CN217238697U

CN217238697U - Terminal electronic equipment

Info

Publication number: CN217238697U
Application number: CN202123049145.5U
Authority: CN
Inventors: 张宇; 袁思伟; 朱明超
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-12-07
Filing date: 2021-12-07
Publication date: 2022-08-19
Anticipated expiration: 2031-12-07
Also published as: WO2023103807A1

Abstract

The application provides a terminal electronic equipment, this terminal electronic equipment includes center, circuit mainboard and radiator unit, and the center includes body and at least one heat conduction portion, and circuit mainboard and radiator unit install in the body, and the heat conduction portion links to each other with the body, and radiator unit includes heat-conducting piece and fan, and heat-conducting piece butt is in circuit mainboard and heat conduction portion. The heat of circuit mainboard is via the heat-conducting component to the heat conduction portion transmission, because the body of heat conduction portion and center links to each other, the heat continues to the body transmission from the heat conduction portion, and the external environment direct contact of body and terminal electronic equipment, and the body has great area, can realize the heat dissipation of large tracts of land through the body. The fan can accelerate the air flow around the heat conducting part, so that the heat of the heat conducting part can be rapidly transferred to the surrounding air, and the heat dissipation efficiency is improved. The terminal electronic equipment reduces the heat of the circuit main board through two modes of natural heat dissipation and active heat dissipation.

Description

Terminal electronic equipment

Technical Field

The application relates to the technical field of terminal electronic equipment heat dissipation, in particular to terminal electronic equipment.

Background

The interior of the existing terminal electronic equipment generally realizes heat dissipation by arranging a heat dissipation device. The conventional heat dissipation device is generally a fan module, which can blow out the high-temperature gas in the equipment from the air outlet of the equipment. However, with the increasingly higher power consumption of the terminal electronic device and the design requirement for the delicate appearance of the product, especially when the number of the air inlets and the air outlets is reduced, the requirement for heat dissipation is increasingly high, and effective heat dissipation cannot be achieved only by the existing heat dissipation device, so that the device is hot, and the user experience is poor.

SUMMERY OF THE UTILITY MODEL

An object of the application is to provide a terminal electronic equipment, improves the radiating effect.

The application discloses terminal electronic equipment includes center, circuit board and radiator unit, and the center includes body and at least one heat-conducting portion, and circuit board and radiator unit install in the body, and the heat-conducting portion links to each other with the body, and radiator unit includes the heat-conducting piece, and the heat-conducting piece butt is in circuit board and heat-conducting portion.

The terminal electronic equipment can reduce the heat of the circuit main board by utilizing two heat dissipation modes of natural heat dissipation and active heat dissipation. Taking natural heat dissipation as an example, the heat of the circuit main board is transferred to the heat conducting part via the heat conducting part, and since the heat conducting part is connected with the body of the middle frame, the heat is continuously transferred from the heat conducting part to the body, and the body is in direct contact with the external environment of the terminal electronic device, and the body has a large area, so that large-area heat dissipation can be realized through the body. Therefore, this application can make circuit board's heat can be in proper order via heat-conducting member, heat-conducting part and body outside environment fast transmission for circuit board can operate at normal temperature within range. Taking active heat dissipation as an example, heat can also be transferred to the surrounding air through the heat conduction portion, and the fan in the heat dissipation assembly accelerates the air flow around the heat conduction portion, so that the heat of the heat conduction portion can be rapidly transferred to the surrounding air, and the heat dissipation efficiency is improved, so that the circuit main board can operate in a normal temperature range. According to different heat dissipation requirements, under the condition that the heat of the circuit main board is low, the terminal electronic equipment mainly adopts a natural heat dissipation mode, and under the condition that the heat of the circuit main board is high, natural heat dissipation and active heat dissipation can be combined and utilized, so that the heat dissipation efficiency is improved.

