CN101022717A - Liquid self-loop composite heat pipe radiating device used for electronic equipment - Google Patents
Liquid self-loop composite heat pipe radiating device used for electronic equipment Download PDFInfo
- Publication number
- CN101022717A CN101022717A CN 200710064697 CN200710064697A CN101022717A CN 101022717 A CN101022717 A CN 101022717A CN 200710064697 CN200710064697 CN 200710064697 CN 200710064697 A CN200710064697 A CN 200710064697A CN 101022717 A CN101022717 A CN 101022717A
- Authority
- CN
- China
- Prior art keywords
- condenser
- heat
- liquid
- pipe
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat radiation device of liquid self-circulation composite heat tube used on electronic component is prepared as arranging bottom condenser below top condenser; connecting bottom condenser with heat absorption container, top condenser, stream supplying tube and liquid returning tube to be an integral unit for forming a closed space, using mainly bottom condenser to radiate heat when heating amount is small and using top and bottom condensers simultaneously to radiate heat when heating amount is big for making said heat radiation device be always on excellent effect of heat radiation.
Description
Technical field
The present invention relates to the radiator, the particularly composite heat pipe radiating device of liquid self-loopa of used for electronic device in the products such as microcomputer, projecting apparatus, power supply, semiconductor device, power device, belong to the heat radiation field.
Background technology
(radiator that electronic device such as CPU generally uses at present is the Luftgekuhlte rotierende radiator to central processing unit (CPU), the heat transferred of sending during the work of electronic devices such as CPU is installed in aluminium alloy or the copper alloy heatsink on its heat-delivery surface, when air leans on the mode of free convection or fan forced convection to flow through fin surface heat is taken away, reached the purpose of electronic devices such as cooling CPU.Raising along with the electronic device performance, the continuous increase of special CPU frequency, its caloric value is also increasing, and traditional air-cooled radiator seems more and more and be difficult to the heat radiation requirement of competent high-performance electronic device that the increase of power consumption and pneumatic noise simultaneously also brings some negative effects to its use.In the prior art, the heat-carrying capacity of liquid radiator is much larger than air radiator, and liquid cools electronic devices such as water can improve cooling effect.But traditional liquid radiator needs pump to come circulating fluid, therefore, radiator power consumption and produce problem such as noise and also still exist, the leak of liquid harm of coming out to electronic equipment simultaneously also is fatal.
For this reason, Chinese invention patent 03137282.1 proposes a kind of no pump liquid heat dissipating method and device thereof that is used for microelectronic component, as shown in Figure 3, it adopt a kind of low boiling, heat-carrying agent 3 nontoxic, that do not fire pack into the heat absorption container 2 in, this heat absorption container 2 becomes the inner confined space of formation that links into an integrated entity with terminal radiator 9, absorb the caloric value of microelectronic component with thermal liquid, the outer surface of radiator is dispersed into heat in the surrounding air, and the drop after the heat radiation is back to formation heat radiation process circulation in the heat absorption container along the inwall of terminal radiator 9 and tube connector 8.This invention has the effect of liquid cools, saves pump again, not only good heat dissipation effect, and not power consumption, noiseless, and wherein the low boiling thermal liquid at room temperature encloses gaseous state, also electronic equipment is not produced harm even leak.
The heat-carrying agent 3 of above-mentioned no pump liquid heat abstractor need be vaporized in heat absorption container 2, just can rise in the terminal radiator through tube connector 8 and dispel the heat, and is condensed into liquid after the heat radiation again, flows in the heat absorption container through tube connector again.The live load of electronic device is dynamic change, and generally, live load is light more, and its caloric value is more little, and electronic product often considerable time works under light load.Under the less situation of caloric value, the amount of thermal liquid vaporization is very little, the resistance that this part steam can't overcome in the whole runner is diffused in the whole terminal radiator, and mainly be trapped in the heat absorption container no liquid part, tube connector and the terminal radiator that occupy near the part of tube connector, make terminal radiator not bring into play thermolysis fully and influence the radiating effect of whole device.
Summary of the invention
In order to overcome above-mentioned problems of the prior art, a kind of liquid self-loop composite heat pipe radiating device that is applicable to electronic device is proposed, improve above-mentioned no pump liquid heat abstractor at device heating amount radiating effect hour, it can all have good performance of heat dissipation in the caloric value scope of broadness and under the situation of big heat flow.
In order to realize above-mentioned goal of the invention, technical scheme of the present invention realizes as follows:
This device comprises heat absorption container 2, steam delivery tube 6, liquid back pipe 5 and the last condenser 7 that fills low-boiling point liquid heat-carrying agent 3, it is characterized in that: also comprise the following condenser 4 that is contained in condenser 7 belows, following condenser 4 and heat absorption container 3, go up condenser 7, steam delivery tube 6, liquid back pipe 5 and be connected as a single entity the inner confined space that forms.
After the heat absorption container absorbs the caloric value of electronic device, the heat-carrying agent vaporization, its steam is full of condenser, following condenser inner surface, produce heat exchange with the air of condenser outer surface, heat-carrying agent after the heat radiation is re-condensed into liquid, inwall along condenser inner surface and tube connector is back in the heat absorption container, constitutes the circulation of heat radiation process.When caloric value hour, heat mainly sheds by condenser down, when caloric value was big, heat shed by last condenser and following condenser simultaneously.
Liquid self-loop composite heat pipe radiating device of the present invention, following condenser can be used as the part chamber wall of heat absorption container, or with heat absorption container welding or be tightened to one, itself and air contact side have radiated rib.
Liquid self-loop composite heat pipe radiating device of the present invention, steam delivery tube, liquid back pipe can be same section light-wall pipes, also can be two sections different pipes, can also be U type tubular constructions.
Liquid self-loop composite heat pipe radiating device of the present invention, last condenser can be a pipe string chip architecture, it also can be the structure of pipe contact plate, can also be that two sheet metal compactings or inflation form, latticed or the chip font shape of the chip that thin plate is pressed into, the wall of computer case of electronic device can be used as the radiating surface of condenser.
The present invention is owing to adopted above-mentioned structure, heat absorption container, last condenser, following condenser and steam delivery tube, liquid back pipe are connected as a single entity, make its inner confined space that forms, and condenser is below last condenser down, last condenser, following condenser all are exposed among the air.The thermal liquid of heat absorption in the container of packing into absorbs the caloric value of electronic device, and liquid heat absorption rear section is evaporated to steam.When the electronic device caloric value hour, the amount of thermal liquid vaporization is less, and at this moment steam mainly is full of the top that heat absorption container no liquid occupies, by condenser is diffusing in air with heat down, the bottom of getting back to the heat absorption container is dripped at the drop that is condensed into of following condenser inner surface in steam heat radiation back; When the electronic device caloric value is big, the amount of thermal liquid vaporization is bigger, at this moment steam not only is full of the top that heat absorption container no liquid occupies, and passes through the steam delivery tube ascension in last condenser, and the outer surface by last condenser, following condenser is dispersed into heat in the surrounding air simultaneously.Be condensed into drop after the steam heat radiation in the last condenser, drop is back in the heat absorption container along the inwall of condenser and liquid back pipe.Like this, no matter how electronic device caloric value in the course of the work changes, and can both reach better heat radiating effect by the present invention.Compare with prior art, the present invention has not only that heat-sinking capability is strong, volume is little, energy free consumption, muting characteristics, especially when the heat dissipation capacity dynamic change, remains better heat radiating effect.The present invention is reasonable in design, simple in structure, handling ease, with low cost, and the utmost point is beneficial to be promoted the use of.
The present invention is further illustrated below in conjunction with accompanying drawing and concrete execution mode.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention 1;
Fig. 2 is the structural representation of the embodiment of the invention 2;
Fig. 3 is the structural representation that is used for the no pump liquid heat abstractor of microelectronic component;
Above number in the figure explanation:
1, electronic device, 2, the heat absorption container, 3, heat-carrying agent, 4, condenser down, 5, liquid back pipe, 6, steam delivery tube 7, go up condenser 8, communicating pipe, 9, terminal radiator.
Embodiment
The specific embodiments division is as follows:
Claims (4)
1, a kind of liquid self-loop composite heat pipe radiating device that is used for electronic device, comprise the heat absorption container (2), steam delivery tube (6), liquid back pipe (5) and the last condenser (7) that fill low-boiling point liquid heat-carrying agent (3), it is characterized in that: also comprise the following condenser (4) that is contained in condenser (7) below, following condenser (4) and heat absorption container (3), go up condenser (7), steam delivery tube (6), liquid back pipe (5) and be connected as a single entity the inner confined space that forms.
2, the liquid self-loop composite heat pipe radiating device that is used for electronic device according to claim 1 is characterized in that: described condenser down is with the welding of heat absorption container or be tightened to one, and itself and air contact side have radiated rib.
3. the liquid self-loop composite heat pipe radiating device that is used for electronic device according to claim 1 is characterized in that: described steam delivery tube, liquid back pipe are same section pipe or two sections different pipes, or same section U type pipe.
4. the liquid self-loop composite heat pipe radiating device that is used for electronic device according to claim 1, it is characterized in that: the described condenser of going up is a pipe string chip architecture, or the structure of pipe contact plate, or the platy structure that forms of the compacting of two sheet metals or inflation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710064697 CN101022717A (en) | 2007-03-23 | 2007-03-23 | Liquid self-loop composite heat pipe radiating device used for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710064697 CN101022717A (en) | 2007-03-23 | 2007-03-23 | Liquid self-loop composite heat pipe radiating device used for electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101022717A true CN101022717A (en) | 2007-08-22 |
Family
ID=38710326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710064697 Pending CN101022717A (en) | 2007-03-23 | 2007-03-23 | Liquid self-loop composite heat pipe radiating device used for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101022717A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103081581A (en) * | 2010-08-31 | 2013-05-01 | 日本电气株式会社 | System for cooling electronic device |
| CN103824823A (en) * | 2014-03-10 | 2014-05-28 | 吴鸿平 | Internal source and source adding fluid heat exchange system |
| CN104733603A (en) * | 2015-01-29 | 2015-06-24 | 李静 | Heat pipe exchanger used for heat radiation of semiconductor chip |
| CN104813576A (en) * | 2012-11-29 | 2015-07-29 | 株式会社丰田自动织机 | Inverter device |
-
2007
- 2007-03-23 CN CN 200710064697 patent/CN101022717A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103081581A (en) * | 2010-08-31 | 2013-05-01 | 日本电气株式会社 | System for cooling electronic device |
| CN103081581B (en) * | 2010-08-31 | 2015-08-26 | 日本电气株式会社 | For the system of cooling electronic device |
| CN104813576A (en) * | 2012-11-29 | 2015-07-29 | 株式会社丰田自动织机 | Inverter device |
| CN103824823A (en) * | 2014-03-10 | 2014-05-28 | 吴鸿平 | Internal source and source adding fluid heat exchange system |
| CN103824823B (en) * | 2014-03-10 | 2017-07-18 | 吴鸿平 | Endogenous fluids heat-exchange system |
| CN104733603A (en) * | 2015-01-29 | 2015-06-24 | 李静 | Heat pipe exchanger used for heat radiation of semiconductor chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111642103B (en) | High heat flux porous heat sink flow cooling device | |
| CN104851857B (en) | A kind of chip-cooling system | |
| WO2020155900A1 (en) | Phase change heat radiating device | |
| CN103200803B (en) | A kind of heat radiation device for loop heat pipe having pool boiling | |
| CN103997877B (en) | High-thermal-flux-density temperature-equalization heat-dissipation device | |
| CN100506004C (en) | Remote passive circulating phase-change heat-diffusing method and system | |
| CN104197612B (en) | A kind of high efficiency and heat radiation assembly of semiconductor freezer | |
| CN101363696B (en) | Flat hot pipe for cooling electron device and processing technology thereof | |
| CN101325863A (en) | Radiator for cooling automatic cycle liquid | |
| CN101917835A (en) | Large-power module cooling structure of electric vehicle controller | |
| CN110456893A (en) | A kind of cooling cabinet of enhanced immersion type | |
| CN111083911B (en) | Composite liquid-cooled heat pipe radiator | |
| CN101022717A (en) | Liquid self-loop composite heat pipe radiating device used for electronic equipment | |
| CN201044553Y (en) | Air cooling type microflute group and thermoelectricity composite laser thermal control system | |
| CN201532140U (en) | Circular thermosiphon loop heat pipe radiator | |
| CN201344753Y (en) | Combined flat-plate heat tube radiator with complex cavity | |
| CN210014476U (en) | Radiator, air condensing units and air conditioner | |
| CN112000206A (en) | Heat radiation system based on pump-driven capillary phase change loop | |
| CN201569340U (en) | Flat heating pipe type heat dissipater | |
| CN201571152U (en) | Radiating structure of liquid crystal display television | |
| CN116096055A (en) | Radiator with sealing plate | |
| CN112105231B (en) | Pulsating heat pipe type blade server thermal management system | |
| CN201039645Y (en) | A heat radiation device of liquid recycling compound heat tube for electronic parts | |
| CN104733603B (en) | Heat exchange of heat pipe for semiconductor chip radiating | |
| CN202713879U (en) | Cooling structure for high-power module of electric vehicle controller |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20070822 |