CN110456893A - A kind of cooling cabinet of enhanced immersion type - Google Patents
A kind of cooling cabinet of enhanced immersion type Download PDFInfo
- Publication number
- CN110456893A CN110456893A CN201910680559.6A CN201910680559A CN110456893A CN 110456893 A CN110456893 A CN 110456893A CN 201910680559 A CN201910680559 A CN 201910680559A CN 110456893 A CN110456893 A CN 110456893A
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- Prior art keywords
- cooling
- cabinet
- immersed pump
- heat
- cooling liquid
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention discloses a kind of cooling cabinets of enhanced immersion type, including cabinet casing, mainboard electronic component, immersed pump, heat-exchange device, the insulating and cooling liquid body that cabinet casing internal is 30-70 DEG C filled with a certain amount of boiling point, the mainboard electronic component are completely submerged in cooling liquid；One or more outlet branches pipelines of immersed pump are arranged in below mainboard electronic component one or more heat source, jet stream is formed under the driving force effect of immersed pump, the import of immersed pump is divided into multiple import branch lines, is tightly attached to cabinet casing two sides, drives the cooling liquid forced convection in periphery；The heat-exchange device is located at cabinet casing internal or outer surface, and the heat transfer that cooling liquid gasification is absorbed is into environment.The present invention improves the forced-convection heat transfer ability of mainboard electronic component and cooling liquid, guarantees that heat source temperature control in reasonable range, makes mute cabinet, good cooling effect, improves working performance.
Description
Technical field
The invention patent relates to a kind of cabinets that enhanced immersion type is cooling, belong to the cooling technical field of heat dissipation of computer.
Background technique
With the rapid development of computer technology, the energy consumption of the data center server of high-performance, high-density also constantly increases
Add, the fever of chip and cabinet is also on the rise, and in order to guarantee the normal operation of server, is badly in need of improving the cooling of cabinet inside
Ability.
Air-cooled cooling technology is generallyd use in the prior art, specifically, first passes through heat pipe or other highly heat-conductive materials for core
The heat transfer that piece generates comes out, then by high performance fans or big heat sink by heat loss in the environment.Server exists
The heat flow density of chip is very high when high load capacity works, and the heat conduction efficiency of air is very low, in addition air flow method unevenly holds
It is excessively high to easily lead to mainboard local temperature, influences server normal work.The continuous of power density is climbed in data center machine room simultaneously
Rising keeps the energy consumption for cooling of air-conditioning also increasing, this is not consistent with cooling efficiency, the development trend for reducing cooling cost is improved.
New generation of high density server is also stepped up the consumption of unitary space, if further increase radiator and
The volume of fan will propose bigger challenge to the space of cabinet inside, it is likely that it is unable to satisfy the demand of high-density deployment, because
This needs fundamentally to change the type of cooling.
A kind of chip cluster is disclosed in Chinese patent 201720068028.8 be dipped in the server cooling of liquid cooling apparatus set
Standby, this cooling equipment relies on passive cooling technology, the heat generated when taking away chip operation by coolant liquid gasification heat absorption, then
Steam is condensed by the cold fluid in condenser, condensed liquid coolant, which is back in liquid cooling apparatus, to be recycled.
Although evaporation cooling technique realizes that heat exchanges using the cooling higher gasification heat absorption capacity of liquid unit mass of low boiling point, core
Piece size for machine box for server is smaller, and cooling liquid is natural convection in cabinet, in the higher feelings of thermic load
Heat is difficult to be sufficiently transmitted in environment under condition, causes pressure rise in cabinet, and cooling saturation temperature is increased, eventually led to
Chip overtemperature.
Summary of the invention
The object of the present invention is to provide a kind of cabinets that enhanced immersion type is cooling, for solving in the prior art using leaching
Bubble is cooling the technical issues of being unable to satisfy mainboard electronic component higher radiating requirements.In the primary electron device hot-fluid of mainboard
Under the premise of density is higher, the natural convection of cooling liquid, which is changed into forced convection state, can effectively increase heat exchange
Ability improves cooling effect.
In order to achieve the above object, the technical solution adopted by the present invention is that:
A kind of cooling cabinet of enhanced immersion type, including cabinet casing, mainboard electronic component, immersed pump, heat exchange dress
It sets, the cabinet casing internal is completely submerged in cooling liquid filled with cooling liquid, the mainboard electronic component, described latent
The outlet of liquid pump is arranged in below mainboard electronic component heat source, forms jet stream under the driving force effect of immersed pump；The heat
Switch is located at the cooling liquid progress heat exchange behind cabinet casing internal or outer surface, with endothermic gasification, by heat transfer
Into environment.
Further, immersed pump and each pipeline for connection must have good compatibility with cooling liquid, liquid of diving
Pump can be immersed in cooling liquid or set with cooling liquid isolation cloth, the position of immersed pump in cabinet casing internal bottom, or
In the space of one isolation in cabinet casing internal bottom, or outside cabinet casing.Wherein, immersed pump is arranged in cabinet inside
When, it need to be suitably sized according to the selection of cabinet casing internal space size, the flow and lift of immersed pump pump need to be sent out according to heat source
Heat and distributing position are selected, wherein self-sealing joint, easy to repair and replacement is arranged in the inlet and outlet both ends of immersed pump.
Further, the quantity phase of the outlet branches a total of tubes of immersed pump and the main pyrotoxin on mainboard electronic component
Multiple import branch lines are equipped with Deng, immersed pump, multiple import branch lines one end is tightly attached to cabinet casing internal two sides, is used for
Surrounding liquid forced convection is driven, the exchange capability of heat of cooling liquid and cabinet casing is enhanced, the other end is connected on inlet header；
Each export branch road one end is connected on the outlet manifold of immersed pump, and the other end is arranged in immediately below each heat source, in latent liquid
Each branch way outlet forms jet stream under the driving force effect of pump, takes thermal energy power to heat source for enhancing cooling liquid.
Further, optionally, cooling liquid is the fluorine carbon compound for meeting environmental requirement, and the liquid is with higher
Insulation performance, and boiling point is generally chosen at 30-70 degree.
The heat-exchange device is cooling line or the radiating fin that is evenly arranged, or both have concurrently.Wherein, cooling tube
Road is annulus coil pipe, is arranged in cabinet casing internal top, keeps certain distance with the liquid level of cooling liquid, or will directly cool down
Pipeline is immersed in cooling liquid.Circulation has cold fluid to condense steam in cooling line, wherein cold fluid can be in managing
It is that air is also possible to water or other refrigerants；Or cabinet casing outer surface is evenly arranged in using radiating fin, increase cabinet
The heat exchange area of casing and outside air, so that cabinet casing has enough condensations and cooling capacity, to keep cabinet machine
The pressure of shell is stablized.
Preferably, cabinet casing, cooling line and radiating fin are highly heat-conductive material, heat quickly can be transferred to ring
In border.
Further, the operating mode of immersed pump is divided into two kinds, normally opened operation and intermittent operating state.
Normally opened operating status refers to that chassis power supply immersed pump Yi Dan connected is started to work.
Intermittent operating state refers to that immersed pump carries out start-up and shut-down control according to heat source cooling requirement.Immersed pump starts and stops
It is controlled by cabinet inside pressure or heat source temperature, when mainboard electronic component is operated at full capacity, leads to heat source part temperature
When degree increases or cabinet inside pressure increases to a certain threshold value, immersed pump is opened at this time, to heat source temperature reduction or cabinet inside
When pressure drops to a certain threshold value, stop immersed pump at this time.
When the starting and stopping of immersed pump is controlled using temperature threshold, temperature value can be from the temperature detecting function of chip itself
In addition middle acquisition can also increase a temperature sensor on chip and obtain temperature value, when using pressure threshold control, machine
Case internal pressure value can be obtained by the way that pressure sensor is arranged in cabinet inside.
Optionally, cabinet casing is made of high heat conductive material, guarantees the leakproofness of casing.
The solution have the advantages that: heat exchange principle is made full use of, mainboard electronic component is totally submerged in cooling
The heat for generating mainboard electronic component in liquid and cooling liquid fast exchange, while immersed pump is set and is connected thereto
Pipe-line system, the outlet branches pipeline of immersed pump is directly arranged to the lower section of each heat source of mainboard electronic component, makes cabinet
Interior cooling liquid reaches the state of forced convection, increases the heat convection ability of cabinet casing internal, avoids thermic load unexpected
After raising, the heat source overtemperatute due to caused by boiling heat transfer scarce capacity.Make mute cabinet, good cooling effect, improve work
Make performance.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the cooling cabinet of the enhanced immersion type of one of embodiment of the present invention.
Fig. 2 is the structural schematic diagram of the cooling cabinet of the enhanced immersion type of another kind in the embodiment of the present invention.
In figure: 11, cabinet casing；12, mainboard electronic component；13, immersed pump；14, import manifold；15, import
Branch line；16, manifold is exported；17, outlet branches pipeline；18, cooling line；19, radiating fin；20, cooling liquid.
Specific embodiment
The present invention is further illustrated below in conjunction with the drawings and specific embodiments.
Firstly, the part noun or term that occur during the embodiment of the present application is described are suitable for following solution
It releases:
Immersed pump is made of the pump housing and immersed motor, and when work can be immersed in cooling liquid, not exclusively submergence when,
It need to guarantee to be filled with liquid in inlet and pump chamber.
Embodiment 1
According to the embodiment of the present application, an a kind of specific embodiment of cooling cabinet of enhanced immersion type is provided.
Fig. 1 is according to the structural schematic diagram of the cooling cabinet of the enhanced immersion type of the embodiment of the present application one, in the present embodiment
It include: cabinet casing 11, mainboard electronic component 12, immersed pump 13, import manifold 14, import branch line 15, outlet
Manifold 16, outlet branches pipeline 17, heat-exchange device (cooling line 18, radiating fin 19) and cooling liquid 20.
Cooling liquid level height in the present embodiment in cabinet casing 11 can be such that mainboard electronic component 12 soaks completely
Not in wherein.
The key improvements of the present embodiment are that increasing immersed pump 13 makes the intracorporal cooling liquid of case reach forced convection
State increases the heat convection ability inside cabinet casing 11, after avoiding thermic load from increasing suddenly, not due to boiling heat transfer ability
Heat source overtemperatute caused by foot.
Wherein, immersed pump 13 is fixed on 11 interior bottom portion of cabinet casing or cabinet casing by bolt or other fixation devices
11 outside, can be immersed at cabinet 11 inside of casing in cooling liquid 20 or be arranged in and cooling liquid 20 is isolated
In space, and self-sealing joint, easy to repair and replacement is arranged in the inlet and outlet both ends of immersed pump 13.Immersed pump 13 is arranged in cabinet
When 11 inside of casing, suitably sized, the flow and lift of immersed pump 13 need to be selected according to 11 inner space size of cabinet casing
It need to be selected according to heat source calorific value and distributing position.The embodiment of the present application is only totally submerged with immersed pump 13 in cabinet casing
It is illustrated in 11 internal coolant bodies 20.
The end that 13 import manifold 14 of immersed pump is connected in the present embodiment is equipped with several import branch lines 15, and tight
11 inner side of cabinet casing arrangement is pasted, for the lower cooling liquid of temperature to be delivered to 12 heat source position of mainboard electronic component
It sets and is cooled down, outlet branches pipeline 17 is arranged in immediately below each heat source of mainboard electronic component 12, other end connection
To the outlet manifold 16 of immersed pump 13, and jet stream is formed under the driving force effect of immersed pump 13, increase cooling liquid
20 flow velocity enhances the heat convection ability of cooling liquid 20 with heat source.The end of outlet branches pipeline 17 can be arbitrary shape
Shape, preferably flat trumpet type enable Jetstream fluid to cover the wholly or largely surface of exothermic heat source.
Heat-exchange device in the present embodiment can be disposed on the cooling line 18 of 11 inner tip of cabinet casing, can also
To be to be evenly arranged in radiating fin 19 outside cabinet casing 11 or the two has concurrently.Wherein, cooling line 18 can be to appoint
Meaning shape, it is preferred that cooling line is annulus coil pipe, while the liquid level of cooling line 18 and cooling liquid 20 keeps a spacing
From, directly cooling line 18 can also be immersed in cooling liquid 20, in the embodiment of the present application only with cooling line 18 with it is cold
But liquid 20 keeps being illustrated for certain distance, and the radiating fin 19 being evenly arranged outside cabinet casing 11 then passes through increase
Heat exchange area transfers heat in environment, the effect of the two be all will cool down 20 endothermic gasification of liquid generation steam carry out it is cold
It is solidifying, flow back into liquid after cooling under gravity inside cabinet casing 11.In the present invention there is circulation in cooling line
Cold fluid condenses steam, and the interior cold fluid of pipe can be air and be also possible to water or other refrigerants.Pass through cooling line
18 and radiating fin 19 effect, increase cabinet casing 11 and outside air heat exchange area so that cabinet casing 11 have enough
Enough condensations and cooling capacity, so that the temperature, pressure of cabinet casing 11 be kept to stablize.Cooling line 18 and radiating fin 19 are adopted
With high heat conductive material, heat can be quickly transferred in environment.Cabinet casing 11 equally uses high thermal conductivity coefficient simultaneously
Material is made, while guaranteeing the leakproofness of cabinet casing 11.
High heat conductive material of the present invention is aluminium alloy, but is not limited to aluminum alloy materials, for other
The excellent Heat Conduction Material of heating conduction belongs to the framework of the present definition as long as meeting performance requirement of the present invention.
Cooling liquid 20 used in the present embodiment is the fluorine carbon compound for meeting environmental requirement, which has higher
Insulation performance, can guarantee to be immersed in each electronic component therein will not occur not enough to make because of cooling 20 dielectric strength of liquid
At electric short circuit accident.In order to guarantee that the exothermic heat source on mainboard electronic component 12 is in optimum working temperature, coolant liquid
The boiling point of body 20 is generally chosen at 30-70 degree.
Based on the embodiment that Fig. 1 is provided, the embodiment of the present application is in practical application, mainboard electronic component 12 and immersed pump
13 and the import and export pipeline be completely submerged in cooling liquid 20, when mainboard each electronic component work, generates heat, coolant liquid
Body 20 absorbs thermal temperature and increases, when cooling 20 temperature of liquid reaches the saturation temperature under corresponding pressure will ebullition, gasification,
The steam of generation is escaped from liquid cooled liquid 20 under the action of buoyancy, encounters cabinet top cooling line 18 and cabinet machine
It liquefies, is transferred heat in environment when 11 inner surface of shell, the cooling liquid after condensation again returns in cabinet, is followed with this
Ring back and forth utilizes.
Immersed pump 13 in the present embodiment is set as discontinuous operation pattern, when mainboard electronic component 12 is operated at full capacity
When, each heat source loss, which increases, causes 20 temperature of Local cooling liquid to increase, fluidized state aggravation, to heat source temperature raising or machine
When 11 internal pressure of punch-out equipment shell increases to a certain threshold value, immersed pump 13 is opened at this time, enhances cooling liquid 20 and heat source, cabinet machine
Exchange capability of heat between shell 11 and cooling liquid 20, reduces to heat source temperature or 12 internal pressure of cabinet casing drops to a certain threshold
When value, stop immersed pump 13 at this time.Entire cooling system automatically can adjust heat convection ability with the variation of thermic load,
Remain reliable dynamic equilibrium.
When the starting and stopping of the immersed pump 13 that above-mentioned application embodiment is mentioned is controlled using temperature threshold, temperature value can be from
It is obtained in the temperature detecting function of chip itself, can also in addition increase a temperature sensor on chip and obtain temperature value,
When using pressure threshold control, 12 internal pressure value of cabinet casing can be by being arranged pressure sensing inside cabinet casing 12
Device obtains.
Embodiment 2
According to the one aspect of the embodiment of the present application, the operating mode of another immersed pump 13 is provided.Referring to attached drawing 2,
Unlike the first embodiment, with cooling liquid 20 arrangement is isolated in immersed pump 13 in the present embodiment.Optionally, in the present embodiment,
The operating mode of above-mentioned immersed pump can be supervised using operational mode in embodiment 1 according to the temperature and pressure in cabinet casing 11
Measured value automatically turns on operation.It can also be normally opened operating status, after chassis power supply is connected, immersed pump 13 starts work simultaneously, will
The cooling liquid 20 of 11 bottom of cabinet casing is delivered at heat source, strengthens heat convection, reduces heat source temperature.
Above-mentioned all embodiments are only to illustrate the technical concepts and features of the application, and its object is to people can understand
Present context is simultaneously implemented accordingly, and the protection scope of the application can not be limited with this.It is all according to the application major technique side
The equivalent transformation or modification that the Spirit Essence of case is done should all be covered within the scope of protection of this application.
Claims (10)
1. a kind of cooling cabinet of enhanced immersion type, it is characterised in that: including cabinet casing (11), mainboard electronic component
(12), immersed pump (13), heat-exchange device, the cabinet casing (11) are internal filled with cooling liquid (20), the mainboard electronics
Component (12) is completely submerged in cooling liquid (20), and the outlet of the immersed pump is arranged in mainboard electronic component (12) heat
Below source, jet stream is formed under the driving force effect of immersed pump (13)；It is internal that the heat-exchange device is located at cabinet casing (11)
Or the cooling liquid (20) behind outer surface, with endothermic gasification carries out heat exchange, transfers heat in environment.
2. the cooling cabinet of enhanced immersion type according to claim 1, which is characterized in that the immersed pump (13) and institute
The cooling liquid (20) stated have good compatibility, immersed pump (13) inlet and outlet both ends setting can self-sealing connector, just
In maintenance and replacement, outlet branches general pipeline (17) number and the exothermic heat sources on mainboard electronic component (12) of immersed pump (13)
Quantity is equal.
3. the cooling cabinet of enhanced immersion type according to claim 1, which is characterized in that the immersed pump (13) can be with
It is immersed in cooling liquid (20) or arrangement is isolated with cooling liquid (20), wherein the position of immersed pump (13) is arranged in cabinet
Casing (11) interior bottom portion；Or in space of cabinet casing (11) interior bottom portion one isolation, or cabinet casing (11) outside
Portion.
4. the cooling cabinet of enhanced immersion type according to claim 1-3, which is characterized in that immersed pump (13) is set
There are multiple import branch lines (15), multiple import branch lines (15) are tightly attached to cabinet casing (11) two sides, immersed pump (13)
Peripheral liquid forced convection is driven when starting.
5. the cooling cabinet of enhanced immersion type according to claim 1, which is characterized in that the cooling liquid (20) is
Meet the fluorine carbon compound of environmental requirement, boiling point is 30-70 degree under normal pressure.
6. the cooling cabinet of enhanced immersion type according to claim 1, which is characterized in that the cabinet casing (11),
Cooling line (18), radiating fin (19) are made of high heat conductive material.
7. the cooling cabinet of enhanced immersion type according to claim 1, which is characterized in that the heat-exchange device is cold
But pipeline (18) or radiating fin (19) or the two have concurrently.
8. the cooling cabinet of enhanced immersion type according to claim 7, which is characterized in that described cooling line (18) cloth
It sets in cabinet casing (11) inner upper, the radiating fin (19) is evenly arranged in cabinet casing (11) outer surface.
9. the cooling cabinet of enhanced immersion type according to claim 7 or 8, which is characterized in that cooling line (18) is circle
The ring disk pipe, the liquid level holding certain distance of cooling line (18) and cooling liquid (20), or directly submerge cooling line (18)
In cooling liquid (20).
10. the cooling cabinet of enhanced immersion type according to claim 9, which is characterized in that be equipped in cooling line (18)
Cold fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910680559.6A CN110456893A (en) | 2019-07-26 | 2019-07-26 | A kind of cooling cabinet of enhanced immersion type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910680559.6A CN110456893A (en) | 2019-07-26 | 2019-07-26 | A kind of cooling cabinet of enhanced immersion type |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110456893A true CN110456893A (en) | 2019-11-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910680559.6A Pending CN110456893A (en) | 2019-07-26 | 2019-07-26 | A kind of cooling cabinet of enhanced immersion type |
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| Country | Link |
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| CN (1) | CN110456893A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111625071A (en) * | 2020-06-03 | 2020-09-04 | 武义县达香电子有限公司 | Heat dissipation processing device for chip temperature rise |
| CN112612351A (en) * | 2020-12-30 | 2021-04-06 | 兰洋(宁波)科技有限公司 | Immersed liquid cooling heat dissipation structure and process of ore machine |
| CN113260235A (en) * | 2021-06-17 | 2021-08-13 | 深圳市英维克科技股份有限公司 | Immersion cooling system and electronic equipment |
| CN115023075A (en) * | 2022-06-02 | 2022-09-06 | 超聚变数字技术有限公司 | Computing equipment and cabinet |
| CN115751534A (en) * | 2022-11-22 | 2023-03-07 | 中通服节能技术服务有限公司 | Split type dual-mode multi-connected air conditioning system and control method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206479925U (en) * | 2017-01-18 | 2017-09-08 | 阿里巴巴集团控股有限公司 | Cooling device, chip and server |
| CN207883875U (en) * | 2018-01-08 | 2018-09-18 | 付慧芳 | A kind of immersion cell packet heat management device |
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2019
- 2019-07-26 CN CN201910680559.6A patent/CN110456893A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN206479925U (en) * | 2017-01-18 | 2017-09-08 | 阿里巴巴集团控股有限公司 | Cooling device, chip and server |
| CN207883875U (en) * | 2018-01-08 | 2018-09-18 | 付慧芳 | A kind of immersion cell packet heat management device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111625071A (en) * | 2020-06-03 | 2020-09-04 | 武义县达香电子有限公司 | Heat dissipation processing device for chip temperature rise |
| CN112612351A (en) * | 2020-12-30 | 2021-04-06 | 兰洋(宁波)科技有限公司 | Immersed liquid cooling heat dissipation structure and process of ore machine |
| CN113260235A (en) * | 2021-06-17 | 2021-08-13 | 深圳市英维克科技股份有限公司 | Immersion cooling system and electronic equipment |
| CN115023075A (en) * | 2022-06-02 | 2022-09-06 | 超聚变数字技术有限公司 | Computing equipment and cabinet |
| CN115023075B (en) * | 2022-06-02 | 2023-11-03 | 超聚变数字技术有限公司 | Computing equipment and cabinet |
| CN115751534A (en) * | 2022-11-22 | 2023-03-07 | 中通服节能技术服务有限公司 | Split type dual-mode multi-connected air conditioning system and control method thereof |
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Application publication date: 20191115 |