CN218125015U - Cyanide-free multilayer circuit board convenient to radiate heat - Google Patents
Cyanide-free multilayer circuit board convenient to radiate heat Download PDFInfo
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- CN218125015U CN218125015U CN202221843389.2U CN202221843389U CN218125015U CN 218125015 U CN218125015 U CN 218125015U CN 202221843389 U CN202221843389 U CN 202221843389U CN 218125015 U CN218125015 U CN 218125015U
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- circuit board
- multilayer circuit
- cyanide
- board body
- refrigeration
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Abstract
The utility model provides a convenient radiating no cyanogen multilayer circuit board relates to heat abstractor technical field, first louvre and second louvre have been seted up in no cyanogen multilayer circuit board body, the upper surface of no cyanogen multilayer circuit board body is provided with radiator unit, this internal fixedly connected with landing leg of no cyanogen multilayer circuit board, no cyanogen multilayer circuit board body upper end electric connection ic chip. The utility model discloses a superconductive refrigeration board and cyanide-free multilayer circuit board body direct contact, mainly be responsible for on heat transfer to the refrigeration wafer of cyanide-free multilayer circuit board body, the alloy heat dissipation post then carries out the heat dispersion to the refrigeration wafer, last axial fan starts the air flow rate around the refrigeration wafer with higher speed, make the refrigeration wafer produce low temperature, low temperature transfer is to on the cyanide-free multilayer circuit board body, reach the quick radiating effect to cyanide-free multilayer circuit board body, thereby reduce the impedance of multilayer circuit board body, better protection circuit board.
Description
Technical Field
The utility model relates to a heat abstractor technical field particularly, relates to a convenient radiating cyanide-free multilayer circuit board.
Background
The circuit board can be divided into a single-sided board, a double-sided board, a four-layer board, a six-layer board and other multi-layer circuit boards according to the number of the layers of the circuit board. The existing multilayer printed circuit board mostly improves the stability and the integration level by increasing the number of layers so as to increase the application range, but the existing multilayer printed circuit board can generate a large amount of heat in the circuit operation process to cause the situation of overheating of the multilayer printed circuit board, and the situation not only can cause the damage of the circuit board, but also can cause the whole impedance of the circuit board to be increased to influence the normal operation of the circuit board.
At present, in order to solve the heat dissipation problem of a multilayer printed circuit board and reduce impedance, a metal base is usually added on the printed circuit board to realize heat dissipation, but the heat dissipation is carried out by depending on the structure of a substrate, the heat dissipation effect is not ideal, and the circuit board is easy to be damaged due to overheating, so that a cyanide-free multilayer circuit board convenient to dissipate heat is provided to solve the problems encountered in the prior art.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a convenient radiating cyanide-free multilayer circuit board can effectively solve the problem in the background art.
In order to achieve the above purpose, the utility model adopts the technical proposal that:
the utility model provides a convenient radiating no cyanogen multilayer line board, includes no cyanogen multilayer line board body, first louvre and second louvre have been seted up in no cyanogen multilayer line board body, the upper surface of no cyanogen multilayer line board body is provided with radiator unit, this internal fixedly connected with landing leg of no cyanogen multilayer line board, first bolt has been passed in the landing leg, no cyanogen multilayer line board body upper end electric connection ic chip.
Preferably, the heat dissipation assembly comprises a superconducting refrigeration plate, a refrigeration wafer and an alloy heat dissipation column;
the inner wall of the superconducting refrigeration plate is fixedly connected with a refrigeration wafer, and the upper surface of the refrigeration wafer is fixedly connected with an alloy heat dissipation column.
Preferably, the upper surface of the alloy heat dissipation column is fixedly connected with an axial fan, and heat-conducting silicone grease is arranged between the refrigeration wafer and the ic chip.
Preferably, the two superconducting refrigeration plates are arranged in a rectangular shape, and a transmission guide pillar is fixedly connected between the two superconducting refrigeration plates.
Preferably, two sides of one superconducting refrigeration plate are fixedly connected with fixing pieces, the fixing pieces are fixedly connected with the cyanide-free multilayer circuit board body through second bolts, and the fixing pieces are arranged in an L shape.
Compared with the prior art, the utility model discloses following beneficial effect has:
the superconducting refrigeration plate is in direct contact with the cyanide-free multilayer circuit board body and is mainly responsible for transferring heat of the cyanide-free multilayer circuit board body to the refrigeration wafer, the alloy heat dissipation column then disperses the heat of the refrigeration wafer, and finally an axial flow fan on the heat dissipation assembly is started to accelerate air flow rate around the refrigeration wafer so as to enable the refrigeration wafer to generate low temperature which is transferred to the cyanide-free multilayer circuit board body, so that the effect of quickly dissipating the heat of the cyanide-free multilayer circuit board body is achieved, the impedance of the multilayer circuit board body is reduced, and the circuit board is better protected;
be provided with heat conduction silicone grease between refrigeration wafer and the ic chip, can be effectual with the heat transfer on the ic chip for refrigeration wafer to further promotion heat dispersion.
Drawings
FIG. 1 is a schematic view of the overall structure of a cyanide-free multilayer circuit board convenient for heat dissipation according to the present invention;
FIG. 2 is a schematic view of a heat dissipation assembly of a cyanide-free multi-layered circuit board for facilitating heat dissipation according to the present invention;
FIG. 3 is an enlarged schematic view of a portion a of a cyanide-free multilayer circuit board convenient for heat dissipation according to the present invention;
fig. 4 is an enlarged schematic view of the position b of the cyanide-free multilayer circuit board of the present invention for facilitating heat dissipation.
In the figure: 1. a cyanide-free multilayer circuit board body; 2. a support leg; 3. a first bolt; 4. a first heat dissipation hole; 5. a second heat dissipation hole; 6. a heat dissipating component; 601. a superconducting refrigeration plate; 602. refrigerating the wafer; 603. an alloy heat-dissipating stud; 604. an axial flow fan; 605. a guide post; 606. a fixing sheet; 607. a second bolt; 7. and (c) an ic chip.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
As shown in fig. 1 to 4, a cyanide-free multilayer circuit board convenient for heat dissipation includes a cyanide-free multilayer circuit board body 1, a first heat dissipation hole 4 and a second heat dissipation hole 5 are formed in the cyanide-free multilayer circuit board body 1, a heat dissipation assembly 6 is arranged on the upper surface of the cyanide-free multilayer circuit board body 1, a support leg 2 is fixedly connected in the cyanide-free multilayer circuit board body 1, a first bolt 3 passes through the support leg 2, and an ic chip 7 is electrically connected to the upper end of the cyanide-free multilayer circuit board body 1.
In the present application, the heat dissipation assembly 6 includes a superconducting refrigeration plate 601, a refrigeration wafer 602, and an alloy heat dissipation column 603; the inner wall of the superconducting refrigeration plate 601 is fixedly connected with a refrigeration wafer 602, and the upper surface of the refrigeration wafer 602 is fixedly connected with an alloy heat dissipation column 603.
It should be noted that the supporting legs 2 extend to the outside of the cyanide-free multilayer circuit board body 1, so that a gap exists between the cyanide-free multilayer circuit board body 1 and a fixed position, air circulation is ensured, and heat dissipation of the cyanide-free multilayer circuit board body 1 is facilitated.
In the present application, an axial fan 604 is fixedly connected to the upper surface of the alloy heat dissipation column 603, and a heat conductive silicone grease is disposed between the cooling wafer 602 and the ic chip 7. The two superconducting refrigeration plates 601 are arranged in a rectangular shape, and a transmission column 605 is fixedly connected between the two superconducting refrigeration plates 601. Two sides of one of the superconducting refrigeration plates 601 are fixedly connected with a fixing sheet 606, the fixing sheet 606 is fixedly connected with the cyanide-free multilayer circuit board body 1 through a second bolt 607, and the fixing sheet 606 is arranged in an L shape.
It should be noted that, the utility model discloses, superconductive refrigeration board 601 and cyanide-free multilayer circuit board body 1 direct contact are mainly responsible for on transferring the heat of cyanide-free multilayer circuit board body 1 to refrigeration wafer 602, alloy heat dissipation post 603 then carries out the heat dispersion to refrigeration wafer 602, axial fan 604 on the last radiating component 6 starts, air flow rate around the refrigeration wafer 602 is accelerated, make refrigeration wafer 602 produce low temperature, low temperature transfer is to cyanide-free multilayer circuit board body 1, reach the effect to the quick heat dissipation of cyanide-free multilayer circuit board body 1, thereby reduce the impedance of multilayer circuit board body; the heat conduction silicone grease is arranged between the refrigerating wafer 602 and the ic chip 7, so that heat on the ic chip 7 can be effectively transferred to the refrigerating wafer 602, and the heat dissipation performance is further improved. The second heat dissipation hole 5 is arranged around the ic chip 7, so that air can better circulate, and the heat dissipation effect is ensured.
The working principle of the cyanide-free multilayer circuit board convenient for heat dissipation is as follows:
the utility model discloses, superconductive refrigeration board 601 and cyanide-free multilayer circuit board body 1 direct contact mainly are responsible for on transferring the heat of cyanide-free multilayer circuit board body 1 to refrigeration wafer 602, alloy heat dissipation post 603 then carries out the heat dispersion to refrigeration wafer 602, axial fan 604 on the last radiator unit 6 starts, with higher speed refrigerates the air velocity around the wafer 602, makes refrigeration wafer 602 produce low temperature, and low temperature transmits to cyanide-free multilayer circuit board body 1, reaches the effect to the quick heat dissipation of cyanide-free multilayer circuit board body 1, thereby reduces the impedance of multilayer circuit board body;
the heat-conducting silicone grease is arranged between the refrigerating wafer 602 and the ic chip 7, so that heat on the ic chip 7 can be effectively transferred to the refrigerating wafer 602, and the heat dissipation performance is further improved;
obviously, the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it is obvious for those skilled in the art to make other variations or changes based on the above descriptions, and all embodiments cannot be exhausted here, and all obvious variations or changes introduced by the technical solution of the present invention are still within the protection scope of the present invention.
Claims (5)
1. The utility model provides a convenient radiating no cyanogen multilayer circuit board, includes no cyanogen multilayer circuit board body (1), its characterized in that: first louvre (4) and second louvre (5) have been seted up in cyanide-free multilayer circuit board body (1), the upper surface of cyanide-free multilayer circuit board body (1) is provided with radiator unit (6), fixedly connected with landing leg (2) in cyanide-free multilayer circuit board body (1), first bolt (3) have been passed in landing leg (2), cyanide-free multilayer circuit board body (1) upper end electric connection ic chip (7).
2. The cyanide-free multilayer circuit board convenient for heat dissipation according to claim 1, characterized in that: the heat dissipation assembly (6) comprises a superconducting refrigeration plate (601), a refrigeration wafer (602) and an alloy heat dissipation column (603);
the inner wall of the superconducting refrigeration plate (601) is fixedly connected with a refrigeration wafer (602), and the upper surface of the refrigeration wafer (602) is fixedly connected with an alloy heat dissipation column (603).
3. The cyanide-free multilayer circuit board convenient for heat dissipation according to claim 2, wherein: the upper surface of the alloy heat dissipation column (603) is fixedly connected with an axial fan (604), and heat-conducting silicone grease is arranged between the refrigeration wafer (602) and the ic chip (7).
4. The cyanide-free multilayer circuit board convenient for heat dissipation according to claim 2, wherein: the two superconducting refrigeration plates (601) are arranged in a rectangular shape, and a transmission column (605) is fixedly connected between the two superconducting refrigeration plates (601).
5. The cyanide-free multilayer circuit board convenient for heat dissipation according to claim 2, wherein: two sides of one of the superconducting refrigeration plates (601) are fixedly connected with a fixing piece (606), the fixing piece (606) is fixedly connected with the cyanide-free multilayer circuit board body (1) through a second bolt (607), and the fixing piece (606) is arranged in an L shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221843389.2U CN218125015U (en) | 2022-07-18 | 2022-07-18 | Cyanide-free multilayer circuit board convenient to radiate heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221843389.2U CN218125015U (en) | 2022-07-18 | 2022-07-18 | Cyanide-free multilayer circuit board convenient to radiate heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218125015U true CN218125015U (en) | 2022-12-23 |
Family
ID=84518138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221843389.2U Active CN218125015U (en) | 2022-07-18 | 2022-07-18 | Cyanide-free multilayer circuit board convenient to radiate heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218125015U (en) |
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2022
- 2022-07-18 CN CN202221843389.2U patent/CN218125015U/en active Active
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