CN114364204B - Phase-change heat dissipation system of electronic equipment - Google Patents
Phase-change heat dissipation system of electronic equipment Download PDFInfo
- Publication number
- CN114364204B CN114364204B CN202111397865.2A CN202111397865A CN114364204B CN 114364204 B CN114364204 B CN 114364204B CN 202111397865 A CN202111397865 A CN 202111397865A CN 114364204 B CN114364204 B CN 114364204B
- Authority
- CN
- China
- Prior art keywords
- working medium
- heat
- assembly
- phase
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A phase change heat dissipation system of electronic equipment comprises a working medium driver, a heat absorption assembly, a flow regulation assembly and a heat release assembly which are circularly connected together through a working medium pipeline; the working medium driver provides driving force for the circulation flow of the working medium, the heat absorption component is fixedly connected with the heating element, the working medium flows out of the working medium driver, boils in the heat absorption component and absorbs heat generated by the heating element; the flow regulating assembly is positioned between the heat absorbing assembly and the heat releasing assembly and is used for adaptively regulating the maximum dryness of the working medium under variable working conditions; the heat release component is connected with the working medium driver, the two-phase working medium condenses in the heat release component to release heat, and the supercooled liquid-phase working medium flows into the working medium driver to be put into the next circulation again. The working medium driver is adopted to provide driving force for working medium flow, and the reliability and the heat radiation capability of the traditional heat pipe-fan heat radiation mode can be greatly improved by utilizing the advantages of phase change heat exchange of the working medium. The application has the characteristics of high reliability, high heat dissipation capacity, high efficiency and small and compact structure.
Description
Technical Field
The application relates to the technical field of heat dissipation of electronic equipment, in particular to a phase-change heat dissipation system of the electronic equipment.
Background
With the advancement of technology, the heat productivity of high-power-consumption components (such as chips) of electronic devices is continuously increased, and the sizes of the components are continuously reduced, which results in the rapid increase of the heat flux density of the power-consumption components, and the heat dissipation problem of the electronic devices is more and more serious.
At present, the common heat dissipation mode of electronic equipment is a heat pipe-fan mode, namely, heat released by power consumption elements is conducted to a heat dissipation plate such as fins through a heat pipe, forced convection heat exchange is carried out by blowing air by a fan, and the heat is released to the environment. Taking a small portable notebook as an example, the heat pipe-fan mode is limited by the narrow space of the notebook, and the heat pipe has low heat conduction limit. When faced with higher heating chips, the heat pipe is at risk of failure. The heat pipe uses working principle of phase change heat exchange of working medium, and has extremely high heat exchange coefficient compared with liquid cooling. The heat pipe for heat dissipation of electronic equipment drives working medium to flow by capillary force generated by a capillary structure, and the capillary force is a main reason that the heat conduction limit of the heat pipe is very low.
Disclosure of Invention
The application aims to solve the problem that the heat pipe-fan heat dissipation mode in the prior art is difficult to be applied to high heat flux density power consumption elements, and provides a phase change heat dissipation system of electronic equipment, which provides driving force for working medium flow and utilizes the advantages of phase change heat exchange of working medium to ensure that the heat dissipation system has the characteristics of high reliability, high heat dissipation capacity, high efficiency and small and compact structure.
In order to achieve the above purpose, the present application has the following technical scheme:
a phase change heat dissipation system of electronic equipment comprises a working medium driver, a heat absorption assembly, a flow regulation assembly and a heat release assembly which are circularly connected together through a working medium pipeline; the working medium driver provides driving force for the circulation flow of the working medium, the heat absorption component is fixedly connected with the heating element, the working medium flows out of the working medium driver and boils in the heat absorption component to absorb heat generated by the heating element; the flow regulating assembly is positioned between the heat absorbing assembly and the heat releasing assembly and is used for adaptively regulating the maximum dryness of working media under variable working conditions; the heat release component is connected with the working medium driver, the two-phase working medium condenses and releases heat in the heat release component, and the supercooled liquid-phase working medium flows into the working medium driver to be put into the next circulation again.
As a preferable scheme of the phase-change heat dissipation system, the working medium driver adopts a miniature liquid pump capable of being adjusted in a variable frequency mode, all components of the working medium driver adopt an oil-free lubrication design, and the working medium driver can continuously convey refrigerant working medium with viscosity smaller than 0.1 cP.
As a preferable scheme of the phase-change heat dissipation system, the working medium driver can bear the fluid pressure of 1MPa, the flow rate of the conveyed working medium is between 1 and 10mL/s, and the lift is not lower than 0.1m.
As a preferred scheme of the phase-change heat dissipation system, the heat absorption component comprises a heat absorption component liquid storage unit, a steam channel, a heat absorption component first channel and a heat absorption component second channel, and liquid phase working medium flows into the heat absorption component from the working medium driver through the heat absorption component first channel and is stored in the heat absorption component liquid storage unit; the liquid phase working medium absorbs the heat released by the heating element, phase change occurs, and the gas phase working medium generated by boiling enters the steam channel and flows out of the heat absorption component through the second channel of the heat absorption component.
As a preferable scheme of the phase-change heat dissipation system, the liquid storage unit of the heat absorption component is of a capillary structure, so that full-liquid evaporation of working media can be realized.
As a preferable scheme of the phase-change heat dissipation system, the bottom surface of the heat absorption component is provided with a groove for accommodating the heating element, and the heat absorption component and the heating element are integrally processed and molded.
As a preferable scheme of the phase-change heat dissipation system, the flow regulating assembly comprises a plurality of regulating assembly liquid storage units, and capillary structures are arranged inside the regulating assembly liquid storage units.
As a preferable scheme of the phase-change heat dissipation system, the flow regulation assembly further comprises a guide plate, the gas-phase working medium flows into the flow regulation assembly from the heat absorption assembly through a first channel of the regulation assembly, flows along the guide plate, is mixed with the liquid-phase working medium in a liquid storage unit of the regulation assembly in the flowing process, and finally flows out of the flow regulation assembly through a second channel of the regulation assembly.
As a preferable scheme of the phase-change heat dissipation system, the heat dissipation component is provided with the heat dissipation component micro-channel, and the heat dissipation component micro-channel dissipates heat through the heat exchange fins fixedly connected with the heat dissipation component.
As a preferable scheme of the phase-change heat dissipation system, the heat dissipation assembly further comprises a heat dissipation fan, the maximum air volume of the heat dissipation fan is not lower than 11cfm, and the air flow direction is parallel to the gaps of the heat exchange fins.
Compared with the prior art, the application has at least the following beneficial effects: the working medium driver is adopted to provide driving force for working medium flow, and the reliability and the heat radiation capability of the traditional heat pipe-fan heat radiation mode can be greatly improved by utilizing the advantages of phase change heat exchange of the working medium. The working medium driver provides driving force for the circulation flow of the working medium, can efficiently and continuously convey the working medium, and can be flat for electronic equipment with flat shape. According to the application, the flow regulating assembly is arranged between the heat absorbing assembly and the heat releasing assembly, and the working medium maximum dryness can be adaptively regulated under variable working conditions through the flow regulating assembly, so that the circulation is always in a high-efficiency state. The working medium pipeline is high-pressure resistant, is flexible in structure or can be bent into a certain shape, and can adapt to the internal structure of electrical equipment. The heat radiation system has the characteristics of high reliability, high heat radiation capability, high efficiency and small and compact structure.
Drawings
Fig. 1 is a schematic structural diagram of a phase-change heat dissipation system of an electronic device according to an embodiment of the present application;
FIG. 2 is a schematic view of the internal structure of the heat sink assembly of FIG. 1;
FIG. 3 is a schematic view of a first internal structure of the flow regulating assembly of FIG. 1;
FIG. 4 is a schematic view of a second internal structure of the flow regulating assembly of FIG. 1;
FIG. 5 is a diagram of a phase-change heat dissipation system according to an embodiment of the present application;
fig. 6 is a theoretical cyclic pressure enthalpy diagram corresponding to fig. 5;
in the accompanying drawings: 1-a working medium driver; 2-a heat sink assembly; 3-a flow regulating assembly; 4-an exothermic assembly; 5-heating element; 6-working medium pipelines; 21-a heat sink assembly reservoir unit; 22-vapor channels; 23-a first heat sink assembly channel; 24-a second heat sink assembly channel; 31-an adjusting assembly reservoir unit; 32-a deflector; 33-adjusting the assembly first passage; 34-adjusting the assembly second channel.
Detailed Description
The present application will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1, the phase-change heat dissipation system of an electronic device provided by the application structurally comprises a working medium driver 1, a heat absorption component 2, a flow regulation component 3, a heat release component 4, a heating element 5 and a working medium pipeline 6.
The working medium driver 1 provides driving force for the circulation flow of working medium, and has a structure of a miniature liquid pump and the capability of efficiently and continuously conveying the working medium.
The components of the working medium driver 1 adopt oil-free lubrication design, and can convey refrigerant working medium with viscosity less than 0.1 cP.
The working medium driver 1 can bear the fluid pressure of 1MPa, the flow rate of the conveying working medium is 1-10 mL/s, and the lift is not lower than 0.1m.
The working medium driver 1 can be adjusted in a variable frequency manner, and the power consumption of the working medium driver 1 is reduced to the greatest extent for different heat load working conditions.
If the electronic device is flat, i.e. has a thickness of less than 20mm, the working medium drive 1 is correspondingly of a flat pump construction.
As shown in fig. 2, the heat sink assembly 2 includes a heat sink assembly reservoir unit 21, a vapor passage 22, a heat sink assembly first passage 23, and a heat sink assembly second passage 24.
The liquid phase working medium flows into the heat absorption assembly 2 from the working medium driver 1 through the first channel 23 of the heat absorption assembly and is stored in the liquid storage unit 21 of the heat absorption assembly; the liquid phase working medium absorbs the heat released by the heating element 5, phase change occurs, and the gas phase working medium generated by boiling enters the vapor channel 22 and flows out of the heat absorption assembly 2 through the heat absorption assembly second channel 24.
In an embodiment, the bottom surface of the heat absorbing assembly 2 is provided with a recess for accommodating the heat generating element 5.
In the embodiment, the heat absorbing component 2 and the heating element 5 are integrally processed and molded, so that the heat transfer resistance is reduced to the maximum extent.
In one embodiment, the electronic device is flat, gravity has weak effect on the working medium, and the heat absorption component liquid storage unit 21 of the heat absorption component 2 is of a capillary structure, so as to realize 'full-liquid' evaporation of the working medium, improve the heat exchange coefficient of the heat absorption component 2 to the maximum extent, and ensure that the overall thickness of the heat absorption component 2 is not more than 10mm.
As shown in fig. 3 and 4, the flow regulating assembly 3 may be formed in two structures, and the flow regulating assembly 3 in two forms includes a regulating assembly liquid storage unit 31, a baffle 32, a regulating assembly first channel 33, and a regulating assembly second channel 34.
The gaseous working medium flows from the heat absorbing assembly 2 into the flow regulating assembly 3 via the regulating assembly first channel 33.
The flow regulating component 3 is used for adaptively regulating the maximum dryness of working media under variable working conditions, so that the circulation is always in a high-efficiency state.
In one embodiment, the electronic device is flat in shape, gravity has weak effect on the working medium, and the adjusting component liquid storage unit 31 in the flow adjusting component 3 is of a capillary structure and stores liquid phase working medium.
The gas phase working medium flows along the guide plate 32, and is mixed with the liquid phase working medium in the liquid storage unit 31 of the regulating assembly in the flowing process, and finally flows out of the flow regulating assembly 3 through the second channel 34 of the regulating assembly.
The working medium flowing out of the flow regulating assembly 3 is in a two-phase state so as to avoid the overheat of the working medium and reduce the heat exchange coefficient.
In an embodiment, the heat release assembly 4 includes a fan, heat exchange fins, and heat release assembly microchannels.
The working medium flows out of the flow regulating assembly 3 and into the heat releasing assembly 4.
The two-phase working medium condenses in the heat release component 4 to release heat, and finally the liquid-phase working medium flows into the working medium driver 1 in a supercooled state.
Optionally, in order to realize efficient condensation heat exchange, an exothermic assembly micro channel is arranged in the exothermic assembly 4, the two-phase working medium exchanges heat with the outside in the exothermic assembly micro channel, and the hydraulic diameter of the exothermic assembly micro channel is not more than 3mm.
The heat exchange fins are welded on the outer side of the heat release assembly 4 according to a certain arrangement rule and used for heat dissipation, and the fan generates wind with a certain flow direction, so that forced convection heat exchange occurs on the heat exchange fins.
The maximum air quantity of the fan is not lower than 11cfm, and the flow direction of the air is parallel to the gaps of the heat exchange fins; in the embodiment, the height and the gap of the heat exchange fin are optimized, so that the heat exchange fin has a thinner thermal boundary layer.
Optionally, the material of the heat exchange fin is copper.
The working medium pipeline 6 is used for connecting the working medium driver 1, the heat absorption assembly 2, the flow regulating assembly 3 and the heat release assembly 4.
Optionally, the working medium pipeline 6 is high-pressure resistant, is flexible in structure or can be bent into a certain shape, and is suitable for the internal structure of electronic equipment.
Referring to fig. 5 and fig. 6, it can be seen that the heat dissipation system of the present application has high heat dissipation capability as shown in the theoretical circulating pressure enthalpy corresponding to the phase change heat dissipation system provided by the embodiment of the present application. In order to solve the problems when the heat pipe-fan heat dissipation mode is applied to high heat flux density power consumption elements, the phase change heat dissipation system of the electronic equipment provided by the application has the characteristics of high reliability and small and compact structure.
The foregoing description of the preferred embodiment of the present application is not intended to limit the technical solution of the present application in any way, and it should be understood that the technical solution can be modified and replaced in several ways without departing from the spirit and principle of the present application, and these modifications and substitutions are also included in the protection scope of the claims.
Claims (6)
1. The phase-change heat dissipation system of the electronic equipment is characterized in that: comprises a working medium driver (1), a heat absorbing component (2), a flow regulating component (3) and a heat releasing component (4) which are circularly connected together through a working medium pipeline (6); the working medium driver (1) provides driving force for the circulation flow of working medium, the heat absorption component (2) is fixedly connected with the heating element (5), the working medium flows out of the working medium driver (1), and boils in the heat absorption component (2) to absorb heat generated by the heating element (5); the flow regulating assembly (3) is positioned between the heat absorbing assembly (2) and the heat releasing assembly (4) and is used for adaptively regulating the maximum dryness of working media under variable working conditions; the heat release component (4) is connected with the working medium driver (1), the two-phase working medium condenses and releases heat in the heat release component (4) to form a supercooled liquid phase working medium which flows into the working medium driver (1) to be put into the next circulation again; the working medium driver (1) adopts a miniature liquid pump capable of being adjusted in a variable frequency mode, all components of the working medium driver (1) adopt an oil-free lubrication design, and the working medium driver (1) can continuously convey refrigerant working medium with viscosity smaller than 0.1 cP; the heat absorption assembly (2) comprises a heat absorption assembly liquid storage unit (21), a steam channel (22), a heat absorption assembly first channel (23) and a heat absorption assembly second channel (24), and liquid phase working medium flows into the heat absorption assembly (2) from the working medium driver (1) through the heat absorption assembly first channel (23) and is stored in the heat absorption assembly liquid storage unit (21); the liquid phase working medium absorbs heat released by the heating element (5), phase change occurs, and the gas phase working medium generated by boiling enters the steam channel (22) and flows out of the heat absorption component (2) through the second channel (24) of the heat absorption component; the inside of the liquid storage unit (21) of the heat absorption component is of a capillary structure, so that full-liquid evaporation of working media can be realized; the flow regulating assembly (3) comprises a plurality of regulating assembly liquid storage units (31), and capillary structures are arranged inside the regulating assembly liquid storage units (31).
2. The phase-change heat dissipation system of an electronic device as recited in claim 1, wherein: the working medium driver (1) can bear the fluid pressure of 1MPa, the flow rate of the conveyed working medium is between 1mL/s and 10mL/s, and the lift is not lower than 0.1m.
3. The phase-change heat dissipation system of an electronic device as recited in claim 1, wherein: the bottom surface of the heat absorption component (2) is provided with a groove for accommodating the heating element (5), and the heat absorption component (2) and the heating element (5) are integrally formed.
4. The phase-change heat dissipation system of an electronic device as recited in claim 1, wherein: the flow regulating assembly (3) further comprises a guide plate (32), the gas-phase working medium flows into the flow regulating assembly (3) from the heat absorbing assembly (2) through a first channel (33) of the regulating assembly, flows along the guide plate (32) and is mixed with the liquid-phase working medium in a liquid storage unit (31) of the regulating assembly in the flowing process, and finally flows out of the flow regulating assembly (3) through a second channel (34) of the regulating assembly.
5. The phase-change heat dissipation system of an electronic device as recited in claim 1, wherein: the heat release assembly (4) is internally provided with a heat release assembly micro-channel, and the heat release assembly micro-channel dissipates heat through a heat exchange fin fixedly connected with the heat release assembly.
6. The phase-change heat dissipation system of an electronic device as defined in claim 5, wherein: the heat release assembly (4) further comprises a cooling fan, the maximum air quantity of the cooling fan is not lower than 11cfm, and the air flow direction is parallel to the gaps of the heat exchange fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111397865.2A CN114364204B (en) | 2021-11-23 | 2021-11-23 | Phase-change heat dissipation system of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111397865.2A CN114364204B (en) | 2021-11-23 | 2021-11-23 | Phase-change heat dissipation system of electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114364204A CN114364204A (en) | 2022-04-15 |
| CN114364204B true CN114364204B (en) | 2023-08-22 |
Family
ID=81095894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111397865.2A Active CN114364204B (en) | 2021-11-23 | 2021-11-23 | Phase-change heat dissipation system of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114364204B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104851857A (en) * | 2015-04-28 | 2015-08-19 | 西安交通大学 | Chip cooling system |
| CN107454797A (en) * | 2017-06-27 | 2017-12-08 | 北京空间飞行器总体设计部 | A kind of pump for high hot-fluid dissipation from electronic devices drives quarter-phase circuit device |
| CN108711491A (en) * | 2018-05-03 | 2018-10-26 | 辽宁和天精工科技有限公司 | A kind of phase transformation heat pipe and the cooling combined formula radiator of liquid circulation |
| CN110631391A (en) * | 2019-09-11 | 2019-12-31 | 广东工业大学 | Shell-and-tube phase-change heat exchanger with dryness regulation function |
| CN111479441A (en) * | 2020-03-18 | 2020-07-31 | 南京艾科美热能科技有限公司 | Heat dissipation system of data center machine room |
| WO2020155900A1 (en) * | 2019-01-29 | 2020-08-06 | 株洲智热技术有限公司 | Phase change heat radiating device |
| CN112421071A (en) * | 2020-11-10 | 2021-02-26 | 中国科学院广州能源研究所 | Heat dissipation system for fuel cell of unmanned aerial vehicle |
-
2021
- 2021-11-23 CN CN202111397865.2A patent/CN114364204B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104851857A (en) * | 2015-04-28 | 2015-08-19 | 西安交通大学 | Chip cooling system |
| CN107454797A (en) * | 2017-06-27 | 2017-12-08 | 北京空间飞行器总体设计部 | A kind of pump for high hot-fluid dissipation from electronic devices drives quarter-phase circuit device |
| CN108711491A (en) * | 2018-05-03 | 2018-10-26 | 辽宁和天精工科技有限公司 | A kind of phase transformation heat pipe and the cooling combined formula radiator of liquid circulation |
| WO2020155900A1 (en) * | 2019-01-29 | 2020-08-06 | 株洲智热技术有限公司 | Phase change heat radiating device |
| CN110631391A (en) * | 2019-09-11 | 2019-12-31 | 广东工业大学 | Shell-and-tube phase-change heat exchanger with dryness regulation function |
| CN111479441A (en) * | 2020-03-18 | 2020-07-31 | 南京艾科美热能科技有限公司 | Heat dissipation system of data center machine room |
| CN112421071A (en) * | 2020-11-10 | 2021-02-26 | 中国科学院广州能源研究所 | Heat dissipation system for fuel cell of unmanned aerial vehicle |
Non-Patent Citations (1)
| Title |
|---|
| 采用相变蓄热材料优化冰箱(冷柜)冷凝器散热过程的研究;刘佳 杨帆 任敏;《2015年中国家用电器技术大会》;20151027;全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114364204A (en) | 2022-04-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111642103B (en) | High heat flux porous heat sink flow cooling device | |
| US7077189B1 (en) | Liquid cooled thermosiphon with flexible coolant tubes | |
| US8479805B2 (en) | Heat-dissipating assembly | |
| CN203163564U (en) | Loop gravity assisted heat pipe heat transfer device provided with flat plate type evaporator | |
| CN103759563A (en) | Micro-channel heat dissipation device achieving heat transfer through phase-change circulating motion of working medium | |
| CN101210785A (en) | Bionic power drive type heat pipe radiator | |
| CN103200803A (en) | Loop heat pipe cooling device with pool boiling function | |
| CN104154787A (en) | Multi-stage evaporation micro-channel heat pipe heat transferring and radiating device | |
| CN202485512U (en) | Tank-channel type vapor chamber type heat pipe heat radiator | |
| CN102425968B (en) | Compact type loop heat pipe device | |
| US20030192669A1 (en) | Micro-loop heat pipe | |
| CN219146029U (en) | Energy accumulator for realizing circulating heat dissipation | |
| CN114364204B (en) | Phase-change heat dissipation system of electronic equipment | |
| US20060131003A1 (en) | Apparatus and associated method for microelectronic cooling | |
| CN108106473A (en) | The hot transmission module of phase stream | |
| CN1278414C (en) | Thermally driven heat exchanger | |
| CN201039655Y (en) | Heat radiator structure | |
| CN112367805B (en) | Double-circulation peak clipping phase change heat exchanger | |
| JP2023024240A (en) | Heat discharge system | |
| CN100433960C (en) | Liquid-cooled column-type heat tube radiator | |
| CN210321359U (en) | Separated microchannel siphon type heat exchanger | |
| TWI706118B (en) | Immersion cooling apparatus | |
| CN2829087Y (en) | Liquid-cooled heat-pipe radiator | |
| CN113375353A (en) | Integrated initiative refrigerated no water cooling high power laser | |
| JP2847343B2 (en) | Closed system temperature controller |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |