CN112105231A - Pulsating heat pipe type blade server heat management system - Google Patents

Pulsating heat pipe type blade server heat management system Download PDF

Info

Publication number
CN112105231A
CN112105231A CN202010991592.3A CN202010991592A CN112105231A CN 112105231 A CN112105231 A CN 112105231A CN 202010991592 A CN202010991592 A CN 202010991592A CN 112105231 A CN112105231 A CN 112105231A
Authority
CN
China
Prior art keywords
section
heat
working medium
evaporation section
management system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010991592.3A
Other languages
Chinese (zh)
Other versions
CN112105231B (en
Inventor
王长宏
骆清怡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong University of Technology
Original Assignee
Guangdong University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong University of Technology filed Critical Guangdong University of Technology
Priority to CN202010991592.3A priority Critical patent/CN112105231B/en
Publication of CN112105231A publication Critical patent/CN112105231A/en
Application granted granted Critical
Publication of CN112105231B publication Critical patent/CN112105231B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • H05K7/20809Liquid cooling with phase change within server blades for removing heat from heat source
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • H05K7/20818Liquid cooling with phase change within cabinets for removing heat from server blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention discloses a pulsating heat pipe type blade server heat management system which comprises an evaporation section, a condensation section and a circulating working medium, wherein the evaporation section is a flat pipe; the flat surface of the evaporation section is in contact with the upper surface of the central processing unit of the server, and the evaporation section completely covers the upper surface of the central processing unit; two ends of the condensing section are communicated with two ends of the evaporating section, and the upper part of the condensing section extends out of the case of the server; the circulating working medium is filled in the evaporation section and the condensation section, the circulating working medium of the evaporation section absorbs heat generated by the central processing unit, is vaporized into steam and vertically flows upwards to the condensation section, and the circulating working medium of the condensation section transfers heat outwards to reduce the temperature and flows back to the evaporation section under the action of self gravity to form a self-circulation heat dissipation heat loop structure. The invention utilizes the gravity action to drive the circulating working medium to flow back, can convey heat outside the case to release without inputting external energy, and has the advantages of high heat exchange efficiency, good heat dissipation efficiency and low energy consumption.

Description

Pulsating heat pipe type blade server heat management system
Technical Field
The invention relates to a thermal management system, in particular to a pulsating heat pipe type blade server thermal management system.
Background
With the gradual development of information technology, the processing capacity and speed of data center processing are required to be higher and higher in the information industry. The existing blade server has the advantage of strong processing capability, so that a large amount of data can be processed quickly; the power consumption of the corresponding blade server is also large, a large amount of heat can be generated, and the high heat productivity of the server becomes a great hidden trouble for the safe and stable operation of the data center.
Cooling of a blade server is mainly performed by cooling equipment to cool the indoor temperature of the server, and then cooling air is blown to the server by a fan to cool the server. Although the mode can simultaneously dissipate heat of the server in a large area, the heat exchange efficiency is low, the heat dissipation effect is general, the electric energy consumption is high, and the heat dissipation cost is high.
Disclosure of Invention
The invention aims to solve the problems and provides a pulsating heat pipe type blade server heat management system with high heat exchange efficiency, good heat dissipation efficiency and low energy consumption. The system can spontaneously bring the heat generated by the server to the environment outside the case by utilizing the gravity action and the phase change of the pulsating heat pipe, and can replace a fan in the case and reduce the cold consumption in the environment.
The purpose of the invention can be achieved by adopting the following technical scheme:
a pulse heat pipe type blade server heat management system comprises an evaporation section, a condensation section and a circulating working medium, wherein the evaporation section is a flat pipe; the flat surface of the evaporation section is in contact with the upper surface of the central processing unit of the server, and the evaporation section completely covers the upper surface of the central processing unit; the condensing section is a circular pipe, the condensing section is vertically arranged, two ends of the condensing section are communicated with two ends of the evaporating section, and the upper part of the condensing section extends out of the case of the server; the circulating working medium is filled in the evaporation section and the condensation section, the circulating working medium of the evaporation section absorbs heat generated by the central processing unit, is vaporized into steam and vertically flows upwards to the condensation section, and the circulating working medium of the condensation section transfers heat outwards to reduce the temperature and flows back to the evaporation section under the action of self gravity to form a self-circulation heat dissipation heat loop structure.
Preferably, a fan for blowing the condensing section is arranged outside the chassis of the server.
Preferably, porous capillary tubes are arranged in the evaporation section and the condensation section.
As a preferred scheme, the evaporation section is installed on the upper surface of a central processing unit of the server through a U-shaped half ring buckle, two ends of the U-shaped half ring buckle are connected with the side surface of the central processing unit, and the evaporation section is inserted into a gap between the upper surface of the central processing unit and the U-shaped half ring buckle.
As a preferred scheme, the circulating working medium is deionized distilled water working medium.
Preferably, the U-shaped semi-ring buckle is made of copper.
The implementation of the invention has the following beneficial effects:
1. when the circulating working medium reaches the condensation end, the gas plug releases heat and then becomes short, the gas plug is condensed into liquid to flow back, the pressure at the condensation end is reduced, and then the liquid at the condensation end flows back to the evaporation section under the action of self gravity. The whole process drives the circulation working medium to flow back under the action of gravity, heat can be conveyed to the outside of the case to be released without external energy input, and the problems of high power consumption of a centrifugal fan in the case of the traditional blade server and dust, noise and local overheating caused by use are greatly reduced.
2. The evaporation section dissipates heat of a central processing unit and a memory of the blade server, and the pulsating heat pipe has more advantages in heat dissipation in electronic equipment due to the fact that the pulsating heat pipe is 20% -30% higher than a common sintering heat pipe and is smaller and more flexible in size.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a pulsating heat pipe blade server thermal management system according to the present invention.
Fig. 2 is a schematic view of the internal mounting structure of fig. 1.
FIG. 3 is a schematic diagram of a connection structure between an evaporation section of the pulsating heat pipe type blade server thermal management system and a central processing unit of a server according to the present invention.
Fig. 4 is a side view of fig. 3.
FIG. 5 is a schematic structural diagram of a self-circulation heat dissipation loop structure of the pulse heat pipe blade server thermal management system according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
Referring to fig. 1 to 5, the present embodiment relates to a pulsating heat pipe type blade server thermal management system, including an evaporation section 1, a condensation section 2 and a cycle medium, where the evaporation section 1 is a flat pipe; the flat surface of the evaporation section 1 is in contact with the upper surface of the central processor 10 of the server, and the evaporation section 1 completely covers the upper surface of the central processor 10; the condensing section 2 is a circular pipe, the condensing section 2 is vertically arranged, two ends of the condensing section 2 are communicated with two ends of the evaporating section 1, and the upper part of the condensing section 2 extends out of the case 11 of the server; the circulating working medium is filled in the evaporation section 1 and the condensation section 2, the circulating working medium of the evaporation section 1 absorbs heat generated by the central processing unit 10, is vaporized into steam and vertically flows upwards to the condensation section 2, and the circulating working medium of the condensation section 2 transfers heat outwards to reduce the temperature and flows back to the evaporation section 1 under the action of self gravity to form a self-circulation heat dissipation loop structure. The evaporation section 1 is in a flat tubular shape, so that the evaporation section 1 has a larger contact area with the central processing unit, the heat exchange efficiency and the temperature uniformity are improved, and the heat absorption efficiency is better than that of a common round tubular evaporator. The vertical section of the condensation section 2 accounts for 87.43% of the total length, and the horizontal section of the condensation section adopts circular arc transition, so that the pressure loss is reduced.
When the circulating working medium reaches the condensation end, the steam plug releases heat and then becomes short, the steam plug is condensed into liquid to flow back, the pressure at the condensation end is reduced, and then the liquid at the condensation end flows back to the evaporation section 1 under the action of self gravity. The whole process drives the circulation working medium to flow back under the action of gravity, heat can be conveyed to the outside of the case 11 to be released without external energy input, and the problems of high power consumption of a centrifugal fan in the traditional blade server case, dust, noise and local overheating caused by use are greatly reduced.
And a fan for blowing the condensing section 2 is arranged outside the chassis of the server, and the heat of the condensing section 2 is transferred to the environment outside the chassis.
Capillary tubes are arranged in the evaporation section 1 and the condensation section 2. The capillary has larger capillary force, can reduce flow resistance, enables the circulation loop to operate more efficiently, and ensures the stability of system operation.
As shown in fig. 3 and 4, the evaporation section 1 is installed on the upper surface of the central processing unit 10 of the server through the U-shaped half ring buckle 3, two ends of the U-shaped half ring buckle 3 are connected with the side surface of the central processing unit 10, the evaporation section 1 is inserted into the gap 31 between the upper surface of the central processing unit 10 and the U-shaped half ring buckle 3, and the U-shaped half ring buckle 3 is in contact with the evaporation section 1. The U-shaped semi-ring buckle 3 is made of copper. When the heat-radiating device works, a part of heat absorbed by the evaporation section 1 is transferred to the U-shaped half ring buckle 3, so that the heat-radiating area is increased, and the heat-radiating effect is improved.
The circulating working medium is deionized distilled water working medium. The deionized distilled water working medium has higher latent heat of vaporization and lower viscosity, and can effectively ensure the heat transfer efficiency. During low-power heat dissipation, the vertical pipe of the condensation section 2 can take away heat by utilizing phase change heat exchange; when the high-power heat dissipation is performed, the circulating working medium in the evaporation section 1 is vaporized to generate larger air pressure, so that the circulating flow is promoted, the heat exchange is increased, and the heat exchange effect and the temperature uniformity are improved.
While the invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not to be limited to the disclosed embodiment, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims (6)

