JP3106428U - Heat dissipation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat dissipating device having a small size capable of efficiently dissipating heat generated from an electronic component without mounting a cooling fan or expanding a heat dissipating area.
SOLUTION: The heat radiating device 3 has a built-in heat transfer medium 30 and can dissipate heat generated by an electronic component by performing a heat transfer action by a gas-liquid change of the heat transfer medium. This heat radiating device is provided with two ducts 33 and 34 that connect the heat absorbing element 31, the heat radiating element 32, and the heat absorbing element and the heat radiating element. The heat absorbing element 31 has first and second chambers 315 and 316 that communicate with each other inside, and can absorb heat generation by phase transition from the liquid phase to the gas phase of the heat transfer medium. The heat dissipating element 32 has a chamber 321 formed therein, and the heat transfer medium can dissipate heat by causing a phase transition from a gas phase to a liquid phase. The duct is provided with at least one one-way valve, and one duct guides the heat transfer medium from the chamber to the first chamber, and the other duct guides the heat transfer medium from the second chamber to the chamber.
[Selection] Figure 1

Description

  The present invention relates to a heat radiating device, and more particularly to a heat radiating device capable of dissipating heat generated by an electronic component by a phase transition from a liquid phase to a gas phase.

  Today's electronic devices are progressing toward higher integration. Accordingly, measures for heat dissipation of equipment have become one of the important issues for practical application. In particular, the demand for electronic thermal management technology for coping with the heat generated when using electronic devices such as computers is expanding with the development of the computer industry.

  Conventionally, there are various types of cooling elements that are mounted on a computer and dissipate heat generated by electronic components such as CPUs. Usually, for example, a fan device 1 with a hook as shown in FIG. 4 is often used. ing. This fan-equipped fan device 1 has a surface enlarged by a plurality of ridges 11 and an enlarged surface of the electronic component 2 by forced air intake or supply by a cooling fan 12 (that is, a wide surface formed by a plurality of ridges 11). Then, the heat generated from the electronic component 2 such as a CPU is carried outside to cool the electronic component 2 or the computer.

  However, in recent years, as the processing speed of computers increases, the heat generated by electronic components, particularly CPUs, in computers increases further, so that the heat dissipation effect of cooling elements is further required. That is, in order to dissipate the high heat generated by the electronic components, it is necessary to use a larger and more powerful cooling fan and a firewood that can expand the heat dissipating area. For this reason, there exists a fault contrary to the light and short tide of an electronic device which has the tendency for the volume and altitude of a bag to be bulky.

  The present invention has been made in view of the above circumstances, and its object is to efficiently dissipate heat generated by electronic components even if a cooling fan is not mounted or the heat dissipation area is not increased. The object is to provide a heat dissipation device having a small size.

  In order to achieve the above object, a heat radiating device according to the present invention has a built-in heat transfer medium, and can dissipate heat generated by an electronic component by performing a heat transfer action by gas-liquid change of the heat transfer medium. The heat dissipating device has first and second chambers that communicate with each other inside, and contacts the electronic component on the bottom surface to transfer heat generated by the electronic component from the liquid phase to the gas phase of the heat transfer medium. An endothermic element that can absorb by the phase transition, a chamber is formed therein, and the heat transfer medium can dissipate heat by the phase transition from the gas phase to the liquid phase. One one-way valve is provided, one of which guides the heat transfer medium from the chamber to the first chamber and the other one guides the heat transfer medium from the second chamber to the chamber. It is possible to provide two ducts that communicate between the heat absorbing element and the heat radiating element.

  According to the present invention, it is possible to provide a heat dissipation device having a small size capable of efficiently dissipating heat generated from an electronic component even if a cooling fan is not mounted or the heat dissipation area is not increased.

  Hereinafter, preferred embodiments of the present invention will be described in detail. In the following description, regardless of the size, components having substantially the same function and configuration are denoted by the same reference numerals, and redundant description is performed only when necessary.

  First, a preferred first embodiment of the heat dissipation device of the present invention will be described with reference to FIG. 1 and FIG.

  As shown in FIG. 1, the heat radiating device 3 according to this embodiment includes a heat transfer medium 30 such as a refrigerant in a simple manner, and the gas-liquid change of the heat transfer medium 30 (from the gas phase to the liquid phase). The heat transfer action can be performed by the phase transition to the liquid phase and the phase transition from the liquid phase to the gas phase) to dissipate the heat generated by the electronic component.

  The heat radiating device 3 includes a heat absorbing element 31, a heat radiating element 32, and two ducts 33 and 34. In the heat radiating device 3, the heat absorbing element 31 and the heat radiating element 32 are connected by two ducts 33 and 34.

  The heat-absorbing element 31 is in contact with the heat generating electronic component to be the heat-absorbing end of the entire apparatus, and is at least the front end surface 311, the rear end surface 312 facing the front end surface 311, the bottom surface 313, and the opposite surface of the bottom surface 313. And an internal space 310 is formed. Note that the description of the left and right end faces is omitted. The internal space 310 is separated into a first chamber 315 and a second chamber 316 by a partition wall 317. More specifically, the partition 317 extends from the front end surface 311 to the rear end surface 312 so as not to be connected to the rear end surface 312. That is, the first chamber 315 and the second chamber 316 are in communication with each other. Further, the front end surface 311 is formed with an inlet 318 communicated with the first chamber 315 and an outlet 319 communicated with the second chamber 316.

  On the other hand, the heat dissipating element 32 is a heat dissipating end of the entire apparatus, and a chamber 321 is formed therein. The heat radiating element 32 includes an end face 322 corresponding to the front end face 311 of the heat absorbing element 31. The one end face 322 is formed with an outlet 323 and an inlet 324 that communicate with the chamber 321 and correspond to the inlet 318 and the outlet 319 in the front end face 311 of the heat absorbing element 31, respectively.

  The two ducts 33 and 34 are disposed so that the heat absorbing element 31 and the heat radiating element 32 communicate with each other. More specifically, one end of one duct 33 is connected to the inlet 318 of the heat absorbing element 31, and the other end is connected to the outlet 323 of the heat radiating element 32. One end of the other duct 34 is connected to the outlet 319 of the heat absorbing element 31, and the other end is connected to the inlet 324 of the heat radiating element 32.

  First one-way valves 341 and 342 are disposed at one end and the other end of the other duct 34, respectively. That is, the first one is connected to the part where one end of the other duct 34 is connected to the outlet 319 of the heat absorbing element 31 and the part where the other end of the duct 34 is connected to the inlet 324 of the heat radiating element 32. Directional valves 341 and 342 are provided.

  These first one-way valves 341 and 342 can cause the heat transfer medium 30 to flow from the second chamber 316 of the heat absorption element 31 to the chamber 321 of the heat dissipation element 32. That is, the first one-way valves 341 and 342 cause the heat transfer medium 30 in the second chamber 316 to flow out of the outlet 319 of the heat absorbing element 31, pass through the duct 34, and pass through the inlet 324 of the heat radiating element 32. Then, it can be guided to flow into the chamber 321.

  Second one-way valves 331 and 332 are disposed at one end and the other end of one duct 33, respectively. That is, the second one is connected to the part where one end of one duct 33 is connected to the inlet 318 of the heat absorbing element 31 and the part where the other end of the duct 33 is connected to the outlet 323 of the heat radiating element 32. Directional valves 331 and 332 are provided.

  These second one-way valves 331 and 332 can cause the heat transfer medium 30 to flow from the chamber 321 of the heat dissipating element 32 to the first chamber 315 of the heat absorbing element 31. That is, the second one-way valves 331 and 332 cause the heat transfer medium 30 in the chamber 321 to flow out from the outlet 323 of the heat radiating element 32, pass through the duct 33, and pass through the inlet 318 of the heat absorbing element 31. It can be led to flow into the chamber 315.

  Next, the effect | action of the thermal radiation apparatus 3 which concerns on this embodiment is demonstrated using FIG.

  For example, when the heat radiating device 3 is mounted on a computer, the heat radiating device 3 is brought into contact with the electronic component 42 in the housing 41 at the bottom surface 313 of the heat absorbing element 31. The heat radiating element 32 is attached near the heat dissipation hole 411 provided in the housing 41.

  Thus, when the electronic component 42 generates heat, the generated heat is conducted into the internal space 310 of the heat absorbing element 31 via the bottom surface 313 of the heat absorbing element 31. Heat can be absorbed by the phase transition from the liquid phase to the gas phase of the heat transfer medium 30 in the internal space 310.

  The heat transfer medium 30 that has absorbed heat and has become a gas phase is filled in the second chamber 316 and then led to the first one-way valves 341 and 342 to be dissipated in the housing 41 via the other duct 34. It flows into the chamber 321 of the heat dissipating element 32 close to the hole 411 and is cooled there to remove heat. For this reason, it condenses into a liquid phase with it.

  Further, the heat transfer medium 30 that has become a liquid phase due to the phase transition is guided to the second one-way valves 332 and 331, flows through one duct 33, returns to the first chamber 315 of the heat absorbing element 31, and absorbs heat again. To do. That is, the heat radiating device 3 transfers the heat transfer medium 30 from the first chamber 315 of the heat absorbing element 31 to the second chamber 316, the other duct 34, the heat radiating element 32, one duct 33, the first chamber 315, The heat transfer effect is performed by repeatedly changing the gas and liquid along the cycle. Therefore, the heat generated by the electronic component 42 can be efficiently dissipated.

  Next, a second embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 3, the heat dissipating device 3 according to this embodiment is substantially the same as that of the first embodiment except that a heat dissipation element 35 is additionally provided on the top surface 314 of the heat absorbing element 31. It is in being provided. The heat dissipating scissors element 35 has a plurality of scissors 351 and can enlarge the heat dissipating surface.

  When the heat absorption element 31 of the heat dissipation device 3 according to this embodiment is brought into contact with the electronic component 42, the heat generation is conducted into the heat absorption element 31 via the bottom surface 313 of the heat absorption element 31, and then the heat transfer medium 30. Is absorbed by the phase transition from the liquid phase to the gas phase and led to the heat radiating element 32, and the heat radiating element 32 eliminates heat generation. Further, the heat dissipation element 31 is transmitted to the heat dissipation element 35 via the top surface 314 of the heat absorption element 31, and heat is dissipated by the plurality of elements 351. Therefore, by providing the plurality of flanges 351 on the top surface of the heat absorbing element 31, the heat dissipation efficiency can be further improved.

  As can be seen from the above first and second embodiments, the heat radiating device 3 does not require an electric cooling device such as a cooling fan as in the prior art, and is based on the phase transition from the liquid phase to the gas phase of the heat transfer medium 30 by itself. The heat transfer action can be performed to efficiently eliminate the heat generated by the electronic component 42. Further, since only a part of the device is mounted on the electronic component 42, the volume can be further reduced as compared with the conventional device, and it does not hinder downsizing of the electronic device. Further, in some cases, even if the heat dissipation element 35 is added to the top surface of the heat absorption element 31 in order to dissipate the heat generated by the electronic component 42 more quickly, the volume and altitude are still smaller than those of the conventional fan apparatus with a flange. So of course not disturbed.

  The embodiments described above are merely intended to clarify the technical contents of the present invention, and the present invention is not limited to such specific examples and is not construed in a narrow sense. It can be implemented with various modifications within the scope described in the spirit and claims.

  When the heat dissipation device according to the structure is in use, when the heat absorption element comes into contact with an electronic component, the heat generation is conducted to the first chamber and the second chamber of the heat absorption element via the bottom surface, Absorbed by the phase transition from the liquid phase to the gas phase of the heat transfer medium, and further changed to the gas phase by the phase transition via the duct communicating from the second chamber to the heat dissipation element. It can be led to the chamber with the heat transfer medium and eliminated there. Then, after condensing the gas phase medium into a liquid phase, the heat-radiating element is repeatedly returned to the heat-absorbing element via the duct communicating from the heat-dissipating element to the first chamber. Therefore, the heat generation of the electronic component can be efficiently dissipated only by the gas-liquid change of the heat transfer medium, and when the electronic component is mounted on the electronic component, the entire volume is not enormous.

1 is a schematic perspective view showing the configuration of a preferred embodiment of a heat dissipation device according to a first embodiment of the present invention. The schematic perspective view which shows the state which mounted the heat radiator which concerns on 1st Embodiment in the computer. Side surface sectional drawing of other preferable embodiment of the thermal radiation apparatus which concerns on the 2nd Embodiment of this invention. The side view of the conventional fan apparatus with a hook.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Fan-equipped fan apparatus, 11 ... Reed, 12 ... Cooling fan, 2 ... Electronic component, 3 ... Heat dissipation device, 30 ... Heat transfer medium, 31 ... Heat absorption element, 310 ... Internal space, 311 ... Front end surface, 312 ... Rear End surface, 313 ... Bottom surface, 314 ... Top surface, 315 ... First chamber, 316 ... Second chamber, 317 ... Partition, 318 ... Inlet, 319 ... Outlet, 32 ... Heat dissipation element, 321 ... Chamber, 322 ... One end surface 323 ... outlet, 324 ... inlet, 33 ... duct, 331, 332 ... second one-way valve, 34 ... duct, 341, 342 ... first one-way valve, 35 ... heat dissipation soot element, 351 ... soot, 41 ... Housing, 411 ... Heat dissipation hole, 42 ... Electronic component

Claims (5)

In a heat dissipation device that has a built-in heat transfer medium and can dissipate heat generated by electronic components by performing a heat transfer action by gas-liquid change of the heat transfer medium,
It has first and second chambers that communicate with each other inside, and contacts the electronic component at its bottom surface to absorb the heat generated by the electronic component by phase transition from the liquid phase to the gas phase of the heat transfer medium. Possible endothermic elements,
A chamber is formed therein, and the heat transfer medium is capable of dissipating heat by causing a phase transition from the gas phase to the liquid phase,
At least one one-way valve is provided therein, one of which leads the heat transfer medium from the chamber to the first chamber, and the other one transfers the heat transfer medium from the second chamber. Two ducts communicating between the heat-absorbing element and the heat-dissipating element so as to be guided to the chamber,
Accordingly, the heat absorption element is brought into contact with the electronic component, and the heat generation is conducted to the first chamber and the second chamber of the heat absorption element via the bottom surface, and then the heat transfer medium is heated. Absorbed by the phase transition from the liquid phase to the gas phase, and further, together with the heat transfer medium that has become a gas phase by the phase transition via the duct communicating from the second chamber to the heat dissipation element After being led to the chamber and eliminated there, the vapor phase medium is condensed into a liquid phase, and then returned to the heat absorption element via the duct communicating from the heat dissipation element to the first chamber. A heat dissipation device characterized by that. The duct from the second chamber to the heat dissipation element is provided with one-way valves from the second chamber to the heat dissipation element at both ends,
The heat radiating device according to claim 1, wherein a one-way valve from the heat radiating element to the first chamber is provided at both ends of the duct from the heat radiating element to the first chamber.   The heat-absorbing element has a front end surface communicating with the two ducts and a rear end surface facing the front end surface, and the rear end surface from the front end surface to the rear end surface therein 3. The heat dissipation device according to claim 1, wherein a partition wall formed by extending in a state where connection with the first chamber is prevented is formed, and the first chamber and the second chamber are separated from each other. .   The heat dissipation device according to any one of claims 1 to 3, wherein the heat transfer medium is a refrigerant. The heat radiating device according to any one of claims 1 to 4, wherein the heat absorbing element includes a plurality of heat dissipating rods on a top surface opposite to the bottom surface.

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