CN219555492U

CN219555492U - Multilayer heat conduction circuit board

Info

Publication number: CN219555492U
Application number: CN202320249146.4U
Authority: CN
Inventors: 秦折华
Original assignee: Suzhou Huiliyuan Technology Co ltd
Current assignee: Suzhou Huiliyuan Technology Co ltd
Priority date: 2023-02-20
Filing date: 2023-02-20
Publication date: 2023-08-18
Anticipated expiration: 2033-02-20

Abstract

The utility model discloses a multilayer heat conduction circuit board, relates to the technical field of multilayer circuit boards, and aims to solve the problems that most of the existing multilayer circuit boards are single silicone grease for heat dissipation, low in heat dissipation efficiency and easy to overheat and damage after long-time use. The lower end of the multilayer circuit board main body is provided with a lower bottom plate, and heat dissipation silicone grease is arranged between the lower bottom plate and the multilayer circuit board main body; further comprises: a heat dissipation top plate which is arranged on one side of the multi-layer circuit board main body, wherein heat dissipation fans are arranged in the heat dissipation top plate, and two heat dissipation fans are arranged; the connecting side is arranged between the heat dissipation top plate and the multi-layer circuit board main body, one side surfaces at two ends of the connecting side are provided with first rotating grooves, the other side surfaces at two ends of the connecting side are provided with second rotating grooves, and the first rotating grooves, the second rotating grooves and the connecting side are of an integrated structure.

Description

Multilayer heat conduction circuit board

Technical Field

The utility model relates to the technical field of multilayer circuit boards, in particular to a multilayer heat conduction circuit board.

Background

The method for manufacturing the multilayer board is generally that an inner layer pattern is firstly made, then a single-sided or double-sided substrate is manufactured by a printing etching method, and is incorporated into a designated interlayer, and then the substrate is heated, pressurized and bonded, and the subsequent drilling is the same as a plating through hole method of the double-sided board, and is commonly used for a circuit board, so that the circuit board is miniaturized and visualized, plays an important role in mass production of a fixed circuit and optimizing the layout of an electrical appliance, and the circuit board can be called a printed circuit board or a printed circuit board and has the characteristics of high wiring density, light weight, thin thickness and good flexibility.

However, most of the existing multilayer circuit boards are single silicone grease for heat dissipation, so that the heat dissipation efficiency is low, and the multilayer circuit boards are easy to overheat and damage after long-time use; therefore, the existing requirements are not met, and a multi-layer heat conducting circuit board is provided.

Disclosure of Invention

The utility model aims to provide a multilayer heat conduction circuit board, which solves the problems that most of the existing multilayer circuit boards in the background art are single silicone grease for heat dissipation, have low heat dissipation efficiency and are easy to overheat and damage after long-time use.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a multilayer thermally conductive circuit board comprising: the multi-layer circuit board comprises a multi-layer circuit board main body, wherein a lower bottom plate is arranged at the lower end of the multi-layer circuit board main body, and heat dissipation silicone grease is arranged between the lower bottom plate and the multi-layer circuit board main body;

further comprises:

a heat dissipation top plate which is arranged on one side of the multi-layer circuit board main body, wherein heat dissipation fans are arranged in the heat dissipation top plate, and two heat dissipation fans are arranged;

the connecting side is arranged between the heat dissipation top plate and the multi-layer circuit board main body, one side surfaces at two ends of the connecting side are provided with first rotating grooves, the other side surfaces at two ends of the connecting side are provided with second rotating grooves, and the first rotating grooves, the second rotating grooves and the connecting side are of an integrated structure.

Preferably, a first rotating plate is fixedly arranged on one side surface of the multi-layer circuit board main body, a first rotating shaft is fixedly arranged in the first rotating groove, the first rotating shaft penetrates through the first rotating plate, and the first rotating plate is rotationally connected with the first rotating groove through the first rotating shaft.

Preferably, a second rotating plate is fixedly arranged on one side surface of the heat dissipation top plate, a second rotating shaft is fixedly arranged in the second rotating groove, the second rotating shaft penetrates through the second rotating plate, and the second rotating plate is rotationally connected with the second rotating groove through the second rotating shaft.

Preferably, a fan mounting groove is arranged between the cooling fan and the cooling top plate, and the fan mounting groove penetrates through the cooling top plate.

Preferably, the inner wall of the fan mounting groove is fixedly provided with a mounting inner plate, a threaded fastener is arranged at the edge of the cooling fan, and the cooling fan is in threaded fixation with the mounting inner plate through the threaded fastener.

Preferably, the fixed sideboard is fixedly arranged on the surface of the other side of the heat dissipation top plate, a single-head fastener is arranged on one side of the fixed sideboard, and the single-head fastener penetrates through the fixed sideboard to be in threaded connection with the main body of the multilayer circuit board.

Preferably, the lower surface of the lower bottom plate is fixedly provided with radiating fins, and the radiating fins are provided with a plurality of radiating fins.

Preferably, a supporting bottom plate is arranged below the radiating fins, a connecting frame is fixedly arranged between two ends of the supporting bottom plate and the lower bottom plate, and a flow cavity is arranged between the supporting bottom plate and the radiating fins.

Preferably, the corners of the main body of the multilayer circuit board are provided with fixing screws, and one ends of the fixing screws penetrate through the main body of the multilayer circuit board, the lower bottom plate, the connecting frame and the supporting bottom plate.

Preferably, the surface of the multi-layer circuit board main body is provided with heat dissipation holes, and the heat dissipation holes are provided with a plurality of heat dissipation holes.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the heat radiation top plate with the heat radiation fan is arranged on one side of the multilayer circuit board main body, the first rotating plate rotates with the first rotating groove through the first rotating shaft, so that the connecting edge rotates to the vertical position, then the second rotating plate rotates with the second rotating groove through the second rotating shaft, so that the heat radiation top plate rotates to the position right above the multilayer circuit board main body, then the single-head fastener penetrates through the fixed side plate to be in threaded connection with the multilayer circuit board main body, the heat radiation top plate is fixed, meanwhile, the protection effect is achieved on the multilayer circuit board main body, the safety is improved, the heat radiation efficiency is improved compared with the single heat radiation silicone grease by directly radiating the surface of the multilayer circuit board main body from top to bottom through the heat radiation fan.

2. Through set up the fin at the lower surface of underfloor, have the flow cavity between fin and the supporting baseplate, rely on the fin to carry out multilayer heat conduction heat dissipation to radiator fan's wind can blow the underfloor below through the louvre, dispel the heat to the fin, improved the radiating efficiency of multilayer circuit board main part.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

fig. 2 is a schematic diagram of a front view of a connection between a main body of a multi-layered circuit board and a heat dissipating top plate according to the present utility model;

FIG. 3 is an enlarged view of a portion of the utility model at A;

FIG. 4 is an enlarged view of a portion of the utility model at B;

in the figure: 1. a multilayer wiring board main body; 2. a set screw; 3. a heat dissipation top plate; 4. fixing the side plates; 5. a single-headed fastener; 6. a fan mounting groove; 7. a heat radiation fan; 8. connecting edges; 9. a lower base plate; 10. heat dissipation silicone grease; 11. a support base plate; 12. a connecting frame; 13. a heat sink; 14. a flow cavity; 15. a first rotating plate; 16. a first rotation shaft; 17. a first rotating groove; 18. a second rotating plate; 19. a second rotating groove; 20. a second rotation shaft; 21. a threaded fastener; 22. installing an inner plate; 23. and the heat dissipation holes.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1-4, an embodiment of the present utility model is provided: a multilayer thermally conductive circuit board comprising: the multi-layer circuit board comprises a multi-layer circuit board body 1, wherein a lower bottom plate 9 is arranged at the lower end of the multi-layer circuit board body 1, and heat dissipation silicone grease 10 is arranged between the lower bottom plate 9 and the multi-layer circuit board body 1;

further comprises:

a heat radiation top plate 3 provided on one side of the multilayer circuit board body 1, the heat radiation top plate 3 being provided with heat radiation fans 7 inside, and the heat radiation fans 7 being provided in two;

and a connecting edge 8 arranged between the heat radiation top plate 3 and the multi-layer circuit board main body 1, wherein a first rotating groove 17 is arranged on one side surface of two ends of the connecting edge 8, a second rotating groove 19 is arranged on the other side surface of two ends of the connecting edge 8, and the first rotating groove 17, the second rotating groove 19 and the connecting edge 8 are of an integrated structure.

The surface heat dissipation is directly carried out on the multi-layer circuit board main body 1 by means of the heat dissipation fan 7, and the multi-layer heat conduction and dissipation are carried out through the heat dissipation silicone grease 10 and the heat dissipation fins 13, so that the overall heat dissipation performance is improved.

Referring to fig. 1 and 3, a first rotating plate 15 is fixedly disposed on a surface of one side of the multi-layer circuit board main body 1, a first rotating shaft 16 is fixedly disposed in the first rotating groove 17, the first rotating shaft 16 penetrates through the first rotating plate 15, and the first rotating plate 15 is rotatably connected with the first rotating groove 17 through the first rotating shaft 16, so that the connecting edge 8 rotates to a vertical position.

Referring to fig. 1 and 3, a second rotating plate 18 is fixedly disposed on one side surface of the heat dissipation top plate 3, a second rotating shaft 20 is fixedly disposed in the second rotating groove 19, the second rotating shaft 20 penetrates through the second rotating plate 18, the second rotating plate 18 is rotationally connected with the second rotating groove 19 through the second rotating shaft 20, the heat dissipation top plate 3 rotates to be right above the multilayer circuit board main body 1, heat dissipation is performed on the multilayer circuit board main body 1 from top to bottom, heat dissipation performance is improved, and meanwhile, protection effect and safety are achieved on the multilayer circuit board main body 1.

Referring to fig. 1, a fan mounting groove 6 is disposed between the cooling fan 7 and the cooling top plate 3, and the fan mounting groove 6 penetrates through the cooling top plate 3, and the cooling fan 7 is mounted inside the fan mounting groove 6.

Referring to fig. 4, an inner wall of the fan mounting groove 6 is fixedly provided with a mounting inner plate 22, a threaded fastener 21 is arranged at an edge of the cooling fan 7, and the cooling fan 7 is in threaded fixation with the mounting inner plate 22 through the threaded fastener 21, so that the cooling fan 7 is fixed.

Referring to fig. 1 and 2, a fixed side plate 4 is fixedly arranged on the surface of the other side of the heat dissipation top plate 3, a single-head fastener 5 is arranged on one side of the fixed side plate 4, and the single-head fastener 5 penetrates through the fixed side plate 4 to be in threaded connection with the multi-layer circuit board main body 1, so that a fixing effect is achieved on the heat dissipation top plate 3 and the multi-layer circuit board main body 1.

Referring to fig. 2, the lower surface of the lower base plate 9 is fixedly provided with a plurality of heat dissipation fins 13, so as to achieve multi-layer heat dissipation and improve heat dissipation efficiency.

Referring to fig. 2, a supporting base plate 11 is disposed below the heat sink 13, a connecting frame 12 is fixedly disposed between two ends of the supporting base plate 11 and the lower base plate 9, a flow cavity 14 is disposed between the supporting base plate 11 and the heat sink 13, supporting effect is achieved on the multi-layer circuit board main body 1, and air circulation is facilitated through the flow cavity 14 for heat dissipation.

Referring to fig. 1 and 2, fixing screws 2 are disposed at corners of the main body 1 of the multi-layer circuit board, and one ends of the fixing screws 2 penetrate through the main body 1 of the multi-layer circuit board, the lower base plate 9, the connecting frame 12 and the supporting base plate 11, so that the main body 1 of the multi-layer circuit board is conveniently externally connected and fixed.

Referring to fig. 1, a heat dissipation hole 23 is provided on the surface of the multi-layer circuit board body 1, and a plurality of heat dissipation holes 23 are provided for ventilation, so that the wind of the heat dissipation fan 7 can blow to the lower part of the lower base plate 9, thereby improving the heat dissipation efficiency.

Working principle: when the cooling fan 7 is used, the cooling fan 7 is placed in the fan mounting groove 6 of the cooling top plate 3, the cooling fan 7 is in threaded fixation with the mounting inner plate 22 on the inner wall of the fan mounting groove 6 by means of the threaded fastener 21, after the multi-layer circuit board main body 1 is fixed at a position needing to be fixed by the fixing screw 2, the first rotating plate 15 rotates with the first rotating groove 17 through the first rotating shaft 16, the connecting edge 8 rotates to a vertical position, then the second rotating plate 18 rotates with the second rotating groove 19 through the second rotating shaft 20, the cooling top plate 3 rotates to the position right above the multi-layer circuit board main body 1, then the single-head fastener 5 penetrates through the fixing edge plate 4 to be in threaded connection with the multi-layer circuit board main body 1, the cooling top plate 3 is fixed, meanwhile, the protection effect is achieved on the multi-layer circuit board main body 1, the safety is improved, the multi-layer heat conduction cooling is directly carried out on the multi-layer circuit board main body 1 by means of the cooling fan 7, and the whole cooling performance is improved by means of multi-layer heat conduction heat dissipation through the heat dissipation silicone grease 10 and the cooling fin 13.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The multilayer heat conduction circuit board comprises a multilayer circuit board main body (1), wherein a lower bottom plate (9) is arranged at the lower end of the multilayer circuit board main body (1), and heat dissipation silicone grease (10) is arranged between the lower bottom plate (9) and the multilayer circuit board main body (1);

the method is characterized in that: further comprises:

a heat radiation top plate (3) which is arranged on one side of the multi-layer circuit board main body (1), wherein a heat radiation fan (7) is arranged in the heat radiation top plate (3), and two heat radiation fans (7) are arranged;

the connecting side (8) is arranged between the radiating top plate (3) and the multi-layer circuit board main body (1), one side surfaces of two ends of the connecting side (8) are provided with first rotating grooves (17), the other side surfaces of two ends of the connecting side (8) are provided with second rotating grooves (19), and the first rotating grooves (17) and the second rotating grooves (19) are of an integrated structure with the connecting side (8).

2. The multilayer thermally conductive circuit board of claim 1, wherein: a first rotating plate (15) is fixedly arranged on one side surface of the multilayer circuit board main body (1), a first rotating shaft (16) is fixedly arranged in the first rotating groove (17), the first rotating shaft (16) penetrates through the first rotating plate (15), and the first rotating plate (15) is rotationally connected with the first rotating groove (17) through the first rotating shaft (16).

3. The multilayer thermally conductive circuit board of claim 1, wherein: one side surface fixation of radiating roof (3) is provided with second rotation board (18), the inside of second rotation groove (19) is fixedly provided with second axis of rotation (20), and second axis of rotation (20) run through second rotation board (18), second rotation board (18) are rotated with second rotation groove (19) through second axis of rotation (20).

4. The multilayer thermally conductive circuit board of claim 1, wherein: a fan mounting groove (6) is formed between the cooling fan (7) and the cooling top plate (3), and the fan mounting groove (6) penetrates through the cooling top plate (3).

5. The multilayer thermally conductive circuit board of claim 4, wherein: the inner wall of the fan mounting groove (6) is fixedly provided with a mounting inner plate (22), a threaded fastener (21) is arranged at the edge of the cooling fan (7), and the cooling fan (7) is in threaded fixation with the mounting inner plate (22) through the threaded fastener (21).

6. The multilayer thermally conductive circuit board of claim 1, wherein: the heat dissipation roof is characterized in that a fixed side plate (4) is fixedly arranged on the surface of the other side of the heat dissipation roof (3), a single-head fastener (5) is arranged on one side of the fixed side plate (4), and the single-head fastener (5) penetrates through the fixed side plate (4) to be in threaded connection with the multilayer circuit board main body (1).

7. The multilayer thermally conductive circuit board of claim 1, wherein: the lower surface of the lower bottom plate (9) is fixedly provided with radiating fins (13), and the radiating fins (13) are provided with a plurality of radiating fins.

8. The multilayer thermally conductive circuit board of claim 7, wherein: the cooling fin structure is characterized in that a supporting bottom plate (11) is arranged below the cooling fin (13), a connecting frame (12) is fixedly arranged between two ends of the supporting bottom plate (11) and the lower bottom plate (9), and a flowing cavity (14) is arranged between the supporting bottom plate (11) and the cooling fin (13).

9. The multilayer thermally conductive circuit board of claim 8, wherein: the corner of the multilayer circuit board main body (1) is provided with a fixing screw (2), and one end of the fixing screw (2) penetrates through the multilayer circuit board main body (1), the lower bottom plate (9), the connecting frame (12) and the supporting bottom plate (11).

10. The multilayer thermally conductive circuit board of claim 1, wherein: the surface of the multilayer circuit board main body (1) is provided with radiating holes (23), and the radiating holes (23) are provided with a plurality of radiating holes.