CN105578840A - Mobile terminal - Google Patents

Mobile terminal Download PDF

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Publication number
CN105578840A
CN105578840A CN201510466836.5A CN201510466836A CN105578840A CN 105578840 A CN105578840 A CN 105578840A CN 201510466836 A CN201510466836 A CN 201510466836A CN 105578840 A CN105578840 A CN 105578840A
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CN
China
Prior art keywords
plate
frame support
mobile terminal
mainboard
board
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Granted
Application number
CN201510466836.5A
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Chinese (zh)
Other versions
CN105578840B (en
Inventor
伏坚
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Yulong Computer Telecommunication Scientific Shenzhen Co Ltd
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Yulong Computer Telecommunication Scientific Shenzhen Co Ltd
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Priority to CN201510466836.5A priority Critical patent/CN105578840B/en
Publication of CN105578840A publication Critical patent/CN105578840A/en
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Publication of CN105578840B publication Critical patent/CN105578840B/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

Abstract

The invention discloses a mobile terminal comprising a shell, an intermediate frame support and a mainboard which is provided with electronic components. The intermediate frame support comprises a first board and a second board which are arranged in a lamination way. The first board and the second board are metal boards, and the peripheral edges of the first board and the second board are fixedly connected and a vacuum cavity is formed between the first board and the second board. Two-phase fluid is arranged in the vacuum cavity. The internal wall of the vacuum cavity is provided with capillary structures. The mainboard is connected with the first board so as to transfer heat generated by the electronic components to the first board. Gasification and liquefaction of two-phase fluid are cyclically performed in the vacuum cavity so that heat can be transferred to the position of the intermediate frame support with lower temperature and thus heat radiation can be realized. Two effects of structural supporting and heat radiation can be realized by one intermediate frame support so that the terminal structure is simplified. Besides, heat generation is solved by relying on a hardware heat radiation scheme completely, temperature is controlled within the acceptable range of users, and frequency and the size of charging current of the electronic components are controlled without software so that performance of the terminal is enabled to be fully exerted.

Description

A kind of mobile terminal
Technical field
The present invention relates to electronic product, particularly relate to a kind of mobile terminal.
Background technology
With the development of intelligent machine, CPU monokaryon, double-core rise to four cores, eight cores, frequency is also come high, mobile terminal heating is too high more and more becomes experience bottleneck, current solution is for use is natural, electrographite film is attached at inside cell phone rear cover and strengthens thermal diffusion performance, reduce fuselage surface temperature, improve hot body and test impression.But in this technical scheme, the use of heat dissipation film material improves generally can at 3 ~ 8 DEG C, and temperature reduces limited, and more improvement needs software to realize radiating management measures such as CPU frequency reducing or charging current limiters, but these measures all can reduce the performance of mobile phone, affect Consumer's Experience.
Summary of the invention
Technical problem to be solved by this invention is, provides a kind of mobile terminal, effectively can improve heat dispersion.
In order to solve the problems of the technologies described above, The embodiment provides a kind of mobile terminal, comprise shell, middle frame support and being provided with the mainboard of electronic component; Described middle frame support is fixed in described shell, and described mainboard is fixed on described middle frame support;
Described middle frame support comprises the first plate and second plate of stacked arrangement, and described first plate and described second plate are metallic plate, and the edge of the two is fixedly connected with, and is formed with vacuum cavity between; Described vacuum cavity is provided with two phase fluid, and the inwall of described vacuum cavity is provided with capillary structure;
Described mainboard is connected with described first plate, is delivered on described first plate, and is dispelled the heat by described middle frame support with the heat produced by described electronic component.
Wherein, described mainboard has mounting panel face, and described electronic component is arranged on described mounting panel face; The outer surface of described mounting panel face and described first plate is oppositely arranged;
On the outer surface of described first plate, the position corresponding with described electronic component has been recessed to form storage tank; Described electronic component is arranged in described storage tank, and described electronic component is connected with the groove bottom of described storage tank.
Wherein, heat-conducting silicone grease is filled with in described storage tank.
Wherein, at described storage tank place, be provided with spacing between the inner surface of described second plate and the inner surface of described first plate, described first plate is connected with the described capillary structure on the inner surface of described both second plates.
Wherein, described second plate is tabular.
Wherein, the edge of described middle frame support is provided with engaging lug, and described engaging lug is fixedly connected with described shell.
Wherein, be provided with support column in described vacuum cavity, described support column is supported between described first plate and described second plate; Described middle frame support is provided with installing hole, and described installing hole is arranged on the position of described support column.
Wherein, described middle frame support extends to outside the edge of described mainboard.
Wherein, described electronic component is positioned at the side place away from described middle frame support on mainboard.
Wherein, described mobile terminal also comprises described display screen component, and the back side of described display screen component is connected with described second plate.
The mobile terminal that the embodiment of the present invention provides, middle frame support can play support structure and fixation to the mainboard in terminal and miscellaneous part, is convenient to the assembly connection of each element in terminal; The gasification of diphasic liquids, liquefy and to carry out at vacuum cavity Inner eycle, the heat that electronic component produces can be delivered to the lower position of middle frame support temperature, thus middle frame support can be utilized to dispel the heat, improve radiating effect; Utilize middle frame support parts can play support structure and heat radiation two effects, simplify terminal structure, and the dependence hardware heat sink conception completely that will generate heat solves, temperature controls in the receptible scope of user, not by frequency and the charging current of software control electronic component, terminal capabilities is given full play to, brings better Consumer's Experience.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the mobile terminal that first embodiment of the invention provides;
Fig. 2 is the A-A place profile in Fig. 1;
Fig. 3 is the structural representation of the mobile terminal that second embodiment of the invention provides;
Fig. 4 is the structural representation of the mobile terminal that third embodiment of the invention provides;
Fig. 5 is the thermal profile of the mobile terminal in Fig. 4;
Fig. 6 is the thermal profile of mobile terminal of the prior art.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described.
See Fig. 1 and Fig. 2, be a kind of mobile terminal that first embodiment of the invention provides, comprise shell 1, middle frame support 2 and be provided with the mainboard 3 of electronic component 4; Middle frame support 2 is fixedly connected with shell 1, and mainboard 3 is fixedly connected with middle frame support 2.
Middle frame support 2 can play support structure and fixation to the mainboard 3 in terminal and miscellaneous part, is convenient to the assembly connection of each element in terminal.Electronic component 4 is element mainboard 3 producing heat, such as CPU etc.Electronic component 4 can be one, also can be multiple.
Middle frame support 2 comprises the first plate 21 and the second plate of stacked arrangement.First plate 21 and the second plate 22 are metallic plate, and as preferably, the first plate 21 and the second plate 22 are copper coin.First plate 21 is fixedly connected with the edge of both the second plates 22, and is formed with vacuum cavity 20 between.Vacuum cavity 20 is provided with two phase fluid (not shown), the inwall of vacuum cavity 20 is provided with capillary structure 23.Any one in the capillary structure etc. that capillary structure 23 can be silk screen capillary structure, porous foam metal capillary structure, loose powder sintering are formed.
Mainboard 3 is connected with the first plate 21, is delivered on the first plate 21, and is dispelled the heat by middle frame support 2 with the heat produced by electronic component 4.When the heat of electronic component 4 is delivered to after on the first plate 21, the gasification phenomenon produced is started after the two phase fluid that vacuum cavity is 20 li is heated, now two phase fluid absorbs heat energy and rapid spatial expansion, the fluid of gas phase is full of whole vacuum cavity 20, when the fluid contact of gas phase liquefies to during the region that temperature is lower, and release heat, the fluid of liquefaction can get back to the position of thermal source and electronic component 4 by capillary structure 23.
The gasification of diphasic liquids, liquefy and to carry out at vacuum cavity 20 Inner eycle, the heat that electronic component 4 produces can be delivered to the lower position of middle frame support 2 temperature, thus middle frame support 2 can be utilized to dispel the heat, improve radiating effect.Utilize middle frame support 2 one parts can play support structure and heat radiation two effects, simplify terminal structure.To generate heat and rely on hardware heat sink conception to solve completely, temperature controls in the receptible scope of user, does not pass through software control electronic component as the frequency of CPU and charging current, terminal capabilities is given full play to, brings better Consumer's Experience.
Mainboard 3 has mounting panel face 30, and electronic component 4 is arranged on mounting panel face 30; The outer surface of mounting panel face 30 and the first plate 21 is oppositely arranged.On the outer surface of the first plate 21, the position corresponding with electronic component 4 has been recessed to form storage tank 24; Electronic component 4 is arranged in storage tank 24, and electronic component 4 is connected with the groove bottom of storage tank 24.Utilize storage tank 24 that middle frame support 2 pairs of electronic components 4 can be made to be formed to surround, can heat absorption capacity be strengthened, improve radiating effect, the space around electronic component 4 can be made full use of simultaneously, make compact conformation, be beneficial to the miniaturization of terminal.
Further, in storage tank 24, be filled with heat-conducting silicone grease (not shown), utilize heat-conducting silicone grease by coated for electronic component 4, to make the cell wall of storage tank 24 also can absorb the heat of electronic component 4, thus improve heat transfer performance.Heat-conducting silicone grease can also fill the slight void between the groove bottom of electronic component 4 and storage tank 24, the conjugation of both raisings, is convenient to heat transmission, to improve radiating effect.Herein, in other embodiments, also thermal conductive silicon pad can be set in storage tank 24, utilize thermal conductive silicon pad to be arranged between electronic component 4 and the first plate 21, can also space be filled, improve heat transfer performance.
At storage tank 24 place, spacing is provided with between the inner surface of the second plate 22 and the inner surface of the first plate 21, can make to there is certain space in the corresponding position of storage tank 24 and also can be provided with two phase fluid and capillary structure 23, be beneficial to the heat that two phase fluid fully absorbs electronic component 4, to improve heat-sinking capability.In the corresponding position of storage tank 24, the first plate 21 is connected with the capillary structure 23 on the inner surface of both the second plates 22, makes the fluid on the second plate 22 can enter into the position of corresponding storage tank 24 on the first plate 21 inner surface, improves heat transfer performance.
Gap is provided with between mounting panel face 30 and the outer surface of the first plate 21.When carrying out assembling fastening, securing member can be utilized to carry out distance that is fastening and that reduce between mounting panel face 30 and the outer surface of the first plate 21, thus make electronic component 4 tight abutment in the groove bottom of storage tank 24, improve the heat transfer performance between electronic component 4 and the first plate 21.
Second plate 22 is tabular, makes its position at corresponding storage tank 24 also for tabular, and the outer surface entirety that can make the second plate 22 is plane, is beneficial to being connected of the second plate 22 and miscellaneous part.
Further, mobile terminal also comprises display screen component 5, and the back side of display screen component 5 is connected with the second plate 22, utilizes middle frame support 2 so that the assembling of display screen component 5, can to dispel the heat to the heat that display screen component 5 produces simultaneously.Display screen component 5 and mainboard 3 are separately positioned on the both sides of middle frame support 2, can be convenient for assembly.
The edge of middle frame support 2 is provided with engaging lug 25, and engaging lug 25 is fixedly connected with shell 1.Shell 1 and middle frame support 2 assembly connection can be realized easily by engaging lug 25, such as, screw can be utilized to be fixed with shell 1 by engaging lug 25 and be connected.Engaging lug 25 is extended to form by the edge of the first plate 21 and the second plate 22, and namely engaging lug 25 is double-decker, can improve the structural strength of engaging lug 25.Herein, in other embodiments, engaging lug 25 also can only be extended to form by the edge of the first plate 21, or is only extended to form by the edge of the second plate 22.
In the present embodiment, shell 1 is the frame of terminal, its inner surface is provided with location division 11, location division 11 is stairstepping on the thickness direction of middle frame support 2, the engaging lug 25 of the edge of middle frame support 2 is resisted against on the cascaded surface of location division 11, the edge of mainboard 3 is fixedly connected with shell 1, thus middle frame support 2 is pressed between location division 11 and mainboard 3, to facilitate the assembly connection of middle frame support 2, and without the need to arranging other syndetons in the centre of middle frame support 2, to avoid damaging vacuum cavity 20.Herein, in other implementations, the edge of middle frame support 2 also can not arrange engaging lug 25, and directly the edge of middle frame support 2 is resisted against on the cascaded surface of location division 11.
Middle frame support 2 extends to outside the edge of mainboard 3, make the size of middle frame support 2 larger relative to mainboard 3, the outer surface of the first plate 21 is greater than the mounting panel face 30 of mainboard 3, thus can conduct heat to relatively away from the position of mainboard 3, dispelling the heat in the position avoiding heat to concentrate on mainboard 3, and then improves heat dispersion.
As shown in Figure 3, in the second embodiment provided by the invention, the overall structure of mobile terminal is roughly the same with the first embodiment, and its difference is, syndeton between middle frame support 2a and shell 1a, and the syndeton between middle frame support 2a and mainboard 3a.
Particularly, between middle frame support 2a and shell 1a, the engaging lug 25a of middle frame support 2a is utilized directly to be fixedly connected with shell 1a by screw.
Between middle frame support 2a and mainboard 3a, be provided with support column 27a in vacuum cavity 20a, support column 27a is supported between the first plate 21a and the second plate 22a; Middle frame support 2a is provided with installing hole, and installing hole 26a is arranged on the position of support column 27a.In the present embodiment, installing hole 26a is screwed hole, and its opening is positioned on the outer surface of the first plate 21a, wears mainboard 3a and be threaded with installing hole 26a by screw, to be connected with mainboard 3a by middle frame support 2a.Meanwhile, installing hole 26a is utilized the miscellaneous part in mobile terminal can be fixed on middle frame support 2a.
Installing hole 26a is arranged on the position of support column 27a, the structural strength of installing hole 26a to middle frame support 2a can be avoided to impact, avoid damaging the vacuum cavity 20a of middle frame support 2a inside simultaneously.
Herein, in other embodiments, installing hole also can be through hole, wears mainboard 3a, middle frame support 2a successively and be threaded with shell 1a by screw, can realize mainboard 3a, assembly connection between middle frame support 2a and shell 1a.
In the above two embodiments, the installed surface of mainboard is arranged towards middle frame support, certainly, in other embodiments, also can be that the another side of mainboard is arranged towards middle frame support.As shown in Figure 4, in the 3rd execution mode provided by the invention, mainboard 3b is connected with first plate of middle frame support 2b, and electronic component 4b is positioned at the side place away from middle frame support 2b on mainboard 3b.The heat that electronic component 4b produces can be delivered on middle frame support 2b by mainboard 3b, then is dispelled the heat by middle frame support 2b.Between mainboard 3b and middle frame support 2b, thermal conductive silicon pad can be set, the space between mainboard 3b and middle frame support 2b can be filled, improve heat transfer performance therebetween, mainboard 3b can be avoided to be electrically connected with middle frame support 2b simultaneously and cause short circuit.
As shown in Figure 5, for the thermal profile of middle frame support on the mobile terminal that third embodiment of the invention provides, Fig. 6 is the heat distribution of common middle frame support structure under identical assembling mode in prior art, visible, the heat distribution of mobile terminal provided by the invention is comparatively even, be not concentrated on a certain point, effectively can improve heat dispersion, reduce the temperature of mobile terminal.
Above-described execution mode, does not form the restriction to this technical scheme protection range.The amendment done within any spirit at above-mentioned execution mode and principle, equivalently to replace and improvement etc., within the protection range that all should be included in this technical scheme.

Claims (10)

1. a mobile terminal, is characterized in that, comprises shell, middle frame support and is provided with the mainboard of electronic component; Described middle frame support is fixed in described shell, and described mainboard is fixed on described middle frame support;
Described middle frame support comprises the first plate and second plate of stacked arrangement, and described first plate and described second plate are metallic plate, and the edge of the two is fixedly connected with, and is formed with vacuum cavity between; Described vacuum cavity is provided with two phase fluid, and the inwall of described vacuum cavity is provided with capillary structure;
Described mainboard is connected with described first plate, is delivered on described first plate, and is dispelled the heat by described middle frame support with the heat produced by described electronic component.
2. mobile terminal according to claim 1, is characterized in that, described mainboard has mounting panel face, and described electronic component is arranged on described mounting panel face; The outer surface of described mounting panel face and described first plate is oppositely arranged;
On the outer surface of described first plate, the position corresponding with described electronic component has been recessed to form storage tank; Described electronic component is arranged in described storage tank, and described electronic component is connected with the groove bottom of described storage tank.
3. mobile terminal according to claim 2, is characterized in that, is filled with heat-conducting silicone grease in described storage tank.
4. mobile terminal according to claim 2, it is characterized in that, at described storage tank place, be provided with spacing between the inner surface of described second plate and the inner surface of described first plate, described first plate is connected with the described capillary structure on the inner surface of described both second plates.
5. mobile terminal according to claim 2, is characterized in that, described second plate is tabular.
6. mobile terminal according to claim 1, is characterized in that, the edge of described middle frame support is provided with engaging lug, and described engaging lug is fixedly connected with described shell.
7. mobile terminal according to claim 1, is characterized in that, is provided with support column in described vacuum cavity, and described support column is supported between described first plate and described second plate; Described middle frame support is provided with installing hole, and described installing hole is arranged on the position of described support column.
8. mobile terminal according to claim 7, is characterized in that, described middle frame support extends to outside the edge of described mainboard.
9. mobile terminal according to claim 1, is characterized in that, described electronic component is positioned at the side place away from described middle frame support on mainboard.
10. the mobile terminal according to any one of claim 1-9, is characterized in that, described mobile terminal also comprises described display screen component, and the back side of described display screen component is connected with described second plate.
CN201510466836.5A 2015-07-31 2015-07-31 A kind of mobile terminal Active CN105578840B (en)

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PCT/CN2015/091342 WO2017020419A1 (en) 2015-07-31 2015-09-30 Mobile terminal

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CN106647022A (en) * 2016-12-01 2017-05-10 深圳市华星光电技术有限公司 Heat dissipation structure of backlight module, backlight module, liquid crystal display module and television set
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CN110035643A (en) * 2019-05-23 2019-07-19 Oppo广东移动通信有限公司 Radiating subassembly and electronic equipment
CN110167322A (en) * 2019-06-12 2019-08-23 Oppo广东移动通信有限公司 Shell and electronic equipment
CN110191626A (en) * 2019-06-28 2019-08-30 Oppo广东移动通信有限公司 Housing unit, preparation method and electronic equipment
CN110213947A (en) * 2019-06-28 2019-09-06 Oppo广东移动通信有限公司 Housing unit and preparation method thereof and electronic equipment
WO2019200882A1 (en) * 2018-04-17 2019-10-24 南昌黑鲨科技有限公司 Heat dissipation component and intelligent terminal
CN110730600A (en) * 2019-10-29 2020-01-24 维沃移动通信有限公司 Electronic equipment's casing and electronic equipment
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CN106131254A (en) * 2016-07-25 2016-11-16 深圳天珑无线科技有限公司 A kind of mobile phone
CN106027708A (en) * 2016-07-25 2016-10-12 深圳天珑无线科技有限公司 Mobile phone
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CN106993396A (en) * 2017-05-16 2017-07-28 奇酷互联网络科技(深圳)有限公司 A kind of anti-shielding construction of mobile phone and cell phone mainboard
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