CN107454797B - A kind of pump drive quarter-phase circuit device for high fever stream dissipation from electronic devices - Google Patents
A kind of pump drive quarter-phase circuit device for high fever stream dissipation from electronic devices Download PDFInfo
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- CN107454797B CN107454797B CN201710501714.4A CN201710501714A CN107454797B CN 107454797 B CN107454797 B CN 107454797B CN 201710501714 A CN201710501714 A CN 201710501714A CN 107454797 B CN107454797 B CN 107454797B
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- evaporator
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
- H05K7/20827—Liquid cooling with phase change within rooms for removing heat from cabinets, e.g. air conditioning devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The present invention provides a kind of pump drive quarter-phase circuit device for high fever stream dissipation from electronic devices, using evaporation endothermic of working medium during circulating and condenses exothermic process, carry out heat collection and transports；It include micro-channel and fin in evaporator of the present invention, it is radiated in high heat flux regions using micro-channel, increase the coefficient of heat transfer of regional area, in low heat flux regions using fin fan heat, since the area discrepancy of micro-channel region and fin area is big in evaporator, since rapid spatial expansion, Temperature of Working reduce when working medium enters fin area in micro-channel, be conducive to the device heat dissipation of fin area；Therefore, the present invention uses structure matching that can be different to solve the heat dissipation problem of the different device of power height using lesser Resources Consumption, adapts to the heat dissipation of the electronic device of different heat flow densities, meets 50W/cm2The work requirements of the electronic device of the above heat flow density.
Description
Technical field
Two-phase is driven the invention belongs to thermal control technical field more particularly to a kind of pump for high fever stream dissipation from electronic devices to return
Road device.
Background technique
With the development of internet and information technology, the demand of mass data storage and data processing is growing, right
Electronic device arithmetic speed and performance made higher requirement, and temperature control have become restrict its development it is crucial because
Element.
For being integrated with the server cabinet of a large amount of electronic devices, the cabinet of the first generation is by the way of air-cooled, individually
General 3~4 kilowatts of the power of cabinet, for the second generation by the way of water cooling and air-cooled combination, the power of cabinet can achieve tens
Or even kW up to a hundred.One typical application is exactly supercomputer, is integrated with a large amount of height on the cabinet board on supercomputer
The device of hot-fluid, by present in the world for the light supercomputer in the highest martial prowess-Taihu Lake of arithmetic speed, single chassis heat
About 300KW is consumed, the heat flow density of CPU regional area reaches 15W/cm2, its heat dissipation, which is solved, by the way of single-phase water circulation asks
Topic.When the arithmetic speed of computer is further speeded up, the single chassis heat consumption of next-generation supercomputer can reach 600KW, office
The heat flow density in portion reaches 30W/cm2, the heat consumption of entire supercomputer reaches 30MW, at this time as still used one side of water-cooling system
The local temperature of face CPU can be more than its operating temperature, and still further aspect goes out the heat transmission in system to will lead to water
The scale of cooling system is very huge.So that the mode of single-phase water cooling is difficult to solve dissipating for this concentration high fever stream dissipation from electronic devices
Heat problem, and the pump based on flow boiling and heat transfer drives two-phase fluid circuit system and is solving the high and extensive heat of local heat flux density
The relatively single-phase heat exchange of amount transmission aspect has significant advantage.
Summary of the invention
To solve the above problems, the present invention provides a kind of pump drive quarter-phase circuit dress for high fever stream dissipation from electronic devices
It sets, using evaporation endothermic of working medium during circulating and condensation exothermic process, carries out heat collection and transport；Working medium into
Enter to absorb after evaporator heat and become vehicle repair major state by single-phase, two-phase fluid is after condenser discharges heat by vapour-liquid two
Mutually become liquid, return evaporator, and so on to realize that the temperature to entire circuit controls；The present invention uses wing simultaneously
The structure matching of piece and micro-channel solves the heat dissipation problem of the different device of power height using lesser Resources Consumption, fits
Answer the heat dissipation of the electronic device of different heat flow densities.
A kind of pump for dissipation from electronic devices drives quarter-phase circuit device, including fluid circuit 11 and successively with fluid hose
Road 11 connect liquid storage device 1, evaporator 9, condenser 10, the evaporator 9 be internally provided with micro-channel 13, drainage channel and
Fin, wherein drainage channel detour in evaporator 9 is surround, and entrance connects in evaporator inlet 14, and micro-channel 13, which is fixed on, draws
In circulation road, and position is corresponding with the high heat flux regions of electronic device, the position of fin and the low heat flux regions pair of electronic device
It answers；
1 lower end of liquid storage device is connected to fluid circuit 11 and carries out working medium and exchanges, and internal equipped with heating device and drop
Warm device.
Further, the drainage channel is formed by partition 16, and wherein partition 16 starts setting up from evaporator inlet 14,
And extend to opposite end, the partition 16 close to 15 side of evaporator outlet extends to behind opposite end to be prolonged to 14 one end of evaporator inlet again
It stretches.
Further, the micro-channel 13 is fixed in drainage channel by a group parallel connection, and every group at least there are two micro-channel
13。
Further, it is also fixed with partition 16 between the micro-channel 13 in each group, forms parallel component, is located at drainage channel
It is interior.
Further, the parallel component of interior series connection 2 of the drainage channel or more.
Further, the micro-channel 13, which is sequentially connected in series, is fixed in drainage channel.
Further, the heating device includes heat pipe 19 and heater 18, and wherein heat pipe 19 is mounted in liquid storage device 1
Portion, heater 18 are located at 19 lower end of heat pipe；
Further, the cooling device includes coil pipe 20 and regulating valve 5, and wherein coil pipe 20 is located inside liquid storage device 1, together
When coil pipe 20 entrance and exit be connected to fluid circuit 11, and entrance connectivity part be equipped with regulating valve 5.
Further, 20 surface layout of coil pipe has fin.
Further, a kind of pump for dissipation from electronic devices drives quarter-phase circuit device, further includes circulating pump 6, regenerator 7
And preheater 8, wherein working medium comes out from evaporator 9 regenerator 7 and condenser 10 are sequentially entered by fluid circuit 11 after, then
Enter regenerator 7 by circulating pump 6, returns to evaporator 9 finally by preheater 8.
Further, a kind of pump for dissipation from electronic devices drives quarter-phase circuit device, further includes temperature sensor 3 and pressure
Force snesor 4, wherein temperature sensor 3 is located on liquid storage device 1, and pressure sensor 4 is located at the company of liquid storage device 1 Yu fluid circuit 11
Logical place.
Further, a kind of pump for dissipation from electronic devices drives quarter-phase circuit device, further includes being located at condenser 10 to go out
At mouthful plus valve 12.
Further, a kind of pump for dissipation from electronic devices drives quarter-phase circuit device, further includes being located at condenser 10 to go out
Filter 2 at mouthful.
Further, a kind of pump for dissipation from electronic devices drives quarter-phase circuit device, and the working material is R134a.
Further, a kind of pump for dissipation from electronic devices drives quarter-phase circuit device, the evaporator 9 and electronic device
Between fill thermally conductive boundary material.
The utility model has the advantages that
1, the present invention provides a kind of pump drive quarter-phase circuit device for high fever stream dissipation from electronic devices, is being followed using working medium
Evaporation endothermic and condensation exothermic process during circulation is dynamic, carry out heat collection and transport；Evaporator of the present invention
In include micro-channel and fin, high heat flux regions using micro-channel heat dissipation, increase the coefficient of heat transfer of regional area, in low-heat stream
Region using fin fan heat, since the area discrepancy of micro-channel region and fin area is big in evaporator, in micro-channel working medium into
Since rapid spatial expansion, Temperature of Working reduce when entering fin area, be conducive to the device heat dissipation of fin area；Therefore, this hair
The bright heat dissipation problem for using structure matching that can be different to solve the different device of power height using lesser Resources Consumption,
The heat dissipation for adapting to the electronic device of different heat flow densities, meets 50W/cm2The work requirements of the electronic device of the above heat flow density；
Working medium can heat internal working medium by heating device in liquid storage device, also can be internal by cooling device
Portion's working medium cools down, therefore the working medium in liquid storage device is in biphase equilibrium state, and temperature and pressure is corresponding, when liquid storage device temperature
Its pressure changes when degree variation, thus change the condensation segment length of evaporating temperature and condensation temperature and condenser, realization pair
The temperature control in entire circuit.
2, drainage channel of the invention is constituted using partition, after partition guidance working medium carries out multiple surround in evaporator,
It is flowed out again from evaporator outlet, heat transfer effect of the working medium in evaporator can be remarkably reinforced.
3, micro-channel of the present invention is fixed in drainage channel by a group parallel connection, is advantageously reduced working medium fluid in evaporator and is hindered
Power.
4, micro-channel series connection of the present invention is fixed in drainage channel, is conducive to improve heat exchange effect of the working medium in evaporator
Fruit.
5, working medium can heat internal working medium by the heater of heat pipe lower end in liquid storage device of the present invention, also can
The supercooling working medium that opening valve comes out condenser enters coil pipe, to cool down to internal working medium, so that in liquid storage device
Working medium is in biphase equilibrium state；The present invention is carried out in conjunction with the heater on heat pipe by the cold liquid of condensator outlet simultaneously
The control of liquid storage device temperature, temperature precise control, fast response time.
6, the coil surface in liquid storage device of the present invention is disposed with fin, can strengthen coil pipe and change with working medium in liquid storage device
Heat.
7, the present invention uses micro-channel material for aluminium, and thermal coefficient is high, is conducive to the heat for absorbing high fever stream electronic device.
8, the present invention is using low boiling point, nonconducting R134a as working medium, and highly-safe, generation leakage situation working medium is fast
Speed volatilization will not generate damage to electronic equipment.
9, quarter-phase circuit device of the invention is additionally provided with circulating pump, and circulating pump promotes fluid to follow in the quarter-phase circuit
Ring, regenerator exchanges heat by the working medium that evaporator comes out and into the working medium of evaporator, so that working medium is to approach saturation temperature
State enter evaporator, while reducing the load of condenser.Preheater preheats the working medium for entering evaporator, it is ensured that work
Matter enters evaporator with the state of two-phase, reduces the temperature difference in evaporator.
10, thermally conductive boundary material is filled between evaporator and electronic device of the present invention, interface resistance can be effectively reduced.
11, pump of the invention drives working medium generation flow boiling of the quarter-phase circuit device at evaporator, and the hot-fluid of heat exchange is close
Degree is high, and the coefficient of heat transfer is more than 10W/cm2DEG C, an order of magnitude higher than the coefficient of heat transfer of single-phase flow heat exchange；
Pump drive quarter-phase circuit device heat transmission ability of the invention is strong, utilizes the latent heat of vaporization of liquid in phase transition process,
The latent heat of vaporization of liquid two orders of magnitude higher than the specific heat capacity of single-phase liquid, therefore, required cycle fluid flow very little, pump work
Rate and line size reduce, and whole system weight and consumption power will be greatly lowered, and furthermore the entire transmission process temperature difference is smaller,
It can solve big power consumption, long distance transmission problem.
Quarter-phase circuit of the invention reduces the temperature difference in heat collection and transmission process, can utilize more naturally cold
Source, it might even be possible to cancel air-conditioning system, natural cooling source, energy conservation and environmental protection, chip heat flow density 30W/cm is fully utilized2When, it utilizes
Water cooling Tower System can control temperature within 60 DEG C in the case where not using air-conditioning.
Detailed description of the invention
Fig. 1 is that present invention pump drives quarter-phase circuit flow diagram；
Fig. 2 is liquid storage device schematic diagram of the present invention；
Fig. 3 is parallel evaporator schematic diagram of the present invention；
Fig. 4 is serial evaporator schematic diagram of the present invention；
1- liquid storage device, 2- filter, 3- temperature sensor, 4- pressure sensor, 5- regulating valve, 6- circulating pump, 7- backheat
Device, 8- preheater, 9- evaporator, 10- condenser, 11- fluid circuit, 12- add valve, 13- micro-channel, 14- evaporator inlet,
15- evaporator outlet, 16- partition, 17- fin area, 18- heater, 19- heat pipe, 20- coil pipe.
Specific embodiment
With reference to the accompanying drawings and examples, the present invention is described in detail.
As shown in Figure 1, quarter-phase circuit flow diagram is driven for the pump of high fever stream dissipation from electronic devices for the present invention, including
Liquid storage device 1, evaporator 9, condenser 10 and fluid circuit 11, working medium are entered by fluid circuit 11 cold out from evaporator 9
After condenser 10, then from condenser 11 return to evaporator 9, and 1 lower end of liquid storage device is connected to fluid circuit 11 and carries out working medium and exchanges；
Working medium in the evaporator 9 condenses in condenser 10, and heat is driven the heat dissipation of two-phase fluid circuit external environment from pump；Institute
State fluid circuit 11 be used to form fluid can be in the circuit wherein flowed；
As shown in Fig. 2, being liquid storage device schematic diagram of the present invention, it is equipped with heating device and cooling device inside the liquid storage device 1,
Wherein heating device includes heat pipe 19 and heater 18, and heat pipe 19 is installed inside liquid storage device 1, and heater is pasted in 19 lower end of heat pipe
18, heater 18 transfers heat to the working medium in liquid storage device 1 by heat pipe 19, realizes the heating to working medium in liquid storage device 1；Drop
Warm device includes coil pipe 20 and regulating valve 5, and wherein coil pipe 20 is located inside liquid storage device 1, and 20 surface layout of coil pipe has reinforcing to change
The fin of heat, for strengthening the heat exchange of working medium in coil pipe and liquid storage device；Coil pipe 20 is connected to fluid circuit 11, and is connected to upstream and is set
There is regulating valve 5；If to cool down to working medium in liquid storage device 1, regulating valve 5 is opened, adjusts working medium in fluid circuit 11
Flow, coil pipe 20 receive the supercooling working medium come out from condenser 10 by fluid circuit 11, and supercooling working medium is flowed through by coil pipe 20
Inside liquid storage device 1, after cooling down to the working medium in liquid storage device 1, fluid circuit 11 is returned, combines heater 18 and storage in this way
The temperature control to liquid storage device 1 may be implemented in coil pipe 20 inside liquid device 1；
Micro-channel, drainage channel and fin are installed inside the evaporator 9, wherein micro-channel 13 and fin area 17
As the radiator structure inside evaporator；9 interior zone of evaporator is split by drainage channel, so that passing through evaporator inlet
14 working medium for entering evaporator 9 are flowed out by evaporator outlet 15 after again by multiple；
The drainage channel is at least made of two pieces of partitions 16, and wherein partition 16 starts setting up from evaporator inlet 14,
And extend to opposite end, the partition 16 close to 15 side of evaporator outlet extends to behind opposite end to be prolonged to 14 one end of evaporator inlet again
It stretches, the partition 16 of drainage channel internal layer extends proximate to 16 turning of partition of evaporator outlet 15, and partition 16 is by evaporator
Entrance 14 is segmented in drainage channel the initial segment, and evaporator outlet 15 is segmented in drainage channel most latter end；
Micro-channel serial or parallel connection is fixed in drainage channel, wherein the flow resistance ratio using cascaded structure two-phase fluid uses
Parallel-connection structure is big, but heat transfer effect is better than using parallel-connection structure, but heat exchange smaller using the flow resistance of parallel-connection structure two-phase fluid
Effect is inferior to cascaded structure；
As shown in figure 3, micro-channel 13 is fixed in drainage channel by a group parallel connection, wherein first when using parallel-connection structure
Group micro-channel 13 is fixed at evaporator inlet 14, and at least one group micro-channel 13 is fixed on the opposite end of evaporator inlet 14, and
Every group at least there are two micro-channels 13；It is also fixed with partition 16 between micro-channel 13 in each group, forms parallel component, is located at and draws
In circulation road, wherein in drainage channel series connection 2 or more parallel component；
As shown in figure 4, micro-channel 13, which is sequentially connected in series, to be fixed in drainage channel, wherein first when using cascaded structure
A micro-channel 13 is fixed at evaporator inlet 14, at least one micro-channel 13 is fixed on the opposite end of evaporator inlet 14.
In order to adapt to the feature that the sub- device area heat flow density of high fever galvanic electricity is high, temperature requirement is stringent, micro-channel position with
The high heat flux regions of electronic device are corresponding, are generally located below high heat flux regions, wherein to be generally hot-fluid close for high heat flux regions
Degree is greater than 20W/cm2Region, such as CPU；Low heat flux regions are corresponding with electronic device for the position of fin, wherein low heat flux regions
Generally heat flow density is lower than 10W/cm2Region；Structure matchings different in this way solves function using lesser Resources Consumption
The heat dissipation problem of the different device of rate height.Additionally due to the area discrepancy of channel region and fin area is big in evaporator, it is micro-
Due to rapid spatial expansion when two-phase fluid enters fin area in conduit, two phase flow temperature reduction is conducive to fin area
Device heat dissipation；Working medium is in biphase equilibrium state in liquid storage device 1, and temperature and pressure is corresponding, when 1 temperature change of liquid storage device
Its pressure changes, to change the condensation segment length of evaporating temperature and condensation temperature and condenser 10, realizes and returns to entire
The temperature on road controls.
Further, a kind of pump for high fever stream dissipation from electronic devices drives quarter-phase circuit device, further include filter 2,
Circulating pump 6, regenerator 7 and preheater 8, wherein working medium comes out from evaporator 9 and sequentially enters regenerator 7 by fluid circuit 11
Enter regenerator 7 after condenser 10, then through circulating pump 6, returns to evaporator 9 finally by preheater 8；Wherein, circulating pump 6
For recycling two-phase fluid in the quarter-phase circuit, working medium and enter evaporator 9 that regenerator 7 comes out evaporator 9
Working medium exchanges heat, so that working medium enters evaporator 9 to approach the state of saturation temperature, while reducing the load of condenser 10,
8 pairs of the preheater working medium for entering evaporator 9 preheat, it is ensured that working medium enters evaporator 9 with the state of two-phase, reduces evaporator
Temperature difference in 9.
Further, a kind of pump for high fever stream dissipation from electronic devices drives quarter-phase circuit device, further includes temperature sensing
Device 3 and pressure sensor 4, wherein temperature sensor 3 is located on liquid storage device 1, and pressure sensor 4 is located at liquid storage device 1 and fluid hose
The connectivity part on road 11；Wherein, temperature sensor 3 measures the temperature of liquid storage device 1, provides temperature for the control of 1 temperature of liquid storage device
Degree feedback；Pressure sensor 4 measures system pressure, prevents system overpressure from generating safety failure, such as hypertonia system
It will stop working.
Further, a kind of pump for high fever stream dissipation from electronic devices drives quarter-phase circuit device, further includes adding valve 12,
Wherein plus valve 12 is located at the exit of condenser 10, for being vacuumized and working medium filling, being released to quarter-phase circuit.
Further, a kind of pump for high fever stream dissipation from electronic devices drives quarter-phase circuit device, further includes filter 2,
Wherein filter 2 is located at 10 exit of condenser, for filtering the fifth wheel in quarter-phase circuit.
Further, the micro-channel, partition 16 and fin are fixed on inside evaporator 9 by way of soldering.
Further, the boundary material of high thermal conductivity is filled between the evaporator 9 and electronic device, to reduce interface heat
Resistance.
Preferably, the micro-channel material is aluminium.
Preferably, the arrangement spacing of the fin is not more than 5mm.
Preferably, the working material is R134a.
When driving quarter-phase circuit device using a kind of pump for high fever stream dissipation from electronic devices of the invention, will entirely fill
The equipment set is connected according to shown in Fig. 1 by fluid circuit 11, then a certain amount of by filling after adding valve 12 to vacuumize
Working medium；Meanwhile liquid storage device inside liquid level is inspected periodically during work, the working medium in circuit is mended when liquid level deficiency
It fills.
Those skilled in the art can heat consumption, temperature control demand according to electronic device, the biography in two-phase fluid circuit is driven to pump
Movement Capabilities, operating temperature range are designed, and determine the flow of system, flow resistance, evaporator heat exchange amount, condenser heat exchange amount, pre-
The system parameters such as hot device heat exchange amount；Secondly, the volume and operating temperature range in two-phase fluid circuit can be driven according to pump, design is to being
System carries out temperature controlled liquid storage device, and to liquid storage device carry out the heat-transfer capability of the heat pipe of temperature control, the heating power of heater,
The length of liquid storage device internal coil and the structure of fin；It is steamed finally, being determined according to the calorific value of high fever stream electronic device, area
The external dimensions of the micro-channel inside device and the size of integral channel are sent out, and micro- according to the progress of the heat consumption of other low-power equipments
The fin arrangement in other regions, finally determines the size of entire evaporator except conduit.
Certainly, the invention may also have other embodiments, without deviating from the spirit and substance of the present invention, ripe
It knows those skilled in the art and makes various corresponding changes and modifications, but these corresponding changes and change in accordance with the present invention
Shape all should fall within the scope of protection of the appended claims of the present invention.
Claims (13)
1. a kind of pump for dissipation from electronic devices drives quarter-phase circuit device, including fluid circuit (11) and successively with fluid hose
Liquid storage device (1), the evaporator (9), condenser (10) of road (11) connection, which is characterized in that the evaporator (9) is internally provided with
Micro-channel (13), drainage channel and fin, wherein drainage channel detour in evaporator (9) is surround, and entrance connects and evaporating
Device entrance (14), micro-channel (13) are fixed in drainage channel, and position is corresponding with the high heat flux regions of electronic device, fin
Low heat flux regions are corresponding with electronic device for position；
Liquid storage device (1) lower end is connected to fluid circuit (11) and carries out working medium and exchanges, and internal equipped with heating device and drop
Warm device, while the working medium in liquid storage device is in biphase equilibrium state；
The heating device includes heat pipe (19) and heater (18), and wherein heat pipe (19) is mounted on liquid storage device (1) inside, heating
Device (18) is located at heat pipe (19) lower end；
The cooling device includes coil pipe (20) and regulating valve (5), and wherein coil pipe (20) is located at liquid storage device (1) inside, while disk
The entrance and exit of pipe (20) is connected to fluid circuit (11), and entrance connectivity part is equipped with regulating valve (5).
2. a kind of pump for dissipation from electronic devices as described in claim 1 drives quarter-phase circuit device, which is characterized in that described
Drainage channel is formed by partition (16), and wherein partition (16) starts setting up at evaporator inlet (14), and is extended to opposite end, is connect
The partition (16) of nearly evaporator outlet (15) side extends to evaporator inlet (14) one end again after extending to opposite end.
3. a kind of pump for dissipation from electronic devices as described in claim 1 drives quarter-phase circuit device, which is characterized in that described
Micro-channel (13) is fixed in drainage channel by a group parallel connection, and every group at least there are two micro-channel (13).
4. a kind of pump for dissipation from electronic devices as claimed in claim 3 drives quarter-phase circuit device, which is characterized in that each group
It is also fixed with partition (16) between interior micro-channel (13), forms parallel component, be located in drainage channel.
5. a kind of pump for dissipation from electronic devices as claimed in claim 4 drives quarter-phase circuit device, which is characterized in that described
The parallel component of series connection 2 or more in drainage channel.
6. a kind of pump for dissipation from electronic devices as described in claim 1 drives quarter-phase circuit device, which is characterized in that described
Micro-channel (13), which is sequentially connected in series, to be fixed in drainage channel.
7. a kind of pump for dissipation from electronic devices as described in claim 1 drives quarter-phase circuit device, which is characterized in that described
Coil pipe (20) surface layout has fin.
8. a kind of pump for dissipation from electronic devices as described in claim 1 drives quarter-phase circuit device, which is characterized in that also wrap
Include circulating pump (6), regenerator (7) and preheater (8), wherein working medium from evaporator (9) come out by fluid circuit (11) according to
After secondary entrance regenerator (7) and condenser (10), then by circulating pump (6) into regenerator (7), finally by preheater (8)
Return to evaporator (9).
9. a kind of pump for dissipation from electronic devices as described in claim 1 drives quarter-phase circuit device, which is characterized in that also wrap
Temperature sensor (3) and pressure sensor (4) are included, wherein temperature sensor (3) is located on liquid storage device (1), pressure sensor (4)
It is located at the connectivity part of liquid storage device (1) Yu fluid circuit (11).
10. a kind of pump for dissipation from electronic devices as described in claim 1 drives quarter-phase circuit device, which is characterized in that also
Including being located at condenser (10) exit plus valve (12).
11. a kind of pump for dissipation from electronic devices as described in claim 1 drives quarter-phase circuit device, which is characterized in that also
Filter (2) including being located at condenser (10) exit.
12. a kind of pump for dissipation from electronic devices as described in claim 1 drives quarter-phase circuit device, which is characterized in that institute
Stating working material is R134a.
13. a kind of pump for dissipation from electronic devices as described in claim 1 drives quarter-phase circuit device, which is characterized in that institute
It states and fills thermally conductive boundary material between evaporator (9) and electronic device.
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| CN201710501714.4A CN107454797B (en) | 2017-06-27 | 2017-06-27 | A kind of pump drive quarter-phase circuit device for high fever stream dissipation from electronic devices |
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| CN201710501714.4A CN107454797B (en) | 2017-06-27 | 2017-06-27 | A kind of pump drive quarter-phase circuit device for high fever stream dissipation from electronic devices |
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| CN106879227A (en) * | 2017-01-23 | 2017-06-20 | 西安电子科技大学 | A kind of micro-channel heat exchanger and fluid interchange experimental provision |
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| CN201700120U (en) * | 2010-06-08 | 2011-01-05 | 中山大学 | Plate card type heat exchange two-phase natural circulation heat-dissipating system based on communication cabinet |
| CN203512059U (en) * | 2013-08-12 | 2014-04-02 | 上海卫星工程研究所 | High-efficiency spacecraft thermal management system |
| CN105118811A (en) * | 2015-07-27 | 2015-12-02 | 电子科技大学 | Temperature equalizing device adopting vapor chamber and microchannel for radiating multi-heat-source device |
| CN106879227A (en) * | 2017-01-23 | 2017-06-20 | 西安电子科技大学 | A kind of micro-channel heat exchanger and fluid interchange experimental provision |
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