JP2023024240A - Heat discharge system - Google Patents

Abstract

To provide a heat discharge system that can reduce the total power consumption and has a simplified structure.SOLUTION: A heat discharge system 10 includes an immersion tank 100 and a radiator 200 and cools a heat source. The immersion tank has an airtight space S, and a part of the airtight space S stores a cooling fluid L1 and is divided in a liquid storage part S1 and a liquid-gas coexistence part S2. The liquid storage part stores the cooling fluid and the heat source. The liquid-gas coexistence part is located above the free surface of the cooling fluid. The radiator includes a transmission chamber 210, a pipe 220, a plurality of internal fins 230, and a plurality of external fins 240. The pipe is connected to the transmission chamber and the transmission chamber and the pipe form a circulation channel. A part of the pipe is located in the liquid-gas coexistence part and another part is located outside the airtight space. The internal fins are located in the liquid-gas coexistence part and is thermally connected to the pipe. The external fins are located outside the airtight space and are thermally connected to the pipe. The diameter of the pipe of the transmission chamber is larger than that of the pipe.SELECTED DRAWING: Figure 1

Description

The present disclosure relates to heat dissipation systems that use changes between two phases of cooling fluid for heat dissipation.

Generally, a conventional immersion heat dissipation system for servers basically consists of an immersion tank body, an intermediate heat exchanger, a circulating water pump and an environmental cooling device. The server host is directly immersed in the insulated working fluid. The heat generated by the chips on the motherboard is conducted to the working fluid, then the heat received by the working fluid is transferred to the external water cooling device through the cooling distribution unit and the pump, and then the heat is transferred to the external water cooling device. Dissipated into the environment by the device.

However, the conventional liquid immersion heat dissipation system needs to include a cooling distribution unit and a pump, which increases the power consumption of the whole system and makes the structure of the whole system more complex.

The present disclosure provides a heat dissipation system that can reduce total power usage and has a simplified structure.

One embodiment of the present disclosure provides a heat dissipation system configured to cool at least one heat source. The heat dissipation system includes an immersion tank and a radiator. There is an airtight space in the immersion bath. A portion of the gastight space is configured to store a cooling fluid, and the gastight space is divided into a liquid storage part and a liquid-gas coexistence part. A liquid storage section is configured to store a cooling fluid and at least one heat source, and a liquid-gas coexistence section is configured to lie above a free surface of the cooling fluid. The radiator includes at least one communication chamber, at least one pipe, a plurality of internal fins, and a plurality of external fins. At least one pipe is connected to at least one transfer chamber, the at least one transfer chamber and the at least one pipe together forming a circulation channel. A portion of the at least one pipe is positioned in the liquid-gas coexistence section, and another portion of the at least one pipe is positioned outside the airtight space. A plurality of internal fins are positioned in the liquid-gas coexistence section and thermally coupled to at least one pipe, and a plurality of external fins are positioned outside the airtight space and thermally coupled to at least one pipe. Furthermore, the pipe diameter of the at least one transfer chamber is larger than the pipe diameter of the at least one pipe.

According to the heat dissipation system as described above, a part of the radiator having a transfer chamber is provided in the immersion bath, and another part of the radiator is provided outside the immersion bath, so that the heat dissipation system is provided with a cooling distribution part and a pump. no longer needed. Therefore, power consumption can be reduced and the structure of the device can be simplified. In addition, it optimizes the power usage effectiveness of the heat dissipation system from 1.3 to less than 1.1, greatly increasing the heat transfer capacity per unit volume by 40%, thereby reducing the size and manufacturing cost of the heat dissipation system. .

In addition, the pipe diameter of the transfer chamber is larger than the pipe diameter of the pipe, and heat causes a change in temperature, so the radiator still works when placed horizontally. That is, even if the radiator is placed at a minus 90 degree position (i.e., the heat absorbing side is located above the heat dissipating side), the radiator still works, thereby having a wider range of applications.

The present disclosure will be more fully understood from the detailed description given below and the accompanying drawings, which are given by way of illustration only, and therefore are not limiting of the disclosure.

1 is a schematic diagram of a heat dissipation system and heat source according to a first embodiment of the present disclosure; FIG. 2 is a perspective view of a radiator of the heat dissipation system of FIG. 1; FIG. FIG. 4 is a schematic diagram of a heat dissipation system and heat source according to a second embodiment of the present disclosure; 4 is a perspective view of a radiator of the heat dissipation system of FIG. 3; FIG. FIG. 4 is a schematic diagram of a heat dissipation system and heat source according to a third embodiment of the present disclosure;

See FIGS. 1 and 2. FIG. FIG. 1 is a schematic diagram of a heat dissipation system 10 and a heat source according to a first embodiment of the present disclosure. FIG. 2 is a perspective view of the radiator 200 of the heat dissipation system 10 of FIG.

In this embodiment, the heat dissipation system 10 is, for example, an immersion heat dissipation system configured to cool at least one heat source. For example, there is a cooling fluid L1 stored in the heat dissipation system 10 . The cooling fluid L1 is electrically insulated, the heat source is immersed in the cooling fluid L1, and the heat source can be cooled by the two-phase cooling circulation of the cooling fluid L1. . In this embodiment, the heat source is, for example, a server, but is not limited to this.

The heat dissipation system 10 includes an immersion bath 100 and a radiator 200 . The immersion bath 100 includes a bottom plate 110 , a plurality of side plates 120 and 130 and a top plate 140 . The bottom plate 110, the side plates 120 and 130, and the top plate 140 are connected to each other to surround an airtight space S. A portion of the airtight space S is divided into a liquid storage portion S1 and a liquid/gas coexistence portion S2 for cooling. It is configured to store fluid L1. The liquid storage section S1 is configured to store the cooling fluid L1 and the heat source, and the liquid-gas coexistence section S2 is configured to be positioned above the free surface X of the cooling fluid L1.

Radiator 200 includes a transfer chamber 210 , a plurality of pipes 220 , a plurality of internal fins 230 and a plurality of external fins 240 .

A pipe 220 is connected to the transfer chamber 210 such that the transfer chamber 210 and the pipe 220 together form a plurality of circulation channels. The circulation channel is at least partially filled with a cooling fluid (not shown). The circulation direction of the cooling fluid may be clockwise or counterclockwise, which is indicated by arrows A and B in the present embodiment, but is not limited to this. Furthermore, the cooling fluid in the circulation channel is different from the cooling fluid L1 in the airtight space S, for example.

In one aspect, each of pipes 220 includes a heat absorption portion 221 and a heat dissipation portion 222 that are connected to each other. The heat absorption part 221 of the pipe 220 is located inside the liquid-gas coexistence part S2, and the heat radiation part 222 of the pipe 220 is located outside the airtight space S. The heat absorbing portion 221 of the pipe 220 is configured to absorb the heat of the cooling fluid L1 in the liquid-gas coexisting portion S2, and the heat absorbed by the heat absorbing portion 221 is transferred via the pipe 220 and the cooling fluid therein. It is transmitted to the heat radiating portion 222 of the pipe 220 . Then, the heat radiation part 222 of the pipe 220 radiates heat to the environment outside the immersion bath 100 .

In one aspect, the tubing diameter D1 of the transfer chamber 210 is larger than the tubing diameter D2 of each of the tubings 220 . Transmission chamber 210 is, for example, cylindrical. The tubing diameter D1 of the transfer chamber 210 is greater than the tubing diameter D2 of each of the tubings 220, and heat causes a change in temperature, resulting in a pressure differential that develops between the transmission chamber 210 and the tubing 220. Thus, the radiator 200 can be arranged not only vertically, but also horizontally (as shown in FIG. 1) to accommodate a variety of applications. Note that the radiator 200 being “perpendicularly arranged” means that the extending direction of the pipe is substantially parallel to the direction of gravity G, and one element is “substantially parallel” to another element. With refers to one element being parallel or nearly parallel to another element. The radiator 200 being “horizontally arranged” means that the extending direction E of the pipe 220 is substantially perpendicular to the direction of gravity G, and one element is “substantially perpendicular” to another element. means that one element is perpendicular or nearly perpendicular to another element. Although the radiator 200 is arranged vertically or horizontally in this embodiment, this is merely an example, and the present disclosure is not limited to this. Radiator 200 may be positioned at any angular position.

The internal fins 230 are located in the liquid-gas coexistence section S2 and are thermally coupled to the heat absorption section 221 of the pipe 220 to increase the heat exchange area of the radiator 200 in the heat absorption section 221, thereby improving the heat absorption efficiency of the radiator 200. increasing. The external fins 240 are located outside the airtight space S and are thermally coupled to the heat radiating portion 222 of the pipe 220 so as to increase the heat exchanging area of the radiator 200 in the heat radiating portion 222, thereby increasing the heat radiation efficiency of the radiator 200. is increasing.

In one aspect, both the heat absorption portion 221 and the heat dissipation portion 222 of the radiator 200 can be arranged horizontally, so the internal fins 230 arranged in the heat absorption portion 221 are substantially parallel to the gravitational direction G. In other words, the normal direction N of the internal fins 230 is substantially perpendicular to the gravitational direction G, and the gap between two adjacent internal fins 230 extends in the gravitational direction G. As a result, the vapor L2 in the liquid-gas coexistence section S2 can flow into the gap between the two inner fins 230 adjacent to each other along the direction of gravity G. It is possible to increase the heat exchange efficiency with. Although the internal fins 230 are substantially parallel to the direction of gravity G in this embodiment, this is exemplary only and the disclosure is not so limited. The internal fins 230 can be arranged at any angular position as long as the steam L2 can flow inside to absorb heat and output the heat.

In one aspect, the spacing G1 between two adjacent internal fins 230 is equal to the spacing G1 between two adjacent external fins 240, although the disclosure is not so limited. In other embodiments, the spacing between any two adjacent internal fins can be greater than the spacing between any two adjacent external fins, so that steam can more easily fill the gaps between the internal fins. can flow to

In one aspect, the number of pipes 220 is multiple, but the disclosure is not so limited. In other embodiments, the number of pipes may be only one.

In one aspect, the heat dissipation system 10 may further include a plate 300 . The plate 300 includes, for example, a first sloped portion 310 , a second sloped portion 320 and a third sloped portion 330 . The second inclined portion 320 is connected between the first inclined portion 310 and the third inclined portion 330 , and the first inclined portion 310 and the third inclined portion 330 are inclined more than the second inclined portion 320 . A plate 300 is located in the liquid-gas coexistence section S2, and the plate 300 is positioned adjacent to the internal fins 230 to receive droplets.

Specifically, the first inclined portion 310 of the plate 300 is arranged adjacent to the internal fins 230 so as to divide the liquid-gas coexisting portion S2 into a high temperature region where the radiator 200 is not located and a low temperature region where the radiator 200 is located. It is Furthermore, an inlet O1 is provided between the first sloping portion 310 of the plate 300 and the top plate 140, through which the hot zone is in fluid communication with the cold zone. The second sloped portion 320 and the third sloped portion 330 of the plate 300 are located on one side of the inner fin 230 in the vicinity of the liquid reservoir S1, and are between the third sloped portion 330 of the plate 300 and the side plate 120. An outlet O2 is provided. The cold zone communicates with liquid reservoir S1 via outlet O2. When the heat source operates, the heat generated from the heat source can evaporate the cooling fluid L1 into hot steam L2, and the hot steam L2 rises from the liquid storage section S1 toward the liquid-gas coexistence section S2 in the F1 direction. do. The high temperature steam L2 then flows into the inlet O1 along the direction F2 and is then cooled in the heat absorbing portion 221 of the radiator 200 and condensed into low temperature condensed droplets L3. The condensed droplets L3 then fall on the plate 300 in the direction F3 and then either return along the plate 300 to the liquid reservoir S1 or flow directly to the liquid reservoir S1 through the outlet O2. In addition, the second sloped portion 320 and the third sloped portion 330 of the plate 300 function as drainage slopes, and the condensed droplets L3 flow back to the liquid reservoir S1 along the second sloped portion 320 and the third sloped portion 330. do. The cold condensed droplets then flow in direction F4 towards the heat source to be cooled. According to the circulation flow path described above, natural convection is formed due to temperature changes in the cooling fluid L1 in the airtight space S, and the heat dissipation performance of the heat dissipation system 10 can be enhanced.

Although in one aspect the plate 300 consists of three slanted portions, the disclosure is not so limited. In other embodiments, the plate can be formed in various configurations, such as a single sloped plate or an arcuate plate.

In one aspect, the cooling fluid L1 within the airtight space S performs cooling circulation by natural convection, but the present disclosure is not so limited. In other embodiments, the heat dissipation system may further include a fluid driver, such as a fan or pump, to drive the cooling fluid to move within the airtight space. As a result, the cooling fluid in the airtight space can undergo cooling circulation by forced convection.

In one aspect, the heat dissipation system 10 may further include an airflow generator 400 located outside the airtight space S and disposed on the heat dissipation portion 222 of the pipe 220, for example. The airflow generation device 400 is, for example, an axial fan. When the airflow generation device 400 operates, the airflow generation device 400 releases the heat of the heat radiation part 222 of the pipe 220 together with the external fins 240 to the outside. As a result, the external airflow generated by the airflow generating device 400 can enhance the heat radiation efficiency of the pipe 220 and the heat radiation portion 222 of the external fins 240 .

In one aspect, the diameters of tubing 220 are the same, although the disclosure is not so limited. In other embodiments, the diameters of at least two of the tubes may differ from each other.

See FIGS. 3 and 4. FIG. FIG. 3 is a schematic diagram of a heat dissipation system 10A and a heat source according to a second embodiment of the disclosure. FIG. 4 is a perspective view of radiator 200A of heat dissipation system 10A of FIG.

In this embodiment, the heat dissipation system 10A comprises an immersion bath 100A and a radiator 200A. The immersion bath 100A includes a bottom plate 110A, side plates 120A and 130A, and a top plate 140A. The bottom plate 110A, the side plates 120A, 130A, and the top plate 140A are connected to each other to surround an airtight space S. A part of the airtight space S is configured to store a cooling fluid L1, and the airtight space S is liquid. It is divided into a storage section S1 and a liquid-gas coexistence section S2. Further, the liquid storage section S1 is configured to store the cooling fluid L1 and the heat source, and the liquid-gas coexistence section S2 is configured to be positioned above the free surface X of the cooling fluid L1.

Radiator 200A includes a first transmission chamber 211A, a second transmission chamber 213A, a third transmission chamber 215A, a fourth transmission chamber 217A, a first pipe 212A, a plurality of second pipes 214A, a third pipe. 216A, a plurality of fourth pipes 218A, a plurality of inner fins 230A and a plurality of outer fins 240A. The first pipe 212A is connected to the first transmission chamber 211A and the second transmission chamber 213A. The number of second pipes 214A is, for example, three, and the second pipes 214A are connected to the second transmission chamber 213A and the third transmission chamber 215A. A third pipe 216A is connected to a third transmission chamber 215A and a fourth transmission chamber 217A. The number of fourth pipes 218A is, for example, three, and the fourth pipes 218A are connected to the fourth transmission chamber 217A and the first transmission chamber 211A. The transfer chamber and the pipe thus together form a circulation flow path. The circulation channel is at least partially filled with a cooling fluid (not shown). The direction of circulation of the cooling fluid may be clockwise or counterclockwise, and in this embodiment, the cooling fluid circulates in directions A, B, C, and D, for example, but the present disclosure is limited thereto. not. Furthermore, the cooling fluid in the circulation channel is different from the cooling fluid L1 in the airtight space S, for example.

Although the number of second pipes 214A is three and the number of fourth pipes 218A is three in this embodiment, the present disclosure is not limited thereto. In other embodiments, the number of each of the second pipe and the fourth pipe may be one, two, three or more.

In one aspect, first transfer chamber 211A, fourth transfer chamber 217A, a portion of first line 212A, a portion of third line 216A and a portion of fourth line 218A are located within liquid-gas coexistence section S2. ing. The second transfer chamber 213A, the third transfer chamber 215A, the second pipe 214A, another portion of the first pipe 212A, and another portion of the third pipe 216A are located outside the airtight space S. One side of the radiator 200A located in the liquid-gas coexistence section S2 is the heat absorption side. The other side of the radiator 200A located outside the airtight space S is the heat dissipation side. The heat absorption side is configured to absorb the heat of the cooling fluid L1 in the liquid-gas coexistence section S2, and the heat absorbed by the heat absorption side is transferred to the heat dissipation side by the pipes in the pipes and the cooling fluid. be. Then, the heat radiation side radiates heat to the environment outside the immersion bath 100A.

In one aspect, the pipe diameter of the first pipe 212A for conducting air is equal to the pipe diameter of the third pipe 216A for conducting liquid, but the disclosure is not so limited. Further, in another embodiment, the pipe diameter of the first pipe for guiding the air is made larger than the pipe diameter of the third pipe for guiding the liquid so as to improve the smoothness of the cooling circulation. good too.

In one aspect, the pipe diameter D1 of each transfer chamber is greater than the pipe diameter of D2 of each pipe. For example, if the pipe diameter D1 of each of the transfer chambers 211A, 213A, 215A and 217A is greater than the pipe diameter D2 of each of the pipes 212A, 214A, 216A and 218A, the heat will cause temperature changes and the transfer chambers 211A, 213A, 215A 217A and the pipes 212A, 214A, 216A and 218A, the heat absorption side of the radiator 200A can be arranged not only vertically but also horizontally (see FIG. 3). As shown), it can be used in a wider range of applications. The fact that the heat absorption surface of the radiator 200A is “vertically arranged” means that the extending direction of the pipe is substantially parallel to the direction of gravity G, and one element is “substantially parallel” to another element. "is" means that one element is parallel or nearly parallel to another element. The heat absorption surface of the radiator is "horizontally arranged", which means that the extending direction of the pipe is substantially perpendicular to the direction of gravity G, and one element is "substantially perpendicular" to another element. refers to one element being perpendicular or nearly perpendicular to another element. It should be noted that, in this embodiment, the fact that the heat absorption side of the radiator is arranged vertically or horizontally is merely an example, and the present disclosure is not limited to this. Radiator 200A can be placed at any angular position.

The internal fins 230A are located in the liquid-gas coexistence section S2 and are thermally coupled to the heat absorption side so as to increase the heat exchange area of the radiator 200A on the heat absorption side, thereby increasing the heat absorption efficiency of the radiator 200A. . Further, the external fins 240A are positioned outside the airtight space S and are thermally coupled to the heat dissipation side so as to increase the heat exchange area of the radiator 200A on the heat dissipation side, thereby enhancing the heat dissipation efficiency of the radiator 200A.

In one aspect, the first transfer chamber 211A, the fourth pipe 218A and the fourth transfer chamber 217A can be arranged horizontally on the heat absorption side of the radiator 200A such that the internal fins 230A arranged on the heat absorption side are oriented in the direction of gravity. Approximately parallel to G. In other words, the normal direction of the internal fins 230A is substantially perpendicular to the gravitational direction G, and the gap between two adjacent internal fins 230A extends in the gravitational direction G. As a result, the vapor L2 in the liquid-gas coexistence section S2 can flow into the gap between the two inner fins 230A adjacent to each other along the direction of gravity G. can increase the heat exchange efficiency of Although the internal fins 230A are substantially parallel to the direction of gravity G in this embodiment, this is exemplary only and the disclosure is not so limited. The internal fins 230A may be arranged at any angular position as long as the steam L2 flows inside and can be output after absorbing heat.

In one aspect, the spacing between two adjacent internal fins 230A is equal to the spacing between two adjacent external fins 240A, although the disclosure is not so limited. In other embodiments, the spacing between any two adjacent internal fins can be greater than the spacing between any two adjacent external fins, so that steam can more easily fill the gaps between the internal fins. can flow to

In one aspect, the heat dissipation system 10A may further include a plate 300A. The plate 300A includes, for example, a first sloped portion 310A, a second sloped portion 320A, and a third sloped portion 330A. The second inclined portion 320A is connected between the first inclined portion 310A and the third inclined portion 330A, and the first inclined portion 310A and the third inclined portion 330A are inclined more than the second inclined portion 320A. there is Plate 300A is located in liquid-gas coexistence section S2, and plate 300A is positioned adjacent internal fins 230A to receive droplets.

Specifically, the first inclined portion 310A of the plate 300A is arranged adjacent to the internal fins 230A so as to divide the liquid-gas coexisting portion S2 into a high temperature region where the radiator 200A is not located and a low temperature region where the radiator 200A is located. It is Further, an inlet O1 is provided between the first inclined portion 310A of the plate 300A and the top plate 140A, and the hot zone is in fluid communication with the cold zone via the inlet O1. The second sloped portion 320A and the third sloped portion 330A of the plate 300A are located on one side of the inner fin 230A located adjacent to the liquid reservoir S1, and the outlet between the third sloped portion 330A of the plate 300A and the side plate 120A. O2 is provided. The cold zone communicates with liquid reservoir S1 via outlet O2. When the heat source operates, the heat generated from the heat source can evaporate the cooling fluid L1 into hot steam L2, and the hot steam L2 rises from the liquid storage section S1 toward the liquid-gas coexistence section S2 in the F1 direction. do. Hot vapor L2 then flows along direction F2 toward inlet O1, where it is then cooled on the endothermic side of radiator 200A and condensed into cold condensed droplets L3. The condensed droplets L3 then fall on the plate 300A in the direction F3 and then either return to the liquid reservoir S1 along the plate 300A or flow directly to the liquid reservoir S1 through the outlet O2. In addition, the second sloped portion 320A and the third sloped portion 330A of the plate 300A function as drainage slopes, and the condensed droplets L3 flow back to the liquid reservoir S1 along the second sloped portion 320A and the third sloped portion 330A. do. The cold condensed droplets then flow in direction F4 towards the heat source to be cooled. According to the circulation flow path described above, natural convection is formed due to the temperature change of the cooling fluid L1 in the airtight space S, and the heat dissipation performance of the heat dissipation system 10A can be enhanced.

Although in one aspect the plate 300A consists of three angled portions, the disclosure is not so limited. In other embodiments, the plate can be formed in various configurations, such as a single sloped plate or an arcuate plate.

In one aspect, the cooling fluid L1 within the airtight space S performs cooling circulation by natural convection, but the present disclosure is not so limited. In other embodiments, the heat dissipation system may further include a fluid driver, such as a fan or pump, to drive the cooling fluid to move within the airtight space. As a result, the cooling fluid in the airtight space can undergo cooling circulation by forced convection.

In one aspect, the heat dissipation system 10A may further include, for example, an airflow generator 400A located outside the airtight space S and arranged on the heat dissipation side. The airflow generation device 400A is, for example, an axial fan, and when the airflow generation device 400A operates, the airflow generation device 400A releases heat to the outside together with the external fins 240A. As a result, the external airflow generated by the airflow generation device 400A can enhance the heat dissipation efficiency of the heat dissipation side and the external fins 240A.

See FIG. FIG. 5 is a schematic diagram of a heat dissipation system 10B and a heat source according to a third embodiment of the disclosure.

In this embodiment, the heat dissipation system 10B comprises an immersion bath 100B and a radiator 200B. The immersion tank 100B includes a bottom plate 110B, multiple side plates 120B and 130B, and a top plate 140B. The bottom plate 110B, the side plates 120B, 130B, and the top plate 140B are connected to each other to surround an airtight space S. A part of the airtight space S is configured to store the cooling fluid L1, and is connected to the liquid storage part S1. It is divided into a liquid-gas coexistence section S2. Further, the liquid storage section S1 is configured to store the cooling fluid L1 and the heat source, and the liquid-gas coexistence section S2 is configured to be positioned above the free surface X of the cooling fluid L1.

The radiator 200B has a transfer chamber 210B, a plurality of first pipes 220B, a plurality of second pipes 230B, a plurality of inner fins 240B and a plurality of outer fins 250B. A first line 220B is located in the liquid-gas coexistence section S2 and is connected to the transfer chamber 210B, wherein both the first line 220B and the transfer chamber 210B are at least partially filled with a cooling fluid (not shown). Form a filled circulation channel. The direction of circulation of the cooling fluid may be clockwise or counterclockwise, for example, although the cooling fluid circulates in direction A and direction B in this embodiment, the present disclosure is not so limited. A portion of the second pipe 230B is located within the liquid-gas coexistence section S2. Another part of the second pipe 230B is located outside the airtight space S, the second pipe 230B is connected to the transfer chamber 210B, and the second pipe 230B and the transfer chamber 210B are at least partially connected to each other. Another circulation channel is formed which is filled with a cooling fluid (not shown). Although the direction of circulation of the cooling fluid may be clockwise or counterclockwise, and in this embodiment the cooling fluid circulates in directions C and D, for example, the disclosure is not so limited. Furthermore, the cooling fluid in the circulation channel is different from the cooling fluid L1 in the airtight space S, for example.

In one aspect, the first pipe 220B of the radiator 200B located in the liquid-gas coexistence section S2 is the heat absorption side. Also, the second pipe 230B of the radiator 200B located outside the airtight space S is on the heat radiation side. The heat absorption side is configured to absorb the heat of the cooling fluid L1 in the liquid-gas coexistence section S2, and the heat absorbed by the heat absorption side is transmitted to the heat radiation side by the pipes in the pipe and the cooling fluid L1. be done. Then, the heat radiation side radiates heat to the environment outside the immersion bath 100B.

In one aspect, the tubing diameter D1 of the transfer chamber 210B is larger than the tubing diameter D2 of the tubing. For example, the pipe diameter D1 of transmission chamber 210B is greater than the pipe diameter D2 of each of pipes 220B and 230B. Not only can one pipe 220B be arranged vertically, but it can also be arranged horizontally (as shown in FIG. 5) for a wider range of applications. The first pipe 220B of the radiator 200B being “vertically arranged” means that the extending direction of the first pipe is substantially parallel to the direction of gravity G, and one element "Substantially parallel" to means that one element is parallel or nearly parallel to another element. The first pipe 220B of the radiator 200B being “horizontally arranged” means that the extending direction E1 of the first pipe 220B is substantially perpendicular to the direction of gravity G, and an element "substantially perpendicular" to an element of refers to one element being perpendicular or nearly perpendicular to another element. In addition, in the present embodiment, the first pipe 220B of the radiator 200B is placed vertically or horizontally, but this is merely an example and is not limited to this. Radiator 200B can be placed at any angular position.

The internal fins 240B are located in the liquid-gas coexistence section S2 and are thermally coupled to the first pipe 220B to increase the heat exchange area of the radiator 200B on the heat absorption side, thereby increasing the heat absorption efficiency of the radiator 200B. there is Further, the external fins 250B are positioned outside the airtight space S and are thermally coupled to the heat dissipation side so as to increase the heat exchange area of the radiator 200B on the heat dissipation side, thereby enhancing the heat dissipation efficiency of the radiator 200B.

In one aspect, the heat absorption side of the radiator 200B can be arranged horizontally, so that the internal fins 240B arranged on the heat absorption side are substantially parallel to the gravitational direction G. In other words, the normal direction of the internal fins 240B is substantially perpendicular to the gravitational direction G, and the gap between two adjacent internal fins 240B extends in the gravitational direction G. As a result, the vapor L2 in the liquid-gas coexistence section S2 can flow into the gap between the two inner fins 240B adjacent to each other along the direction of gravity G, so that the vapor L2 in the liquid-gas coexistence section S2 and the heat absorption side of the radiator 200B can flow. can increase the heat exchange efficiency of Although the internal fins 240B are substantially parallel to the direction of gravity G in this embodiment, this is exemplary only and the disclosure is not so limited. The internal fins 240B may be arranged at any angular position as long as the steam L2 can flow inside to absorb heat and output the heat.

In one aspect, the spacing G1 between two adjacent inner fins 240B is greater than the spacing G2 between two adjacent outer fins 250B, although the disclosure is not so limited. In other embodiments, the spacing between any two adjacent internal fins can be equal to the spacing between any two adjacent external fins, so that steam flows more easily through the gaps between the internal fins. be able to.

In one aspect, the number of first pipes 220B is multiple and the number of second pipes 230B is multiple, although the disclosure is not so limited. In other embodiments, the number of first lines may be only one and the number of second lines may be only one.

In one aspect, the heat dissipation system 10B may further include a plate 300B. The plate 300B includes, for example, a first sloped portion 310B, a second sloped portion 320B, and a third sloped portion 330B. The second inclined portion 320B is connected between the first inclined portion 310B and the third inclined portion 330B, and the first inclined portion 310B and the third inclined portion 330B are inclined more than the second inclined portion 320B. Plate 300B is located in liquid-gas coexistence section S2, and plate 300B is positioned adjacent internal fins 240B to receive droplets.

Specifically, the first inclined portion 310B of the plate 300B is arranged adjacent to the internal fins 240B so as to divide the liquid-gas coexisting portion S2 into a high temperature region where the radiator 200B is not located and a low temperature region where the radiator 200B is located. It is Further, an inlet O1 is provided between the first inclined portion 310B of the plate 300B and the top plate 140B, and the hot zone is in fluid communication with the cold zone via the inlet O1. The second sloped portion 320B and the third sloped portion 330B of the plate 300B are located on one side of the inner fin 240B located closer to the liquid reservoir S1, and are between the third sloped portion 330B of the plate 300B and the side plate 120B. An outlet O2 is provided. The cold zone communicates with liquid reservoir S1 via outlet O2. When the heat source operates, the heat generated from the heat source can evaporate the cooling fluid L1 into hot steam L2, and the hot steam L2 rises from the liquid storage section S1 toward the liquid-gas coexistence section S2 in the F1 direction. do. The hot vapor L2 then enters the inlet O1 along the direction F2 before being cooled and condensed into cold condensed droplets L3 on the heat absorption side of the radiator 200B. The condensed droplets L3 then fall on the plate 300B in the direction F3 and then either return to the liquid reservoir S1 along the plate 300B or flow directly to the liquid reservoir S1 through the outlet O2. In addition, the second inclined portion 320B and the third inclined portion 330B of the plate 300B function as drainage gradients, and the condensed droplets L3 flow back to the liquid storage portion S1 along the second inclined portion 320B and the third inclined portion 330B. can do. The cold condensed droplets then flow in direction F4 towards the heat source to be cooled. According to the circulation flow path described above, natural convection is formed due to the temperature change of the cooling fluid L1 in the airtight space S, and the heat dissipation performance of the heat dissipation system 10B can be enhanced.

Although in one aspect the plate 300B consists of three angled portions, the disclosure is not so limited. In other embodiments, the plate can be formed in various configurations, such as a single sloped plate or an arcuate plate.

In one aspect, the cooling fluid L1 within the airtight space S performs cooling circulation by natural convection, but the present disclosure is not so limited. In other embodiments, the heat dissipation system may further include a fluid driver, such as a fan or pump, to drive the cooling fluid to move within the airtight space. As a result, the cooling fluid in the airtight space can undergo cooling circulation by forced convection.

In one aspect, the heat dissipation system 10B may further include an airflow generator 400B, for example, located outside the airtight space S and arranged on the heat dissipation side. The airflow generation device 400B is, for example, an axial fan, and when the airflow generation device 400B operates, the airflow generation device 400B releases heat to the outside together with the external fins 250B. As a result, the external airflow generated by the airflow generating device 400B can enhance the heat dissipation efficiency of the heat dissipation side and the external fins 250B.

In view of the above, the present specification provides a portion of the radiator with a transfer chamber inside the immersion bath and another portion of the radiator outside the immersion bath, thereby eliminating the need to provide a cooling distribution and pump for the heat dissipation system. There is no Therefore, power consumption can be reduced and the structure of the device can be simplified. In addition, it optimizes the power usage effectiveness of the heat dissipation system from 1.3 to less than 1.1, greatly increasing the heat transfer capacity per unit volume by 40%, thereby reducing the size and manufacturing cost of the heat dissipation system. .

Moreover, the pipe diameter of the transfer chamber is larger than that of the pipe, and the heat causes the temperature change, so the radiator can still function when placed horizontally. That is, even if the radiator is placed at a minus 90 degree position (i.e., the heat absorbing side is located above the heat dissipating side), the radiator still works, thereby having a wider range of applications.

Furthermore, since the plate divides the liquid-gas coexistence area into a high-temperature area and a low-temperature area, the cooling fluid in the airtight space forms natural convection due to changes in the temperature of the fluid, improving the heat dissipation performance of the heat dissipation system.

Furthermore, since the heat absorption part and the heat radiation part of the piping of the radiator can be arranged horizontally during operation, the internal fins arranged in the heat absorption part can be arranged substantially parallel to the direction of gravity, and the steam in the liquid-gas coexistence part can be can flow into the gaps between the interior fins in the gravitational direction, and the heat exchange efficiency between the steam in the liquid-gas coexistence section and the heat absorption section of the piping of the radiator can be enhanced.

Furthermore, the spacing between any two adjacent internal fins is greater than the spacing between any two adjacent external fins so that steam can flow more easily through the gaps between the internal fins.

The embodiments best describe the principles of the disclosure and its practical application, thereby rendering the disclosure and the various embodiments with various modifications suitable for the particular uses contemplated by others skilled in the art. have been selected and described to allow you to make the best use of It is intended that the scope of the disclosure be defined by the following claims and their equivalents.

10, 10A, 10B: Heat dissipation system 100, 100A, 100B: Immersion tank 110, 110A, 110B: Bottom plate 120, 130, 120A, 130A, 120B, 130B: Side plate 140, 140A, 140B: Top plate 200, 200A, 200B: Radiator 210: transmission chamber 220: pipe 221: heat absorption part 222: heat dissipation part 230: internal fin 240: external fin 211A: first transmission chamber 212A: first pipe 213A: second transfer chamber 214A: second pipe 215A: third Transmission chamber 216A: Third pipe 217A: Fourth transmission chamber 218A: Fourth pipe 230A: Internal fin 240A: External fin 210B: Transmission chamber 220B: First pipe 230B: Second pipe 240B: Internal fin 250B: External fin 300, 300A, 300B: plates 310, 310A, 310B: first inclined portion 320, 320A, 320B: second inclined portion 330, 330A, 330B: third inclined portion 400, 400A, 400B: airflow generator D1, D2: pipe diameter S: airtight space S1: liquid storage section S2: liquid-gas coexistence section L1: cooling fluid L2: vapor L3: droplet X: free surface G: direction of gravity E, E1, E2: direction of extension N: normal direction F1 ～F4, A～D: Direction G1, G2: Interval O1: Entrance O2: Exit

Claims (10)

A heat dissipation system configured to cool at least one heat source, comprising:
An immersion bath having an airtight space, wherein a part of the airtight space is divided into a liquid storage part and a liquid-gas coexistence part to store a cooling fluid, and the liquid storage part stores the cooling fluid and the liquid-gas coexistence part. at least one heat source, wherein the liquid-gas coexistence section is configured to be positioned above a free surface of the cooling fluid;
a radiator comprising at least one transfer chamber, at least one pipe, a plurality of internal fins, and a plurality of external fins, the at least one pipe connecting the at least one transfer chamber and the at least one pipe is connected to the at least one transmission chamber so as to form a circulation flow path, a portion of the at least one pipe is located in the liquid-gas coexistence section, and another portion of the at least one pipe is the The plurality of internal fins are located outside the airtight space, the plurality of internal fins are located in the liquid-gas coexistence section, and are thermally coupled to the at least one liquid-gas pipe, and the plurality of external fins are located outside the airtight space. , thermally coupled to the at least one pipe;
The heat dissipation system, wherein the pipe diameter of the at least one transfer chamber is larger than the pipe diameter of the at least one pipe. The heat sink of claim 1, wherein the spacing between any two adjacent internal fins of the plurality of internal fins is greater than the spacing between any two adjacent external fins of the plurality of external fins. system. 2. The heat dissipation system of claim 1, further comprising a plate located in the liquid-gas coexistence section, the plate being positioned adjacent to the plurality of internal fins. The at least one transmission chamber comprises a first transmission chamber, a second transmission chamber, a third transmission chamber and a fourth transmission chamber, and the at least one pipe comprises a first pipe, a second pipe, a third pipe and a fourth pipe, the first pipe being connected to the first transfer chamber and the second transfer chamber, the second pipe being connected to the second transfer chamber and the second transfer chamber; 3 transmission chambers, said third pipe being connected to said third transmission chamber and said fourth transmission chamber, said fourth pipe being connected to said fourth transmission chamber and said first transmission chamber 2. The heat dissipation system of claim 1, connected to a . The heat dissipation system according to claim 4, wherein the pipe diameter of the first pipe is larger than the pipe diameter of the third pipe. The heat dissipation system of claim 1, further comprising an airflow generator located outside the airtight space and disposed on the at least one pipe. 2. The heat dissipation system of claim 1, wherein the at least one pipe is plural in quantity, and the pipe is connected to the at least one transfer chamber. 8. The heat dissipation system of claim 7, wherein pipe diameters of at least two of said pipes are different from each other. The heat dissipation system according to claim 7, wherein the pipe diameters of the pipes are the same. The at least one pipe comprises a first pipe and a second pipe, the first pipe located within the liquid-gas coexistence section, and the first pipe and the at least one transfer chamber together. A portion of the second pipe is connected to the at least one transfer chamber so as to form a circulation flow path, a portion of the second pipe is located within the liquid-gas coexistence portion, and another portion of the second pipe is the airtight located outside the space, the second pipe is connected to the at least one transfer chamber, the second pipe and the at least one transfer chamber together form another circulation flow path, and the plurality of internal 2. The heat dissipation system of claim 1, wherein fins are positioned on said first pipe and said plurality of external fins are positioned on said second pipe.

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