1. A pulse heat pipe type blade server heat management system is characterized by comprising an evaporation section, a condensation section and a circulating working medium, wherein the evaporation section is a flat pipe; the flat surface of the evaporation section is in contact with the upper surface of the central processing unit of the server, and the evaporation section completely covers the upper surface of the central processing unit; the condensing section is a circular pipe, the condensing section is vertically arranged, two ends of the condensing section are communicated with two ends of the evaporating section, and the upper part of the condensing section extends out of the case of the server; the circulating working medium is filled in the evaporation section and the condensation section, the circulating working medium of the evaporation section absorbs heat generated by the central processing unit, is vaporized into steam and vertically flows upwards to the condensation section, and the circulating working medium of the condensation section transfers heat outwards to reduce the temperature and flows back to the evaporation section under the action of self gravity to form a self-circulation heat dissipation heat loop structure.
2. The pulsating heat pipe blade server thermal management system of claim 1, wherein a fan is disposed outside the server chassis for blowing the condenser section.
3. A pulsating heat pipe blade server thermal management system as in claim 2, wherein porous capillaries are provided in said evaporator section and condenser section.
4. The pulsating heat pipe blade server thermal management system of claim 3, wherein said evaporator section is mounted on an upper surface of a CPU of the server via a U-shaped half-ring fastener, both ends of said U-shaped half-ring fastener are connected to a side surface of the CPU, and the evaporator section is inserted into a gap between the upper surface of the CPU and the U-shaped half-ring fastener.
5. The pulsating heat pipe blade server thermal management system of claim 4, wherein said cycle fluid is deionized distilled water.
6. A pulsating heat pipe blade server thermal management system as in claim 5, wherein said U-shaped half-ring is made of copper.
CN202010991592.3A 2020-09-18 2020-09-18 Pulsating heat pipe type blade server thermal management system Active CN112105231B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010991592.3A CN112105231B (en) 2020-09-18 2020-09-18 Pulsating heat pipe type blade server thermal management system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010991592.3A CN112105231B (en) 2020-09-18 2020-09-18 Pulsating heat pipe type blade server thermal management system

