CN202257414U - Novel laptop radiator - Google Patents
Novel laptop radiator Download PDFInfo
- Publication number
- CN202257414U CN202257414U CN2011202502305U CN201120250230U CN202257414U CN 202257414 U CN202257414 U CN 202257414U CN 2011202502305 U CN2011202502305 U CN 2011202502305U CN 201120250230 U CN201120250230 U CN 201120250230U CN 202257414 U CN202257414 U CN 202257414U
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- heat
- heat pipe
- laptop
- radiator
- radiating
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A novel laptop radiator integrates a semiconductor refrigerating sheet, a heat pipe and a radiating fin and is pasted on the surface of a heating element of a laptop through silica gel. When the laptop normally works, heat generated by a main heating element inside the laptop is transferred to a heat absorbing surface of the semiconductor refrigerating sheet, then rapidly converged to a heat delivery surface of the semiconductor refrigerating sheet, and finally transferred to an evaporation section of the heat pipe to enable a working medium in the evaporation section of the heat pipe to absorb heat and evaporate. Under effects of differential pressure, steam rapidly flows to a condensation section of the heat pipe and enables heat to be rapidly and efficiently discharged to environment by aid of the radiating fin. Under the capillary suction force effect of an imbibition core of the inner wall of a heat pipe casing, the working medium in the condensation section of the heat pipe flows back to the evaporation section of the heat pipe to continuously absorb the heat. By means of the circulation, the heat is continuously delivered from a high temperature position to a low temperature position, and radiating requirements of the laptop with high performance are met. The novel laptop radiator has the advantages of guaranteeing radiating effects of the laptop, and fundamentally solving the problem of large fan noise, low radiating efficiency and the like.
Description
Technical field
The utility model relates to a kind of novel notebook PC radiator.This heating radiator is integrated by semiconductor chilling plate, heat pipe and radiating fin, and is pasted on notebook computer heater element surface through silica gel.When guaranteeing the notebook computer radiating effect, fundamentally solve problems such as its radiating efficiency is low, noise is big, belong to heat dissipation equipment manufacturing technology field.
Background technology
For all electronic equipments, the generation of used heat is inevitable.If used heat can not in time be got rid of, it will directly influence the operate as normal of electronic equipment.At present, surpassing the main cause that 55% electronic equipment lost efficacy is because its working temperature is too high.This shows, electronic equipment fast, high efficiency and heat radiation is particularly important.Along with notebook computer chip integration, packaging density and frequency of operation improve constantly; Single chip energy consumption strengthens; The compact equipment design makes the notebook computer heat radiation difficult more; And the runnability and the serviceable life of radiating effect and notebook computer chip are closely related, thus the high-performance notebook computer press for adopt new Refrigeration Technique scheme realize equipment fast, high efficiency and heat radiation, and then make notebook computer safety, stable operation.The inner heat that produces of notebook computer is mainly from CPU, board chip set, video card, hard disk and internal memory.Because hard disk high-temperature stability and internal memory generation heat is few, so hard disk and internal memory do not need special heat radiation.Wind-cooling heat dissipating is a kind of radiating mode that present notebook computer is the simplest, application is the most general, but there are problems such as radiating efficiency is low, noise is big in it, and this traditional heat-dissipating mode more and more can not satisfy the heat radiation requirement of high-performance notebook computer.Novel notebook PC radiator has fast, the high efficiency and heat radiation performance, can fundamentally solve problems such as the notebook computer radiating efficiency is low, noise is big.
Summary of the invention
The utility model technical matters to be solved is in order to overcome problems such as the notebook computer radiating efficiency is low, noise is big, a kind of novel notebook PC radiator to be provided.For solving the problems of the technologies described above, the notebook PC radiator that the utility model provides comprises semiconductor chilling plate, heat pipe and radiating fin.Wherein heat pipe is made up of housing, capillary wick, actuating medium, and capillary wick is close to the thermotube shell inwall.Silica gel is a kind of high activity sorbing material, belongs to amorphous substance, has characteristics such as absorption property height, Heat stability is good, stable chemical performance.Novel notebook PC radiator is characterised in that by the good thermal conductivity of silica gel; Be pasted on the heat-absorbent surface of three semiconductor chilling plates respectively the heating surface of CPU, board chip set and the video card chip of notebook computer; The heat delivery surface of each semiconductor chilling plate closely pastes with the evaporator section of three heat pipes through silica gel mutually; The condensation segment of corresponding three heat pipes all is pooled to the original fan of notebook computer place; And arrange radiating fin at the outside surface of three heat pipe condenser sections, further strengthen its heat-sinking capability.
Novel notebook PC radiator technical characterstic is mainly reflected in following three aspects: (1) compact conformation: novel notebook PC radiator is combined by semiconductor chilling plate, heat pipe and radiating fin, and volume is little, in light weight; (2) noise is low: air-cooled relatively heat dissipation type notebook computer, novel notebook PC radiator have been eliminated the noise that fan produces; (3) efficient is high: novel notebook PC radiator has fundamentally improved the radiating efficiency of notebook computer through the combination of semiconductor refrigerating technology and high-efficiency heat pipe heat dissipation technology.
Description of drawings
Fig. 1 is the structural representation of the utility model instance.
Fig. 2 is novel notebook PC radiator general structure synoptic diagram.
Each several part is among the figure: 1-CPU, 2-semiconductor chilling plate heat-absorbent surface, 3-semiconductor chilling plate, 4-semiconductor chilling plate heat delivery surface, 5-heat pipe evaporator section, 6-heat pipe, 7-heat pipe condenser section, 8-radiating fin, 9-board chip set, 10-video card chip.
Embodiment
A kind of novel notebook PC radiator mainly comprises semiconductor chilling plate 3, heat pipe 6 and radiating fin 8.When notebook computer normally moved, its inner main heating element (comprising CPU1, board chip set 9, display chip 10) produced quantity of waste heat, these heat transferred and the tight heat-absorbent surface 2 of the semiconductor chilling plate 3 of subsides mutually in notebook computer heater element surface; And then be pooled to the heat delivery surface 4 of semiconductor chilling plate 3 fast; And then pass to and the semiconductor chilling plate heat delivery surface 4 tight evaporator sections 5 of the heat pipes 6 of subsides mutually, make the actuating mediums heat absorption vaporization in the heat pipe evaporator section 5, the local pressure rising; Under differential pressure action; The condensation segment 7 of the fast flow speed and direction heat pipe 6 of steam by radiating fin 8, fast, efficiently is discharged to heat in the environment and goes; Under the wick capillary suction force effect of heat pipe 6 inner walls, the actuating medium in the heat pipe condenser section 7 flows back to heat pipe evaporator section 5 and continues to absorb heat.So circulation, heat constantly is transported to the low temperature place from high temperature, satisfies the radiating requirements of high-performance notebook computer.
Claims (4)
1. a novel notebook PC radiator comprises semiconductor chilling plate, heat pipe and radiating fin, it is characterized in that: this heating radiator is integrated by semiconductor chilling plate, heat pipe and radiating fin, and is pasted on notebook computer heater element surface through silica gel.
2. novel notebook PC radiator according to claim 1 is characterized in that: described semiconductor chilling plate quantity is three, and its heat-absorbent surface is pasted on the heating surface of CPU, board chip set and the video card chip of notebook computer respectively.
3. novel notebook PC radiator according to claim 1 and 2; It is characterized in that: described heat pipe quantity is three; Its evaporator section closely pastes with the heat delivery surface of described three semiconductor chilling plates respectively mutually, and the condensation segment of three heat pipes all is pooled to the original fan of notebook computer place.
4. novel notebook PC radiator according to claim 3 is characterized in that: described radiating fin is arranged in the outside surface of the condensation segment of described three heat pipes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202502305U CN202257414U (en) | 2011-07-06 | 2011-07-06 | Novel laptop radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202502305U CN202257414U (en) | 2011-07-06 | 2011-07-06 | Novel laptop radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202257414U true CN202257414U (en) | 2012-05-30 |
Family
ID=46118625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202502305U Expired - Fee Related CN202257414U (en) | 2011-07-06 | 2011-07-06 | Novel laptop radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202257414U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107943250A (en) * | 2017-12-05 | 2018-04-20 | 佛山科学技术学院 | Laptop radiating system |
| CN108156403A (en) * | 2017-12-22 | 2018-06-12 | 安徽省鑫林电器科技有限公司 | A kind of housing of TV set with good heat radiating function |
-
2011
- 2011-07-06 CN CN2011202502305U patent/CN202257414U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107943250A (en) * | 2017-12-05 | 2018-04-20 | 佛山科学技术学院 | Laptop radiating system |
| CN108156403A (en) * | 2017-12-22 | 2018-06-12 | 安徽省鑫林电器科技有限公司 | A kind of housing of TV set with good heat radiating function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20130706 |