CN220755306U - Electronic equipment - Google Patents

Abstract

The embodiment of the application provides electronic equipment, including framework and radiator unit, the framework includes first framework, second framework and rotates the connecting piece, and first framework and second framework are connected in the both sides of rotating the connecting piece to can fold or expand relatively. The heat dissipation assembly comprises a first soaking piece, a second soaking piece and a communicating part, wherein the first soaking piece is arranged in the first frame, the second soaking piece is arranged in the second frame, liquid media are filled in the first soaking piece and the second soaking piece, and the communicating part penetrates through the rotating connecting piece and is communicated with the first soaking piece and the second soaking piece. Through setting up the intercommunication portion, pass and rotate the connecting piece and will set up in the first soaking piece in first framework and set up in the second soaking piece intercommunication in the second framework for first soaking piece and second soaking piece are when transferring heat, and the heat can evenly disperse in first framework and second framework, and then carries out the heat dissipation towards the low temperature district with the high temperature district heat, improves radiating efficiency.

Description

Electronic equipment

Technical Field

The application relates to the technical field of heat dissipation, in particular to electronic equipment.

Background

With the development of communication technology, mobile electronic devices such as mobile phones and tablet computers are widely used in daily life. In order to improve portability of electronic devices, foldable electronic devices have also appeared, which can be unfolded when in use and folded when not in use, so as to be portable.

Because folding electronic equipment has a plurality of middles, has separated inside setting space, consequently in order to hold more components and parts, can set up all kinds of components and parts respectively in different middles, and these components and parts can produce a large amount of heats when the during operation, how to dispel the heat to the components and parts that distribute in different middles has just become the problem that needs to be solved urgently.

Disclosure of Invention

An object of the present application is to provide an electronic device, so as to at least partially solve the above technical problems.

The embodiment of the application provides electronic equipment, including framework and radiator unit, the framework includes first framework, second framework and rotates the connecting piece, and first framework and second framework are connected in the both sides of rotating the connecting piece to can fold or expand relatively. The heat dissipation assembly comprises a first soaking piece, a second soaking piece and a communicating part, wherein the first soaking piece is arranged in the first frame, the second soaking piece is arranged in the second frame, liquid media are filled in the first soaking piece and the second soaking piece, and the communicating part penetrates through the rotating connecting piece and is communicated with the first soaking piece and the second soaking piece.

The electronic equipment that this embodiment provided, through setting up the intercommunication portion, pass and rotate the connecting piece and will set up in the first soaking piece in first framework and set up the second soaking piece intercommunication in the second framework for first soaking piece and second soaking piece are when transferring heat, and the heat can be at the interior even dispersion of first framework and second framework, and then dispel the heat with the heat band in high temperature district toward the low temperature district, improves radiating efficiency.

These and other aspects of the present application will be more readily apparent from the following description of the embodiments.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of an electronic device in an unfolded state according to an embodiment of the present application.

Fig. 2 is a schematic structural view of the electronic device shown in fig. 1 in an unfolded state.

Fig. 3 is a schematic diagram of an assembly structure of a heat dissipating assembly in another electronic device according to an embodiment of the present application.

Fig. 4 is a schematic structural diagram of a first soaking member according to an embodiment of the present application.

Fig. 5 is a schematic structural diagram of a heat dissipating assembly according to an embodiment of the present application.

Fig. 6 is a schematic structural diagram of a heat dissipating assembly according to another embodiment of the present application.

Fig. 7 is a schematic structural diagram of a heat dissipating assembly according to another embodiment of the present disclosure.

Fig. 8 is a schematic structural diagram of still another heat dissipating assembly according to an embodiment of the present application.

Fig. 9 is a schematic structural diagram of still another heat dissipating assembly according to an embodiment of the present application.

Fig. 10 is a logic block diagram of an electronic device according to an embodiment of the present application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

Because the foldable electronic device has a plurality of middle frames, the space for setting the inside is separated, therefore in order to accommodate more components, various components are respectively arranged in different middle frames, for example, components such as a main board, a battery and the like are respectively arranged in different middle frames, and a large amount of heat can be generated by the main board in the use process, and if the heat is not timely dissipated, the normal work of the electronic device can be influenced.

At present, a main mode of heat dissipation in electronic equipment is to heat dissipation through attaching cooling fins such as graphite sheets and metal sheets, so that heat in a region with higher heat generation amount drives a region with lower heat generation amount, and the local temperature of the electronic equipment is reduced. However, because the middle frame of the foldable electronic device is divided into small blocks, the patch radiating mode has small covered area, and the heat in the high-heat area can not be quickly transferred to the low-heat area, thereby affecting the radiating efficiency

Based on this, the inventors of the present application have long studied and have proposed an electronic device that can achieve better heat dissipation of a folding electronic device.

The following detailed description of the present application refers to the accompanying drawings, which illustrate specific embodiments.

As shown in fig. 1, the present embodiment provides an electronic device 10, where the electronic device 10 may be a mobile phone or a smart phone (e.g., an iPhone-based TM, an Android-based TM) and a Portable game device (e.g., nintendo DS (TM), playStation Portable (TM), gameboy Advance TM, iPhone (TM)), a laptop, a PDA, a Portable internet device, a music player, a data storage device, other handheld devices, and the like, and the electronic device 10 may also be other wearable devices.

Referring to fig. 1 and 2 together, the present embodiment provides an electronic device 10, and the electronic device 10 is foldable. In which fig. 1 shows a structure in which the electronic apparatus 10 is in an unfolded state, and fig. 2 shows a structure in which the electronic apparatus 10 is in a folded state. The electronic device 10 provided in this embodiment will be described by taking a mobile phone as an example. The electronic device 10 includes a housing 20, a display 30, a battery 50, and the like, and the main board 40 and the battery 50 are disposed inside the electronic device 10. The electronic device 10 may also be provided with a front camera (not shown) disposed on the side of the electronic device 10 where the display screen 30 is disposed.

With continued reference to fig. 1 and 2, the frame 20 is foldable, specifically, the frame 20 includes a first frame 100, a second frame 200, and a rotating connector 300, the rotating connector 300 is connected between the first frame 100 and the second frame 200, and the first frame 100 is relatively folded or unfolded with respect to the second frame 200 by the rotating connector 300, where folding refers to stacking the first frame 100 and the second frame 200 in an overlapping posture. During the relative folding of the first and second frames 100, 200, the rotational connector 300 may bend, and in some embodiments, the first and second frames 100, 200 may be axisymmetric along the rotational connector 300, i.e., the first and second frames 100, 200 may completely overlap when the first and second frames 100, 200 are in the folded state, i.e., the areas of the first and second frames 100, 200 are substantially equal. In other embodiments, the first and second housings 100 and 200 may not be completely overlapped in the folded state, and the areas of the first and second housings 100 and 200 may not be equal in this case, which is not limited in this example.

In some embodiments, the rotational connector 300 may be formed by a plurality of hinge structures, not limited herein. In some embodiments, the rotational connector may also be a flexible and retractable structure, not specifically limited herein.

Wherein the first frame 100 has a first side and a second side facing away from the first side, wherein the first side and the second side are laminated along a thickness direction of the first frame 100. In some embodiments, the first frame 100 may include a middle frame and a rear cover, where the rear cover is mounted on the middle frame to form a cavity, and the rear cover may be assembled with the middle frame by bonding or clamping, and in some embodiments, the rear cover may be made of glass, ceramic, plastic, metal, etc.

The second frame 200 has a third side and a fourth side facing away from the third side, wherein the third side and the fourth side are laminated in a thickness direction of the second frame 200. In some embodiments, the second frame 200 may also be composed of a middle frame and a rear cover, where the rear cover is mounted on the middle frame to form a cavity, and the rear cover may be assembled with the middle frame by bonding or clamping, and in some embodiments, the rear cover may be made of glass, ceramic, plastic, metal, etc. When the first and second frames 100 and 200 are in the flattened state, the first side may be flush with the third side, and the second side may be flush with the fourth side.

In one embodiment, the display screen 30 may be a foldable flexible display screen that is continuously assembled to the first and second housings 100 and 200, and the display screen 30 is folded when the first and second housings 100 and 200 are folded. It should be understood that, when the first housing 100 and the second housing 200 are in the relatively folded state, the display screen 30 may be located on the inner side and not exposed, i.e. the electronic device 10 is an inwardly folded electronic device, and the display screen 30 may be located on the outer side and exposed on the surface of the electronic device 10, i.e. the electronic device 10 is an outwardly folded electronic device.

In another embodiment, the number of the display screens 30 may be two, and the two display screens 30 are respectively disposed on the first frame 100 and the second frame 200, and In this case, the display screens 30 may use an LCD (Liquid Crystal Display ) screen for displaying information, and the LCD screen may be a TFT (Thin Film Transistor ) screen or an IPS (In-Plane Switching) screen or an SLCD (Splice Liquid Crystal Display, split-joint dedicated liquid crystal display) screen. In other embodiments, the display screen 30 may employ an OLED (Organic Light-Emitting Diode) screen for displaying information, and the OLED screen may be an AMOLED (Active Matrix Organic Light Emitting Diode ) screen or a Super AMOLED (Super Active Matrix Organic Light Emitting Diode, super active driving Organic Light Emitting Diode) screen or a Super AMOLED Plus (Super Active Matrix Organic Light Emitting Diode Plus, magic screen) screen, which will not be described herein.

In addition, the electronic device 10 may further include a secondary screen (not shown) disposed on the first housing 110 or the second housing 120 and located on a side opposite to the display screen 30, where the secondary screen may be one or more, and the embodiment is not limited thereto.

Referring to fig. 3, the rotary connector 300 includes a hinge 310 and a decorative case 320, and the first frame 100 and the second frame 200 are connected to two sides of the hinge 310 and can rotate relative to the hinge 310, so as to realize relative folding or unfolding of the first frame 100 and the second frame 200. The hinge 310 may be any commercially available hinge 310 structure, and this embodiment is not limited thereto. In this embodiment, the hinge 310 is formed by two rotating shafts provided with gears, and the gears on the two adjacent rotating shafts are meshed with each other and synchronously rotate, and the rotating shaft near the first frame 100 is fixedly connected with the first frame 100, and the rotating shaft near the second frame 200 is fixedly connected with the second frame 200. The decoration case 320 is disposed outside the hinge 310 and on a side opposite to the display screen, the decoration case 320 is connected to the first frame 100 and the second frame 200 and can rotate relative to the first frame 100 and the second frame 200, and the decoration case 320 can be made of the same material as the first frame 100 and the second frame 200, so that the uniformity of the appearance of the electronic device 10 can be maintained.

A gap 330 is provided between the decorative case 320 and the hinge 310, and the gap 330 allows the hinge 310 to rotate freely, so that the hinge 310 and the decorative case 320 do not interfere. The width of the gap 330 may be, for example, 3-5mm.

The electronic device 10 further includes a main board 40 and a battery 50, where the main board 40 may be disposed in the first housing 100, the battery 50 may be disposed in the second housing 200, and in order to improve the cruising ability of the electronic device 10, the battery 50 may be a large-volume battery 50, for example, an area of the battery 50 may cover at least 80% of the area of the second housing 200. The main board 40 may be electrically connected to a battery 50 to obtain power. Various types of processors 60, memory, and other devices may be integrated on motherboard 40, and thus more heat may be generated during operation of motherboard 40. In one embodiment, the electronic device 10 may further include a secondary battery (not shown), which may be disposed within the first housing 100 and adjacent to the motherboard 40, and which may be electrically connected to the motherboard 40, and which may provide power to the motherboard 40, such that the battery 50 may not need to be wired into the first housing 100 to power the electrical components within the first housing 100. The battery 50 may be electrically connected to the display screen to power the display screen. Since the components such as the main board 40 are already provided in the first housing 100, the space available for providing the sub-battery is small, and therefore the capacity of the sub-battery is generally smaller than that of the battery 50. The battery 50 and the sub-battery also generate heat when operating or charging, but generally generate less heat than the motherboard 40.

With continued reference to fig. 3, the electronic device 10 further includes a heat dissipation assembly 400, where the heat dissipation assembly 400 includes a first heat spreader 410, a second heat spreader 420, and a communication portion 430, and the communication portion 430 communicates with the first heat spreader 410 and the second heat spreader 420.

The first soaking piece 410 is disposed in the first frame 100, and the first soaking piece 410 may be attached to a heating element in the first frame 100, for example: the first soaking piece 410 may be attached to and cover at least a portion of the motherboard 40, and when the heating element in the first frame 100 further includes other heating elements, the first soaking piece 410 may also be attached to and cover other heating elements, which is not limited herein. In one embodiment, the area of the first soaking member 410 may be greater than or equal to 50% of the area of the first frame 100. When the sub-battery is disposed in the first frame 100, the first soaking member 410 may cover at least a portion of the sub-battery.

The second soaking piece 420 is disposed in the second frame 200, and the second soaking piece 420 may be attached to a heating element in the second frame 200, for example: the second soaking member 420 may be attached to and cover at least a portion of the battery 50, and when the heating element in the second frame 200 further includes other heating elements, the second soaking member 420 may also be attached to and cover other heating elements, which is not limited herein. In one embodiment, the area of the second soaking member 420 may be greater than or equal to 75% of the area of the second frame 200.

The first soaking member 410 and the second soaking member 420 are filled with a liquid medium, which may be, for example, water, a salt solution, or the like, and the present embodiment is not limited thereto. The liquid medium may flow within the first heat spreader 410 and the second heat spreader 420 and may absorb heat. The communication portion 430 communicates the first soaking member 410 and the second soaking member 420, and the liquid medium can flow, so that the communication portion 430 is also filled with the liquid medium. By providing the communicating portion 430, the liquid media in the first soaking piece 410 and the second soaking piece 420 can be fused and flow, so that when the temperature of the liquid media in the first soaking piece 410 is higher than that of the liquid media in the second soaking piece 420, the hot liquid media in the first soaking piece 410 can flow towards the second soaking piece 420, the cold liquid media in the second soaking piece 420 can flow towards the first soaking piece 410 to form circulation, and the temperature of the liquid media in the first soaking piece 410 is reduced, so that the purpose of dissipating heat near the first soaking piece 410 towards the vicinity of the second soaking piece 420 is achieved. Similarly, when the temperature of the liquid medium in the first soaking member 410 is lower than the temperature of the liquid medium in the second soaking member 420, the hot liquid medium in the second soaking member 420 may flow toward the inside of the first soaking member 410, and the cold liquid medium in the first soaking member 410 flows toward the inside of the second soaking member 420 to form a circulation, thereby reducing the temperature of the liquid medium in the second soaking member 420 and achieving the purpose of dissipating the heat near the second soaking member 420 toward the vicinity of the first soaking member 410.

The area of the first soaking piece 420 may be smaller than that of the second soaking piece 420, and this arrangement mode of the first aspect may adapt to the space in the first frame 100 and the second frame 200, and meanwhile, since the heat productivity of the main board 40 in the first frame 100 is large, the first soaking piece 410 is set smaller, so that the heat generated by the main board is quickly absorbed, the temperature in the first soaking piece 410 is quickly increased, and then the liquid medium in the first soaking piece 410 can flow into the second soaking piece 420 as soon as possible, so as to achieve the purpose of exchanging heat with the second soaking piece 420, and improve the heat dissipation efficiency. And because the area of the second soaking piece 420 is larger, the volume of the filled liquid medium is larger, which is more favorable for uniformly distributing heat in the second frame 200, and avoiding the excessively fast temperature rise of the second frame 200.

Specifically, referring to fig. 4, fig. 4 shows a structure of a first soaking member 410, where the first soaking member 410 and the second soaking member 420 each include a first plate 411 and a second plate 412 that are disposed opposite to each other, edges of the first plate 411 and the second plate 412 are connected and enclose a cavity 413, a liquid medium is filled in the cavity 413, and a communication portion 430 communicates the cavity 413 of the first soaking member 410 and the cavity 413 of the second soaking member 420. The first plate 411 and the second plate 412 may be made of a material with high thermal conductivity, such as copper, iron, steel, and other metal materials. In order to adapt the thickness space within the electrical apparatus 10, the thicknesses of the first soaking member 410 and the second soaking member 420 may be, for example, 1-4mm, and the thicknesses of the first plate 411 and the second plate 412 may be, for example, 0.3-0.8mm, which is not particularly limited in this embodiment. The first soaking member 410 and the second soaking member 420 may have equal thickness or different thickness, and the thicknesses of the first soaking member 410 and the second soaking member 420 may be appropriately selected according to the space in the first frame 100 and the second frame 200.

The cavity 413 may be an integral cavity 413 structure, that is, the cavity 413 is a continuous regular whole and is formed between the first plate 411 and the second plate 412, so that the arrangement mode can increase the volume of the cavity 413, further fill more liquid medium, and ensure that the temperature of the whole electronic device 10 is not too high when in use. In this embodiment, as shown in fig. 5, a pipe structure 414 with a plurality of bends is formed between the first plate 411 and the second plate 412, and a cavity 413 is formed in the pipe structure 414. The pipe structure 414 may cover most areas of the first plate 411 and the second plate 412, when the liquid medium flows in the cavity 413, the liquid medium flows along the direction of the pipe structure 414, and in this arrangement, since the pipe structure 414 has a plurality of bends, the flow path of the liquid medium will be prolonged, so that the flow area of the liquid medium for heat exchange in the flowing process is larger, and the heat exchange efficiency is higher.

Illustratively, as shown in fig. 5, the conduit structure 414 may be configured as a serpentine structure that is reciprocally bent, and the conduit structure 414 may be configured as any other shape, which is not limited in this embodiment.

Since the first soaking member 410 is disposed in the first frame 100 and the second soaking member 420 is disposed in the second frame 200, the communicating portion 430 needs to be disposed through the rotary connector 300 when communicating the first soaking member 410 and the second soaking member 420. In one embodiment, the display screen may be a flexible display screen and is continuously laid on the first frame 100, the rotating connector 300, and the second frame 200, and the communicating portion 430 may be disposed below the flexible display screen and communicate with the first soaking member 410 and the second soaking member 420. In this embodiment, the flexible display may contact or interfere with the communication part 430 during the folding or unfolding of the first and second housings 100 and 200, which is disadvantageous for prolonging the service life of the electronic device 10. In this embodiment, referring to fig. 3 again, when the communication portion 430 passes through the rotary connector 300, the communication portion 430 can pass through the gap 330 between the hinge 310 and the decorative shell 320, so that the communication portion 430 can avoid the display screen, and the communication portion 430 does not interfere with the hinge 310 and does not affect the normal operation of the hinge.

In order to better protect the communication part 430 and the flexible display screen, the communication part 430 is preferably made of a material with a certain flexible deformation capability, for example, the communication part 430 may be made of a material such as flexible plastic, silica gel, or the like, or made of a metal such as copper, or the like, which has better flexibility. In communicating with the first soaking member 410 and the second soaking member 420, the communicating portion 430 may communicate with the first soaking member 410 and the second soaking member 420 by means of heat fusion, welding, or the like.

As shown in fig. 6, the communicating portion 430 may be a unitary structure, and in this case, when the liquid medium flows between the first soaking member 410 and the second soaking member 420, the cold liquid medium and the hot liquid medium both flow between the first soaking member 410 and the second soaking member 420 from the same position.

In another embodiment, as shown in fig. 7, the communicating portion 430 may include at least two communicating pipes 431, each communicating pipe 431 communicates with the first soaking member 410 and the second soaking member 420, and the at least two communicating pipes 431 are disposed at intervals, which is advantageous in that: the cold liquid medium and the hot liquid medium flow between the first soaking piece 410 and the second soaking piece 420 from the different communicating pipes 431, so that flow circulation is formed, flow balance and heat exchange of the liquid medium are realized quickly, and the heat dissipation effect is better.

Further, in an embodiment, referring to fig. 8, the first soaking member 410 may form a plurality of independent cavities 413, the second soaking member 420 may also form a plurality of cavities 413, each cavity 413 is filled with a liquid medium, and the plurality of communicating pipes 431 may be respectively communicated with different cavities 413 of the first soaking member 410 and different cavities 413 of the second soaking member 420, which may implement a flow circuit of a plurality of liquid mediums.

In the flowing process of the liquid medium, the driving force is derived from the temperature difference between the first soaking piece 410 and the second soaking piece 420, and when the temperature difference between the first soaking piece 410 and the second soaking piece 420 is smaller, the flowing speed of the liquid medium is obviously reduced, which is unfavorable for the rapid diffusion and exchange of heat. Thus, in one embodiment, as shown in fig. 9, the heat dissipating assembly 400 may further include a micro pump 450, where the micro pump 450 is disposed in the communication portion 430 and is used to provide a driving force for the flow of the liquid medium, and it is understood that the micro pump 450 may be one or multiple. By providing the micropump 450, a strong driving force can be provided for the flow of the liquid medium, so that the flow speed of the liquid medium is increased, and the heat exchange efficiency is further improved.

In a more specific embodiment, referring to fig. 9 and 10, the micro pump 450 may be disposed in the first housing 100 or adjacent to the first housing 100 and electrically connected to the motherboard 40, and the processor 60 of the motherboard 40 may control the micro pump 450 to be turned on or off, so that the micro pump 450 is turned on only when the micro pump 450 needs to be turned on, thereby reducing the power consumption of the micro pump 450. For example, the heat sink assembly 400 may further include a temperature sensor 70, the temperature sensor 70 being configured to detect a temperature of the first heat spreader 410 and a temperature of the second heat spreader 420. When the difference between the temperature of the first soaking member 410 and the temperature of the second soaking member 420 detected by the temperature sensor 70 is less than or equal to a preset temperature threshold value, the micropump 450 is controlled to be turned on. When the difference between the temperature of the first soaking member 410 and the temperature of the second soaking member 420 detected by the temperature sensor 70 is greater than the preset temperature threshold, the micropump 450 is controlled to be turned off, and at this time, the liquid medium can still maintain a faster flow rate due to the greater temperature difference between the first soaking member 410 and the second soaking member 420.

It should be noted that, in other embodiments, the micro pump 450 may be kept in an on state all the time. And the output power of the micropump 450 can be adjusted in real time so that the liquid medium maintains a stable flow rate.

In another more specific embodiment, since the processor 60 disposed on the motherboard 40 is a more heat generating component, the temperature sensor 70 may be used to detect the temperature of the processor 60 on the motherboard 40, activate the micropump 450 and operate the micropump 450 at a first speed when the temperature of the processor 60 is detected to exceed a first temperature threshold, and deactivate the micropump 450 when the temperature of the processor 60 is detected to be below the first threshold. When the temperature of the processor 60 is detected to exceed the second temperature threshold, the micropump 450 is activated and the micropump 450 is operated at the second speed, and when the temperature of the processor 60 is detected to exceed the third temperature threshold, the micropump 450 is activated and the micropump 450 is operated at the third speed. Similarly, the operating rate of micropump 450 may also be set in a manner proportional to the temperature of processor 60, which is not limited in this embodiment. It should be understood that in this embodiment, the operation rate of the micropump 450 refers to the rotational speed of the micropump 450.

Wherein the processor 60 may include one or more processing cores. The processor 60 utilizes various interfaces and lines to connect various portions of the overall electronic device 10, perform various functions of the electronic device 1010 and process data by executing or executing instructions, programs, code sets, or instruction sets stored in memory, and invoking data stored in memory. Alternatively, the processor 60 may be implemented in hardware in at least one of digital signal processing (Digital Signal Processing, DSP), field programmable gate array (Field-Programmable Gate Array, FPGA), programmable logic array (Programmable Logic Array, PLA). The processor 60 may integrate one or a combination of several of a central processing unit 60 (Central Processing Unit, CPU), an image processing unit 60 (Graphics Processing Unit, GPU), and a modem, etc. The CPU mainly processes an operating system, a user interface, an application program and the like; the GPU is used for being responsible for rendering and drawing of display content; the modem is used to handle wireless communications. It will be appreciated that the modem may not be integrated into the processor 60 and may be implemented solely by a single communication chip.

After the micropump 450 is disposed, there may be a malfunction of the micropump 450, etc., and at this time, due to the malfunction of the micropump 450, a certain blockage may be formed in the communication pipe 431 in which the micropump 450 is disposed, affecting the flow of the liquid medium. Therefore, referring to fig. 9 again, the heat dissipating assembly 400 may further include an auxiliary pipe 440 and a check valve 460, wherein the auxiliary pipe 440 communicates with the first soaking member 410 and the second soaking member 420 and may be adjacent to the communicating pipe 431 provided with the micropump 450, the check valve 460 is disposed on the auxiliary pipe 440, and the flow direction of the check valve 460 is the same as the flow direction of the communicating pipe 431 provided with the micropump 450. The advantage of this arrangement is that even if the micro pump 450 malfunctions, resulting in clogging of the communication pipe 431, since the auxiliary pipe 440 is disposed adjacent to the communication pipe 431 where the micro pump 450 is disposed, the liquid medium that would otherwise flow via the micro pump 450 can flow via the auxiliary pipe 440 and form a flow cycle.

Wherein the check valve 460 may be a solenoid valve, a diaphragm valve, etc. In this embodiment, the check valve 460 is a tesla valve, and the tesla valve does not need to be provided with a movable component, so that the arrangement is simple and the space is not excessively occupied. Meanwhile, the Tesla valve has the advantages of high response speed, high reliability, long service life, simplicity in maintenance and the like, so that the service life of the whole heat radiation assembly 400 can be prolonged by using the Tesla valve, and meanwhile, the control requirement on the one-way valve 460 is reduced because no movable part is required to be arranged, and the setting is simpler.

In the electronic device 10 provided in this embodiment, the communicating portion 430 is provided, and the first soaking member 410 disposed in the first frame 100 and the second soaking member 420 disposed in the second frame 200 are communicated through the rotating connecting member 300, so that when the first soaking member 410 and the second soaking member 420 transfer heat, heat can be uniformly dispersed in the first frame 100 and the second frame 200, and heat in a high temperature region is further brought to a low temperature region for heat dissipation, thereby improving heat dissipation efficiency.

It should be noted that, in the present embodiment, the expressions "first", "second", "third", "fourth", etc. are used for distinguishing only, and do not represent a limitation on the specific structure.

The foregoing is merely a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and variations may be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims (10)

1. An electronic device, comprising:

the frame body comprises a first frame body, a second frame body and a rotary connecting piece, wherein the first frame body and the second frame body are connected to two sides of the rotary connecting piece and can be folded or unfolded relatively; and

the heat dissipation assembly comprises a first soaking piece, a second soaking piece and a communicating part, wherein the first soaking piece is arranged in the first frame, the second soaking piece is arranged in the second frame, liquid media are filled in the first soaking piece and the second soaking piece, and the communicating part penetrates through the rotating connecting piece and is communicated with the first soaking piece and the second soaking piece.

2. The electronic device according to claim 1, wherein the rotation connecting member includes a decorative case and a hinge connected between the first frame and the second frame, the decorative case being fitted to the first frame and the second frame and rotatable with respect to the first frame and the second frame, a gap being formed between the decorative case and the hinge, and the communication portion passes through the rotation connecting member via the gap.

3. The electronic apparatus according to claim 1 or 2, wherein the communicating portion includes at least two communicating tubes, each communicating tube communicating the first soaking member and the second soaking member.

4. The electronic device according to claim 1 or 2, wherein the heat dissipation assembly further comprises a micropump provided in the communication portion.

5. The electronic device of claim 4, wherein the heat dissipation assembly further comprises an auxiliary tube and a check valve, the auxiliary tube communicating the first soaking member and the second soaking member, the check valve being disposed in the auxiliary tube.

6. The electronic device of claim 5, wherein the one-way valve is a tesla valve.

7. The electronic device according to claim 1 or 2, wherein the first soaking member and the second soaking member each include a first board body and a second board body that are disposed opposite to each other, edges of the first board body and the second board body are connected and enclose a cavity, the liquid medium is filled in the cavity, and the communicating portion communicates the cavity of the first soaking member and the cavity of the second soaking member.

8. The electronic device of claim 7, wherein a channel structure having a plurality of bends is formed between the first plate and the second plate, the cavity being formed within the channel structure.

9. The electronic device of claim 1 or 2, further comprising a motherboard disposed within the first housing and a battery disposed within the second housing, wherein the first soaking member covers at least a portion of the motherboard and the second soaking member covers at least a portion of the battery.

10. The electronic device of claim 9, wherein an area of the first heat spreader is smaller than an area of the second heat spreader.