CN109062371B - Dedicated noiseless formula mainboard heat abstractor of computer - Google Patents
Dedicated noiseless formula mainboard heat abstractor of computer Download PDFInfo
- Publication number
- CN109062371B CN109062371B CN201810878901.9A CN201810878901A CN109062371B CN 109062371 B CN109062371 B CN 109062371B CN 201810878901 A CN201810878901 A CN 201810878901A CN 109062371 B CN109062371 B CN 109062371B
- Authority
- CN
- China
- Prior art keywords
- double
- computer
- radiating fin
- scroll
- aluminum base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention discloses a noise-free mainboard heat dissipation device special for a computer, which comprises a computer case shell, and a computer main board arranged in the case body, wherein the computer main board is provided with a support frame, the support frame is provided with an aluminum base, the bottom of the aluminum base is provided with a catching groove matched with the CPU, the aluminum base is provided with a cylindrical double-layer radiating fin, an electric fan driven by a motor is arranged in the middle of the double-layer radiating fin, an inorganic fiber ring is arranged on the double-layer radiating fin positioned on the outer ring of the electric fan, a copper pipe is radially arranged in the middle of the double-layer radiating fin, the tail end of the copper pipe extending out of the double-layer radiating fin is connected with a bridging radiating device, a pinhole is arranged on the side surface of the aluminum base, the pinhole runs through the aluminum base and extends to the catching groove, so that the heat dissipation efficiency is improved, and the computer mainboard obtains a good mute effect.
Description
Technical Field
The invention relates to the field of computer heat dissipation, in particular to a noise-free type mainboard heat dissipation device special for a computer.
Background
At present, intelligent electronic equipment such as computers, televisions and the like are widely used in daily life as an information transmission medium, along with the rapid development of information technology, the electronic equipment is continuously updated and occupies more and more important positions in daily life, as is known, because the electronic equipment uses a large amount of integrated circuits, the high temperature is a enemy of the integrated circuits, the high temperature can not only cause unstable system operation and short service life, but also can even cause that some parts are burnt, and the high-temperature heat comes from the inside of the electronic equipment or the inside of the integrated circuits, so in order to ensure the service life and the use effect of the electronic equipment, the electronic equipment is generally added with a heat dissipation function to absorb the heat generated inside the electronic equipment and then dissipate the heat to the outside of the terminal, in the related technology, the electronic equipment is provided with a certain number of heat dissipation windows, the heat dissipation window is arranged on the shell of the electronic equipment and keeps an open state, and heat generated inside the electronic equipment is dissipated to the outside of the electronic equipment through the heat dissipation window.
The computer case is characterized in that a plurality of components are arranged in the case, wherein main heating components comprise a CPU, a display card, a power supply and the like, the CPU and the display card are arranged on a mainboard and are cooled and dissipated through a traditional fan, a transmission fan is uncontrollable generally, when the temperature of the mainboard is too high, the rotating speed of the fan is accelerated to be cooled through increasing a circuit of the fan, the noise of a computer is increased, the problem that the CPU and the display card are effectively cooled is urgently solved, and the real-time monitoring of the cooling temperature of the mainboard of the computer case is very important;
for example, a technical solution provided by a computer motherboard heat dissipation device with application number CN201721795376.1 is that the heat dissipation device comprises a heat dissipation mesh sheet, connecting upright posts, a fan top plate, a rotating upright post, heat dissipation sub-plates, heat dissipation main plates and locking nuts, wherein a plurality of connecting upright posts are uniformly distributed and inserted at the edges around the lower top end surface of the heat dissipation mesh sheet, the fan top plate is fixedly connected between the upper top end surfaces of a plurality of connecting upright posts, the rotating upright post is fixedly connected at the center of the lower top end surface of the fan top plate, a plurality of heat dissipation sub-plates are uniformly distributed and fixedly connected at the edges around the lower top end surface of the rotating upright post side, a plurality of heat dissipation main plates are uniformly distributed and fixedly connected at the edges around the upper top end surface of the rotating upright post side, the locking nuts are inserted at the edges above the top end surface of each connecting upright post side, and the heat dissipation fan can be inserted into the heat dissipation plates for heat dissipation to prevent the internal temperature of the heat dissipation plates from being too high, in the technical scheme, the metal radiating fins of the CPU are improved, so that the purpose of radiating is achieved, more air flow passing through the CPU is conducted to the radiating fins in a main radiating fin and auxiliary radiating fins, and the air flow is easy to whistle and generate larger noise due to the complex multi-connection structure of the main radiating fin and the auxiliary radiating fins in the high-speed radiating process.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a noise-free mainboard heat dissipation device special for a computer, which improves the heat dissipation efficiency of a computer mainframe and can effectively solve the problems in the background art.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the utility model provides a dedicated noiseless formula mainboard heat abstractor of computer, includes the chassis casing to and install the computer mainboard in the chassis casing, be provided with the support frame on the computer mainboard, install aluminium base on the support frame, aluminium base bottom is provided with the catching groove that matches with CPU, be provided with cylindric double-deck radiating fin on the aluminium base, and be provided with motor drive's electric fan in the middle of the double-deck radiating fin, be located and be provided with the inorganic fiber circle on the double-deck radiating fin of electric fan outer lane, radially be provided with the copper pipe in the middle of the double-deck radiating fin, just the end-to-end connection that the copper pipe extends double-deck radiating fin has bridging heat abstractor, just aluminium base side surface is provided with the pinhole, the pinhole runs through aluminium base and extends to in the catching groove.
Further, bridging heat abstractor is including setting up the semicircle board circle on machine case casing and computer motherboard opposite face to and connect the copper base at semicircle board circle both ends, the inside spiral heat conduction device that is provided with of semicircle board circle, just the both ends of spiral heat conduction device are connected on the copper base, for spiral heat conduction device's machine case casing surface is provided with miniature exhaust fan, just be provided with the silica gel thin slice between spiral heat conduction device and the computer motherboard, be provided with the inlay groove on the copper base, and be located and be provided with the screwed pipe hole on the copper base of inlay groove top and bottom, the one end of copper pipe is installed in the inlay groove, the copper base is connected with the circulating water cooling device through the screwed pipe hole.
Furthermore, the circulating water cooling device comprises a return frame arranged on the case shell, a plurality of continuous U-shaped frames are arrayed on the return frame, continuous glass tubes are arranged inside the U-shaped frames, one end of each glass tube is connected with an eddy current pump, the other end of each glass tube is connected to a threaded tube hole in the bottom of the embedded groove through threads, the eddy current pump is connected to the threaded tube hole in the top of the embedded groove through a pipeline, and short fins are arrayed on the surface of the U-shaped frame.
Further, the top of casing is provided with the top-mounted board, the top at the casing is installed through the gib block in the both sides of top-mounted board, the gib block is installed at the inside surface top of casing, top-mounted board dorsal surface is provided with the air inlet intermediate layer, both ends surface is provided with the spout around air inlet intermediate layer one side, insert the dead lever of fixed mounting in gib block one end in the spout, both ends are provided with miniature piston rod around the air inlet intermediate layer is located one side of semicircle plate circle.
Further, the scroll heat conduction device comprises a scroll pole piece A and a scroll pole piece B which are the same in shape, and a heat conduction electronic bridge arranged between the scroll pole piece A and the scroll pole piece B, a metal mesh layer is arranged between the scroll pole piece B and the miniature exhaust fan, and the scroll pole piece A and the silica gel sheet are attached together.
Furthermore, an S-shaped pipeline is formed in the aluminum base through the pinhole of the aluminum base, pinholes are arranged on two sides of the aluminum base, the thickness of the buckling groove is 1.2-1.3 times of the installation height of a CPU of a computer mainboard, and the side wall of the buckling groove is in a step shape.
Further, the short fins are arranged on the outer side face of the U-shaped frame and are corrugated.
Further, the inorganic fiber ring is mounted on the double-layer radiating fins through the aluminum columns, and the width of the inorganic fiber ring is smaller than the length of the aluminum columns, so that a channel entering the electric fan is formed between the inorganic fiber ring and the double-layer radiating fins.
Compared with the prior art, the invention has the beneficial effects that:
the invention is practical in the heat dissipation of the mainboard of the computer, the connection form of the double-layer radiating fins and the aluminum base is adopted, the inorganic fiber ring arranged on the double-layer radiating fins absorbs the air flow friction noise generated in the rotation process of the electric fan, meanwhile, when the electric fan rotates at high speed, the air flow passing through the CPU passes through the connection part of the aluminum base at the bottom of the inorganic fiber ring and the double-layer radiating fins, when the high-speed air flow is transmitted through the radiating fins, the vibration of sound is transmitted through the aluminum column, and is absorbed when reaching the inorganic fiber ring, thereby reducing the noise generation, and simultaneously, the semiconductor heat dissipation is carried out through the bridging radiating device, thereby realizing the high-efficiency and rapid heat dissipation.
Drawings
FIG. 1 is a schematic structural view of a cabinet housing arrangement of the present invention;
FIG. 2 is a schematic view of a double-layered heat sink fin mounting structure according to the present invention;
FIG. 3 is a schematic structural diagram of a bridging heat sink according to the present invention;
FIG. 4 is a schematic diagram of a top loading plate structure according to the present invention;
FIG. 5 is a schematic diagram of a longitudinal cross-sectional view of an aluminum base according to the present invention;
FIG. 6 is a schematic diagram of a longitudinal cross-sectional view of a thermally conductive electronic bridge according to the present invention;
reference numbers in the figures:
1-a housing of the machine box; 2-a computer motherboard; 3-a support frame; a 4-aluminum base; 5-catching grooves; 6-double-layer radiating fins; 7-inorganic fiber ring; 8-an electric fan; 9-copper tube; 10-a bridge heat sink; 11-pinhole; 12-a water cooling device; 13-top mounting plate; 14-a guide strip; 15-air intake interlayer; 16-a chute; 17-a fixation rod; 18-a miniature piston rod;
1001-semicircular plate ring; 1002-a copper base; 1003-scroll heat transfer device; 1004-micro exhaust fan; 1005-silica gel sheet; 1006-embedding groove; 1007-threaded pipe holes;
10031-volute pole piece A; 10032-volute pole piece B; 10033-a thermally conductive electronic bridge; 10034-a metal mesh layer;
1201-clip frame; 1202-U-shaped frame; 1203-glass tube; 1204-a vortex pump; 1205-short fins; 1206-embedding groove; 1207-screwed pipe hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 6, the present invention provides a noise-free motherboard heat dissipation device dedicated for a computer, including a chassis housing 1, and a computer motherboard 2 installed in the chassis housing 1, wherein the computer motherboard 2 is provided with a support frame 3, the support frame 3 is provided with an aluminum base 4, the bottom of the aluminum base 4 is provided with a fastening slot 5 matched with a CPU, the aluminum base 4 is provided with a cylindrical double-layer heat dissipation fin 6, a motor-driven electric fan 8 is arranged in the middle of the double-layer heat dissipation fin 6, the double-layer heat dissipation fin 6 located at the outer ring of the electric fan 8 is provided with an inorganic fiber ring 7, the middle of the double-layer heat dissipation fin 6 is radially provided with a copper pipe 9, the end of the copper pipe 9 extending out of the double-layer heat dissipation fin 6 is connected with a bridging heat dissipation device 10, and the side surface of the aluminum base 4 is provided with a pinhole 11, and the pinhole 11 penetrates through the aluminum base 4 and extends into the fastening slot 5.
The inorganic fiber ring 7 is arranged on the double-layer radiating fin 6 through an aluminum column, and the width of the inorganic fiber ring 7 is smaller than the length of the aluminum column, so that a channel entering the electric fan 8 is formed between the inorganic fiber ring 7 and the double-layer radiating fin 6.
The invention is practical in the mainboard heat dissipation of the computer, the connection form of the double-layer heat dissipation fins 6 and the aluminum base 4 is adopted, the inorganic fiber ring 7 arranged on the double-layer heat dissipation fins 6 absorbs the air flow friction noise generated in the rotation process of the electric fan 8, meanwhile, when the electric fan 8 rotates at high speed, the air flow passing through the CPU passes through the connection part of the aluminum base 4 at the bottom of the inorganic fiber ring 7 and the double-layer heat dissipation fins 6, when the high-speed air flow is transmitted through the heat dissipation fins 6, the vibration of sound is also transmitted through the aluminum columns, and is absorbed when reaching the inorganic fiber ring 7, thereby reducing the noise generation, and simultaneously, the semiconductor heat dissipation is carried out through the bridging heat dissipation device 10, thereby realizing high-efficiency and quick heat dissipation.
Bridging heat abstractor 10 is including setting up the semicircle board circle 1001 on the casing 1 and computer motherboard 2 opposite face, and connect the copper base 1002 at semicircle board circle 1001 both ends, semicircle board circle 1001 is inside to be provided with scroll heat conduction device 1003, and the both ends of scroll heat conduction device 1003 are connected on copper base 1002, be provided with miniature exhaust fan 1004 for the casing 1 surface of scroll heat conduction device 1003, and be provided with silica gel thin slice 1005 between scroll heat conduction device 1003 and the computer motherboard 2, be provided with embedded groove 1006 on the copper base 1002, and be located and be provided with threaded hole 1007 on the copper base 1002 at embedded groove 1006 top and bottom, the one end of copper pipe 9 is installed in embedded groove 1006, copper base 1002 is connected with circulating water cooling device 12 through threaded hole 1007.
The circulating water cooling device 12 comprises a loop frame 1201 arranged on a chassis shell 1, a plurality of continuous U-shaped frames 1202 are arrayed on the loop frame 1201, continuous glass tubes 1203 are arranged inside the U-shaped frames 1202, one ends of the glass tubes 1203 are connected with vortex pumps 1204, the other ends of the glass tubes 1204 are connected to threaded tube holes 1007 at the bottoms of the embedded grooves 1006 through threads, the vortex pumps 1204 are connected to the threaded tube holes 1007 at the tops of the embedded grooves 1006 through pipelines, and short fins 1205 are arrayed on the surface of the U-shaped frames 1202.
The top of casing 1 is provided with top-mounted plate 13, top-mounted plate 13's both sides are passed through the gib block 14 and are installed at the top of casing 1, gib block 14 is installed at the inboard surface top of casing 1, top-mounted plate 13 dorsal surface is provided with air inlet intermediate layer 15, both ends surface is provided with spout 16 around air inlet intermediate layer 15 one side, insert the dead lever 17 of fixed mounting in gib block 14 one end in the spout 16, both ends are provided with miniature piston rod 18 around air inlet intermediate layer 15 is located one side of semicircle plate circle 1001.
Scroll heat conduction device 1003 includes scroll pole piece a10031 and scroll pole piece B10032 with the same shape, and heat conduction electronic bridge 10033 arranged between scroll pole piece a10031 and scroll pole piece B10032, metal mesh layer 10034 arranged between scroll pole piece B10032 and micro exhaust fan 1004, scroll pole piece a10031 and silicone sheet 1005 are pasted together.
The pinhole 11 penetrating the aluminum base 4 forms an S-shaped pipeline in the aluminum base 4, the two sides of the aluminum base 4 are both provided with the pinhole 11, the thickness of the buckling groove 5 is 1.2-1.3 times of the installation height of the CPU of the computer mainboard 2, and the side wall of the buckling groove 5 is in a step shape.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (7)
1. The utility model provides a dedicated noiseless formula mainboard heat abstractor of computer, includes casing (1) of computer to and install computer mainboard (2) in casing (1) of computer, its characterized in that: the computer main board (2) is provided with a support frame (3), the support frame (3) is provided with an aluminum base (4), the bottom of the aluminum base (4) is provided with a catching groove (5) matched with the CPU, a cylindrical double-layer radiating fin (6) is arranged on the aluminum base (4), an electric fan (8) driven by a motor is arranged in the middle of the double-layer radiating fin (6), an inorganic fiber ring (7) is arranged on the double-layer radiating fin (6) positioned on the outer ring of the electric fan (8), the copper pipe (9) is arranged in the middle of the double-layer radiating fin (6) in the radial direction, the tail end of the copper pipe (9) extending out of the double-layer radiating fin (6) is connected with a bridging radiating device (10), a pinhole (11) is arranged on the side surface of the aluminum base (4), and the pinhole (11) penetrates through the aluminum base (4) and extends into the buckling groove (5);
the bridging heat dissipation device (10) comprises a semicircular plate ring (1001) arranged on the opposite surface of a case shell (1) and a computer mainboard (2) and a copper base (1002) connected to the two ends of the semicircular plate ring (1001), wherein a scroll heat conduction device (1003) is arranged inside the semicircular plate ring (1001), the two ends of the scroll heat conduction device (1003) are connected to the copper base (1002), a micro exhaust fan (1004) is arranged on the surface of the case shell (1) opposite to the scroll heat conduction device (1003), a silica gel sheet (1005) is arranged between the scroll heat conduction device (1003) and the computer mainboard (2), an embedded groove (1006) is arranged on the copper base (1002), threaded pipe holes (1007) are arranged on the copper base (1002) positioned at the top and the bottom of the embedded groove (1006), and one end of a copper pipe (9) is installed in the embedded groove (1006), the copper base (1002) is connected with a circulating water cooling device (12) through a threaded pipe hole (1007).
2. The noiseless motherboard heat sink device as recited in claim 1, wherein: the circulating water cooling device (12) comprises a circular frame (1201) arranged on a chassis shell (1), a plurality of continuous U-shaped frames (1202) are arrayed on the circular frame (1201), continuous glass tubes (1203) are arranged inside the U-shaped frames (1202), one ends of the glass tubes (1203) are connected with vortex pumps (1204), the other ends of the glass tubes (1203) are connected to threaded tube holes (1007) in the bottoms of embedded grooves (1006) through threads, the vortex pumps (1204) are connected to the threaded tube holes (1007) in the tops of the embedded grooves (1006) through pipelines, and short fins (1205) are arrayed on the surface of the U-shaped frames (1202).
3. The noiseless motherboard heat sink device as recited in claim 1, wherein: the top of quick-witted case casing (1) is provided with top-mounted board (13), the top at quick-witted case casing (1) is installed through gib block (14) in the both sides of top-mounted board (13), gib block (14) are installed at the inboard surface top of quick-witted case casing (1), top-mounted board (13) dorsal plane is provided with air inlet intermediate layer (15), both ends surface is provided with spout (16) around air inlet intermediate layer (15) one side, insert dead lever (17) of fixed mounting in gib block (14) one end in spout (16), both ends are provided with miniature piston rod (18) around air inlet intermediate layer (15) are located one side of semicircle plate circle (1001).
4. The noiseless motherboard heat sink device as recited in claim 1, wherein: scroll heat conduction device (1003) is including the same scroll pole piece A (10031) of shape and scroll pole piece B (10032) to and set up heat conduction electronic bridge (10033) between scroll pole piece A (10031) and scroll pole piece B (10032), be provided with metal mesh layer (10034) between scroll pole piece B (10032) and miniature exhaust fan (1004), scroll pole piece A (10031) and silica gel thin slice (1005) are laminated together.
5. The noiseless motherboard heat sink device as recited in claim 1, wherein: the pinhole (11) that runs through aluminium base (4) forms an S-shaped pipeline in aluminium base (4), and the both sides of aluminium base (4) all are provided with pinhole (11), the thickness of catching groove (5) is 1.2 ~ 1.3 times of the CPU mounting height of computer mainboard (2), and the lateral wall of catching groove (5) is the echelonment.
6. The noiseless motherboard heat sink device as recited in claim 2, wherein: the short fins (1205) are arranged on the outer side face of the U-shaped frame (1202), and the short fins (1205) are corrugated.
7. The noiseless motherboard heat sink device as recited in claim 1, wherein: the inorganic fiber ring (7) is arranged on the double-layer radiating fin (6) through an aluminum column, and the width of the inorganic fiber ring (7) is smaller than the length of the aluminum column, so that a channel entering the electric fan (8) is formed between the inorganic fiber ring (7) and the double-layer radiating fin (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810878901.9A CN109062371B (en) | 2018-08-03 | 2018-08-03 | Dedicated noiseless formula mainboard heat abstractor of computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810878901.9A CN109062371B (en) | 2018-08-03 | 2018-08-03 | Dedicated noiseless formula mainboard heat abstractor of computer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109062371A CN109062371A (en) | 2018-12-21 |
| CN109062371B true CN109062371B (en) | 2021-10-01 |
Family
ID=64833140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810878901.9A Active CN109062371B (en) | 2018-08-03 | 2018-08-03 | Dedicated noiseless formula mainboard heat abstractor of computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109062371B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111965518A (en) * | 2020-07-09 | 2020-11-20 | 浙江昱欧电子科技有限公司 | Test machine is used in production of PCBA board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2420682Y (en) * | 1999-11-24 | 2001-02-21 | 陈欣怡 | Radiator of CPU |
| CN1942088A (en) * | 2005-09-29 | 2007-04-04 | 三星电子株式会社 | Heat sink assembly |
| CN203217460U (en) * | 2013-04-15 | 2013-09-25 | 陇东学院 | Radiator for CPU of computer |
| CN205721605U (en) * | 2016-05-05 | 2016-11-23 | 辅路科技（天津）有限公司 | The Noiseless type computer heat radiating device that a kind of computer is special |
| CN206723091U (en) * | 2017-04-24 | 2017-12-08 | 商洛学院 | A kind of special Noiseless type computer heat radiating device of computer |
| CN207337331U (en) * | 2017-09-18 | 2018-05-08 | 天津锐木克博科技有限公司 | A kind of dedicated Noiseless type computer heat radiating device of computer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8375117B2 (en) * | 2010-04-28 | 2013-02-12 | Juniper Networks, Inc. | Using endpoint host checking to classify unmanaged devices in a network and to improve network location awareness |
-
2018
- 2018-08-03 CN CN201810878901.9A patent/CN109062371B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2420682Y (en) * | 1999-11-24 | 2001-02-21 | 陈欣怡 | Radiator of CPU |
| CN1942088A (en) * | 2005-09-29 | 2007-04-04 | 三星电子株式会社 | Heat sink assembly |
| CN203217460U (en) * | 2013-04-15 | 2013-09-25 | 陇东学院 | Radiator for CPU of computer |
| CN205721605U (en) * | 2016-05-05 | 2016-11-23 | 辅路科技（天津）有限公司 | The Noiseless type computer heat radiating device that a kind of computer is special |
| CN206723091U (en) * | 2017-04-24 | 2017-12-08 | 商洛学院 | A kind of special Noiseless type computer heat radiating device of computer |
| CN207337331U (en) * | 2017-09-18 | 2018-05-08 | 天津锐木克博科技有限公司 | A kind of dedicated Noiseless type computer heat radiating device of computer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109062371A (en) | 2018-12-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210835959U (en) | Liquid cooling radiator for server | |
| CN109062371B (en) | Dedicated noiseless formula mainboard heat abstractor of computer | |
| CN205297965U (en) | Heat dissipation device | |
| CN208314712U (en) | A kind of computer server heat dissipation equipment | |
| CN108227883A (en) | A kind of huge computer servers radiator | |
| CN203149473U (en) | Low-noise computer heat radiator | |
| CN204145276U (en) | A kind of radiating structure of frequency converter | |
| CN105370599A (en) | Cooling device | |
| CN109002141B (en) | Computer mainframe heat dissipation equipment | |
| CN210402260U (en) | Radiating fin with good radiating efficiency | |
| CN201184991Y (en) | Efficient radiator | |
| CN210166747U (en) | GPU server and machine case water-cooling auxiliary cooling circulation system thereof | |
| CN206879304U (en) | Rack and miniature data center | |
| CN112105231A (en) | Pulsating heat pipe type blade server heat management system | |
| CN207474442U (en) | A kind of radiating enhanced integrated circuit packaging structure | |
| CN109917873A (en) | A kind of Sheet-metal machine box structure of external plug-in radiating module | |
| CN218125015U (en) | Cyanide-free multilayer circuit board convenient to radiate heat | |
| CN219305107U (en) | High-precision PCB (printed circuit board) metalized half-hole circuit board structure | |
| CN214627477U (en) | High heat dissipation copper-based printed wiring board | |
| CN212160582U (en) | High-efficient heat radiation structure of mainboard for face identification | |
| CN220473946U (en) | Expansion type server radiator structure | |
| CN219068755U (en) | Heat radiation structure and terminal applying same | |
| CN217825832U (en) | Heat pipe conduction type server liquid cooling heat radiation structure | |
| CN209710548U (en) | A kind of cabinet based on forced air cooling heat dissipation | |
| CN212544160U (en) | Circuit board with good heat dissipation function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |