CN113905565B - Shell, shell assembly and electronic equipment - Google Patents
Shell, shell assembly and electronic equipment Download PDFInfo
- Publication number
- CN113905565B CN113905565B CN202111211976.XA CN202111211976A CN113905565B CN 113905565 B CN113905565 B CN 113905565B CN 202111211976 A CN202111211976 A CN 202111211976A CN 113905565 B CN113905565 B CN 113905565B
- Authority
- CN
- China
- Prior art keywords
- cavity
- phase
- phase change
- change medium
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000008859 change Effects 0.000 claims abstract description 78
- 230000017525 heat dissipation Effects 0.000 claims abstract description 42
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 239000012071 phase Substances 0.000 claims description 78
- 239000007788 liquid Substances 0.000 claims description 50
- 238000004891 communication Methods 0.000 claims description 6
- 238000009833 condensation Methods 0.000 claims description 6
- 230000005494 condensation Effects 0.000 claims description 6
- 239000007791 liquid phase Substances 0.000 claims description 6
- 238000001704 evaporation Methods 0.000 claims description 2
- 230000008020 evaporation Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 19
- 230000008569 process Effects 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 6
- 230000004660 morphological change Effects 0.000 abstract description 5
- 230000006870 function Effects 0.000 description 36
- 239000003550 marker Substances 0.000 description 23
- 238000010586 diagram Methods 0.000 description 9
- 230000003993 interaction Effects 0.000 description 8
- 229920001621 AMOLED Polymers 0.000 description 6
- 239000010408 film Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000010329 laser etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229940070527 tourmaline Drugs 0.000 description 1
- 229910052613 tourmaline Inorganic materials 0.000 description 1
- 239000011032 tourmaline Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000016776 visual perception Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the application provides a shell, which comprises a cover plate and a heat dissipation assembly arranged on the cover plate, wherein the heat dissipation assembly comprises a first cavity, a second cavity, a first pipeline and a dynamic function piece, a phase change medium in a first phase is filled in the first cavity, and when the phase change medium is changed into a second phase due to heated phase change and enters the first pipeline from the first cavity, the dynamic function piece is subjected to morphological change under the drive of the phase change medium in the second phase. According to the shell provided by the embodiment of the application, the first cavity is arranged corresponding to the heating element of the electronic equipment, when the heating element heats, the phase change medium in the first cavity can diffuse heat, the phase change medium in the movement process can also apply work to the dynamic functional part, and the dynamic functional part is driven to change the form, so that a part of heat energy is converted into mechanical energy to be consumed, the heat can be quickly dissipated, and the dynamic effect of the shell can be realized. In addition, the embodiment of the application also provides a shell component and electronic equipment.
Description
Technical Field
The application relates to the field of consumer electronic products, in particular to a shell, a shell assembly and electronic equipment.
Background
With the development of communication technology, electronic devices such as mobile phones and tablet computers have become an indispensable tool. The power supply of the electronic equipment or other electronic devices can generate a large amount of heat during operation, so that the overall temperature of the electronic equipment is increased, and when the temperature is increased sharply, the risk of spontaneous combustion exists. Some existing electronic devices automatically take partial measures for reducing power consumption after the temperature rises, which causes the operation efficiency of the electronic devices to be reduced and causes the electronic devices to become stuck; meanwhile, the user can get hands hot when holding the electronic equipment.
Disclosure of Invention
The application aims to provide a shell, a shell assembly and electronic equipment, so as to improve the technical problems.
In a first aspect, an embodiment of the present application provides a housing, including a cover plate and a heat dissipation assembly installed on the cover plate, where the heat dissipation assembly includes a first cavity, a second cavity, a first pipe communicating the first cavity and the second cavity, and a dynamic function element communicating with the first pipe, the first cavity is filled with a phase change medium in a first phase, and when the phase change medium changes into a second phase due to a heated phase and enters the first pipe from the first cavity, the dynamic function element changes in shape under the driving of the phase change medium in the second phase.
In a second aspect, an embodiment of the present application provides a housing assembly, including a middle frame, a front shell and the above-mentioned housing, where the front shell is assembled to the middle frame, and the housing is assembled to the middle frame and located on two opposite sides of the middle frame from the front shell.
In a third aspect, an embodiment of the present application further provides an electronic device, including the above-mentioned housing assembly and a heat generating assembly, where the heat generating assembly is disposed in the housing assembly, and the first cavity is disposed corresponding to the heat generating assembly.
According to the shell, the shell assembly and the electronic equipment provided by the embodiment of the application, the first cavity can be arranged corresponding to the heating element of the electronic equipment, when the heating element heats, the phase change medium in the first cavity can bring heat from the heating element area to other areas for diffusion, and by arranging the dynamic functional piece, in the working process of the heat dissipation assembly, the phase change medium in the moving process can also apply work to the dynamic functional piece to drive the dynamic functional piece to change the form, so that a part of heat energy is converted into mechanical energy to be consumed, the heat can be quickly dissipated, the temperature of the electronic equipment is reduced, the dynamic effect of the shell can be realized, and different man-machine interaction modes are provided.
These and other aspects of the application will be more readily apparent from the following description of the embodiments.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 2 is a schematic cross-sectional view taken along line A-A in fig. 1.
Fig. 3 is a schematic diagram of a split structure of a housing assembly according to an embodiment of the present application.
Fig. 4 is a schematic cross-sectional view of a housing according to an embodiment of the present application.
Fig. 5 is a schematic structural diagram of a heat dissipating assembly according to an embodiment of the present application.
Fig. 6 is a schematic diagram of a state of a dynamic function component in a heat dissipation assembly according to an embodiment of the present application when a form change occurs.
Fig. 7 is a schematic diagram of a state of a dynamic function component in a heat dissipation assembly according to an embodiment of the present application when another form change occurs.
Fig. 8 is a schematic structural diagram of another heat dissipating component according to an embodiment of the present application.
Fig. 9 is a schematic structural diagram of a heat dissipating assembly according to another embodiment of the present application.
Fig. 10 is a schematic structural diagram of a heat dissipating assembly according to another embodiment of the present application.
Fig. 11 is a schematic view of a partial cross-sectional structure of another housing according to an embodiment of the present application.
Fig. 12 is a schematic structural diagram of a first texture layer according to an embodiment of the present application.
Fig. 13 is a schematic view of a partial cross-sectional structure of still another housing according to an embodiment of the present application.
Description of the embodiments
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
With the development of communication technology, mobile terminals such as mobile phones and tablet computers have become an indispensable tool. When facing to mobile terminal products of the full-scale of the tourmaline, consumers not only need to consider whether the functions of the products meet the requirements of themselves, but also the appearance of the products is one of important factors for controlling whether the consumers purchase the products or not. However, as mobile terminals iterate, the mobile terminal appearance of each brand gradually tends to be homogenous, the appearance recognition degree is poor, and after the mobile terminal leaves the factory, the color and pattern of the mobile terminal are usually fixed, and aesthetic fatigue is easy to generate for a long time. The user can usually realize the outward appearance change only through installing the protective housing, but after installing the protective housing, thickness, weight etc. of electronic equipment all can be showing the increase, hold the feel and can be worsened.
In the related art, heat dissipation of electronic equipment is generally realized by attaching a graphite heat conducting fin in a middle frame, so that the heat dissipation efficiency of the heat dissipation mode is lower, and although the graphite heat conducting fin can take away the heat of a heating area, the heat cannot be quickly dissipated, and the overall temperature of the electronic equipment can be quickly increased.
Based on this, the inventors of the present application have proposed a case, a housing assembly, and an electronic apparatus of various embodiments of the present application in order to improve the above-described drawbacks. Embodiments of the present application are specifically described below with reference to the accompanying drawings.
As shown in fig. 1, the present embodiment provides an electronic device 10, which includes a housing assembly 110 and a heat generating assembly (not shown), wherein the heat generating assembly is located in the housing assembly 110, and the electronic device 100 further includes a display screen 120, a motherboard, a battery 140, a front camera 130, and the like. The main board and the battery 140 are disposed in the housing assembly 110, and the front camera 130 is disposed on a side of the electronic device 10 where the display screen 120 is disposed. The electronic device 10 provided in this embodiment will be described by taking a mobile phone as an example.
Referring to fig. 2, in which the display screen 120 is mounted to the front case 112, the display screen 120 may employ an LCD (Liquid Crystal Display ) screen for displaying information, which may be a TFT (Thin Film Transistor ) screen or an IPS (In-Plane Switching) screen or an SLCD (Splice Liquid Crystal Display, tiled dedicated liquid crystal display) screen. In other embodiments, the display screen 120 may employ an OLED (Organic Light-Emitting Diode) screen for displaying information, and the OLED screen may be an AMOLED (Active Matrix Organic Light Emitting Diode ) screen or a Super AMOLED (Super Active Matrix Organic Light Emitting Diode, super active driving Organic Light Emitting Diode) screen or a Super AMOLED Plus (Super Active Matrix Organic Light Emitting Diode Plus, magic screen) screen, which will not be described herein.
The heat generating component may be, for example, one or more of a chip, a battery 140, a motherboard, etc., without limitation.
Referring to fig. 1 and 3, the housing assembly 110 includes a middle frame 111, a front shell 112 and a housing 200, wherein the middle frame 111 includes a middle plate 1111 and a frame 1112, the frame 1112 is disposed around an edge of the middle plate 1111, the frame 1112 protrudes from the middle plate 1111, and the frame 1112 protrudes from the middle plate 1111 on two opposite sides of the middle plate 1111. The front shell 112 and the shell 113 are respectively assembled on two opposite sides of the middle plate 1111, and the front shell 112 and the shell 200 are assembled and fixed with the frame 1112; the housing 200, the middle frame 111 and the front shell 112 together form a housing cavity, and various components such as a motherboard, a camera 130, an antenna, a processor and the like can be arranged in the housing cavity.
In this embodiment, referring to fig. 4, the housing 200 includes a cover 210 and a heat dissipation assembly 230, the cover 210 has an inner surface 202 and an outer surface 203 opposite to each other, the outer surface 203 can be exposed as a part of the external surface of the electronic device 100, the inner surface 202 faces the accommodating cavity 102, and the inner surface 202 and the outer surface 203 are substantially parallel to each other. The cover 210 may be a transparent cover 210 such that the dynamics of the side of the inner surface 202 may be viewed from the side of the outer surface 203, e.g., the cover 210 may be a glass material or other light transmissive material. The cover 210 may also be made of a partially transparent material, and only a portion corresponding to the heat sink 230 is provided with a transparent window.
The cover plate 210 is a rectangular plate body, and a certain radian can be set at the edge of the cover plate 210, so that the electronic equipment has better holding hand feeling. The cover plate 210 may include opposite first and second edges, and opposite third and fourth edges, wherein the first and second edges are connected between the third and fourth edges, and the first, third, second and fourth edges are connected end-to-end to form an outer edge of the cover plate 210, wherein the first and second edges may be disposed along a length of the cover plate 210, and the third and fourth edges may be disposed along a width of the cover plate 210.