Publications (2)

Publication Number Publication Date
CN112105231A true CN112105231A (en) 2020-12-18
CN112105231B CN112105231B (en) 2024-08-27

Family

ID=73759064

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010991592.3A Active CN112105231B (en) 2020-09-18 2020-09-18 Pulsating heat pipe type blade server thermal management system

Country Status (1)

Country Link
CN (1) CN112105231B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114269110A (en) * 2021-12-01 2022-04-01 南京工业大学 Separated pulsating heat pipe transmission device for heat recovery

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103196116A (en) * 2012-01-06 2013-07-10 中国计量学院 Improved gravity assisted heat pipe radiator used for high-power LED
CN110455106A (en) * 2019-08-20 2019-11-15 上海理工大学 A kind of radiator with three-dimensional pulsating heat pipe
CN111664733A (en) * 2020-05-18 2020-09-15 广东工业大学 Heat radiator combining micro-channel heat exchanger with heat pipe
CN213462750U (en) * 2020-09-18 2021-06-15 广东工业大学 Pulsating heat pipe type blade server heat management system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103196116A (en) * 2012-01-06 2013-07-10 中国计量学院 Improved gravity assisted heat pipe radiator used for high-power LED
CN110455106A (en) * 2019-08-20 2019-11-15 上海理工大学 A kind of radiator with three-dimensional pulsating heat pipe
CN111664733A (en) * 2020-05-18 2020-09-15 广东工业大学 Heat radiator combining micro-channel heat exchanger with heat pipe
CN213462750U (en) * 2020-09-18 2021-06-15 广东工业大学 Pulsating heat pipe type blade server heat management system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114269110A (en) * 2021-12-01 2022-04-01 南京工业大学 Separated pulsating heat pipe transmission device for heat recovery
CN114269110B (en) * 2021-12-01 2024-01-12 南京工业大学 Separated pulsating heat pipe transmission device for heat recovery

Also Published As

Publication number Publication date
CN112105231B (en) 2024-08-27

Similar Documents

Publication Publication Date Title
CN104851857B (en) A kind of chip-cooling system
JP3169627U (en) Cooling device heat dissipation structure
CN105682426B (en) A kind of heat-exchanger rig suitable for communication base station cabinet
CN106855741A (en) A kind of heat abstractor and system for blade server chip
CN111988965B (en) High-heating electronic equipment immersion type phase change cooling cabinet
CN115185357A (en) Active and passive coupling heat dissipation system and method in limited space
CN213462750U (en) Pulsating heat pipe type blade server heat management system
CN112105231B (en) Pulsating heat pipe type blade server thermal management system
CN114003111A (en) Heat dissipation equipment for computer chip
CN1278202C (en) Liquid-circulating refrigeration system for computer heat radiation
CN106132177A (en) A kind of cooling system of inverter
CN201039655Y (en) Heat radiator structure
CN116096055A (en) Radiator with sealing plate
CN201893331U (en) Heat dissipation structure
CN214384718U (en) Heat radiator for be used for memory disc
CN101022717A (en) Liquid self-loop composite heat pipe radiating device used for electronic equipment
CN207602555U (en) A kind of channel-type water-filled radiator
CN104733603A (en) Heat pipe exchanger used for heat radiation of semiconductor chip
CN216210892U (en) Forced air cooling heat dissipation device for computer chip
CN220307674U (en) Water cooling structure of power supply module
CN218183789U (en) Annular heat dissipation device
CN218273313U (en) Air-cooling and water-cooling combined heat dissipation equipment for computer chip
CN216982355U (en) Power module heat dissipation device based on heat pipe technology
CN204333037U (en) For the heat exchange of heat pipe of semiconductor chip heat radiation
CN219716061U (en) Heat dissipation assembly

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant