CN201327845Y - Cooling device used for semiconductor temperature difference electricity generation module - Google Patents

Cooling device used for semiconductor temperature difference electricity generation module Download PDF

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Publication number
CN201327845Y
CN201327845Y CNU2008201396133U CN200820139613U CN201327845Y CN 201327845 Y CN201327845 Y CN 201327845Y CN U2008201396133 U CNU2008201396133 U CN U2008201396133U CN 200820139613 U CN200820139613 U CN 200820139613U CN 201327845 Y CN201327845 Y CN 201327845Y
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CN
China
Prior art keywords
generation module
radiator
temperature difference
condenser
cooling device
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Expired - Fee Related
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CNU2008201396133U
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Chinese (zh)
Inventor
周正
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WUXI MINGHUITONG SCIENCE AND TECHNOLOGY Co Ltd
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WUXI MINGHUITONG SCIENCE AND TECHNOLOGY Co Ltd
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Priority to CNU2008201396133U priority Critical patent/CN201327845Y/en
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Abstract

The utility model provides a comparatively efficient cooling device used for a semiconductor temperature difference electricity generation module. The cooling device comprises a metal heat radiator and a metal condenser that are communicated with each other, wherein the heat radiator is mounted on the cold end surface of the semiconductor temperature difference electricity generation module, the condenser is positioned higher than the heat radiator, and a cavity of the heat radiator is filled with cooling fluid. Based on a characteristic of the biggish latent heat of liquid phase change, the cooling fluid can absorb more heat from the cold end surface of the semiconductor temperature difference electricity generation module, and further increase temperature difference on the cold end surface of the semiconductor temperature difference electricity generation module so as to achieve a better effect of generating electricity by utilizing the residual heat. Meanwhile, the cooling liquid flows circularly and needs no power, so that the device has the advantages of no medium loss and leakage, energy conservation and environmental protection.

Description

The cooling device that is used for semi-conductor thermo-electric generation module
Technical field
The utility model relates to a kind of cooling device, particularly a kind of cooling device that is used for semi-conductor thermo-electric generation module.
Background technology
Along with the development of Domestic Automotive Industry, the fuel amount that vehicle consumes is huge, but about 60% energy is not effectively used in the fuel oil, and the overwhelming majority is discharged in the atmosphere with the form of used heat, has caused the waste and the environmental pollution of fuel oil.The existing at present semiconductor thermo-electric generation apparatus that is directed to the using waste heat from tail gas of internal combustion engine recovery invents, the thermoelectric effect of utilizing the solid semiconductor material is carried out the principle of thermo-electric generation and the engine exhaust heat designed reclaims temperature difference electricity generation device, the quality of its effect is decided by the temperature difference of semi-conductor thermo-electric generation module both sides, the temperature difference is big more, and its utilization rate of waste heat is high more, effect is good more.
The utility model content
The purpose of this utility model provides a kind of cooling device that is used for semi-conductor thermo-electric generation module, and being intended to provides a kind of cooling system more efficiently to the exhaust gases of internal combustion engines semiconductor thermoelectric generating system for recycling waste heat.
The purpose of this utility model is to be achieved through the following technical solutions:
A kind of cooling device that is used for semi-conductor thermo-electric generation module, comprise the metal radiator and the condenser that are interconnected, radiator is installed in the cold junction face of semi-conductor thermo-electric generation module, and the condenser installation site is higher than radiator, is filled with cooling fluid in the cavity of radiator.
Further described cooling fluid boiling point is lower than 100 ℃.
The top of further described radiator and condenser overhead, radiator bottom and condenser bottom are communicated with.
The further described radiator and the condenser outside all are covered with thin fin.
Further described radiator and condenser radiator and condenser internal cavities are cuboid.
The beneficial effects of the utility model are, the cooling liquid boiling point in the radiator is lower, utilizes the bigger characteristics of liquid phase-change latent heat, and radiator can absorb more heat from the cold junction face of semi-conductor thermo-electric generation module; Steam after the evaporation does not just dispel the heat in radiator, more is to enter into to be condensed into liquid behind the condenser and to dispel the heat, and has overcome the problem of radiator because of area, volume restrictions heat-sinking capability deficiency; Liquid circulation flows, and need not power, no dielectric loss, leakage, energy-conserving and environment-protective.
Description of drawings
With embodiment the utility model is described in further detail with reference to the accompanying drawings below.
Fig. 1 is the utility model structural representation;
Among the figure:
1, radiator; 2, condenser; 3, catheter; 4, wireway; 5,6, thin fin; 7, semi-conductor thermo-electric generation module.
Embodiment
As shown in Figure 1, the cooling device that is used for semi-conductor thermo-electric generation module described in the utility model, comprise the radiator 1 and the condenser 2 that are interconnected, radiator 1 is the cuboid that adopts metal material to make, for obtaining better heat-transfer effect, preferably copper and aluminium material, there is rectangular cavity in portion within it, and charges into cooling fluid; Radiator 1 one sides are smooth plane, and this simultaneously is attached on the cold junction face of semi-conductor thermo-electric generation module 7, and opposite side is covered with thin fin 6, in order to the heat exchange area of increase with air; The top of radiator 1 cavity is communicated to the top of condenser 2 by a wireway 4, and the bottom of radiator 1 cavity is communicated to the bottom of condenser 2 by a catheter 3; The structure of condenser 2 is identical with the structure of radiator, and the surface is covered with thin fin 5 and comes enhance heat, and the installation site of condenser 2 can be determined on a case-by-case basis, as long as guarantee to be positioned at the top of radiator 1; Cooling fluid in radiator 1 cavity, be characterized in that boiling point is lower, can evaporate behind the heat that absorption semiconductor module 7 cold junction faces transmit, because evaporation back radiator 1 cavity internal pressure rises, steam relies on the pressure effect to enter the cavity of condenser 2 by wireway 4, because it is liquid with vapor condensation that condenser 2 carries out heat exchange with air, liquid flow back in the radiator 1 along the catheter of opening in condenser 2 cavity bottom 3 owing to the action of gravity meeting, liquid is reuptaked heat again and is evaporated, and through such circulation heat all is dispersed in the air.
This device utilizes the bigger characteristics of liquid phase-change latent heat, can be from the cold junction face of semi-conductor thermo-electric generation module Absorb more heat, the steam after the evaporation does not just dispel the heat in radiator, more is to enter into condensation Be condensed into liquid behind the device and dispel the heat, it is hypodynamic because of area, volume restrictions heat radiation energy to have overcome radiator Problem; Can further improve the temperature difference of the cold and hot end face of semi-conductor thermo-electric generation module, thereby obtain better Utilize the generating effect of waste heat, liquid circulation flows simultaneously, need not power, no dielectric loss, leakage, Energy-conserving and environment-protective.

Claims (5)

1, a kind of cooling device that is used for semi-conductor thermo-electric generation module, it is characterized in that comprising the metal radiator and the condenser that are interconnected, radiator is installed in the cold junction face of semi-conductor thermo-electric generation module, and the condenser installation site is higher than radiator, is filled with cooling fluid in the cavity of radiator.
2,, it is characterized in that described cooling fluid boiling point is lower than 100 ℃ according to the claim 1 described cooling device that is used for semi-conductor thermo-electric generation module.
3,, it is characterized in that the top of described radiator and condenser overhead, radiator bottom and condenser bottom are communicated with according to the claim 1 described cooling device that is used for semi-conductor thermo-electric generation module.
4,, it is characterized in that described radiator and the condenser outside all is covered with thin fin according to the claim 1 described cooling device that is used for semi-conductor thermo-electric generation module.
5, be used for the cooling device of semi-conductor thermo-electric generation module according to claim 1 to 4 described any, it is characterized in that described radiator and condenser internal cavities are cuboid.
CNU2008201396133U 2008-10-28 2008-10-28 Cooling device used for semiconductor temperature difference electricity generation module Expired - Fee Related CN201327845Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008201396133U CN201327845Y (en) 2008-10-28 2008-10-28 Cooling device used for semiconductor temperature difference electricity generation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008201396133U CN201327845Y (en) 2008-10-28 2008-10-28 Cooling device used for semiconductor temperature difference electricity generation module

Publications (1)

Publication Number Publication Date
CN201327845Y true CN201327845Y (en) 2009-10-14

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CNU2008201396133U Expired - Fee Related CN201327845Y (en) 2008-10-28 2008-10-28 Cooling device used for semiconductor temperature difference electricity generation module

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102064747A (en) * 2011-01-27 2011-05-18 长兴奔能燃具有限公司 Micro-voltage generating device
CN103618479A (en) * 2013-12-19 2014-03-05 东南大学 Power-generating and energy-storing system based on waste heat of diesel generating set of South-Pole astronomical observation station in South Pole
CN108784228A (en) * 2018-07-09 2018-11-13 南京航空航天大学 Thermal insulation cup electricity generation system based on thermosiphon principle and method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102064747A (en) * 2011-01-27 2011-05-18 长兴奔能燃具有限公司 Micro-voltage generating device
CN102064747B (en) * 2011-01-27 2013-09-04 长兴奔能燃具有限公司 Micro-voltage generating device
CN103618479A (en) * 2013-12-19 2014-03-05 东南大学 Power-generating and energy-storing system based on waste heat of diesel generating set of South-Pole astronomical observation station in South Pole
CN103618479B (en) * 2013-12-19 2015-08-19 东南大学 Based on generating and the energy-storage system of South Pole astronomic station diesel generating set waste heat
CN108784228A (en) * 2018-07-09 2018-11-13 南京航空航天大学 Thermal insulation cup electricity generation system based on thermosiphon principle and method

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Granted publication date: 20091014

Termination date: 20131028