CN219999861U - Heat radiating device and electronic element - Google Patents
Heat radiating device and electronic element Download PDFInfo
- Publication number
- CN219999861U CN219999861U CN202321096251.5U CN202321096251U CN219999861U CN 219999861 U CN219999861 U CN 219999861U CN 202321096251 U CN202321096251 U CN 202321096251U CN 219999861 U CN219999861 U CN 219999861U
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- China
- Prior art keywords
- mounting
- cooling
- mounting panel
- electronic component
- bottom plate
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Links
- 238000001816 cooling Methods 0.000 claims abstract description 40
- 230000017525 heat dissipation Effects 0.000 claims abstract description 29
- 238000009434 installation Methods 0.000 claims abstract description 12
- 239000004519 grease Substances 0.000 claims description 8
- 229920001296 polysiloxane Polymers 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 239000002131 composite material Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the technical field of electronic elements, and discloses a heat dissipation device and an electronic element. Comprises a bottom plate; the bottom plate bottom is equipped with installation mechanism, installation mechanism includes mounting panel, mounting groove and locating hole, the mounting panel sets up in the bottom plate bottom, be equipped with cooling body on the mounting panel, the mounting groove sets up in the middle of the mounting panel top, the mounting groove runs through the mounting panel setting, the locating hole sets up at the mounting panel edge. Can promote the radiating efficiency to electronic component with bottom plate and mounting panel and electronic component and radiator fan interconnect respectively through bilayer structure that sets up, can form the wind channel between the bilayer structure to promoted radiating efficiency, can be convenient for through the installation and use of the installation mechanism of setting up electronic component and cooling body, through setting for different clearances in order to adapt to different mounted positions.
Description
Technical Field
The utility model relates to the technical field of electronic elements, in particular to a heat dissipation device and an electronic element.
Background
Electronic component heat dissipation is a common problem of electronic equipment, for example, many heating devices, such as MOS transistors, are arranged on a PCB of a universal frequency converter. The electronic component can produce a large amount of heat in the use, and the current heat dissipation scheme is to use the heat conduction ceramic fin to dispel the heat, namely scribble heat conduction silicone grease on the both sides of heat conduction ceramic fin, paste heat-conducting ceramic fin on the components and parts that generate heat, the heat dissipation shell is laminated to the another side of heat conduction ceramic fin, carries out the heat dissipation above the heat transfer shell. But there are some drawbacks to using thermally conductive ceramic sheets: when the heat-conducting ceramic piece is used for heat dissipation of the MOS tube, the screws are required to be fastened and locked, and due to assembly tolerance, uneven strength of screw fastening can be generated, so that the risk of crushing the heat-conducting ceramic piece is caused, and adverse effects on heat-conducting performance can be generated after the heat-conducting ceramic piece is crushed.
In order to solve the above problems, the utility model patent with publication number CN 215220702U discloses an electronic component heat dissipating device and an electronic device, in which the electronic component is attached to a first surface of a heat conducting composite pad and a second surface of the heat conducting composite pad is attached to a radiator through the electronic component, the heat conducting composite pad and the radiator; the heat conduction composite gasket comprises a first heat conduction silica gel layer, a second heat conduction silica gel layer and a glass fiber layer, wherein the first surface of the glass fiber layer is attached to the first heat conduction silica gel layer, and the second surface of the glass fiber layer is attached to the second heat conduction silica gel layer. The heat-conducting composite gasket can be tightly attached to the electronic element and the radiator, has good heat dissipation performance and excellent ageing resistance, ensures good heat dissipation and prolongs the service life of the electronic element.
However, some disadvantages still exist in the above solution, where the heat dissipation structure in the above solution is a single-layer structure, and the surface area is small, so that the heat dissipation effect is affected.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the utility model provides a heat dissipation device and an electronic element.
(II) technical scheme
In order to achieve the above purpose, the present utility model provides the following technical solutions: a heat dissipating double-fuselage and electronic component, including the bottom plate;
the bottom plate bottom is equipped with installation mechanism, installation mechanism includes mounting panel, mounting groove and locating hole, the mounting panel sets up in the bottom plate bottom, be equipped with cooling body on the mounting panel, the mounting groove sets up in the middle of the mounting panel top, the mounting groove runs through the mounting panel setting, the locating hole sets up at the mounting panel edge.
Preferably, the mounting mechanism further comprises mounting columns, the mounting columns are arranged at four corners of the bottom end of the bottom plate, the positions of the mounting columns correspond to the positions of the positioning holes, and the mounting column structures correspond to the positioning hole structures.
Preferably, the mounting mechanism further comprises a positioning block, the positioning block is arranged on the outer side of the mounting column in a surrounding mode, and the positioning block is movably connected with the mounting column. The positioning block can be used for fixing the mounting plate and the mounting column to facilitate subsequent use, and the gap between the mounting plate and the bottom plate can be adjusted according to the use requirement by adjusting the position of the positioning block.
Preferably, the cooling mechanism comprises a cooling plugboard, the cooling plugboard is arranged at the bottom end of the bottom plate, and the cooling plugboard and the mounting groove are in corresponding positions. The surface area of the cooling structure can be increased through the arranged cooling plugboard, so that the heat dissipation efficiency is improved.
Preferably, the cooling plugboard is provided with heat dissipation holes, the heat dissipation holes are uniformly distributed on the cooling plugboard, and the heat dissipation holes penetrate through the cooling plugboard.
The electronic component comprises the heat radiating device, wherein the bottom end of the electronic component body is provided with the mounting seat, the top end of the bottom plate is provided with the fixing groove corresponding to the structure of the mounting seat, and the inside of the mounting seat and the inside of the fixing groove are both provided with heat radiating silicone grease. Through the heat dissipation silicone grease that sets up can promote radiating efficiency when installing fixedly to the electronic component body, bottom plate, mounting panel and cooling picture peg are high heat conduction material, can outwards transmit the heat that the electronic component body operation in-process produced.
(III) beneficial effects
Compared with the prior art, the utility model provides the heat dissipation device and the electronic element, which have the following beneficial effects:
1. this heat abstractor and electronic component, through bilayer structure with bottom plate and mounting panel and electronic component and heat dissipation fan interconnect who sets up respectively can promote the radiating efficiency to electronic component, can form the wind channel between the bilayer structure to radiating efficiency has been promoted.
2. The heat radiating device and the electronic component can be conveniently installed and used on the electronic component and the cooling mechanism through the installation mechanism, and different gaps are set to adapt to different installation positions.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is an exploded view of the present utility model;
FIG. 2 is a schematic front view of the present utility model;
FIG. 3 is a schematic front view of an assembly of the present utility model;
in the figure: 1. a bottom plate; 101. a fixing groove; 2. a mounting mechanism; 201. a mounting plate; 202. a mounting groove; 203. positioning holes; 204. a mounting column; 205. a positioning block; 3. a cooling mechanism; 301. cooling the plugboard; 302. a heat radiation hole; 4. an electronic component body; 401. a mounting base; 402. heat dissipation silicone grease.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Example 1
As shown in fig. 1-3, the present utility model provides a heat dissipating device and an electronic component, including a base plate 1; the bottom end of the bottom plate 1 is provided with a mounting mechanism 2, the mounting mechanism 2 comprises a mounting plate 201, a mounting groove 202 and a positioning hole 203, the mounting plate 201 is arranged at the bottom end of the bottom plate 1, the mounting plate 201 is provided with a cooling mechanism 3, the mounting groove 202 is arranged in the middle of the top end of the mounting plate 201, the mounting groove 202 penetrates through the mounting plate 201, and the positioning hole 203 is arranged at the edge of the mounting plate 201; the mounting mechanism 2 further comprises mounting columns 204, the mounting columns 204 are arranged at four corners of the bottom end of the bottom plate 1, the positions of the mounting columns 204 correspond to the positions of the positioning holes 203, and the structures of the mounting columns 204 correspond to the structures of the positioning holes 203; the mounting mechanism 2 further comprises a positioning block 205, the positioning block 205 is arranged on the outer side of the mounting column 204 in a surrounding mode, and the positioning block 205 is movably connected with the mounting column 204;
in the present embodiment, the electronic component body 4 and the cooling mechanism 3 can be easily mounted and fixed to the base plate 1 by the mounting mechanism 2 provided, thereby improving the mounting efficiency of the entire electronic component body 4.
Example 2
As shown in fig. 1-3, on the basis of embodiment 1, the present utility model provides a technical solution: the cooling mechanism 3 comprises a cooling plugboard 301, the cooling plugboard 301 is arranged at the bottom end of the bottom plate 1, and the positions of the cooling plugboard 301 and the mounting groove 202 correspond to each other; the cooling plugboard 301 is provided with radiating holes 302, the radiating holes 302 are uniformly distributed on the cooling plugboard 301, and the radiating holes 302 penetrate through the cooling plugboard 301;
an electronic component comprises the heat dissipation device, wherein the bottom end of an electronic component body 4 is provided with a mounting seat 401, the top end of a bottom plate 1 is provided with a fixing groove 101 corresponding to the structure of the mounting seat 401, and heat dissipation silicone grease 402 is arranged in the mounting seat 401 and the fixing groove 101;
in this embodiment, the cooling mechanism 3 can cool the electronic component body 4, and the double-layer cooling structure can improve the cooling efficiency of the electronic component body 4.
The following specifically describes the working principles of the heat dissipating device and the electronic component.
As shown in fig. 1 to 3, during installation, the mounting board 201 is installed to the bottom end of the base plate 1, the mounting posts 204 are installed inside the positioning holes 203, meanwhile, two positioning blocks 205 on the mounting posts 204 are respectively arranged at two sides of the mounting board 201, the mounting board 201 is fixed through silicone grease, then the installation and fixing operation of the mounting board 201 is completed, then the electronic component body 4 is installed to the top end of the base, and the electronic component body 4 and the base plate 1 are fixed through the heat dissipation silicone grease 402, during use, the mounting board 201 is fixed through the positioning blocks 205, so that a certain gap exists between the mounting board 201 and the base plate 1, the gap height can be adjusted before the positioning blocks 205 are fixed, meanwhile, the cooling plugboard 301 at the bottom end of the base plate 1 passes through the mounting groove 202, the base plate 1 with high heat conductivity, the mounting board 201 and the cooling plugboard 301 can improve the cooling and heat dissipation efficiency through the lifting surface area, in addition, the structure of the plurality of heat dissipation holes 302 on the cooling plugboard 301 can further improve the heat dissipation efficiency, and the gap between the mounting board 201 and the base plate 1 can form an air duct to facilitate the heat dissipation air circulation.
Claims (6)
1. A heat sink comprising a base plate (1), characterized in that: the bottom plate (1) bottom is equipped with installation mechanism (2), installation mechanism (2) are including mounting panel (201), mounting groove (202) and locating hole (203), mounting panel (201) set up in bottom plate (1) bottom, be equipped with cooling body (3) on mounting panel (201), mounting groove (202) set up in the middle of mounting panel (201) top, mounting groove (202) run through mounting panel (201) setting, locating hole (203) set up at mounting panel (201) edge.
2. A heat sink according to claim 1, wherein: the mounting mechanism (2) further comprises mounting columns (204), the mounting columns (204) are arranged at four corners of the bottom end of the bottom plate (1), the positions of the mounting columns (204) and the positions of the positioning holes (203) correspond to each other, and the structures of the mounting columns (204) and the positioning holes (203) correspond to each other.
3. A heat sink according to claim 1, wherein: the mounting mechanism (2) further comprises a positioning block (205), the positioning block (205) is arranged on the outer side of the mounting column (204) in a surrounding mode, and the positioning block (205) is movably connected with the mounting column (204).
4. A heat sink according to claim 1, wherein: the cooling mechanism (3) comprises a cooling inserting plate (301), the cooling inserting plate (301) is arranged at the bottom end of the bottom plate (1), and the positions of the cooling inserting plate (301) and the mounting groove (202) correspond to each other.
5. A heat sink as defined in claim 4, wherein: the cooling plugboard (301) is provided with radiating holes (302), the radiating holes (302) are uniformly distributed on the cooling plugboard (301), and the radiating holes (302) penetrate through the cooling plugboard (301).
6. An electronic component, characterized in that the electronic component comprises the heat dissipation device as claimed in any one of claims 1 to 5, wherein the bottom end of the electronic component body (4) is provided with a mounting seat (401), the top end of the bottom plate (1) is provided with a fixing groove (101) corresponding to the structure of the mounting seat (401), and heat dissipation silicone grease (402) is arranged in the mounting seat (401) and the fixing groove (101).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321096251.5U CN219999861U (en) | 2023-05-08 | 2023-05-08 | Heat radiating device and electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321096251.5U CN219999861U (en) | 2023-05-08 | 2023-05-08 | Heat radiating device and electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219999861U true CN219999861U (en) | 2023-11-10 |
Family
ID=88611882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321096251.5U Active CN219999861U (en) | 2023-05-08 | 2023-05-08 | Heat radiating device and electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219999861U (en) |
-
2023
- 2023-05-08 CN CN202321096251.5U patent/CN219999861U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |