JP2009086704A - Electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device that enables the thickness of a casing to be made as thin as possible while maintaining the cooling performance of heating components. <P>SOLUTION: The electronic device 1 has a base 5 and a casing 4 with a thickness (T) defined by both the base 5 and a top cover 6. At least either the base 5 or the top cover 6 is formed with wall units 26, 91. The wall units 26, 91 partition the inside of the casing 4 into a first area 30 that accommodates a heating component 22 and a second area 31 where the inlets 33, 37, 81 and the outlet 34 of the casing 4 are aligned. The heat of the heating component 22 is transferred from the first area 30 to the second area 31 via heat transfer members 42, 93. An impeller 44 that rotates about a rotating shaft 52 extending along the thickness direction of the casing 4 is housed in the second area 31. The impeller 44 forms flow of cooling air that moves from the inlets 33, 37, 81 to the outlet 34 inside the second area 31, thereby exhausting outside of the casing 4 the heat of the heating component 22 transferred to the second area 31. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic device in which a heat generating component such as a CPU is accommodated in a housing, and more particularly to a structure that contributes to a thin housing while maintaining the cooling performance of the heat generating component.

  An electronic device such as a portable computer is equipped with a cooling unit that keeps the CPU operating temperature properly by cooling the CPU. The cooling unit is housed in the housing of the electronic device together with main components such as a printed circuit board on which a CPU is mounted and a hard disk drive.

  The cooling unit includes a heat receiving plate thermally connected to the CPU, a heat sink disposed at an exhaust port of the housing, a heat pipe that transfers the heat of the CPU transmitted to the heat receiving plate to the heat sink, and cooling air to the heat sink. And a fan for blowing air.

  The conventional fan has an impeller and a flat fan casing that accommodates the impeller. The impeller has a plurality of radially arranged blades and rotates upon receiving torque from the motor. The fan casing has a suction port facing the rotation center of the impeller and a discharge port facing the outer periphery of the impeller.

  The fan is housed in the housing in a horizontal orientation with the rotation axis of the impeller along the thickness direction of the housing, and the discharge port of the fan casing faces the heat sink.

  When the impeller rotates, air is sucked from the suction port into the rotation center of the impeller. The sucked air is discharged from the outer periphery of the impeller into the fan casing by centrifugal force, and is discharged as cooling air from the discharge port of the fan casing. The cooling air discharged from the discharge port passes through the heat sink. As a result, the heat of the CPU transferred to the heat sink is discharged out of the casing by multiplying the flow of the cooling air.

  By the way, the fan casing that accommodates the impeller is generally formed in a box shape by a thin metal plate, and is interposed between the inner surface of the casing and the impeller when the fan is accommodated in the casing. .

  Therefore, according to the conventional electronic device, it is necessary to secure a space for housing the fan casing inside the housing, and the thickness of the fan casing hinders following the thinning of the housing. I can't deny it.

  For this reason, for example, in the electronic device disclosed in Patent Document 1, a dedicated fan casing is omitted by forming a chamber for accommodating the impeller inside the housing.

According to the electronic device disclosed in Patent Document 1, a partition that is a component different from the casing is accommodated inside the casing. The partition wall has a top plate portion facing the bottom wall of the housing and a peripheral wall portion extending downward from the periphery of the top plate portion, and a lower end of the peripheral wall portion is coupled to the bottom wall. For this reason, the partition forms a chamber for accommodating the impeller in cooperation with the bottom wall of the casing, and a suction port is formed in the bottom wall of the casing facing the chamber.
JP 2006-19384 A

  In the electronic device disclosed in Patent Document 1, a partition which is a component different from the casing is accommodated in the casing. For this reason, the top plate portion of the partition wall enters below the keyboard mounting portion located on the upper surface of the housing and overlaps the lower surface of the keyboard mounting portion.

  According to such a configuration, since the top plate portion of the partition wall is interposed between the impeller and the keyboard mounting portion, there is no need to secure a space for accommodating the top plate portion of the partition wall between the impeller and the keyboard mounting portion. must not.

  Therefore, it is unavoidable that the casing becomes thicker than the top plate portion, and there is still room for improvement in the progress of thinning the casing.

  The objective of this invention is obtaining the electronic device which can make the thickness dimension of a housing | casing thin, maintaining the cooling performance of a heat-emitting component.

In order to achieve the above object, an electronic apparatus according to one aspect of the present invention provides:
A casing having a thickness defined by a base and a top cover that covers the base, and in which an intake port and an exhaust port are formed,
A first region formed on at least one of the base and the top cover and connected to the first region where the heat-generating component is accommodated and the intake and exhaust ports when the base is covered with the top cover. A wall parting into two regions;
A heat transfer member for transferring heat of the heat generating component from the first region to the second region;
Flow of cooling air from the intake port toward the exhaust port in the second region by being rotated around a rotation axis that is accommodated in the second region of the case and extends in the thickness direction of the case. And an impeller for discharging the heat of the heat generating component transferred to the second region to the outside of the housing.

  According to the present invention, the heat of the heat generating component can be efficiently released to the outside of the casing, and the thickness dimension of the casing can be reduced.

  Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 discloses a portable computer 1 which is an example of an electronic apparatus. The portable computer 1 includes a main unit 2 and a display unit 3.

  The main unit 2 has a first housing 4. The first housing 4 has a flat box shape having a bottom wall 4a, a front wall 4b, left and right side walls 4c, and an upper wall 4d. The side wall 4c stands from the side edge of the bottom wall 4a.

  As shown in FIG. 2, the first housing 4 includes a base 5 and a top cover 6. The base 5 has a bottom wall 4a, a front wall 4b, and left and right side walls 4c. The top cover 6 has an upper wall 4d and covers the base 5 from above. The base 5 and the top cover 6 are connected to each other via a plurality of screws to define the thickness dimension T of the first housing 4.

  The upper wall 4 d of the top cover 6 faces the bottom wall 4 a of the base 5 and constitutes the upper surface of the first housing 4. A palm rest 8 and a keyboard attachment portion 9 are formed on the upper surface of the first housing 4. The palm rest 8 is located in the front half of the upper surface of the first housing 4 and extends in the width direction of the first housing 4.

  The keyboard attachment portion 9 is located behind the palm rest 8. The keyboard attachment portion 9 is a rectangular recess that opens to the upper surface of the first housing 4, and has a width dimension that covers substantially the entire width of the first housing 4.

  As shown in FIG. 2, the keyboard attachment portion 9 has a bottom surface 10 positioned below the top surface of the first housing 4 and a standing surface 11 surrounding the bottom surface 10. The upper edge of the standing surface 11 is continuous with the upper surface of the first housing 4.

  The keyboard attachment portion 9 supports the keyboard 12. The keyboard 12 includes a keyboard base 13 and a plurality of key tops 14. The keyboard base 13 has a rectangular plate shape that fits tightly with the keyboard attachment portion 9. In other words, the keyboard base 13 is placed on the bottom surface 10 of the keyboard attachment portion 9 and is surrounded by the standing surface 11. The key top 14 is supported on the upper surface of the keyboard base 13 and is exposed on the upper surface of the first housing 4.

  The keyboard 12, for example, hooks the rear edge of the keyboard base 13 to the keyboard attachment portion 9 and sandwiches the front edge of the keyboard base 13 between the pair of keyboard holders 15 a, 15 b and the keyboard attachment portion 9, thereby 9 is held.

  Further, a battery pack 16 is attached to the rear end portion of the first housing 4. The battery pack 16 extends in the width direction of the first housing 4 behind the keyboard 12.

  As shown in FIG. 1, the display unit 3 has a second housing 17. The second casing 17 has a flat box shape that is substantially the same size as the first casing 4. The second housing 17 accommodates a liquid crystal display panel 18. The liquid crystal display panel 18 has a display surface 18a for displaying character information and image information. The display surface 18 a is exposed to the outside of the display unit 3 through an opening 19 opened in the front surface of the second housing 17.

  The display unit 3 is connected to the rear end portion of the main unit 2 via a hinge (not shown). The display unit 3 is rotatable between a closed position lying on the main unit 2 and an open position standing from the rear end of the main unit 2 with the hinge as a fulcrum.

  As shown in FIGS. 2 and 3, the first housing 4 accommodates main components such as a printed circuit board 21 and a hard disk drive (not shown). The printed circuit board 21 is disposed in parallel with the bottom wall 4 a of the first housing 4.

  As shown in FIGS. 3 and 4, a CPU 22, which is an example of a heat generating component, is mounted on the lower surface of the printed circuit board 21. The CPU 22 is constituted by a semiconductor package having a base substrate 23 and an IC chip 24 soldered to the base substrate 23. The IC chip 24 generates a large amount of heat during operation as the processing speed increases and the number of functions increases, and cooling is necessary to maintain a stable operation.

  As shown in FIGS. 2 and 3, a wall portion 26 is formed integrally with the bottom wall 4 a of the base 5. The wall portion 26 stands up along the thickness direction of the first housing 4 from the inner surface of the bottom wall 4a. The wall portion 26 has first to third portions 27a to 27c. The first portion 27 a is curved in an arc shape toward the right side wall 4 c of the base 5. The second portion 27 b extends in the width direction of the first housing 4 and connects one end of the first portion 27 a and the right side wall 4 c of the base 5. The third portion 27 c extends in the width direction of the first housing 4 and connects the other end of the first portion 27 a and the right side wall 4 c of the base 5.

  The wall portion 26 has a seal member 28 at its upper end. The seal member 28 is formed of a flexible material such as synthetic resin, silicone rubber, or sponge, for example, and fills a gap between the upper end of the wall portion 26 and the top cover 6. Therefore, the wall portion 26 partitions the inside of the first housing 4 into the first region 30 and the second region 31 in an airtight manner.

  The first region 30 occupies most of the inside of the first housing 4. This first region 30 houses main components such as the printed circuit board 21. The second region 31 is located below the right end portion of the keyboard attachment portion 9 and is adjacent to the CPU 22 mounted on the printed circuit board 21.

  The base 5 of the first housing 4 has a first intake port 33 and an exhaust port 34. The first air inlet 33 is formed in the bottom wall 4 a of the base 5 and opens to the second region 31. The exhaust port 34 is formed in the right side wall 4 c of the base 5 and opens to the second region 31.

  Further, a concave portion 35 is formed at the right end portion of the bottom surface 10 of the keyboard attachment portion 9. The recessed portion 35 is recessed so as to slightly enter the upper portion of the second region 31. A gap 36 serving as an intake area is formed between the recess 35 and the keyboard base 13. A plurality of second air inlets 37 are formed at the bottom of the recess 35. The second air inlet 37 communicates between the second region 31 and the gap 36 and is located immediately above the first air inlet 33.

  As shown in FIGS. 2 to 4, the first housing 4 accommodates an air-cooling type cooling unit 40 that cools the CPU 22. The cooling unit 40 includes a heat receiving plate 41, a heat pipe 42, a heat sink 43, and an impeller 44.

  The heat receiving plate 41 is made of a metal material having excellent thermal conductivity, such as an aluminum alloy, and has a square shape that is slightly larger than the IC chip 24. The heat receiving plate 41 includes a flat heat receiving surface 41a and a fitting groove 41b located on the opposite side of the heat receiving surface 41a. The heat receiving surface 41a of the heat receiving plate 41 is overlaid on the IC chip 24 via a heat conductive grease or a heat conductive sheet.

  Further, the heat receiving plate 41 is held on the printed circuit board 21 via a leaf spring (not shown). Thereby, the heat receiving surface 41a of the heat receiving plate 41 is pressed by the IC chip 24, and the heat receiving plate 41 and the IC chip 24 are thermally connected.

  The heat pipe 42 is routed so as to straddle between the first region 30 and the second region 31 and penetrates through the second portion 27b of the wall portion 26. A packing 45 that maintains the airtightness of the second region 31 is provided at a portion where the heat pipe 42 penetrates the wall portion 26.

  The heat pipe 42 has a heat receiving end 42 a located in the first region 30 and a heat radiating end 42 b located in the second region 31. The heat receiving end portion 42 a is fitted into the fitting groove 41 b of the heat receiving plate 41 and is thermally connected to the heat receiving plate 41. The heat radiating end portion 42 b is located immediately before the exhaust port 34 of the first housing 4.

  The heat sink 43 is attached to the heat radiating end portion 42 b of the heat pipe 42. The heat sink 43 has a plurality of heat radiation fins 46. The radiating fins 46 face the exhaust ports 34 and are arranged in a row at intervals. The heat radiating end portion 42 b of the heat pipe 42 is thermally connected to the heat radiating fins 46.

  The impeller 44 is accommodated in the second region 31 of the first housing 4. The impeller 44 includes a cylindrical boss portion 48 and a plurality of blades 49 protruding radially from the outer peripheral surface of the boss portion 48. The boss portion 48 incorporates, for example, an inner rotor type motor 50. The motor 50 is supported on the circuit board 51. Further, the motor 50 has a rotating shaft 52 that is coaxial with the impeller 44. The circuit board 51 and the rotating shaft 52 are supported by the bottom wall 4 a of the first housing 4.

  The impeller 44 is housed in the second region 31 in a horizontal posture in which the rotation shaft 52 is erected in the thickness direction of the first housing 4, and attached to the bottom wall 4 a of the first housing 4 and the keyboard. It is located between the part 9. For this reason, the impeller 44 is positioned coaxially with respect to the first and second intake ports 33 and 37, and the exhaust port 34 is positioned on the outer peripheral side of the impeller 44.

  As shown in FIG. 3, the first portion 27 a of the wall portion 26 surrounds the outer periphery of the impeller 44 on the side opposite to the exhaust port 34. That is, the first portion 27 a and the second portion 27 b of the wall portion 26 define the spiral chamber 54 on the outer periphery of the impeller 44. The spiral chamber 54 is for converting the velocity energy of the air discharged from the outer periphery of the impeller 44 into pressure energy. The shape of the spiral of the spiral chamber 54 is defined by the first and second portions 27 a and 27 b of the wall portion 26, and the exhaust port 34 is located at the downstream end of the spiral chamber 54.

  In such a configuration, when the portable computer 1 is used, the IC chip 24 of the CPU 22 generates heat. The heat of the IC chip 24 is transmitted from the heat receiving plate 41 to the heat receiving end portion 42 a of the heat pipe 42 and is transferred from the heat radiating end portion 42 b of the heat pipe 42 to the heat sink 43. The heat transferred to the heat sink 43 is released from the surface of the radiating fin 46 to the second region 31.

  When the temperature of the CPU 22 reaches a predetermined value, the motor 50 of the impeller 44 is activated, and the impeller 44 rotates by receiving the torque of the motor 50. Due to the rotation of the impeller 44, negative pressure acts on the first and second air inlets 33 and 37, and the cold air outside the portable computer 1 becomes the first and second air as shown by arrows in FIG. The air is sucked into the rotation center of the impeller 44 from the intake ports 33 and 37. Therefore, the impeller 44 is a so-called double-sided intake that sucks air from both sides along the axial direction of the rotary shaft 52.

  The air sucked into the impeller 44 is discharged from the outer periphery of the impeller 44 to the spiral chamber 54 in the second region 31 by centrifugal force, and is sent to the exhaust port 34 through the spiral chamber 54. The air sent to the exhaust port 34 is blown to the heat sink 43 as cooling air and passes between the heat radiation fins 46 of the heat sink 43.

  As a result, the heat sink 43 is forcibly cooled, and the heat of the IC chip 24 transferred to the heat sink 43 is carried away by heat exchange with the cooling air. The cooling air warmed by this heat exchange is discharged out of the first casing 4 from the exhaust port 34.

  According to the first embodiment of the present invention, the heat pipe 42 that transfers the heat of the CPU 22 to the heat sink 43 is exposed to the flow of cooling air with its heat radiating end 42b introduced into the second region 31. The second region 31 is thermally connected to the heat sink 43. For this reason, the heat of the CPU 22 can be efficiently transmitted to the heat sink 43 and actively released from here, and the cooling performance of the CPU 22 can be maintained well.

  Further, according to the above configuration, when the base 5 and the top cover 6 are combined, the wall portion 26 protruding from the bottom wall 4 a of the base 5 abuts against the upper wall 4 d of the top cover 6 via the seal member 28. Therefore, the wall portion 26 constitutes a second region 31 that accommodates the impeller 44 inside the first housing 4 in cooperation with the base 5 and the top cover 6.

  As a result, when the impeller 44 rotates, a flow of cooling air from the first and second intake ports 33 and 37 toward the exhaust port 34 is directly formed in the second region 31, and the first casing 4. Will serve as a fan casing.

  Therefore, a dedicated fan casing for housing the impeller 44 can be omitted, and there is no need to secure a space for housing the fan casing in the first housing 4. Therefore, the thickness dimension T of the first housing 4 can be reduced while maintaining the cooling performance of the CPU 22 well.

  In addition, since the fan casing is not required, the number of parts on the main unit 2 side can be reduced, and there is an advantage that the cost of the portable computer 1 can be reduced.

  In the first embodiment, since the second air inlet 37 is formed at the bottom of the keyboard mounting portion 9 of the first housing 4, the second air inlet 37 can be covered by the keyboard 12. it can. Therefore, the appearance of the portable computer 1 is improved. At the same time, wind noise and motor 50 operating sound based on the rotation of the impeller 44 from the second air inlet 37 are less likely to leak out of the first housing 4, which contributes to improved quietness.

  In addition, since a gap 36 for air intake is secured between the keyboard base 13 of the keyboard 12 and the second air inlet 37, the second air inlet 37 is covered with the keyboard 12 even though it is covered. Therefore, air can be efficiently sucked from the second air inlet 37.

  The present invention is not limited to the first embodiment described above, and various modifications can be made without departing from the spirit of the invention.

  FIG. 5 discloses a second embodiment of the present invention.

  In the second embodiment, a mesh-like intake cover 61 having air permeability is attached to the bottom wall 4 a of the first housing 4. The intake cover 61 covers the first intake port 33 that opens in the bottom wall 4 a from the outside of the first housing 4.

  According to such a configuration, when the air is sucked into the second region 31 from the first air inlet 33 as the impeller 44 rotates, foreign matter such as dust contained in the air is removed by the air intake cover 61. be able to. For this reason, it is possible to avoid the entry of foreign matter into the second region 31 and prevent the inside of the first housing 4 from being stained.

  FIG. 6 discloses a third embodiment of the present invention.

  In the third embodiment, a plurality of blade-like lattices 71 are provided in the first air inlet 33 that opens in the bottom wall 4 a of the first housing 4. The lattice 71 divides the first intake port 33 into a plurality of opening regions, and the first intake port 33 is formed in a louver shape due to the presence of the lattice 71.

  According to such a configuration, by providing the grid 71 at the first air inlet 33, insertion of foreign matter into the first air inlet 33 can be avoided.

  FIG. 7 discloses a fourth embodiment of the present invention.

  In the fourth embodiment, the intake port 81 is formed only in the bottom wall 4 a of the first housing 4. For this reason, when the impeller 44 rotates, the air outside the first housing 4 is sucked into the second region 31 from one side along the axial direction of the rotation shaft 52 of the impeller 44. The impeller 44 is a so-called single-sided intake.

  According to such a configuration, it is not necessary to secure an intake area between the first housing 4 and the keyboard attachment 9. Therefore, the recess can be eliminated from the bottom of the keyboard attachment portion 9 and the bottom can be formed flat.

  As a result, the interval between the impeller 44 and the bottom of the keyboard attachment portion 9 can be narrowed, and the thickness dimension T of the first housing 4 can be made thinner.

  FIG. 8 discloses a fifth embodiment of the present invention.

  The fifth embodiment is different from the fourth embodiment mainly in the configuration for transferring the heat of the CPU 22 to the heat sink 43, and the other basic configuration is the fourth embodiment. It is the same.

  As shown in FIG. 8, a wall portion 91 is formed integrally with the top cover 6 of the first housing 4. The wall portion 91 protrudes downward from the bottom of the keyboard attachment portion 9 along the thickness direction of the first housing 4. The wall portion 91 has a seal member 92 at its lower end. The seal member 92 is formed of a flexible material such as synthetic resin, silicone rubber, or sponge, for example, and fills a gap between the lower end of the wall portion 91 and the bottom wall 4 a of the base 5. Therefore, the wall portion 91 partitions the inside of the first housing 4 into the first region 30 and the second region 31 in an airtight manner.

  In the fifth embodiment, the CPU 22 is mounted on the upper surface of the printed circuit board 21. The IC chip 24 of the CPU 22 and the heat sink 43 are connected by a heat transfer plate 93. The heat transfer plate 93 is formed of a metal plate having excellent thermal conductivity, such as an aluminum alloy or copper, and has a flat belt shape having a larger width dimension than the IC chip 24.

  The heat transfer plate 93 is arranged adjacent to the bottom of the keyboard attachment portion 9. The heat transfer plate 93 is disposed across the first region 30 and the second region 31 and penetrates the wall portion 91. A packing 94 that maintains the airtightness of the second region 31 is provided at a portion where the heat transfer plate 93 penetrates the wall portion 91.

  The heat transfer plate 93 has a heat receiving end portion 93 a located in the first region 30 and a heat radiating end portion 93 b located in the second region 31. The heat receiving end portion 93 a is thermally connected to the IC chip 24 of the CPU 22. The heat radiating end portion 93 b is located immediately before the exhaust port 34 of the first housing 4. A heat sink 43 is attached to the lower surface of the heat radiating end portion 93b. The heat dissipating fins 46 of the heat sink 43 are arranged in a row at a distance from each other so as to face the exhaust port 34 and are thermally connected to the heat dissipating end portion 93b.

  Further, the heat transfer plate 93 has a heat diffusion portion 96 between the heat receiving end portion 93a and the heat radiating end portion 93b. The thermal diffusion unit 96 is located directly above the impeller 44 in the second region 31. The heat diffusion part 96 slightly protrudes toward the keyboard attachment part 9 and has a flat support surface 96a.

  An opening 97 is formed at the bottom of the keyboard attachment portion 9. The opening 97 opens to the second region 31 at a position corresponding to the heat diffusion portion 96 of the heat transfer plate 93. The thermal diffusion unit 96 enters the inside of the opening 97 and closes the opening 97 from the direction of the second region 31. The thickness of the heat diffusion unit 96 is equal to the thickness of the keyboard attachment unit 9. For this reason, the heat diffusing portion 96 is within the thickness range of the keyboard mounting portion 9 on the upper wall 4 d, and the support surface 96 a is located on the same plane as the bottom surface of the keyboard mounting portion 9.

  In a state where the keyboard 12 is held by the keyboard attachment portion 9, the lower surface of the keyboard base 13 is in contact with the heat diffusion portion 96 and the support surface 96 a. Thereby, the heat transfer plate 93 supports the keyboard 12 from below and is thermally connected to the keyboard base 13.

  Further, a ring-shaped seal member 98 is interposed between the heat transfer plate 93 and the bottom of the keyboard attachment portion 9. The seal member 98 surrounds the heat diffusing portion 96 and the opening 97 and maintains the airtightness of the second region 31.

  In such a configuration, when the impeller 44 rotates, the air outside the first housing 4 is sucked into the rotation center of the impeller 44 from the intake port 81 opened in the bottom wall 4a of the first housing 4. It is. The sucked air is discharged from the outer periphery of the impeller 44 to the second region 31 by centrifugal force and sent to the exhaust port 34. The air sent to the exhaust port 34 is blown to the heat sink 43 as cooling air and passes between the heat radiation fins 46 of the heat sink 43.

  Furthermore, a part of the air discharged to the second region 31 flows along the heat transfer plate 93, and the heat transfer plate 93 is directly exposed to the air flow.

  As a result, the heat transfer plate 93 and the heat sink 43 are forcibly cooled, and the heat of the IC chip 24 transferred to the heat sink 43 is carried away by heat exchange with the cooling air. The cooling air warmed by this heat exchange is discharged out of the first casing 4 from the exhaust port 34.

  In addition, since the heat diffusion unit 96 of the heat transfer plate 93 is thermally connected to the keyboard base 13 of the keyboard 12, a part of the heat of the CPU 22 transmitted to the heat transfer plate 93 is part of the heat diffusion unit 96. To the keyboard base 13. In particular, since the lower surface of the keyboard base 13 is usually covered with a metal shield plate, the heat transmitted to the heat diffusion unit 96 can be efficiently released to the keyboard base 13.

  According to the fifth embodiment of the present invention, the heat of the CPU 22 can be actively released from the heat sink 43 and the keyboard base 13, and the cooling performance of the CPU 22 can be maintained well.

  Furthermore, when the impeller 44 rotates, a flow of cooling air from the intake port 81 toward the exhaust port 34 is directly formed inside the second region 31, and the first casing 4 functions as a fan casing. become. Therefore, a dedicated fan casing for housing the impeller 44 is not necessary, and it is not necessary to secure a space for housing the fan casing inside the first housing 4.

  At the same time, the heat diffusion portion 96 of the heat transfer plate 93 enters the opening 97 opened at the bottom of the keyboard attachment portion 9 and is located within the thickness range of the bottom of the keyboard attachment portion 9. Therefore, similarly to the first embodiment, the thickness dimension T of the first housing 4 can be reduced while maintaining the cooling performance of the CPU 22 well.

  In the above embodiment, the wall portion protrudes from the top cover or the base, but the present invention is not limited to this. For example, a first wall portion protruding upward is formed on the base, and a second wall portion protruding downward is formed on the top cover, and the tip of the first wall portion and the tip of the second wall portion are connected to each other. You may make it divide the inside of a 1st housing | casing into two area | regions by mutually abutting.

  In addition, in the first embodiment, the first air inlet is formed at the bottom of the keyboard mounting portion. However, for example, when the impeller is positioned below the palm rest, the first air intake is provided in the palm rest. A mouth may be formed.

  Furthermore, the heat transfer member that transmits the heat of the CPU to the heat sink is not specified as a heat pipe or a heat transfer plate. For example, the CPU and the heat sink may be connected by a circulation path for circulating the liquid refrigerant, and the heat of the CPU may be transferred to the heat sink via the circulating liquid refrigerant.

1 is a perspective view of a portable computer according to a first embodiment of the present invention. Sectional drawing of the portable computer which shows the state which accommodated the impeller in the 2nd area | region of the housing | casing in the 1st Embodiment of this invention. Sectional drawing of the portable computer which shows the positional relationship of the impeller and heat sink which were accommodated in the 2nd area | region of the housing | casing in the 1st Embodiment of this invention. Sectional drawing which follows the F4-F4 line | wire of FIG. Sectional drawing of the portable computer which concerns on the 2nd Embodiment of this invention. Sectional drawing of the portable computer which concerns on the 3rd Embodiment of this invention. Sectional drawing of the portable computer which concerns on the 4th Embodiment of this invention. Sectional drawing of the portable computer which concerns on the 5th Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 4 ... Housing | casing (1st housing | casing), 5 ... Base, 6 ... Top cover, 22 ... Heat-emitting component (CPU), 26, 91 ... Wall part, 30 ... 1st area | region, 31 ... 2nd area | region, 33, 37, 81 (first and second intake ports), 34 ... exhaust port, 42, 93 ... heat transfer member (heat pipe, heat transfer plate), 44 ... impeller, 52 ... rotating shaft, 97 ... opening Department.

Claims (12)

A casing having a thickness defined by a base and a top cover that covers the base, and in which an intake port and an exhaust port are formed,
A first region formed on at least one of the base and the top cover and connected to the first region where the heat-generating component is accommodated and the intake and exhaust ports when the base is covered with the top cover. A wall parting into two regions;
A heat transfer member for transferring heat of the heat generating component from the first region to the second region;
Flow of cooling air from the intake port toward the exhaust port in the second region by being rotated around a rotation axis that is accommodated in the second region of the case and extends in the thickness direction of the case. And an impeller for discharging the heat of the heat generating component transferred to the second region to the outside of the housing.   The electronic apparatus according to claim 1, wherein the wall portion stands up along a thickness direction of the casing so as to surround an outer peripheral portion of the impeller.   3. The electronic apparatus according to claim 2, wherein the wall portion includes a seal member that maintains airtightness of the second region.   4. The base according to claim 3, wherein the base has a bottom wall, the top cover has an upper wall facing the bottom wall, and the air inlet is formed in at least one of the bottom wall and the upper wall. An electronic device characterized by that.   5. The electronic apparatus according to claim 4, wherein the heat transfer member has a plurality of heat radiating fins, and the heat radiating fins are located at the exhaust port.   6. The top cover of the housing according to claim 5, wherein the top cover has a keyboard mounting portion on which a keyboard is placed, and the air inlet is formed at a position corresponding to the second region in the keyboard mounting portion. In addition, the electronic device is characterized in that the air inlet is hidden by the keyboard.   7. The electronic device according to claim 6, wherein the keyboard has a keyboard base that supports a plurality of key tops, and an air intake gap is formed between the keyboard base and the air inlet. machine. A housing having an air inlet and an air outlet;
A wall that is integrally formed with the housing and divides the interior of the housing into a first region in which a heat-generating component is accommodated and a second region that is continuous with the intake port and the exhaust port;
A flat heat transfer plate that penetrates the wall and is introduced from the first region to the second region, and transfers heat of the heat-generating component to the second region;
Flow of cooling air from the intake port toward the exhaust port in the second region by being rotated around a rotation axis that is accommodated in the second region of the case and extends in the thickness direction of the case. An impeller that discharges the heat of the heat-generating component transferred to the second region to the outside of the housing,
The housing has an opening that opens in the second region, a part of the heat transfer plate is disposed in the opening, and the opening is closed by the heat transfer plate. Electronic equipment.   9. The electronic device according to claim 8, wherein the opening opens to the second region at a position corresponding to the impeller.   10. The housing according to claim 9, wherein the housing includes a base in which the air inlet and the air outlet are formed, and a top cover in which the opening is formed. The base and the top cover include the housing. An electronic device characterized in that a body thickness dimension is defined.   11. The top cover of the housing according to claim 10, wherein the top cover of the housing has a keyboard attachment portion on which a keyboard is placed, the opening portion opens in the keyboard attachment portion, and closes the opening portion of the heat transfer plate. An electronic device characterized in that the portion is hidden by the keyboard.   12. The electronic device according to claim 11, wherein the heat transfer plate is thermally connected to the keyboard.

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