In a possible design, be provided with a plurality of water conservancy diversion passageways in the heat conduction portion, be provided with at least one air outlet on the body, the air-out side and the air outlet intercommunication of water conservancy diversion passageway, the air inlet side of water conservancy diversion passageway is close to in the fan.

Be provided with a plurality of water conservancy diversion passageways in the heat-conducting portion, can increase the area of contact of heat-conducting portion and air, can improve natural radiating efficiency. Moreover, the heat conduction portion is run through to the air-out side that the water conservancy diversion passageway is close to the body from the air inlet side that is close to the fan to the air outlet of intercommunication body, consequently, the water conservancy diversion passageway can be to the outside passageway that flows of body as an air, further increases natural radiating efficiency. When the heat of the circuit main board is too high and the fan needs to be started, the flow guide channel can effectively guide the flowing air generated by the fan to be discharged outwards through the air outlet of the body without being retained in the body, so that the active heat dissipation efficiency is improved.

In one possible design, the heat conducting portion is a linear structure or an arcuate structure.

The structure of the heat conducting part is adjusted according to the layouts of different middle frames, circuit main boards or other components in the terminal electronic equipment, so that the space in the middle frame is fully utilized, the external size of the middle frame is reduced, and the use experience of a user on the terminal electronic equipment is improved.

In one possible design, the body is further provided with at least one air inlet, and the air inlet and the air outlet are respectively arranged on different side walls of the body.

Because the fan discharges air with high heat outwards in the body, negative pressure is generated in the middle frame. Through set up the air intake on the body for the lower air of heat is inhaled the inside of body through the air intake in the body external environment, contacts with the surface of leading in the heat conduction portion circulation channel, and the heat of heat conduction portion continues the air transfer in the circulation channel, and consequently, the air realizes the heat dissipation circulation through air intake and air outlet. On this basis, air intake and air outlet set up respectively on the different lateral walls of body, reduce by the quick risk to the air intake backward flow of air outlet exhaust high heat air to guarantee the radiating reliability of the terminal electronic equipment of this application.

In a possible design, the heat dissipation assembly comprises at least one fan, the body is provided with an installation part, the installation part is connected with the heat conduction part, an installation cavity is formed in the installation part, and the fan is arranged in the installation cavity and communicated with the air inlet side of the flow guide channel and the installation cavity.

The installation cavity of the installation part of the body is used for installing the fan, the installation part can be directly formed on the body and serves as a part of shell of the fan, a special support is not required to be independently provided for the fan, the fan provided with the support is not required to be integrally installed on the body, and therefore the whole thickness and the weight of the fan module can be reduced, and further the lightening and thinning of the electronic equipment are facilitated. In addition, the installation cavity can also effectively guide the air outside the opening of the installation cavity to flow to the flow guide channel, so that the ineffective flow of the air is reduced, and the heat dissipation efficiency is improved. Therefore, the design can improve the heat dissipation efficiency and improve the use experience of the user on the terminal electronic equipment.

In one possible design, the fan includes a fan blade and a mounting cover, the fan blade is rotatably disposed on the mounting cover, the mounting cover is mounted on the mounting portion, and the mounting cover is provided with an air suction hole.

When the installation cover is installed on the installation part, the fan blades are located in the installation cavity, and when the fan blades rotate in the installation cavity, air can be discharged to the outside of the body through the flow guide channel and the air outlet, so that negative pressure is generated in the installation cavity. Because the installation cover is provided with the air suction hole, air flows to the inside of the installation cavity through the air suction hole under the condition that negative pressure exists in the installation cavity, and therefore continuous active heat dissipation is achieved. The mounting cover and the mounting part jointly form the shell of the fan blade, and the mounting part is positioned on the body, so that the height of the fan module can be reduced, and the electronic equipment is light and thin.

In one possible design, the body and the heat conducting portion are integrally formed.

The body and the heat conducting part are integrally formed, so that unnecessary thermal resistance between the body and the heat conducting part can be reduced, and heat of the heat conducting part can be transferred to the body more quickly, thereby further improving the efficiency of natural heat dissipation.

In a possible design, the middle frame further comprises a cover body, the cover body is buckled on the body, a containing cavity is formed between the cover body and the body, the circuit main board and the heat dissipation assembly are arranged in the containing cavity, and the air inlet is communicated with the containing cavity.

When the cover body is buckled on the body, the accommodating cavity forms a relatively closed space, when the fan of the heat dissipation assembly works, air in the accommodating cavity can be discharged to the outside of the body through the fan, negative pressure is formed in the accommodating cavity, the accommodating cavity is directly communicated with the air inlet, and therefore air in the external environment of the body can enter the accommodating cavity through the air inlet and is sucked by the fan, flows to the flow guide channel in the heat conduction portion, absorbs heat, and is discharged through the air outlet to form heat dissipation circulation.

In a possible design, the terminal electronic device is a computer, a flat panel display device, or a folder, and has the heat dissipation effect of the above contents.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

Fig. 1 is a schematic structural diagram of a terminal electronic device provided in the present application, wherein the terminal electronic device is a folder;

FIG. 2 is an exploded view of the terminal electronics of FIG. 1;

FIG. 3 is a first assembled view of the middle frame, the heat sink assembly and the circuit board of FIG. 2;

FIG. 4 is a schematic structural view of the heat conducting portion and the mounting portion of FIG. 3;

FIG. 5 is a cross-sectional view of the middle frame of FIG. 4 taken along the thickness direction thereof;

FIG. 6 is an enlarged partial view of portion A of FIG. 5;

FIG. 7 is a second assembly view of the middle frame, the heat sink assembly and the circuit board of FIG. 2;

FIG. 8 is a cross-sectional view of the middle frame of FIG. 4 taken along the length thereof;

FIG. 9 is a schematic structural diagram of the heat dissipation assembly shown in FIG. 2;

FIG. 10 is a schematic structural diagram of the fan shown in FIG. 9;

fig. 11 is a schematic structural diagram of the fan in fig. 10 from another view angle.

Reference numerals:

10-a terminal electronic device;

10 a-a first part;

10 b-a second part;

1-middle frame;

11-a body;

111-an air outlet;

112-an air inlet;

113-a mounting portion;

113 a-a mounting cavity;

12-a thermally conductive portion;

121-a flow guide channel;

121 a-air outlet side;

121 b-the air intake side;

13-a cover body;

14-a chamber;

2-a heat dissipation assembly;

21-a thermally conductive member;

22-a fan;

221-fan blades;

222-mounting a cover;

222 a-an air suction hole;

3-a circuit main board;

4-a connecting shaft;

5-display screen.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.

Detailed Description

For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.

In one embodiment, the present application is described in further detail below with reference to specific embodiments and accompanying drawings.

The application provides a terminal electronic equipment can be used for terminal electronic equipment heat dissipation technical field, and this terminal electronic equipment can be electronic equipment such as computer, panel display equipment, folder. The internal circuit of the terminal electronic equipment can generate heat in the operation process, and if the heat is not dissipated in time, the good operation of the circuit can be influenced. Therefore, the application provides a terminal electronic device with good heat dissipation effect.

Referring to fig. 1-2, the following description of the terminal electronic device 10 of the present application mainly uses a folder (folding screen mobile phone) as an example, where the terminal electronic device 10 includes a first portion 10a and a second portion 10b, the first portion 10a and the second portion 10b are connected by a connecting shaft 4, and the first portion 10a and the second portion 10b can rotate relatively to open or fold the terminal electronic device 10. Wherein the display screen 5 can cover the first portion 10a and the second portion 10b, the display screen 5 can be a flexible screen, such as an OLED high power consumption screen.

As shown in fig. 1-2, the terminal electronic device 10 includes a middle frame 1, a heat sink 2 and a circuit board 3, the middle frame 1 includes a main body 11 and at least one heat conduction portion 12, the circuit board 3 and the heat sink 2 are mounted on the main body 11, the heat conduction portion 12 is connected to the main body 11, the heat sink 2 includes a heat conduction member 21 and a fan 22, and the heat conduction member 21 abuts against the circuit board 3 and the heat conduction portion 12.

In this embodiment, as shown in fig. 2, the terminal electronic device 10 may reduce the heat of the circuit board 3 by using two heat dissipation manners, namely, natural heat dissipation and active heat dissipation. Taking natural heat dissipation as an example, the heat of the circuit board 3 is transferred to the heat conducting portion 12 via the heat conducting member 21, since the heat conducting portion 12 is connected to the main body 11 of the middle frame 1, the heat is continuously transferred from the heat conducting portion 12 to the main body 11, and the main body 11 is in direct contact with the external environment of the terminal electronic device 10, and the main body 11 has a large area, so that large-area heat dissipation can be achieved through the main body 11. Therefore, the present application can enable heat of the circuit board 3 to be rapidly transferred to the external environment via the heat conducting member 21, the heat conducting portion 12 and the body 11 in sequence, so that the circuit board 3 can operate in a normal temperature range. Taking active heat dissipation as an example, heat will also be transferred to the surrounding air through the heat conduction portion 12, and the fan 22 in the heat dissipation assembly 2 accelerates the air flow around the heat conduction portion 12, so that the heat of the heat conduction portion 12 can be quickly transferred to the surrounding air, thereby improving the heat dissipation efficiency, and enabling the circuit board 3 to operate in a normal temperature range.

According to different heat dissipation requirements, under the condition that the heat of the circuit main board 3 is low, the terminal electronic device 10 mainly adopts a natural heat dissipation mode, and under the condition that the heat of the circuit main board 3 is high, natural heat dissipation and active heat dissipation can be combined and utilized, so that the heat dissipation efficiency is improved. The fan 22 is powered by the circuit board 3.

The heat conducting member 21 is a heat pipe or a vapor chamber, and the heat transfer is achieved by phase change of the internal working fluid, which will not be described in detail herein.

In addition, as shown in fig. 3-4, the middle frame 1 includes two heat conducting portions 12 located on two sides of the circuit board 3, and the heat conducting members 21 extend from the circuit board 3 to the heat conducting portions 12 on the two sides, so that the arrangement can achieve twice of heat dissipation efficiency and improve the working performance of the circuit board 3.

Referring to fig. 5-6, the body 11 and the heat conducting portion 12 are integrally formed.

In this embodiment, the body 11 and the heat conducting portion 12 are integrally formed, which can reduce unnecessary thermal resistance between the body 11 and the heat conducting portion 12, so that the heat of the heat conducting portion 12 can be more quickly transferred to the body 11, thereby further improving the efficiency of natural heat dissipation.

The main body 11 and the heat conducting portion 12 can be made of the same light metal material, and have higher heat conductivity, which is more beneficial to the outward transfer of heat. Or, body 11 and heat conduction portion 12 are the metal that two kinds of materials are different, and the metal material of body 11 is lighter, and the metal material's of heat conduction portion 12 thermal conductivity is bigger, again through welding integrated into one piece technology to the messenger experiences and heat dispersion and can both satisfy user's demand using.

In a specific embodiment, referring to fig. 5-7, a plurality of flow guiding channels 121 are disposed in the heat conducting portion 12, at least one air outlet 111 is disposed on the body 11, an air outlet side 121a of the flow guiding channels 121 is communicated with the air outlet 111, and an air inlet side 121b of the flow guiding channels 121 is close to the fan 22.

In this embodiment, the plurality of flow guide channels 121 are disposed in the heat conducting portion 12, so that the contact area between the heat conducting portion 12 and the air can be increased, and the heat dissipation efficiency of natural heat dissipation can be improved. Furthermore, the diversion channel 121 penetrates the heat conduction part 12 from the air inlet side 121b close to the fan 22 to the air outlet side 121a close to the body 11 and is communicated with the air outlet 111 of the body 11, so that the diversion channel 121 serves as a channel through which air can flow to the outside of the body 11, and the efficiency of natural heat dissipation is further increased. When the heat of the circuit board 3 is too high and the fan 22 needs to be started, the air guiding channel 121 can effectively guide the flowing air generated by the fan 22 to be discharged outwards through the air outlet 111 of the body 11 without being retained inside the body 11, thereby improving the efficiency of active heat dissipation.

Referring to fig. 4 to 5, it should be noted that two adjacent flow guide channels 121 are blocked by a heat dissipation fin, the heat dissipation fin is connected with the body 11 as a whole, and the heat dissipation fin is generally made of a metal material with good thermal conductivity. When the heat-conducting member 21 (heat pipe or heat spreader) conducts the heat of the circuit board 3 to the surface of the heat-conducting portion 12, a part of the heat is conducted to the main body 11 via the heat-dissipating fins, and another part of the heat is conducted to the air in the air-guiding passage 121 via the heat-dissipating fins, so that the hot air in the air-guiding passage 121 can be accelerated to be discharged outward when the fan 22 rotates.

As shown in fig. 5, in the above embodiment, since the middle frame 1 may include two heat conducting portions 12, two air outlets 111 may be disposed on the main body 11 to increase the discharging efficiency of high-heat air, reduce the workload of the fan 22, and improve the heat dissipation efficiency.

Specifically, as shown in fig. 4 and 7, the heat conducting portion 12 may have a linear structure or an arc structure. The structure of the heat conducting part 12 is adjusted according to the layout of different middle frames 1, circuit boards 3 or other components in the terminal electronic device 10, so that the space inside the middle frame 1 is fully utilized, the external size of the middle frame 1 is reduced, and the use experience of a user on the terminal electronic device 10 is improved.

In the embodiment shown in fig. 4, the heat conducting portion 12 is of an arc-line structure, and in the embodiment shown in fig. 7, the heat conducting portion 12 is of a straight-line structure.

More specifically, referring to fig. 5 and 8, the body 11 is further provided with at least one air inlet 112, and the air inlet 112 and the air outlet 111 are respectively disposed on different sidewalls of the body 11.

In this embodiment, since the fan 22 discharges air having a high heat quantity to the outside in the inside of the body 11, a negative pressure is generated in the inside of the middle frame 1. By providing the air inlet 112 on the body 11, air with low heat in the external environment of the body 11 is sucked into the interior of the body 11 through the air inlet 112 and contacts with the surface of the flow guide channel 121 in the heat conduction part 12, and the heat of the heat conduction part 12 continues to be transferred to the air in the flow guide channel 121, so that the air is circulated through the air inlet 112 and the air outlet 111. On this basis, the air inlet 112 and the air outlet 111 in this embodiment are respectively disposed on different side walls of the body 11, so as to reduce the risk that the high-heat air exhausted from the air outlet 111 flows back to the air inlet 112 quickly, thereby ensuring the reliability of heat dissipation of the terminal electronic device 10 of the present application.

As shown in fig. 5, in the above embodiment, the number of the heat conducting portion 12 and the number of the air outlets 111 are two, and correspondingly, the number of the air inlets 112 may also be two, so as to improve the air inlet efficiency, so that more air with low heat can rapidly flow into the flow guide channel 121 inside the heat conducting portion 12, thereby improving the heat dissipation efficiency.

Referring to fig. 9, the heat dissipating assembly 2 includes at least one fan 22, the body 11 is provided with a mounting portion 113, the mounting portion 113 is connected to the heat conducting portion 12, a mounting cavity 113a is formed in the mounting portion 113, the fan 22 is disposed in the mounting cavity 113a, and an air inlet side 121b of the flow guiding channel 121 is communicated with the mounting cavity 113 a.

In this embodiment, the mounting cavity 113a of the mounting portion 113 of the body 11 is used for mounting the fan 22, and the mounting portion 113 can be directly formed on the body 11 to serve as a part of the housing of the fan 22, so that a dedicated support for the fan 22 is not required to be separately provided, and the fan 22 with the support is not required to be integrally mounted on the body 11, thereby reducing the overall thickness and weight of the fan module, and further facilitating the realization of the lightness and thinness of the electronic device. In addition, the mounting cavity 113a can also effectively guide the air outside the opening of the mounting cavity 113a to flow to the flow guide channel 121, so that the ineffective flow of the air is reduced, and the heat dissipation efficiency is improved. Therefore, the embodiment can improve the heat dissipation efficiency and improve the use experience of the user on the terminal electronic equipment.

As shown in fig. 2, since the heat conducting portion 12, the air outlet 111 and the air inlet 112 are two in the above embodiment, the heat dissipating assembly 2 also includes two fans 22, which can provide twice of air flow to improve heat dissipating efficiency, so that the circuit board 3 can operate at normal operating temperature.

As shown in fig. 8, 10 and 11, the fan 22 is a centrifugal fan, and air can be discharged in the radial direction of the fan 22 and directly enter the flow guide channel 121 inside the heat conducting portion 12, so that the flow resistance is small and the heat dissipation efficiency is improved. The centrifugal fan is thinner, so that the volume of the mounting part 113 and the thickness of the middle frame 1 can be reduced, and the use experience of the terminal electronic device 10 by a user can be improved.

Referring to fig. 8, 10 and 11, the fan 22 includes a blade 221 and a mounting cover 222, the blade 221 is rotatably disposed on the mounting cover 222, the mounting cover 222 is mounted on the mounting portion 113, and the mounting cover 222 is provided with an air suction hole 222 a.

In this embodiment, when the mounting cover 222 is mounted on the mounting portion 113, the fan blade 221 is located in the mounting cavity 113a, and when the fan blade 221 rotates in the mounting cavity 113a, the air can be exhausted to the outside of the body 11 through the flow guide channel 121 connected to the mounting cavity 113a and the air outlet 111, so that a negative pressure is generated in the mounting cavity 113 a. Because the mounting cover 222 is provided with the air suction hole 222a, air flows into the mounting cavity 113a through the air suction hole 222a under the condition that the interior of the mounting cavity 113a is negative pressure, so that continuous active heat dissipation is realized.

The mounting cover 222 and the mounting portion 113 together form a housing of the fan blade 221, and the mounting portion 113 is located on the body 11, so that the height of the fan module can be reduced, and the electronic device is light and thin.

In addition, when the area of the air suction hole 222a is larger than the area of the air inlet side 121b of the flow guide channel 121 communicated with the installation cavity 113a, the flow section of the air is gradually reduced, the pressure is gradually increased, the flow speed is gradually increased in the process that the air flows from the air suction hole 222a to the flow guide channel 121, and the improvement of the heat dissipation efficiency is facilitated.

In the above embodiment, referring to fig. 5, the main body 11, the heat conducting portion 12 and the mounting portion 113 may also be integrally formed, so as to simplify the manufacturing process of the middle frame 1.

In the above embodiment, referring to fig. 2 and 8, the middle frame 1 further includes a cover 13, the cover 13 is fastened to the main body 11, a cavity 14 is formed between the cover 13 and the main body 11, the circuit board 3 and the heat dissipation assembly 2 are disposed in the cavity 14, and the air inlet 112 is communicated with the cavity 14.

In this embodiment, when the cover 13 is fastened to the body 11, the cavity 14 forms a relatively closed space, and when the fan 22 of the heat dissipation assembly 2 works, the air inside the cavity 14 can be exhausted to the outside of the body 11 by the fan 22, so that a negative pressure is formed inside the cavity 14, and the cavity 14 is directly communicated with the air inlet 112, and therefore the air in the external environment of the body 11 can enter the cavity 14 through the air inlet 112, and then is sucked by the fan 22, flows to the flow guide channel 121 inside the heat conduction portion 12, absorbs heat, and is exhausted through the air outlet 111, and a heat dissipation cycle is formed.

The heat dissipation process in the terminal electronic device 10 of the present application is as follows:

when the heat generated by the circuit board 3 is low, a natural heat dissipation manner can be adopted, the heat is conducted to the heat conducting portion 12 through the heat conducting member 21, the heat conducting portion 12 and the body 11 are integrally formed, and the heat can be transferred from the body 11 to the external environment. The heat conducting portion 12 has a plurality of flow guiding channels 121 therein and is communicated with the air outlet 111 of the main body 11, and heat can be transferred from the heat conducting portion 12 to the air inside the flow guiding channels 121 to the air outside the air outlet 111. When the heat generated by the circuit board 3 is relatively high, the circuit board 3 obtains a temperature signal through the temperature sensor, and controls the fan 22 in the heat dissipation assembly 2 to start, air in the external environment of the body 11 is sucked into the accommodating cavity 14 through the air inlet 112 and flows to the mounting cavity 113a and the flow guide channel 121 through the air suction hole 222a, the air contacts with the surface of the flow guide channel 121, the heat is transferred to the air through the flow guide channel 121, and high-heat air is discharged to the outside of the body 11 through the air outlet 111, so that the active heat dissipation cycle is completed.

It is noted that a portion of this patent application contains material which is subject to copyright protection. The copyright owner reserves the copyright rights whatsoever, except for making copies of the patent files or recorded patent document contents of the patent office.

Claims

1. A terminal electronic device comprises a middle frame, a circuit main board and a heat dissipation assembly, and is characterized in that the middle frame comprises a body and at least one heat conduction part, the circuit main board and the heat dissipation assembly are mounted on the body, and the heat conduction part is connected with the body; the heat dissipation assembly comprises a heat conducting piece and a fan, and the heat conducting piece is abutted to the circuit main board and the heat conducting part.

2. The terminal electronic device of claim 1, wherein a plurality of flow guiding channels are disposed in the heat conducting portion, at least one air outlet is disposed on the body, an air outlet side of the flow guiding channels is communicated with the air outlet, and an air inlet side of the flow guiding channels is close to the fan.

3. The terminal electronic device according to claim 1, wherein the heat-conducting portion has a linear structure or an arcuate structure.

4. The terminal electronic device of claim 2, wherein the body further comprises at least one air inlet, and the air inlet and the air outlet are respectively disposed on different sidewalls of the body.

5. The terminal electronic device according to claim 4, wherein the heat dissipation assembly comprises at least one fan, the body is provided with an installation portion, the installation portion is connected with the heat conduction portion, an installation cavity is formed in the installation portion, the fan is arranged in the installation cavity, and an air inlet side of the flow guide channel is communicated with the installation cavity.

6. The terminal electronic device of claim 5, wherein the fan comprises a fan blade and a mounting cover, the fan blade is rotatably disposed on the mounting cover, the mounting cover is mounted on the mounting portion, and the mounting cover is provided with an air suction hole.

7. A terminal electronic device according to any of claims 1 to 6, wherein the body is integrally formed with the thermally conductive portion.

8. The terminal electronic device according to any one of claims 4 to 6, wherein the middle frame further comprises a cover body, the cover body is fastened to the body, a cavity is formed between the cover body and the body, the circuit board and the heat dissipation assembly are arranged in the cavity, and the air inlet is communicated with the cavity.

9. The terminal electronic device according to any one of claims 1-6, wherein the terminal electronic device is a computer, a flat panel display device, or a folder.