In one or more embodiments, the mounting enclosure forms a triangle.

In one or more embodiments, a support member is further disposed on the mounting cavity, and the PCB is mounted on the support member and forms a ventilation and heat dissipation space with the partition plate so as to facilitate heat dissipation of the PCB.

In one or more embodiments, the partition plate is provided with a connection screw hole so that the PCB, the partition plate, and the heat dissipation plate are connected together.

The utility model has the advantages that: the heat dissipation plate of the whole PCB is arranged to dissipate heat under the condition that the space above the PCB is limited, so that the temperature rise of the PCB is reduced, and the service life of the PCB is prolonged.

Drawings

Fig. 1 is a schematic diagram of a heat dissipation structure of a PCB.

Fig. 2 is a schematic diagram of a PCB heat dissipation structure.

Detailed Description

The application scheme is further described below with reference to the accompanying drawings:

referring to fig. 1-2, a PCB heat dissipation structure includes a heat dissipation plate 3, a PCB 1 and a partition plate 2, wherein the PCB 1 is disposed on one side of the partition plate 2, the heat dissipation plate 3 is disposed on the other side of the partition plate 2, a window 21 is disposed on the partition plate 2, the window 21 corresponds to a high heat portion 11 of the PCB 1, a heat conduction portion 31 protruding toward the high heat portion 11 of the PCB 1 is disposed on the heat dissipation plate 3, heat of the high heat portion 11 is transferred to the heat conduction portion 31, and the PCB 1 and the heat dissipation plate 3 are insulated from each other.

Further, a thermally conductive silicone pad 4 is disposed between the thermally conductive portion 31 and the high heat portion 11.

Further, the partition board 2 is provided with an installation cavity 22 and an installation space 23, the PCB board 1 is installed on the installation cavity 22, and the heat dissipation plate 3 is installed on the installation space 23.

Further, a mounting enclosure frame 24 is disposed on the left and right sides of one end of the mounting cavity 22 for mounting the terminal pin of the PCB board 1.

Further, the mounting enclosure 24 forms a triangle.

Further, a support member 25 is further disposed on the mounting cavity 22, and the PCB board 1 is mounted on the support member 25 and forms a ventilation and heat dissipation interval with the partition board 2.

Further, the partition board 2 is provided with a connection screw hole 26 so that the PCB board 1, the partition board 2 and the heat dissipation plate 3 are connected together by a screw.

The above preferred embodiments should be considered as examples of the embodiments of the present application, and technical deductions, substitutions, improvements and the like similar to, similar to or based on the embodiments of the present application should be considered as the protection scope of the present patent.

Claims

1. The utility model provides a PCB board heat radiation structure, its characterized in that, includes heating panel, PCB board and baffle, the PCB board sets up in one side of baffle, the heating panel sets up in the opposite side of baffle, be provided with the window on the baffle, the window position corresponds with PCB board high heat portion, be provided with the convex heat conduction part to PCB board high heat portion on the heating panel, the heat of high heat portion transmits to the heat conduction part, PCB board and heating panel are insulating.

2. The PCB board heat dissipation structure of claim 1, wherein a heat conductive silicone pad is disposed between the heat conductive portion and the high heat portion.

3. The PCB heat dissipation structure of claim 1, wherein the partition is provided with a mounting cavity and a mounting space, the PCB is mounted on the mounting cavity, and the heat dissipation plate is mounted on the mounting space.

4. The PCB board heat dissipation structure of claim 3, wherein the left and right sides of one end of the installation cavity are provided with installation enclosure frames for installing terminal pins of the PCB board.

5. The PCB board heat dissipation structure of claim 4, wherein the mounting enclosure forms a triangle.

6. The PCB board heat dissipation structure of claim 3, wherein a support member is further disposed on the mounting cavity, and the PCB board is mounted on the support member and forms a ventilation and heat dissipation space with the partition plate.

7. The PCB heat dissipation structure of claim 1, wherein the partition plate is provided with connection screw holes to connect the PCB, the partition plate and the heat dissipation plate together.