The cover plate 210 may further be provided with a camera mounting hole 201 for mounting a rear camera of the electronic device, the camera mounting hole 201 may penetrate through the cover plate 210, and the camera mounting hole 201 may be a rectangular hole or a round hole, etc., which is not limited herein.
The heat dissipation assembly 230 is disposed on the cover 210, specifically, the heat dissipation assembly 230 is disposed on the inner surface 202 of the cover 210, and can be directly attached to the heat generating components such as the battery 140, the chip, the motherboard, or attached to the heat generating components such as the battery 140, the chip, the motherboard through a heat conducting material, for example, a heat conducting silica gel, a graphite sheet, a heat pipe, etc. In the use process of the electronic device 10, the heat generating component generates more heat, so that the temperature of the area where the heat generating component is located rises faster, especially in the long-term use process of the electronic device 10, the temperature of the area where the heat generating component is located is very high, and the situation of scalding hands occurs.
Referring to fig. 5 to 7, the heat dissipation assembly 230 includes a first cavity 231, a second cavity 232, a first pipe 233, and a dynamic function member 235 communicating with the first pipe 233, wherein the first cavity 231 and the second cavity 232 may be disposed at intervals and disposed at different positions of the heat dissipation assembly 230, respectively, so that the first cavity 231 and the second cavity 232 may correspond to different elements. In one embodiment, the first cavity 231 may be disposed corresponding to one or more heat generating components in the electronic device, that is, the first cavity 231 is located in a region where the heat generating components are located, and as an evaporation cavity, the heat generating components may include at least one of a battery 140, a chip, and a motherboard, for example. The second cavity 232 may be configured to correspond to a non-heat generating component within the electronic device, such as the middle frame 111, that generates less or no heat during operation. I.e., the second chamber 232 is located in the area of the electronic device 10 where the non-heat generating components are located, as a condensing chamber.
The first cavity 231 is filled with a phase change medium (not shown) in a first phase, which is a first phase at normal temperature, such as water, ethanol, etc., and is a second phase after being heated, and the second phase is a gas phase. In this embodiment, the phase-change medium may be a fluorinated liquid, the boiling point of which may be between 40 and 45 ℃, and the advantage of the fluorinated liquid as the phase-change medium is that the boiling point of the fluorinated liquid is low, and the phase-change medium can be gasified at a temperature of 40 to 45 ℃, so that when the fluorinated liquid is applied to electronic equipment, the phase-change medium can be subjected to phase change at a lower temperature, which is beneficial to rapidly taking away heat and improving the heat dissipation effect. The second cavity 232 may be filled with a phase change medium, which is not limited herein. In order to accelerate the condensation heat dissipation rate of the second cavity 232, the second cavity 232 may be configured as an arbitrarily shaped cavity, and in order to increase the heat dissipation area, the second cavity 232 may be configured as a cavity having a larger specific surface area.
In one embodiment, as shown in fig. 5, the first cavity 231 and the second cavity 232 are communicated through the first pipe 233, the phase-change medium in the first cavity 231 may enter the second cavity 232 through the first pipe 233, and the phase-change medium in the second cavity 232 may also return to the first cavity 231 through the first pipe 233. Specifically, in one embodiment, the first cavity 231 may be disposed corresponding to a heat generating component, the second cavity 232 may be disposed corresponding to a non-heat generating component, when the phase-change medium in the first cavity 231 is heated and gasified, the gasified phase-change medium may enter the first pipe 233 and enter the second cavity 232 along with the first pipe 233, and the temperature is relatively lower at the position corresponding to the non-heat generating component of the electronic device, so that the gasified phase-change medium enters the second cavity 232 and becomes cooled and condensed, and changes to be in a liquid state again, after the area of the heat generating component corresponding to the first cavity 231 is reduced, the liquefied phase-change medium may flow back into the first cavity 231 again through the first pipe 233, during this process, part of heat is brought from the area of the heat generating component corresponding to the first cavity 231 to the non-heat generating component area corresponding to the second cavity 232, the heat dissipation efficiency is improved, and the temperature of the area of the heat generating component is reduced more rapidly.
In another embodiment, the first cavity 231 may be disposed corresponding to a heat generating component, the second cavity 232 may be disposed corresponding to another heat generating component, when the heat generating component corresponding to the first cavity 231 generates heat and the heat generating component corresponding to the second cavity 232 does not generate heat, the phase-change medium in the first cavity 231 is gasified after being heated, and the gasified phase-change medium may enter the first pipe 233 and enter the second cavity 232 along with the first pipe 233, and because the temperature of the heat generating component corresponding to the second cavity 232 is relatively lower, the gasified phase-change medium is cooled and condensed after entering the second cavity 232, and is changed into a liquid state again. When the heat generating component corresponding to the second cavity 232 generates heat and the heat generating component corresponding to the first cavity 231 does not generate heat, the phase change medium in the second cavity 232 can be phase-changed and gasified again, and flows back into the first cavity 231 through the first pipe 233 and is re-condensed in the first cavity 231.
The dynamic function member 235 is communicated with the first pipeline 233, and when the phase change medium in the second phase (i.e. the gasified phase change medium) enters the first pipeline 233, the phase change medium in the second phase can drive the dynamic function member 235 to change in shape, and the change in shape of the dynamic function member 235 can be visually observed from the outer surface 203 side of the cover plate 210, so that the shell 200 of the electronic device 10 has a dynamic visual effect, and can be used as a man-machine interaction mode. The change in the form of the dynamic function unit 235 may mean that the dynamic function unit 235 itself is deformed, displaced, or the like, or a relative motion is generated.
In the whole heat dissipation cycle process, the phase change medium is gasified from the liquid state to the gas state, then the gas state is liquefied to the liquid state, heat is transferred from the area where the first cavity 231 is located to the area where the second cavity 232 is located, and naturally and outwards dissipates in the area where the second cavity 232 is located, when the heat generated by the heating component is more, the area where the second cavity 232 is located cannot quickly and outwards dissipate, and at the moment, the temperature of the whole electronic equipment 10 can also be quickly increased. In this embodiment, by setting the dynamic function member 235, during the form change of the dynamic function member 235, a part of the heat carried by the phase change medium in the second phase is converted into mechanical energy, and the dynamic function member 235 is acted, and this part of the heat is consumed due to the acting. Therefore, the heat dissipation process can be quickened, and the heat dissipation effect is improved.
As an embodiment, the dynamic function member 235 may be a liquid tube 236, one end of the liquid tube 236 is connected to the first pipe 233, the other end is closed, the liquid tube 236 is filled with a liquid marker 2361, and the liquid marker 2361 may be a colored liquid, such as a red liquid, a green liquid, a blue liquid, etc., where the liquid may be water. The liquid marker 2361 may be a liquid provided with a marker point, for example, a colored marker ball is doped in the liquid, and the marker ball may be various colors such as infrared, blue, and the like. The liquid marker 2361 is used for enabling a user to visually observe the motion track or the morphological change of the dynamic function piece 235, so that dynamic display and man-machine interaction are realized.
When the phase change medium in the second phase enters the first pipe 233, as shown in fig. 6, the air pressure in the first pipe 233 increases, so that the liquid marker 2361 in the liquid pipe 236 moves toward the closed end of the liquid pipe 236. In a more specific embodiment, the liquid marker 2361 may not fill the liquid tube 236, the closed end of the liquid tube 236 may form a cavity, the cavity may be filled with air or other gas, and when the air pressure in the first conduit 233 is greater than the air pressure in the cavity, the liquid marker 2361 may move and change shape. And when the phase-change medium in the first cavity 231 is not gasified, the air pressure in the cavity may be equal to the air pressure in the first pipe 233, so as to achieve pressure balance, and the liquid marker 2361 does not move.
In order to improve the visual impact of the morphological change of the liquid marker 2361, the length of the liquid marker 2361 may be extended, so that when the morphological change of the liquid marker 2361 occurs, the movement process (i.e., morphological change process) of the liquid marker 2361 may be more remarkable and the dynamic change effect may be better. Meanwhile, in this embodiment, the heat consumed in the process of pushing the liquid marker 2361 to move is larger, so that the heat dissipation effect can be improved. Specifically, the liquid pipe 236 may be configured as a spiral, the spiral liquid pipe 236 may be located on the same plane, and the spiral liquid pipe 236 is disposed in a manner that is not only beneficial to reasonably arranging the position of the liquid pipe 236, avoiding other elements in the electronic device, but also greatly extending the length of the liquid pipe 236. Of course, it is understood that in other embodiments, the liquid tube 236 may be configured in any other manner, and is not limited herein.
When the temperature corresponding to the area where the first cavity 231 is located gradually decreases, the phase-change medium does not enter the first pipe 233 any more, after the phase-change medium having entered the first pipe 233 is condensed and liquefied at the second cavity 232, the air pressure in the first pipe 233 gradually decreases, at this time, the air pressure in the cavity is greater than the air pressure in the first pipe 233, as shown in fig. 7, the liquid marker 2361 moves toward the first pipe 233, at this time, the air pressure in the cavity gradually decreases, when the air pressure in the cavity is equal to the air pressure in the first pipe 233, the balance is reached, and the liquid marker 2361 does not move any more. The user can know the heat radiation state of the electronic device 10 by observing the moving process of the liquid marker 2361.
In the case 200 provided in this embodiment, a user may perform a corresponding operation according to the shape change of the dynamic function component 235 during use. As just one example, in an application scenario, when the user observes that the dynamic function component 235 changes in shape, which indicates that the temperature of the electronic device 10 rises faster and generates a larger amount of heat, the user may manually close a portion of the background application program that is not used, so as to reduce the processor load, or the user may place the electronic device 10 in a low-temperature environment to dissipate heat.
In another embodiment, referring to fig. 8, the heat dissipation assembly 230 may further include a second pipe 234, the first cavity 231 and the second cavity 232 are communicated through the first pipe 233 and the second pipe 234, the first pipe 233 and the second pipe 234 are independent pipes, the phase change medium in the first cavity 231 may enter the second cavity 232 through the first pipe 233, and the phase change medium in the second cavity 232 may return to the first cavity 231 through the second pipe 234 to form a flow loop of the phase change medium. Wherein the flow of the phase change medium may be unidirectional, i.e. the phase change medium from the first cavity 231 into the second cavity 232 may only be achieved by the first conduit 233, and the phase change medium from the second cavity 232 back into the first cavity 231 may only be achieved by the second conduit 234. Through setting up the second pipeline 234, can make the phase change medium in the first cavity 231 when changing into the second phase by first phase, the phase change medium in the second cavity 232 can change into first phase by the second phase simultaneously to flow back to the first cavity 231 through the second pipeline 234, form real-time phase change heat dissipation circulation, and then improve radiating efficiency.
After the phase-change medium is gasified and enters the first pipeline 233, the temperature of the first pipeline 233 is obviously increased, so that the second pipeline 234 can be arranged at a position far away from the first pipeline 233 to improve the isolation degree, so that the phase-change medium in the first phase in the second pipeline 234 is not affected by the high temperature of the first pipeline 233, and the liquid phase-change medium in the second pipeline 234 is regasified. More specifically, the first and second conduits 233 and 234 may be disposed adjacent to the first and second edges of the cover plate 210, respectively, such that the first and second conduits 233 and 234 have a greater spacing. The dynamic function 235 may be disposed between the first pipe 233 and the second pipe 234 at this time. Of course, the first and second conduits 233 and 234 may also be disposed adjacent to the third and fourth edges of the cover plate 210, respectively.
Meanwhile, in order to control the phase change medium in the first cavity 231 to enter the first pipe 233 only after gasification and control the phase change medium in the second cavity 232 to enter the second pipe 234 after condensation and liquefaction, the heat dissipation assembly 230 further comprises a first valve 238 and a second valve 239, the first valve 238 is disposed on the first pipe 233, the second valve 239 is disposed on the second pipe 234, wherein the first valve 238 can be opened only after gasification of the phase change medium in the first cavity 231, and the second valve 239 can be opened only after liquefaction of the phase change medium in the second cavity 232, so that frequent flow of the phase change medium in the first pipe 233 and the second pipe 234 can be avoided, and sound is generated. Wherein the first valve 238 is located between the first cavity 231 and the dynamic function component 235, specifically the first valve 238 is disposed between the outlet of the first cavity 231 and the communication port of the first pipe 233 and the dynamic function component 235; when the first valve 238 is in the closed state, the phase change medium cannot contact the dynamic function component 235.
The first valve 238 and the second valve 239 may be solenoid valves, and may be electrically connected to a motherboard of the electronic device, and controlled to be opened or closed by a processor integrated on the motherboard. In this embodiment, the first valve 238 and the second valve 239 may be one-way pressure valves, which may control one-way flow of the phase change medium in the first pipe 233 or the second pipe 234. Specifically, the first valve 238 controls the phase-change medium in the first pipe 233 to flow unidirectionally only from the first cavity 231 side to the second cavity 232 side, and the second valve 239 controls the phase-change medium in the second pipe 234 to flow unidirectionally only from the second cavity 232 side to the first cavity 231 side. Meanwhile, since the first valve 238 and the second valve 239 are both pressure valves, they can be automatically opened when the external pressure is greater than a preset threshold value, and can be automatically closed when the external pressure is less than the preset threshold value, so that the first valve 238 and the second valve 239 can be automatically controlled to be opened or closed without setting a control device, and the first valve 238 and the second valve 239 are controlled to be opened or closed.
As just one example, when the phase change medium enters the first pipe 233 due to uneven heating of the first and second cavities 231 and 232, the vapor pressure in the first pipe 233 gradually increases, and when the vapor pressure in the first pipe 233 is greater than or equal to a preset threshold value, the first valve 238 is automatically opened, and at this time, the vaporized phase change medium contacts the dynamic function member 235, and the dynamic function member 235 is changed in shape by the driving of the phase change medium. The vaporized phase change medium also enters the second cavity 232 and condenses and liquefies in the second cavity 232 to reform the liquid phase change medium. Since the second conduit 234 communicates with the second chamber 232 and thus with the first conduit 233, the vapor pressure within the first conduit 233 is equal to the vapor pressure within the second conduit 234. When the air pressure in the second pipeline 234 is greater than or equal to the preset pressure value of the second valve 239, the second valve 239 is automatically opened, and the liquefied phase-change medium can return to the first cavity 231 through the second pipeline 234, so that the flow circulation of the phase-change medium is formed.
It should be noted that only one of the first valve 238 and the second valve 239 may be provided, and the present application is not limited thereto.
In another embodiment, referring to fig. 9, in order to increase the condensation speed of the second cavity 232 as the condensation cavity, the second cavity 232 may include a plurality of heat dissipation channels 2321 communicating with each other, and each heat dissipation channel 2321 may be configured as one or more capillary structures, so that the contact area between the phase change medium and the second cavity 232 may be increased, and the purpose of rapid condensation is achieved.
According to the shell 200 provided by the embodiment, the heat dissipation component 230 not only can conduct heat from a high-temperature area to a low-temperature area in the electronic equipment, but also can apply work to the dynamic function parts 235 in the conduction process, so that the dynamic function parts 235 are subjected to form change, interaction forms between users and the electronic equipment 10 are enriched, and user experience is improved. Meanwhile, as a part of heat is consumed in the working process of the dynamic function part 235, the heat is dissipated more quickly, and the heat dissipation is facilitated.
The dynamic function member 235 may be configured in other forms, for example, in another embodiment, as shown in fig. 10, the dynamic function member 235 includes an impeller 237, at least part of blades of the impeller 237 are located in a moving path of the phase change medium, the impeller 237 may be rotatably installed in the first pipe 233, and when the phase change medium enters the first pipe 233 due to uneven heating of the first cavity 231 and the second cavity 232, the phase change medium in the second phase drives the impeller 237 to rotate, so that the shape of the impeller 237 is changed. Specifically, the impeller 237 includes a plurality of blades and a rotating shaft, the plurality of blades are uniformly distributed on the circumference of the rotating shaft, the rotating shaft is rotatably mounted on the heat dissipation assembly 230, and the axial direction of the rotating shaft is substantially perpendicular to the inner surface 202 of the cover plate 210. In this process, a part of the heat carried by the vaporized phase-change medium does work on the impeller 237, and is converted into mechanical energy of the impeller 237, thereby playing a role in heat dissipation. The user can observe the rotation of the impeller 237 from one side of the cover plate 210, thereby enriching the man-machine interaction mode.
As another arrangement, the impeller 237 may be made larger for increased visual perception, for ease of viewing by the user. At this time, the heat dissipation assembly 230 may further be provided with a mounting cavity 240, where the mounting cavity 240 is used for the impeller 237 to be disposed, and the impeller 237 may be rotated. The installation cavity 240 is communicated with the first pipeline 233, and the impeller 237 is arranged in the installation cavity 240, so that when the phase-change medium enters the first pipeline 233 due to uneven heating of the first cavity 231 and the second cavity 232, the impeller 237 rotates under the driving of the phase-change medium, and the shape of the phase-change medium changes. As one way, the blades of the impeller 237 may extend partially into the first conduit 233 to more directly contact the phase change medium entering the first conduit 233 for heat transfer.
In order to facilitate the observation of the user, the blades of the impeller 237 may be provided with a marker, which may be a colored object or a color marker, and when the impeller 237 rotates, the marker rotates together with the impeller 237, so that the user can observe the windmill-shaped rotation track of the impeller 237, and further enrich the man-machine interaction manner. Of course, the marker may be provided only on some of the blades or on all of the blades, and is not limited thereto.
In some embodiments, to keep other components inside the electronic device from being exposed, the cover plate 210 may include a first area adjacent to the dynamic function unit 235 and a second area, where the second area is an area of the cover plate 210 other than the first area, and the second area may be provided in a frosted or other light-shielding form so that various components inside are not exposed.
In another manner, referring to fig. 11, the housing 200 further includes a first texture layer 250, the first texture layer 250 is disposed on a surface of the cover 210, the heat dissipation component 230 is disposed on a surface of the first texture layer 250 away from the cover 210, the first texture layer 250 may be a textured coating, which is transparent to light, and the dynamic function element 235 may be exposed on the outer surface 203 of the cover 210 through the first texture layer 250. At this time, the first texture layer 250 may cover a part of components inside the electronic device, and the first texture layer 250 may also play an aesthetic role on the cover 210. The first texture layer 250 may cover the entire inner surface 202 of the cover plate 210, or may cover only a portion of the inner surface 202 of the cover plate 210, which is not limited herein. The first texture layer 250 may be bonded to the cover plate 210 by an adhesive bonding method, or may be formed on the cover plate 210 by laser etching, electroplating, or the like, which is not limited herein.
The heat dissipation assembly 230 may be a planar film structure, for example, the heat dissipation assembly 230 may be formed by two opposite planar films 2301, and edges of the two planar films 2301 are connected to form various structures such as a first cavity 231, a second cavity 232, a first pipe 233, a second pipe 234, and a mounting cavity 240. The heat dissipation assembly 230 may also be formed by welding two metal plates through edge sealing, which is not limited herein.
In a more specific embodiment, as shown in fig. 12, the first texture layer 250 is a semi-transparent film layer, which can only transmit a small amount of light, the first texture layer 250 is provided with a transparent region 251 and a non-transparent region 252, the dynamic function element 235 corresponds to the transparent region 251, and the dynamic function element 235 can be exposed from the transparent region 251 to the outer surface 203 of the cover plate 210. The first cavity 231, the second cavity 232, the first duct 233, the second duct 234, etc. may be disposed at positions corresponding to the non-light-transmitting region 252 such that such structures are not visible from the outer surface of the cover plate 210.
Further, referring to fig. 13, the housing assembly may further include a second texture layer 270, where the second texture layer 270 is disposed on a surface of the heat dissipation assembly 230 away from the first texture layer 250, and the second texture layer 270 may not be provided with a light-transmitting region 251, so that the interior of the electronic device is completely shielded from light, and various components cannot be exposed, but the dynamic function member 235 can still be displayed on the outer surface 203 of the cover plate 210 through the light-transmitting region 251, so as not to affect the human-computer interaction process between the dynamic function member 235 and the user. The second texture layer 270 may cover the entire surface of the heat dissipating component 230, or may cover only a portion of the surface of the heat dissipating component 230, which is not limited herein. The second texture layer 270 may be bonded to the heat dissipating component 230 by an adhesive bonding method, or may be formed on the heat dissipating component 230 by laser etching, electroplating, or the like, which is not limited herein.
The electronic device provided in this embodiment may provide a new man-machine interaction manner, and meanwhile, because the heat dissipation component 230 converts part of heat energy into mechanical energy of the dynamic function component 235 in the process of heat dissipation circulation, heat can be dissipated more rapidly, and heat dissipation efficiency can be improved.
The electronic device 10 of the present application may be a mobile phone or a smart phone (e.g., iPhone (TM) -based, android (TM) -based phones), portable gaming devices (e.g., nintendo (TM) -based, playStation Portable (TM) -Gameboy Advance TM, iPhone (TM)), laptops, PDAs, portable internet devices, music players, and data storage devices, other handheld devices, and devices such as watches, headphones, pendants, headphones, etc., the electronic device 10 may also be other wearable devices (e.g., head-mounted devices (HMDs) such as e-glasses, e-clothing, e-bracelets, e-necklaces, e-tattoos, electronic devices, or smart watches).
The electronic device 10 may also be any of a number of electronic devices 10, the number of electronic devices 10 including, but not limited to, cellular telephones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, vehicle transportation equipment, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbooks, personal Digital Assistants (PDAs), portable Multimedia Players (PMPs), moving picture experts group (MPEG-1 or MPEG-2) audio layer 3 (MP 3) players, portable medical devices, and digital cameras, and combinations thereof.
The above description is only of the preferred embodiments of the present application and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (14)
1. The utility model provides a casing, its characterized in that includes the apron and install in the radiating component of apron, the apron includes but the first region of printing opacity, radiating component includes first cavity, second cavity, intercommunication first cavity with the first pipeline of second cavity, second pipeline and with the dynamic function spare of first pipeline intercommunication, first cavity intussuseption is filled with the phase change medium that is in first looks, second pipeline intercommunication first cavity and second cavity for the phase change medium that is in first looks flows back to from the second cavity to first cavity, when phase change medium is because of heated phase change becomes the second phase and from first cavity is got into first pipeline, dynamic function spare is in second phase the drive down the form change of phase change medium, dynamic function spare corresponds with first region, so that the form change of dynamic function spare can see through first region, first phase change medium intercommunication first phase first pipeline intercommunication first phase change medium with the second phase change medium is in the first phase, first phase change pipeline is in the pipeline is the liquid phase change, first phase change medium is in the pipeline is in the form liquid phase, the first phase change pipeline is the liquid phase, the first phase change medium is in the pipeline is in the liquid phase, the pipeline is in the liquid phase is filled when the first phase tube is in the liquid, the liquid is in the tube is in the liquid intercommunication, the tube is filled with liquid.
2. The housing of claim 1, wherein the heat dissipating assembly further comprises a first valve disposed between the outlet of the first cavity and the communication port of the first conduit and the dynamic function.
3. The housing of claim 2, wherein the first valve is a one-way pressure valve.
4. The housing of claim 1, wherein the heat sink assembly further comprises a second valve disposed in the second conduit, the second valve configured to control a phase change medium entering the second chamber to flow back to the first chamber via the second conduit.
5. The housing of claim 4, wherein the second valve is a one-way pressure valve.
6. The housing of claim 1, wherein the first cavity is an evaporation cavity and the second cavity is a condensation cavity.
7. The housing of claim 6, wherein the second cavity includes a plurality of heat dissipation runners in communication with one another.
8. The housing of claim 1, further comprising a first texture layer disposed on a surface of the cover plate, the heat sink assembly being disposed on a surface of the first texture layer remote from the cover plate.
9. The housing of claim 8, wherein the first texture layer is provided with a light transmissive region, the dynamic function member corresponding to the light transmissive region.
10. The housing of claim 8 or 9, further comprising a second texture layer disposed on a surface of the heat sink assembly remote from the first texture layer.
11. The housing of claim 1, wherein the phase change medium is a fluorinated liquid.
12. A housing assembly, comprising:
a middle frame;
a front case assembled to the center; and
the housing of any one of claims 1-11, being mounted to the center frame on opposite sides of the center frame from the front housing.
13. An electronic device, comprising:
the housing assembly of claim 12; and
the heating component is arranged in the shell component, and the first cavity is correspondingly arranged with the heating component.
14. The electronic device of claim 13, wherein the heat generating component comprises at least one of a chip, a motherboard, and a battery.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111211976.XA CN113905565B (en) | 2021-10-18 | 2021-10-18 | Shell, shell assembly and electronic equipment |
| PCT/CN2022/113726 WO2023065804A1 (en) | 2021-10-18 | 2022-08-19 | Shell, housing assembly, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111211976.XA CN113905565B (en) | 2021-10-18 | 2021-10-18 | Shell, shell assembly and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113905565A CN113905565A (en) | 2022-01-07 |
| CN113905565B true CN113905565B (en) | 2023-11-10 |
Family
ID=79192617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111211976.XA Active CN113905565B (en) | 2021-10-18 | 2021-10-18 | Shell, shell assembly and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113905565B (en) |
| WO (1) | WO2023065804A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905565B (en) * | 2021-10-18 | 2023-11-10 | Oppo广东移动通信有限公司 | Shell, shell assembly and electronic equipment |
| CN114375136A (en) * | 2021-12-30 | 2022-04-19 | Oppo广东移动通信有限公司 | Casing, shell subassembly and electronic equipment |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3106428U (en) * | 2004-07-07 | 2005-01-06 | 環宇科技事業有限公司 | Heat dissipation device |
| CN1697925A (en) * | 2002-08-15 | 2005-11-16 | 麦莫斯弗罗有限公司 | Micro liquid handling device and methods for using it |
| JP2010171943A (en) * | 2009-11-30 | 2010-08-05 | Taruno Kazuo | Multifunction new technology cellular phone |
| CN101820934A (en) * | 2007-10-10 | 2010-09-01 | 奥林巴斯株式会社 | Medicinal solution dispenser |
| JP2012067613A (en) * | 2010-09-21 | 2012-04-05 | Seiko Epson Corp | Cooling device and projector |
| CN105578840A (en) * | 2015-07-31 | 2016-05-11 | 宇龙计算机通信科技(深圳)有限公司 | Mobile terminal |
| CN107535077A (en) * | 2015-09-01 | 2018-01-02 | 戴尔产品有限公司 | Wireless power antenna and its manufacture method including heat pipe |
| CN108377634A (en) * | 2018-04-25 | 2018-08-07 | 四川大学 | Cooling system and method based on phase-change thermal energy conversion |
| CN110167325A (en) * | 2019-06-24 | 2019-08-23 | Oppo广东移动通信有限公司 | Radiator and electronic equipment |
| CN110174016A (en) * | 2018-02-06 | 2019-08-27 | 山东大学深圳研究院 | A kind of method of cell phone application control capillary wick pressure |
| CN209552871U (en) * | 2018-12-29 | 2019-10-29 | 贺迈新能源科技（上海）有限公司 | A kind of phase-transition heat-storage new energy vehicle warm air system |
| CN209911936U (en) * | 2019-07-11 | 2020-01-07 | 深圳市尊行者科技有限公司 | Multifunctional wireless photoelectric mouse |
| CN112153837A (en) * | 2020-09-04 | 2020-12-29 | Oppo广东移动通信有限公司 | Electronic equipment and shell assembly thereof |
| CN113365470A (en) * | 2021-05-12 | 2021-09-07 | 普元电力发展有限公司 | Liftable high-efficient radiating electric cabinet of formula of convenient maintenance |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905565B (en) * | 2021-10-18 | 2023-11-10 | Oppo广东移动通信有限公司 | Shell, shell assembly and electronic equipment |
-
2021
- 2021-10-18 CN CN202111211976.XA patent/CN113905565B/en active Active
-
2022
- 2022-08-19 WO PCT/CN2022/113726 patent/WO2023065804A1/en active Application Filing
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1697925A (en) * | 2002-08-15 | 2005-11-16 | 麦莫斯弗罗有限公司 | Micro liquid handling device and methods for using it |
| JP3106428U (en) * | 2004-07-07 | 2005-01-06 | 環宇科技事業有限公司 | Heat dissipation device |
| CN101820934A (en) * | 2007-10-10 | 2010-09-01 | 奥林巴斯株式会社 | Medicinal solution dispenser |
| JP2010171943A (en) * | 2009-11-30 | 2010-08-05 | Taruno Kazuo | Multifunction new technology cellular phone |
| JP2012067613A (en) * | 2010-09-21 | 2012-04-05 | Seiko Epson Corp | Cooling device and projector |
| CN105578840A (en) * | 2015-07-31 | 2016-05-11 | 宇龙计算机通信科技(深圳)有限公司 | Mobile terminal |
| CN107535077A (en) * | 2015-09-01 | 2018-01-02 | 戴尔产品有限公司 | Wireless power antenna and its manufacture method including heat pipe |
| CN110174016A (en) * | 2018-02-06 | 2019-08-27 | 山东大学深圳研究院 | A kind of method of cell phone application control capillary wick pressure |
| CN108377634A (en) * | 2018-04-25 | 2018-08-07 | 四川大学 | Cooling system and method based on phase-change thermal energy conversion |
| CN209552871U (en) * | 2018-12-29 | 2019-10-29 | 贺迈新能源科技（上海）有限公司 | A kind of phase-transition heat-storage new energy vehicle warm air system |
| CN110167325A (en) * | 2019-06-24 | 2019-08-23 | Oppo广东移动通信有限公司 | Radiator and electronic equipment |
| CN209911936U (en) * | 2019-07-11 | 2020-01-07 | 深圳市尊行者科技有限公司 | Multifunctional wireless photoelectric mouse |
| CN112153837A (en) * | 2020-09-04 | 2020-12-29 | Oppo广东移动通信有限公司 | Electronic equipment and shell assembly thereof |
| CN113365470A (en) * | 2021-05-12 | 2021-09-07 | 普元电力发展有限公司 | Liftable high-efficient radiating electric cabinet of formula of convenient maintenance |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023065804A1 (en) | 2023-04-27 |
| CN113905565A (en) | 2022-01-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113905565B (en) | Shell, shell assembly and electronic equipment | |
| Chen et al. | Technology advances in flexible displays and substrates | |
| CN107179631B (en) | Display device | |
| KR101724621B1 (en) | Heat radiation adhesive, heat radiation sheet using the same and electronic equipment having the same | |
| CN103442110B (en) | The accessory of mobile terminal | |
| US20230413481A1 (en) | Method for manufacturing heat dissipation structure of electronic element, heat dissipation structure, and electronic device | |
| CN109817106A (en) | Display device | |
| CN209120267U (en) | Radiate mobile phone shell | |
| CN114245639B (en) | Shell, shell assembly and electronic equipment | |
| CN206671784U (en) | Intelligent watch | |
| CN109960317A (en) | Electronic device | |
| CN114340262A (en) | Casing, shell subassembly and electronic equipment | |
| CN106298836B (en) | A kind of display device structure and preparation method thereof | |
| WO2020237518A1 (en) | Display device and preparation method therefor, and electronic apparatus | |
| US20220300048A1 (en) | Thermal management systems for electronic devices and related methods | |
| CN204697157U (en) | A kind of radiator structure of moving camera | |
| JP2004179675A (en) | Electronic equipment case and thermal conduction path member used therein | |
| CN114375136A (en) | Casing, shell subassembly and electronic equipment | |
| CN220755306U (en) | Electronic equipment | |
| CN206118280U (en) | Mobile terminal's heat radiation structure | |
| CN103687429A (en) | Base device and electronic equipment | |
| CN209151199U (en) | A kind of mobile phone radiator structure | |
| CN209104821U (en) | High efficiency and heat radiation mobile power source | |
| CN114158216B (en) | Shell, manufacturing method thereof, shell assembly and electronic equipment | |
| CN206547248U (en) | A kind of diaphragm, the protection structure of glass cover-plate and mobile terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |