WO2023103807A1

WO2023103807A1 - Terminal electronic device

Info

Publication number: WO2023103807A1
Application number: PCT/CN2022/134215
Authority: WO
Inventors: 张宇; 袁思伟; 朱明超
Original assignee: 华为技术有限公司
Priority date: 2021-12-07
Filing date: 2022-11-25
Publication date: 2023-06-15
Also published as: CN217238697U

Abstract

The present application provides a terminal electronic device. The terminal electronic device comprises a middle frame, a circuit mainboard, and a heat dissipation assembly. The middle frame comprises a body and at least one heat conduction portion, the circuit mainboard and the heat dissipation assembly are installed on the body, and the heat conduction portion is connected to the body. The heat dissipation assembly comprises a heat conduction member and a fan, and the heat conduction member abuts against the circuit mainboard and the heat conduction portion. Heat of the circuit mainboard is transmitted to the heat conduction portion by means of the heat conduction member; because the heat conduction portion is connected to the body of the middle frame, the heat continues to be transmitted to the body from the heat conduction portion; moreover, the body is in direct contact with an external environment of the terminal electronic device, and has a large area, such that large-area heat dissipation can be achieved by means of the body. The fan can accelerate the flowing of air around the heat conduction portion, such that the heat of the heat conduction portion can be quickly transmitted to the surrounding air, thereby improving the heat dissipation efficiency. The terminal electronic device of the present application reduces the heat of the circuit mainboard in two ways of natural heat dissipation and active heat dissipation.

Description

terminal electronic equipment

technical field

The present application relates to the technical field of heat dissipation of terminal electronic equipment, and in particular to a terminal electronic equipment.

Background technique

Heat dissipation is generally achieved by arranging a heat dissipation device inside the existing terminal electronic equipment. The existing heat dissipation device is usually a fan module, and the fan module can blow the high-temperature gas in the device out of the device through the air outlet of the device. However, as the power consumption of terminal electronic equipment is getting higher and higher, and considering the design requirements for exquisite appearance on the product, especially when reducing the number of air inlets and outlets, the demand for heat dissipation is getting higher and higher, relying only on The above-mentioned existing heat dissipation device cannot achieve effective heat dissipation, resulting in hot equipment and poor user experience.

application content

The purpose of the present application is to provide a terminal electronic device to improve the heat dissipation effect.

The terminal electronic device of the present application includes a middle frame, a circuit board and a heat dissipation component. The middle frame includes a body and at least one heat conduction part. The circuit board and the heat dissipation component are installed on the body. The heat conduction part is connected to the body. Connected to the circuit board and the heat conduction part.

Two heat dissipation methods, natural heat dissipation and active heat dissipation, can be used in terminal electronic equipment to reduce the heat of the circuit board. Taking natural heat dissipation as an example, the heat of the circuit board is transferred to the heat-conducting part through the heat-conducting part. Since the heat-conducting part is connected to the body of the middle frame, the heat continues to transfer from the heat-conducting part to the body, and the body is in direct contact with the external environment of the terminal electronic device, and The main body has a relatively large area, and large-area heat dissipation can be realized through the main body. Therefore, the present application can enable the heat of the circuit board to be rapidly transferred to the external environment through the heat conduction member, the heat conduction part and the body in sequence, so that the circuit board can operate within a normal temperature range. Taking active heat dissipation as an example, the heat will also be transferred to the surrounding air through the heat transfer part, and the fan in the heat dissipation component accelerates the air flow around the heat transfer part, so that the heat of the heat transfer part can be quickly transferred to the surrounding air, improving the heat dissipation efficiency , so that the circuit board can operate within the normal temperature range. According to different heat dissipation requirements, when the heat of the circuit board is low, the terminal electronic equipment mainly uses natural heat dissipation. When the heat of the circuit board is high, natural heat dissipation and active heat dissipation can be combined to improve heat dissipation efficiency.

In a possible design, a plurality of air guide channels are provided in the heat conduction part, and at least one air outlet is provided on the body, the air outlet side of the air guide channel communicates with the air outlet, and the air inlet side of the air guide channel is close to the fan.

The heat conduction part is provided with a plurality of conduction channels, which can increase the contact area between the heat conduction part and the air, and can improve the heat dissipation efficiency of natural heat dissipation. Not only that, the air guide channel runs through the heat conduction part from the air inlet side close to the fan to the air outlet side close to the body, and communicates with the air outlet of the body. Therefore, the air guide channel serves as a channel through which air can flow to the outside of the body, further increasing the natural The efficiency of heat dissipation. When the heat of the circuit board is too high and the fan needs to be activated, the flow guide channel can effectively guide the flowing air generated by the fan to be discharged outward through the air outlet of the main body without staying inside the main body, thereby improving the efficiency of active heat dissipation.

In a possible design, the heat conduction part has a linear structure or an arc structure.

According to the layout of different middle frames, circuit boards or other components in the terminal electronic equipment, adjust the structure of the heat conduction part, so as to make full use of the space inside the middle frame, reduce the external size of the middle frame, and improve the user experience of the terminal electronic equipment.

In a possible design, at least one air inlet is provided on the body, and the air inlet and the air outlet are respectively arranged on different side walls of the body.

Because the fan discharges air with high heat from the inside of the body, a negative pressure is generated inside the middle frame. By setting the air inlet on the body, the air with lower heat in the external environment of the body is sucked into the body through the air inlet, and contacts with the surface of the flow guide channel in the heat transfer part, and the heat of the heat transfer part continues to transfer to the air in the guide channel, Therefore, the air circulates through the air inlet and outlet for heat dissipation. On this basis, the air inlet and the air outlet are respectively arranged on different side walls of the main body, reducing the risk of the high-calorie air discharged from the air outlet quickly returning to the air inlet, thereby ensuring the reliable heat dissipation of the terminal electronic device of the present application sex.

In a possible design, the heat dissipation assembly includes at least one fan, the body is provided with a mounting portion, the mounting portion is connected to the heat conduction portion, an mounting cavity is formed in the mounting portion, the fan is disposed in the mounting cavity, and the air inlet side of the air guide channel communicate with the installation cavity.

The installation cavity provided on the installation part of the main body is used to install the fan. The installation part can be directly molded on the main body to serve as a part of the fan housing, without providing a separate special support for the fan, and it is not necessary to install the fan with the support as a whole to the main body, so that the overall thickness and weight of the fan module can be reduced, which is beneficial to the realization of light and thin electronic equipment. In addition, the installation cavity can also effectively guide the air located outside the opening of the installation cavity to flow into the flow guide channel, thereby reducing invalid air flow and improving heat dissipation efficiency. Therefore, the design can improve the heat dissipation efficiency and improve the user experience of the terminal electronic device.

In a possible design, the fan includes fan blades and a mounting cover, the fan blades are rotatably disposed on the mounting cover, the mounting cover is mounted on the mounting portion, and the mounting cover is provided with air suction holes.

When the installation cover is installed on the installation part, the fan blade is located in the installation cavity. When the fan blade rotates in the installation cavity, the air can be discharged to the outside of the body through the guide channel and the air outlet, so that negative pressure is generated inside the installation cavity. Since the installation cover is provided with suction holes, when the interior of the installation cavity is under negative pressure, air flows into the installation cavity through the suction holes, thereby realizing continuous active heat dissipation. The installation cover and the installation part together form the casing of the fan blade. Since the installation part is located on the body, the height of the fan module can be reduced, which is beneficial to realize the lightness and thinness of the electronic equipment.

In a possible design, the body and the heat conducting part are integrally formed.

The body and the heat conduction part are integrally formed, which can reduce unnecessary thermal resistance between the body and the heat conduction part, so that the heat of the heat conduction part can be transferred to the body faster, thereby further improving the efficiency of natural heat dissipation.

In a possible design, the middle frame further includes a cover body, the cover body is fastened to the body, a cavity is formed between the cover body and the body, the circuit board and heat dissipation components are arranged in the cavity, and the air inlet communicates with the cavity.

When the cover is fastened to the body, the cavity forms a relatively closed space. When the fan of the heat dissipation component is working, the air inside the cavity can be exhausted to the outside of the body by the fan, so that a negative pressure is formed inside the cavity, and the container The cavity is directly connected to the air inlet, so the air in the external environment of the main body can enter the cavity through the air inlet, and then be sucked by the fan, flow to the diversion channel inside the heat transfer part, absorb heat, and then be discharged through the air outlet to form a heat dissipation cycle.

In a possible design, the terminal electronic device is a computer, a flat panel display device, or a folding machine, and has the above-mentioned heat dissipation effect.

It is to be understood that both the foregoing general description and the following detailed description are exemplary only and are not restrictive of the application.

Description of drawings

FIG. 1 is a schematic structural diagram of a terminal electronic device provided by the present application, wherein the terminal electronic device is a folding machine;

Fig. 2 is a schematic exploded view of the structure of the terminal electronic device in Fig. 1;

Fig. 3 is a schematic diagram of the first assembly of the middle frame, the heat dissipation component and the circuit board in Fig. 2;

Fig. 4 is a schematic structural diagram of the heat conduction part and the installation part in Fig. 3;

Fig. 5 is a cross-sectional view of the middle frame in Fig. 4 along the thickness direction;

Fig. 6 is a partially enlarged schematic diagram of part A in Fig. 5;

Fig. 7 is a schematic diagram of a second assembly of the middle frame, the heat dissipation component and the circuit board in Fig. 2;

Fig. 8 is a sectional view along the length direction of the middle frame in Fig. 4;

Fig. 9 is a schematic structural diagram of the heat dissipation assembly in Fig. 2;

Fig. 10 is a schematic structural diagram of the fan in Fig. 9;

FIG. 11 is a structural schematic diagram of another viewing angle of the fan in FIG. 10 .

Reference signs:

10 - terminal electronic equipment;

10a - first part;

10b - the second part;

1-middle frame;

11 - ontology;

111-air outlet;

112-air inlet;

113 - installation department;

113a - installation cavity;

12-heat conduction part;

121-guiding channel;

121a-air outlet side;

121b-intake side;

13 - cover body;

14-cavity;

2- cooling components;

21 - heat conduction element;

22 - fan;

221-blade;

222 - installation cover;

222a-suction hole;

3-circuit board;

4 - connecting shaft;

5- Display screen.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description serve to explain the principles of the application.

Detailed ways

In order to better understand the technical solutions of the present application, the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings.

In a specific embodiment, the present application will be further described in detail below through a specific embodiment and in conjunction with the accompanying drawings.

The present application provides a terminal electronic device, which can be used in the technical field of terminal electronic device heat dissipation, and the terminal electronic device can be electronic devices such as computers, flat panel display devices, and folders. The internal circuit of terminal electronic equipment will generate heat during operation. If the heat is not dissipated in time, it will affect the good operation of the circuit. Therefore, the present application provides a terminal electronic device with good heat dissipation effect.

Please refer to Figures 1-2, the follow-up introduction of the terminal electronic device 10 of the present application is mainly described by taking a folding machine (folding screen mobile phone) as an example. The terminal electronic device 10 includes a first part 10a and a second part 10b. The first part 10a and the second part 10b are connected by the connecting shaft 4, and the first part 10a and the second part 10b can rotate relative to each other, so that the terminal electronic device 10 can be opened or folded. Wherein, the display screen 5 can cover the first part 10a and the second part 10b, and the display screen 5 can be a flexible screen, such as an OLED high power consumption screen.

As shown in Figures 1-2, the terminal electronic device 10 includes a middle frame 1, a heat dissipation assembly 2 and a circuit board 3, the middle frame 1 includes a body 11 and at least one heat conducting part 12, the circuit board 3 and the heat dissipation assembly 2 are installed on the body 11 , the heat conducting part 12 is connected to the main body 11 , the heat dissipation assembly 2 includes a heat conducting part 21 and a fan 22 , and the heat conducting part 21 abuts against the circuit board 3 and the heat conducting part 12 .

In this embodiment, as shown in FIG. 2 , in the terminal electronic device 10 , two heat dissipation methods, natural heat dissipation and active heat dissipation, can be used to reduce the heat of the circuit board 3 . Taking natural heat dissipation as an example, the heat of the circuit board 3 is transferred to the heat-conducting part 12 through the heat-conducting member 21. Since the heat-conducting part 12 is connected with the body 11 of the middle frame 1, the heat is continuously transferred from the heat-conducting part 12 to the body 11, and the body 11 and the terminal The electronic device 10 is in direct contact with the external environment, and the body 11 has a relatively large area, through which the body 11 can realize large-area heat dissipation. Therefore, the present application enables the heat of the circuit board 3 to be rapidly transferred to the external environment via the heat conduction member 21 , the heat conduction portion 12 and the body 11 in turn, so that the circuit board 3 can operate within a normal temperature range. Taking active heat dissipation as an example, the heat will also be transferred to the surrounding air through the heat conduction part 12, and the fan 22 in the heat dissipation assembly 2 accelerates the air flow around the heat conduction part 12, so that the heat of the heat conduction part 12 can quickly flow to the surrounding air. transfer, improve heat dissipation efficiency, so that the circuit board 3 can operate within a normal temperature range.

According to different heat dissipation requirements, when the heat of the circuit board 3 is low, the terminal electronic device 10 mainly uses natural heat dissipation, and when the heat of the circuit board 3 is high, natural heat dissipation and active heat dissipation can be used in combination to improve heat dissipation efficiency . The fan 22 is powered by the circuit board 3 .

Wherein, the heat conduction element 21 is a heat pipe or a vapor chamber, and heat transfer is realized through phase change of an internal working liquid, which will not be described in detail here.

In addition, please refer to Figures 3-4, the middle frame 1 includes two heat conduction parts 12, which are located on both sides of the circuit board 3, and the heat conduction members 21 extend from the circuit board 3 to the heat conduction parts 12 on both sides. Twice the heat dissipation efficiency improves the working performance of the circuit board 3 .

Referring to FIGS. 5-6 , the main body 11 and the heat conducting part 12 are integrally formed.

In this embodiment, the body 11 and the heat conduction part 12 are integrally formed, which can reduce the unnecessary thermal resistance between the body 11 and the heat conduction part 12, so that the heat of the heat conduction part 12 can be transferred to the body 11 faster, thereby further improving Efficiency of natural cooling.

Wherein, the body 11 and the heat conducting part 12 can be made of the same lightweight metal material, which has a higher thermal conductivity and is more conducive to heat transfer to the outside. Or, the main body 11 and the heat conduction part 12 are two kinds of metals with different materials. The metal material of the main body 11 is lighter, and the metal material of the heat conduction part 12 has a higher thermal conductivity, and then undergoes a welding integral molding process to make the user experience and heat dissipation The performance can meet the needs of users.

In a specific embodiment, please refer to Fig. 5-Fig. The side 121 a communicates with the air outlet 111 , and the air inlet side 121 b of the air guiding channel 121 is close to the fan 22 .

In this embodiment, a plurality of flow guide channels 121 are provided in the heat conduction part 12, which can increase the contact area between the heat conduction part 12 and the air, and can improve the heat dissipation efficiency of natural heat dissipation. Not only that, the air guiding channel 121 runs through the heat conducting part 12 from the air inlet side 121b close to the fan 22 to the air outlet side 121a close to the main body 11, and communicates with the air outlet 111 of the main body 11. The flow channel outside the main body 11 further increases the efficiency of natural heat dissipation. When the heat of the circuit board 3 is too high and the fan 22 needs to be activated, the flow guide channel 121 can effectively guide the flowing air generated by the fan 22 to be discharged outward through the air outlet 111 of the main body 11 without staying inside the main body 11, thereby improving active heat dissipation s efficiency.

Please refer to Fig. 4-Fig. 5, it should be noted that the two adjacent flow guiding channels 121 are blocked by heat dissipation fins, the heat dissipation fins are connected with the body 11 as a whole, and the heat dissipation fins generally have good Thermal conductivity of metallic materials. When the heat conduction member 21 (heat pipe or vapor chamber) conducts the heat from the circuit board 3 to the surface of the heat conduction part 12, part of the heat is conducted to the body 11 through the heat dissipation fins, and the other part of the heat is conducted to the flow guide channel 121 through the heat dissipation fins. When the fan 22 rotates, the hot air in the guide channel 121 can be accelerated to be discharged outward.

Wherein, as shown in FIG. 5, in the above embodiment, since the middle frame 1 may include two heat conducting parts 12, two air outlets 111 may also be provided on the body 11 to increase the discharge efficiency of high-calorie air. The workload of the fan 22 is reduced, and the heat dissipation efficiency is improved.

Specifically, please refer to FIG. 4 and FIG. 7 , the heat conduction portion 12 may be a linear structure or an arc-shaped structure. According to the layout of different middle frame 1, circuit board 3 or other components in the terminal electronic equipment 10, adjust the structure of the heat conduction part 12, so as to make full use of the space inside the middle frame 1, reduce the external size of the middle frame 1, and improve the user's understanding of the terminal electronic equipment. The experience of using the device 10.

Wherein, the heat conducting part 12 in the embodiment shown in FIG. 4 is an arc-shaped structure, and the heat conducting part 12 in the embodiment shown in FIG. 7 is a linear structure.

More specifically, please refer to FIG. 5 and FIG. 8 , at least one air inlet 112 is disposed on the body 11 , and the air inlet 112 and the air outlet 111 are respectively disposed on different side walls of the body 11 .

In this embodiment, since the fan 22 discharges air with high heat from the inside of the main body 11 , a negative pressure is generated inside the middle frame 1 . By setting the air inlet 112 on the main body 11, the air with low heat in the external environment of the main body 11 is sucked into the inside of the main body 11 through the air inlet 112, and contacts with the surface of the flow guide channel 121 in the heat conduction part 12, and the heat of the heat conduction part 12 Continue to transfer to the air in the flow passage 121 , therefore, the air realizes heat dissipation circulation through the air inlet 112 and the air outlet 111 . On this basis, the air inlet 112 and the air outlet 111 in this embodiment are respectively arranged on different side walls of the main body 11 to reduce the risk of the high-calorie air discharged from the air outlet 111 quickly returning to the air inlet 112, thereby ensuring Reliability of heat dissipation of the terminal electronic device 10 of the present application.

Wherein, as shown in FIG. 5 , in the above-mentioned embodiment, there are two heat-conducting parts 12 and two air outlets 111. Correspondingly, two air inlets 112 can also be provided to improve the air inlet efficiency so that more The air with low calorific value can quickly flow into the flow guide channel 121 inside the heat conducting part 12 to improve heat dissipation efficiency.

Please refer to FIG. 9, the heat dissipation assembly 2 includes at least one fan 22, the body 11 is provided with a mounting portion 113, the mounting portion 113 is connected to the heat conduction portion 12, an mounting cavity 113a is formed in the mounting portion 113, and the fan 22 is disposed in the mounting cavity 113a , the air inlet side 121b of the air guide channel 121 communicates with the installation cavity 113a.

In this embodiment, the installation cavity 113a provided on the installation part 113 of the body 11 is used for installing the fan 22. The installation part 113 can be directly molded on the body 11 to serve as a part of the housing of the fan 22, without providing a dedicated support for the fan 22 separately. There is no need to install the fan 22 equipped with the support on the body 11 as a whole, so that the overall thickness and weight of the fan module can be reduced, which is beneficial to realize the thinning of electronic equipment. In addition, the installation cavity 113a can also effectively guide the air located outside the opening of the installation cavity 113a to flow to the flow channel 121, reducing ineffective air flow and improving heat dissipation efficiency. Therefore, this embodiment can not only improve the heat dissipation efficiency, but also improve the user's experience of using the terminal electronic device.

Wherein, please refer to shown in Fig. 2, since the heat conduction part 12, the air outlet 111 and the air inlet 112 in the above-mentioned embodiment are all two, therefore, the cooling assembly 2 also includes two fans 22, which can provide twice the amount of air flow To improve heat dissipation efficiency, so that the circuit board 3 can run at normal operating temperature.

In addition, please refer to Fig. 8, Fig. 10 and Fig. 11, the fan 22 is a centrifugal fan, the air can be discharged along the radial direction of the fan 22, and directly enter the flow guide channel 121 inside the heat conduction part 12, the flow resistance is small, and the heat dissipation is improved. efficiency. Moreover, the thickness of the centrifugal fan is thinner, which can reduce the volume of the installation part 113 and the thickness of the middle frame 1 , and improve the user experience of the terminal electronic device 10 .

Please refer to Fig. 8, Fig. 10 and Fig. 11, the fan 22 includes a fan blade 221 and an installation cover 222, the fan blade 221 is rotatably installed on the installation cover 222, the installation cover 222 is installed on the installation part 113, and the installation cover 222 is provided with a suction Air holes 222a.

In this embodiment, when the installation cover 222 is installed on the installation part 113, the fan blade 221 is located in the installation cavity 113a, and when the fan blade 221 rotates inside the installation cavity 113a, the air can be passed through the guide channel connected to the installation cavity 113a. 121 and the air outlet 111 are discharged to the outside of the main body 11, so that a negative pressure is generated inside the installation cavity 113a. Since the installation cover 222 is provided with a suction hole 222a, when the interior of the installation cavity 113a is under negative pressure, air flows into the installation cavity 113a through the suction hole 222a, thereby realizing continuous active heat dissipation.

Wherein, the installation cover 222 and the installation portion 113 together form the casing of the fan blade 221 , since the installation portion 113 is located on the body 11 , the height of the fan module can be reduced, which in turn facilitates thinning and thinning of electronic equipment.

In addition, when the area of the air suction hole 222a is larger than the area of the air inlet side 121b of the flow guide channel 121 connected to the installation cavity 113a, the flow section of the air will gradually decrease when the air flows from the air suction hole 222a to the flow guide channel 121 , the pressure is gradually increased, and the flow velocity is gradually accelerated, which is also conducive to improving the heat dissipation efficiency.

In the above embodiment, please refer to FIG. 5 , the body 11 , the heat conduction portion 12 and the installation portion 113 can also be integrally formed, so that the manufacturing process of the middle frame 1 is simpler.

In the above embodiment, please refer to FIG. 2 and FIG. 8 , the middle frame 1 also includes a cover body 13, the cover body 13 is fastened to the body 11, a cavity 14 is formed between the cover body 13 and the body 11, and the circuit board 3 The cooling assembly 2 is disposed in the cavity 14 , and the air inlet 112 communicates with the cavity 14 .

In this embodiment, when the cover 13 is fastened to the body 11, the cavity 14 constitutes a relatively closed space, and when the fan 22 of the cooling assembly 2 is working, the air inside the cavity 14 can be exhausted to the body 11 by the fan 22 , so that negative pressure is formed inside the chamber 14, and the chamber 14 is directly connected to the air inlet 112, so the air in the external environment of the main body 11 can enter the chamber 14 through the air inlet 112, and then is sucked by the fan 22 to flow to the heat conduction The air guide channel 121 inside the part 12 absorbs heat and then discharges it through the air outlet 111 to form a heat dissipation cycle.

The cooling process in the terminal electronic device 10 of the present application is as follows:

When the heat generated by the circuit board 3 is relatively low, natural heat dissipation can be adopted, and the heat conduction part 12 is conducted to the heat conduction part 12 through the heat conduction part 21. The heat conduction part 12 is integrally formed with the body 11, and heat can be transferred from the body 11 to the external environment. The heat conduction part 12 has a plurality of air guide channels 121 and communicates with the air outlet 111 of the main body 11 . When the heat generated by the circuit board 3 is relatively high, the circuit board 3 obtains a temperature signal through the temperature sensor, controls the fan 22 in the cooling assembly 2 to start, and the air in the external environment of the body 11 is sucked into the cavity 14 through the air inlet 112, and Flow through the air suction hole 222a to the installation cavity 113a and the guide channel 121, the air contacts the surface of the guide channel 121, the heat is transferred to the air from the guide channel 121, and the high-calorie air is discharged to the outside of the main body 11 through the air outlet 111, completing Active cooling cycle.

It should be pointed out that a part of the patent application documents contains content protected by copyright. Copyright is reserved by the copyright owner other than to make copies of the contents of the patent file or records of the Patent Office.

Claims

A terminal electronic device, comprising a middle frame, a circuit main board and a heat dissipation component, characterized in that the middle frame includes a body and at least one heat conduction part, the circuit main board and the heat dissipation component are installed on the body, and the heat conduction The part is connected with the body; the heat dissipation assembly includes a heat conduction element and a fan, and the heat conduction element is in contact with the circuit board and the heat conduction part.
The terminal electronic device according to claim 1, wherein a plurality of flow guide channels are arranged in the heat conduction part, at least one air outlet is arranged on the body, and the air outlet side of the flow guide channel is in contact with the The air outlet is connected, and the air inlet side of the air guide channel is close to the fan.
The terminal electronic device according to claim 1, wherein the heat conduction part is a linear structure or an arc structure.
The terminal electronic device according to claim 2, wherein the body is further provided with at least one air inlet, and the air inlet and the air outlet are respectively arranged on different side walls of the body.
The terminal electronic device according to any one of claims 2 to 4, wherein the heat dissipation assembly includes at least one fan, the body is provided with a mounting part, and the mounting part is connected to the heat conducting part , an installation cavity is formed in the installation part, the fan is arranged in the installation cavity, and the air inlet side of the flow guide channel communicates with the installation cavity.
The terminal electronic device according to claim 5, wherein the fan includes fan blades and a mounting cover, the fan blades are rotatably arranged on the mounting cover, the mounting cover is mounted on the mounting part, the Air suction holes are arranged on the installation cover.
The terminal electronic device according to any one of claims 1 to 6, wherein the body and the heat conducting part are integrally formed.
The terminal electronic device according to any one of claims 4-7, wherein the middle frame further includes a cover, the cover is fastened to the body, and the gap between the cover and the body is A cavity is formed between them, the circuit board and the heat dissipation component are arranged in the cavity, and the air inlet communicates with the cavity.
The terminal electronic device according to any one of claims 1 to 8, wherein the terminal electronic device is a computer, a flat panel display device, or a folder.