CN112701880A - Capacitor module insulation heat dissipation mode of power supply - Google Patents
Capacitor module insulation heat dissipation mode of power supply Download PDFInfo
- Publication number
- CN112701880A CN112701880A CN202110052679.9A CN202110052679A CN112701880A CN 112701880 A CN112701880 A CN 112701880A CN 202110052679 A CN202110052679 A CN 202110052679A CN 112701880 A CN112701880 A CN 112701880A
- Authority
- CN
- China
- Prior art keywords
- capacitor module
- power supply
- radiator
- heat
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 71
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 16
- 238000009413 insulation Methods 0.000 title claims abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 5
- 229910010293 ceramic material Inorganic materials 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 239000000741 silica gel Substances 0.000 claims description 2
- 229910002027 silica gel Inorganic materials 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- 230000001681 protective Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 210000000614 Ribs Anatomy 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000009422 external insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 230000002035 prolonged Effects 0.000 description 1
- 230000003014 reinforcing Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Abstract
A power supply with an auxiliary radiator for insulating and radiating an internal capacitor module comprises the capacitor module, a heat-conducting insulating sheet and the auxiliary radiator of the power supply, wherein the capacitor module is arranged in a power supply shell; the auxiliary radiator is a power supply shell component, the outer part of the shell is provided with radiating fins, the inner side of the auxiliary radiator and the capacitor module are isolated and assembled through a heat-conducting insulating sheet, and the design of concentrated insulation and heat dissipation of the aluminum electrolytic capacitor module through the auxiliary radiator is adopted, so that the problem that the capacitor module is installed in the shell and reduces the temperature rise inside the power supply by radiating outside the shell is solved.
Description
The technical field is as follows:
the invention relates to the technical field of structural design of power supply equipment, in particular to an insulating and radiating installation of a medium-power and high-power switching power supply, an inverter or a frequency converter and the like on an aluminum electrolytic capacitor module.
Background art:
the power supply equipment such as a switch power supply, an inverter or a frequency converter adjusts the output voltage and frequency by means of the switch of an IGBT/MOSFET semiconductor device, the required power supply voltage can be provided according to the actual requirement of a load, and then the energy-saving purpose is achieved.
Usually, the heat sink of the power supply configuration provides heat dissipation for the IGBT/MOSFET power semiconductor device, and other passive components dissipate heat by means of "direct ventilation". However, in a high-protection-level power supply device in a special application environment, such as a group-string photovoltaic inverter with a protection level above IP65, a charging pile power supply module and the like, because the protection shell needs to be sealed in a dustproof and waterproof manner, so that air circulation is limited, other original devices cannot be cooled and radiated in a direct ventilation manner continuously.
With the continuous improvement of power density of power supply equipment, the heat dissipation requirement of a power capacitor on a main loop is increasingly strengthened, but because the IGBT device has large power loss and high working heat dissipation temperature, a heat radiator configured on a power supply cannot simultaneously dissipate heat for a power semiconductor and the capacitor.
Although the heat dissipation capability of the aluminum electrolytic capacitor is improved after the aluminum electrolytic capacitor is integrated and modularized, the heat dissipation and temperature reduction of the power bus aluminum electrolytic capacitor module outside the sealed shell become problems to be solved by engineers.
The invention content is as follows:
the invention provides a design for carrying out concentrated insulation heat dissipation on an aluminum electrolytic capacitor module by arranging an auxiliary radiator, which solves the problem that the temperature rise inside a power supply is reduced by heat dissipation outside a shell when the capacitor module is installed in the shell.
A power supply with an auxiliary radiator for insulating and radiating an internal capacitor module comprises the capacitor module, a heat-conducting insulating sheet and the auxiliary radiator of the power supply, wherein the capacitor module is arranged in a power supply shell; the auxiliary radiator is a power supply shell component, radiating fins are arranged on the outer side portion of the shell, and the inner side of the auxiliary radiator and the capacitor module are assembled in an isolated mode through a heat conduction insulating sheet.
The capacitor module consists of a discrete aluminum electrolytic capacitor series, a parallel circuit integrated module and a metal component, wherein the metal component and the aluminum shell on the surface of the aluminum electrolytic capacitor have negative voltage of the same grade.
Further, one structural surface of the metal member serves as a mounting base plate of the capacitor module.
The power supply auxiliary radiator is made of a metal material with good heat dissipation performance.
Furthermore, the surface area of the common metal power supply shell is increased by arranging reinforcing ribs on the outer surface, and the common metal power supply shell can be used as a secondary radiator.
Specifically, the power supply auxiliary radiator is used as a part of the power supply radiator, can be arranged in parallel with the power supply main radiator, and can also be arranged on any surface of the side surface and the front surface of the power supply shell.
Further, the capacitor module mounting base plate and the inner side of the auxiliary radiator are attached with a heat conduction insulating sheet for insulation assembly.
Specifically, in order to reduce the gap between the capacitor module mounting base plate and the auxiliary radiator and reduce the thermal resistance, the capacitor module can be assembled by adopting a screw fastening mode and an elastic sheet or power supply shell cover pressing mode.
The capacitor module further comprises a lead-out electric connecting terminal which is electrically connected with the power mainboard or the conductive copper bar.
Specifically, the electrical connection terminal can be electrically connected with the power motherboard or the conductive copper bar by soldering pins or fastening copper sheets and screws.
According to the power supply of the embodiment, the auxiliary radiator is arranged to carry out centralized insulation on the capacitor module to carry out external heat dissipation, so that the loss heat of the power bus capacitor is dissipated to the outside of the closed shell; the temperature rise heat accumulation in the power supply shell is effectively reduced; the power supply working failure rate is reduced; the service life of the capacitor module is greatly prolonged; and the power supply is ensured to have dustproof and moistureproof high-grade protection.
Description of the drawings:
FIG. 1 is a schematic diagram of the external structure of a capacitor module
FIG. 2 schematic diagram of the insulating installation of the auxiliary heat sink and the capacitor module in the power supply housing
The figures in the drawings represent the following:
1-capacitor module
11-capacitor module metal member
12-capacitor module mounting baseplate screw mounting hole
2-discrete type aluminum electrolytic capacitor series and parallel integrated circuit module
Electric connection copper sheet terminal of 21-capacitor module
22-capacitor module mounting screw hole
3-auxiliary radiator
31-auxiliary radiator power supply shell outer side radiating fin
Capacitor module mounting hole on 32-auxiliary radiator
4-main radiator
41-outside radiating fin of power supply shell of main radiator
5-Power supply casing
6-heat-conducting insulation sheet
The specific implementation mode is as follows:
the present invention will be described in further detail with reference to the following detailed description and accompanying drawings. In the following embodiments, numerous details are set forth in order to provide a better understanding of the present invention. However, those skilled in the art will readily recognize that certain features may be replaced or omitted by other elements, materials, methods, or the like in various instances. In some cases, related operations are not shown or described in the specification, so as to avoid obscuring the core of the present application from excessive description, and to enable those skilled in the art to fully understand the related operations from the description in the specification and the general knowledge in the art.
The following are preferred embodiments:
the capacitor module 1 shown in fig. 1 comprises a discrete aluminum electrolytic capacitor circuit integrated module 2 and a metal member 12.
And screw mounting holes 12 are distributed on the capacitor module mounting bottom plate 11 and are used for being fixedly assembled with the auxiliary radiator 3.
The capacitor module 1 housing is provided with mounting screw holes 22 for mounting and fixing the capacitor module 1.
The upper part of the discrete aluminum electrolytic capacitor series and parallel integrated module 2 of the capacitor module 1 is led out to be electrically connected with a copper sheet terminal 21, and the length, the position and the shape of the electrically connected copper sheet terminal 21 can be changed according to specific conditions to adapt to the installation requirement of the electrically connected terminal 21.
As shown in fig. 2, which is a schematic view of the installation manner of the capacitor module 1 disposed on the side of the power supply auxiliary heat sink 3 in the power supply housing, a main heat sink 4 is distributed on the back (rear) surface of the power supply protection housing 5, and is provided with heat dissipation fins 41 on the outer side thereof, and the inner side plane thereof is used for installing IGBT/MOSFET power semiconductors, an auxiliary heat sink 3 is provided on the power supply main heat sink side housing 5, and is provided with heat dissipation fins 31 on the outer side thereof, and the inner side plane thereof is used for installing the capacitor.
The main radiator 4 and the auxiliary radiator 3 are installed in isolation from each other to prevent the high temperature generated by the IGBT/MOSFET on the main radiator 4 from radiating through the auxiliary radiator 3.
The auxiliary radiator 3 is used as a part of the power supply integral closed shell 5 and plays a role in protecting the interior of the power supply, the outer radiating fins 32 of the auxiliary radiator are arranged outside the power supply shell 5 in a low-temperature environment, and the inner plane of the auxiliary radiator is arranged inside the power supply shell 5 in a high-temperature environment.
The auxiliary radiator 3 is integrally positioned at the upper side corner of the main radiator 4, which is beneficial to the influence of high temperature of the power supply back radiating fins 32 far away from the main radiator radiating fins 41.
The auxiliary radiator 3 is positioned on the inner side plane of the power supply shell and is provided with a capacitor module 1 mounting and fixing screw hole 32 which is used for mounting and fixing a screw with a capacitor module 1 shell mounting and fixing hole 22 through a heat-conducting insulating sheet through hole and a through hole on the capacitor module mounting bottom plate 11.
The heat-conducting insulating sheet 6 can be made of hard ceramic material or soft silica gel material.
In the above embodiment, the capacitor module 1 can be installed inside the power-supply sealed casing 5 in a high-temperature environment, and the power loss heat of the capacitor module 1 is dissipated through the metal member 11 of the capacitor module 1, the heat-conducting insulating sheet 6 and the heat dissipating fins 32 of the auxiliary heat sink 3, which are arranged outside the power-supply casing 5; the temperature rise of the power supply closed shell 5 is effectively reduced, and the high protection level of the capacitor module 1 for external insulation and the power supply closed shell 5 is ensured.
The invention has been described above using specific examples, which are only intended to aid understanding of the invention and are not intended to be limiting. For a person skilled in the art to which the invention pertains, several simple deductions, modifications or substitutions may be made according to the idea of the invention.
Claims (8)
1. A power supply is provided with an auxiliary radiator for carrying out centralized insulation heat dissipation design on a capacitor module, and the power supply comprises the capacitor module, the auxiliary radiator and a heat conduction insulating sheet; the capacitor module consists of a discrete aluminum electrolytic capacitor module and a metal component; the heat-conducting insulation sheet is arranged between the metal component of the capacitor module and the inner surface of the power supply auxiliary radiator; and the outer part of the auxiliary radiator shell is provided with radiating fins, and the inner side of the auxiliary radiator shell is insulated and isolated from the capacitor module through a heat-conducting insulating sheet.
2. The metal member as set forth in claim 1, characterized in that: the internal part of the metal component is in close contact with the aluminum shell of the aluminum electrolytic capacitor so that the aluminum electrolytic capacitor has negative voltage, and the external part of the metal component is used as a capacitor module mounting baseplate.
3. The sub-radiator as claimed in claim 1, characterized in that: the power supply auxiliary radiator is a component part forming the power supply protective shell and is made of metal materials with good heat dissipation performance.
4. The sub-radiator as claimed in claim 1, characterized in that: the heat radiator can be dedicated to the capacitor module, or can be shared by the capacitor module and other devices, or a plurality of capacitor modules share one auxiliary heat radiator.
5. The sub-radiator as claimed in claim 1, characterized in that: the heat radiator and the main heat radiator of the power supply can be arranged on the same shell plane, and can also be arranged on different shell planes such as other side surfaces, the front surface and the like.
6. The capacitor module of claim 1, characterized in that: the capacitor module also comprises an electric connecting terminal led out, and the electric connecting terminal is electrically connected with the power mainboard or the conductive copper bar in a welding pin welding mode or a copper sheet screw fastening mode and the like.
7. An electrical connection terminal for capacitor modules according to claims 1 and 4, characterized in that: the length, position and shape of the electric connecting terminal can be changed according to the specific situation to adapt to the installation requirement of the electric connecting terminal.
8. The thermally conductive insulating sheet of claim 1 characterized by: can be made of hard heat-conducting ceramic materials or soft silica gel heat-conducting materials.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110052679.9A CN112701880A (en) | 2021-01-15 | 2021-01-15 | Capacitor module insulation heat dissipation mode of power supply |
| PCT/CN2021/138356 WO2022151899A1 (en) | 2021-01-15 | 2021-12-15 | Aluminum electrolytic capacitor integrated module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110052679.9A CN112701880A (en) | 2021-01-15 | 2021-01-15 | Capacitor module insulation heat dissipation mode of power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112701880A true CN112701880A (en) | 2021-04-23 |
Family
ID=75515262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110052679.9A Pending CN112701880A (en) | 2021-01-15 | 2021-01-15 | Capacitor module insulation heat dissipation mode of power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112701880A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022151899A1 (en) * | 2021-01-15 | 2022-07-21 | 周旺龙 | Aluminum electrolytic capacitor integrated module |
-
2021
- 2021-01-15 CN CN202110052679.9A patent/CN112701880A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022151899A1 (en) * | 2021-01-15 | 2022-07-21 | 周旺龙 | Aluminum electrolytic capacitor integrated module |
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