CN112105231A - Pulsating heat pipe type blade server heat management system - Google Patents
Pulsating heat pipe type blade server heat management system Download PDFInfo
- Publication number
- CN112105231A CN112105231A CN202010991592.3A CN202010991592A CN112105231A CN 112105231 A CN112105231 A CN 112105231A CN 202010991592 A CN202010991592 A CN 202010991592A CN 112105231 A CN112105231 A CN 112105231A
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- section
- heat
- working medium
- evaporation section
- management system
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Links
- 238000001704 evaporation Methods 0.000 claims abstract description 47
- 230000008020 evaporation Effects 0.000 claims abstract description 43
- 238000009833 condensation Methods 0.000 claims abstract description 27
- 230000005494 condensation Effects 0.000 claims abstract description 27
- 238000012545 processing Methods 0.000 claims abstract description 22
- 230000017525 heat dissipation Effects 0.000 claims abstract description 12
- 230000009471 action Effects 0.000 claims abstract description 10
- 230000005484 gravity Effects 0.000 claims abstract description 10
- 238000012546 transfer Methods 0.000 claims abstract description 5
- 239000012153 distilled water Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a pulsating heat pipe type blade server heat management system which comprises an evaporation section, a condensation section and a circulating working medium, wherein the evaporation section is a flat pipe; the flat surface of the evaporation section is in contact with the upper surface of the central processing unit of the server, and the evaporation section completely covers the upper surface of the central processing unit; two ends of the condensing section are communicated with two ends of the evaporating section, and the upper part of the condensing section extends out of the case of the server; the circulating working medium is filled in the evaporation section and the condensation section, the circulating working medium of the evaporation section absorbs heat generated by the central processing unit, is vaporized into steam and vertically flows upwards to the condensation section, and the circulating working medium of the condensation section transfers heat outwards to reduce the temperature and flows back to the evaporation section under the action of self gravity to form a self-circulation heat dissipation heat loop structure. The invention utilizes the gravity action to drive the circulating working medium to flow back, can convey heat outside the case to release without inputting external energy, and has the advantages of high heat exchange efficiency, good heat dissipation efficiency and low energy consumption.
Description
Technical Field
The invention relates to a thermal management system, in particular to a pulsating heat pipe type blade server thermal management system.
Background
With the gradual development of information technology, the processing capacity and speed of data center processing are required to be higher and higher in the information industry. The existing blade server has the advantage of strong processing capability, so that a large amount of data can be processed quickly; the power consumption of the corresponding blade server is also large, a large amount of heat can be generated, and the high heat productivity of the server becomes a great hidden trouble for the safe and stable operation of the data center.
Cooling of a blade server is mainly performed by cooling equipment to cool the indoor temperature of the server, and then cooling air is blown to the server by a fan to cool the server. Although the mode can simultaneously dissipate heat of the server in a large area, the heat exchange efficiency is low, the heat dissipation effect is general, the electric energy consumption is high, and the heat dissipation cost is high.
Disclosure of Invention
The invention aims to solve the problems and provides a pulsating heat pipe type blade server heat management system with high heat exchange efficiency, good heat dissipation efficiency and low energy consumption. The system can spontaneously bring the heat generated by the server to the environment outside the case by utilizing the gravity action and the phase change of the pulsating heat pipe, and can replace a fan in the case and reduce the cold consumption in the environment.
The purpose of the invention can be achieved by adopting the following technical scheme:
a pulse heat pipe type blade server heat management system comprises an evaporation section, a condensation section and a circulating working medium, wherein the evaporation section is a flat pipe; the flat surface of the evaporation section is in contact with the upper surface of the central processing unit of the server, and the evaporation section completely covers the upper surface of the central processing unit; the condensing section is a circular pipe, the condensing section is vertically arranged, two ends of the condensing section are communicated with two ends of the evaporating section, and the upper part of the condensing section extends out of the case of the server; the circulating working medium is filled in the evaporation section and the condensation section, the circulating working medium of the evaporation section absorbs heat generated by the central processing unit, is vaporized into steam and vertically flows upwards to the condensation section, and the circulating working medium of the condensation section transfers heat outwards to reduce the temperature and flows back to the evaporation section under the action of self gravity to form a self-circulation heat dissipation heat loop structure.
Preferably, a fan for blowing the condensing section is arranged outside the chassis of the server.
Preferably, porous capillary tubes are arranged in the evaporation section and the condensation section.
As a preferred scheme, the evaporation section is installed on the upper surface of a central processing unit of the server through a U-shaped half ring buckle, two ends of the U-shaped half ring buckle are connected with the side surface of the central processing unit, and the evaporation section is inserted into a gap between the upper surface of the central processing unit and the U-shaped half ring buckle.
As a preferred scheme, the circulating working medium is deionized distilled water working medium.
Preferably, the U-shaped semi-ring buckle is made of copper.
The implementation of the invention has the following beneficial effects:
1. when the circulating working medium reaches the condensation end, the gas plug releases heat and then becomes short, the gas plug is condensed into liquid to flow back, the pressure at the condensation end is reduced, and then the liquid at the condensation end flows back to the evaporation section under the action of self gravity. The whole process drives the circulation working medium to flow back under the action of gravity, heat can be conveyed to the outside of the case to be released without external energy input, and the problems of high power consumption of a centrifugal fan in the case of the traditional blade server and dust, noise and local overheating caused by use are greatly reduced.
2. The evaporation section dissipates heat of a central processing unit and a memory of the blade server, and the pulsating heat pipe has more advantages in heat dissipation in electronic equipment due to the fact that the pulsating heat pipe is 20% -30% higher than a common sintering heat pipe and is smaller and more flexible in size.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a pulsating heat pipe blade server thermal management system according to the present invention.
Fig. 2 is a schematic view of the internal mounting structure of fig. 1.
FIG. 3 is a schematic diagram of a connection structure between an evaporation section of the pulsating heat pipe type blade server thermal management system and a central processing unit of a server according to the present invention.
Fig. 4 is a side view of fig. 3.
FIG. 5 is a schematic structural diagram of a self-circulation heat dissipation loop structure of the pulse heat pipe blade server thermal management system according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Examples
Referring to fig. 1 to 5, the present embodiment relates to a pulsating heat pipe type blade server thermal management system, including an evaporation section 1, a condensation section 2 and a cycle medium, where the evaporation section 1 is a flat pipe; the flat surface of the evaporation section 1 is in contact with the upper surface of the central processor 10 of the server, and the evaporation section 1 completely covers the upper surface of the central processor 10; the condensing section 2 is a circular pipe, the condensing section 2 is vertically arranged, two ends of the condensing section 2 are communicated with two ends of the evaporating section 1, and the upper part of the condensing section 2 extends out of the case 11 of the server; the circulating working medium is filled in the evaporation section 1 and the condensation section 2, the circulating working medium of the evaporation section 1 absorbs heat generated by the central processing unit 10, is vaporized into steam and vertically flows upwards to the condensation section 2, and the circulating working medium of the condensation section 2 transfers heat outwards to reduce the temperature and flows back to the evaporation section 1 under the action of self gravity to form a self-circulation heat dissipation loop structure. The evaporation section 1 is in a flat tubular shape, so that the evaporation section 1 has a larger contact area with the central processing unit, the heat exchange efficiency and the temperature uniformity are improved, and the heat absorption efficiency is better than that of a common round tubular evaporator. The vertical section of the condensation section 2 accounts for 87.43% of the total length, and the horizontal section of the condensation section adopts circular arc transition, so that the pressure loss is reduced.
When the circulating working medium reaches the condensation end, the steam plug releases heat and then becomes short, the steam plug is condensed into liquid to flow back, the pressure at the condensation end is reduced, and then the liquid at the condensation end flows back to the evaporation section 1 under the action of self gravity. The whole process drives the circulation working medium to flow back under the action of gravity, heat can be conveyed to the outside of the case 11 to be released without external energy input, and the problems of high power consumption of a centrifugal fan in the traditional blade server case, dust, noise and local overheating caused by use are greatly reduced.
And a fan for blowing the condensing section 2 is arranged outside the chassis of the server, and the heat of the condensing section 2 is transferred to the environment outside the chassis.
Capillary tubes are arranged in the evaporation section 1 and the condensation section 2. The capillary has larger capillary force, can reduce flow resistance, enables the circulation loop to operate more efficiently, and ensures the stability of system operation.
As shown in fig. 3 and 4, the evaporation section 1 is installed on the upper surface of the central processing unit 10 of the server through the U-shaped half ring buckle 3, two ends of the U-shaped half ring buckle 3 are connected with the side surface of the central processing unit 10, the evaporation section 1 is inserted into the gap 31 between the upper surface of the central processing unit 10 and the U-shaped half ring buckle 3, and the U-shaped half ring buckle 3 is in contact with the evaporation section 1. The U-shaped semi-ring buckle 3 is made of copper. When the heat-radiating device works, a part of heat absorbed by the evaporation section 1 is transferred to the U-shaped half ring buckle 3, so that the heat-radiating area is increased, and the heat-radiating effect is improved.
The circulating working medium is deionized distilled water working medium. The deionized distilled water working medium has higher latent heat of vaporization and lower viscosity, and can effectively ensure the heat transfer efficiency. During low-power heat dissipation, the vertical pipe of the condensation section 2 can take away heat by utilizing phase change heat exchange; when the high-power heat dissipation is performed, the circulating working medium in the evaporation section 1 is vaporized to generate larger air pressure, so that the circulating flow is promoted, the heat exchange is increased, and the heat exchange effect and the temperature uniformity are improved.
While the invention has been described in connection with what is presently considered to be the most practical and preferred embodiment, it is to be understood that the invention is not to be limited to the disclosed embodiment, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
Claims (6)
1. A pulse heat pipe type blade server heat management system is characterized by comprising an evaporation section, a condensation section and a circulating working medium, wherein the evaporation section is a flat pipe; the flat surface of the evaporation section is in contact with the upper surface of the central processing unit of the server, and the evaporation section completely covers the upper surface of the central processing unit; the condensing section is a circular pipe, the condensing section is vertically arranged, two ends of the condensing section are communicated with two ends of the evaporating section, and the upper part of the condensing section extends out of the case of the server; the circulating working medium is filled in the evaporation section and the condensation section, the circulating working medium of the evaporation section absorbs heat generated by the central processing unit, is vaporized into steam and vertically flows upwards to the condensation section, and the circulating working medium of the condensation section transfers heat outwards to reduce the temperature and flows back to the evaporation section under the action of self gravity to form a self-circulation heat dissipation heat loop structure.
2. The pulsating heat pipe blade server thermal management system of claim 1, wherein a fan is disposed outside the server chassis for blowing the condenser section.
3. A pulsating heat pipe blade server thermal management system as in claim 2, wherein porous capillaries are provided in said evaporator section and condenser section.
4. The pulsating heat pipe blade server thermal management system of claim 3, wherein said evaporator section is mounted on an upper surface of a CPU of the server via a U-shaped half-ring fastener, both ends of said U-shaped half-ring fastener are connected to a side surface of the CPU, and the evaporator section is inserted into a gap between the upper surface of the CPU and the U-shaped half-ring fastener.
5. The pulsating heat pipe blade server thermal management system of claim 4, wherein said cycle fluid is deionized distilled water.
6. A pulsating heat pipe blade server thermal management system as in claim 5, wherein said U-shaped half-ring is made of copper.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010991592.3A CN112105231B (en) | 2020-09-18 | 2020-09-18 | Pulsating heat pipe type blade server thermal management system |
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CN202010991592.3A CN112105231B (en) | 2020-09-18 | 2020-09-18 | Pulsating heat pipe type blade server thermal management system |
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CN112105231A true CN112105231A (en) | 2020-12-18 |
CN112105231B CN112105231B (en) | 2024-08-27 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114269110A (en) * | 2021-12-01 | 2022-04-01 | 南京工业大学 | Separated pulsating heat pipe transmission device for heat recovery |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103196116A (en) * | 2012-01-06 | 2013-07-10 | 中国计量学院 | Improved gravity assisted heat pipe radiator used for high-power LED |
CN110455106A (en) * | 2019-08-20 | 2019-11-15 | 上海理工大学 | A kind of radiator with three-dimensional pulsating heat pipe |
CN111664733A (en) * | 2020-05-18 | 2020-09-15 | 广东工业大学 | Heat radiator combining micro-channel heat exchanger with heat pipe |
CN213462750U (en) * | 2020-09-18 | 2021-06-15 | 广东工业大学 | Pulsating heat pipe type blade server heat management system |
-
2020
- 2020-09-18 CN CN202010991592.3A patent/CN112105231B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103196116A (en) * | 2012-01-06 | 2013-07-10 | 中国计量学院 | Improved gravity assisted heat pipe radiator used for high-power LED |
CN110455106A (en) * | 2019-08-20 | 2019-11-15 | 上海理工大学 | A kind of radiator with three-dimensional pulsating heat pipe |
CN111664733A (en) * | 2020-05-18 | 2020-09-15 | 广东工业大学 | Heat radiator combining micro-channel heat exchanger with heat pipe |
CN213462750U (en) * | 2020-09-18 | 2021-06-15 | 广东工业大学 | Pulsating heat pipe type blade server heat management system |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114269110A (en) * | 2021-12-01 | 2022-04-01 | 南京工业大学 | Separated pulsating heat pipe transmission device for heat recovery |
CN114269110B (en) * | 2021-12-01 | 2024-01-12 | 南京工业大学 | Separated pulsating heat pipe transmission device for heat recovery |
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CN112105231B (en) | 2024-08-27 |
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