CN111386003A

CN111386003A - Heat dissipation method of electronic equipment and electronic equipment

Info

Publication number: CN111386003A
Application number: CN201811643565.6A
Authority: CN
Inventors: 张�杰; 余斌
Original assignee: ZTE Corp
Current assignee: ZTE Corp
Priority date: 2018-12-29
Filing date: 2018-12-29
Publication date: 2020-07-07
Anticipated expiration: 2038-12-29
Also published as: WO2020134729A1; CN111386003B

Abstract

The application provides a heat dissipation method of electronic equipment and the electronic equipment, wherein the method comprises the following steps: inside fan and the shunt of setting up of electronic equipment casing, the fan drives the inside hot-blast to the shunt air intake of electronic equipment, flow to heat dissipation channel through the shunt air outlet, heat dissipation channel encircles this electronic equipment's casing setting, be used for carrying out the circulation of air, hot-blast through heat dissipation channel realization cooling, the problem of leading to the performance to descend by a wide margin because electronic equipment generates heat in the correlation technique has been solved, the heat dissipation has been carried out effectively fast, the power that reduces the chip because equipment generates heat has been avoided, electronic equipment's stable performance has been guaranteed and has been realized.

Description

Heat dissipation method of electronic equipment and electronic equipment

Technical Field

The present application relates to, but not limited to, the field of electronic devices, and in particular, to a heat dissipation method for an electronic device and an electronic device.

Background

In the related technology, the mobile phone with the metal shell is made of metal, so that the strength of the whole mobile phone can be greatly improved under the condition that the size of the mobile phone is very thin, unique appearance and hand feeling are brought, and the mobile phone is made to show a high-end form. Along with the mobile phone configuration is higher and higher, the functions are more and more, and higher power consumption is brought by the high configuration and the multiple functions, so that higher heat dissipation requirements are provided for the mobile phone, and the problem of heat generation in the operation of the mobile phone needs to be solved urgently. The mobile phone overheating condition can be effectively improved by reducing the heating temperature of the mobile phone or delaying the temperature rising speed and increasing the heat dissipation rate, and the user satisfaction degree is improved. However, reducing the heating temperature of the heat source is achieved by reducing power consumption, which is not preferable because the potential of the chip is not fully developed and user experience is affected. At present, the traditional auxiliary material conduction heat dissipation of the mobile phone can relieve the phenomenon of overhigh local temperature to a certain extent, but devices in the mobile phone are closely arranged, the space is compact, the local temperature is very high, and the temperature uniformity of all parts of the mobile phone is difficult to guarantee through auxiliary material conduction.

Aiming at the problem that the performance is greatly reduced due to the heat generation of electronic equipment in the related art, no effective solution is available at present.

Disclosure of Invention

The embodiment of the application provides a heat dissipation method of electronic equipment and the electronic equipment, so as to at least solve the problem that the performance is greatly reduced due to the heat generation of the electronic equipment in the related art.

According to another embodiment of the present application, there is provided a mobile terminal including: a housing; the heat dissipation channel is arranged around the shell and used for air circulation; the air inlet of the flow divider faces to the heating device in the shell, and the air outlet of the flow divider is communicated with the heat dissipation channel; and the fan is arranged in the shell and used for driving the airflow in the shell to enter the air inlet of the flow divider.

According to another embodiment of the present application, there is also provided a heat dissipation method of a mobile terminal, including: when a preset condition is met, a fan arranged in the electronic equipment is started, wherein the fan drives hot air flow to a heat dissipation channel for heat dissipation, and the heat dissipation channel surrounds a shell of the electronic equipment.

According to a further embodiment of the present application, there is also provided a storage medium having a computer program stored therein, wherein the computer program is arranged to perform the steps of any of the above method embodiments when executed.

According to yet another embodiment of the present application, there is also provided an electronic device, comprising a memory in which a computer program is stored and a processor arranged to run the computer program to perform the steps of any of the above method embodiments.

Through this application, at inside fan and the shunt that sets up of electronic equipment casing, the fan drives the inside hot-blast to shunt air intake of electronic equipment, flow to heat dissipation channel through the shunt air outlet, heat dissipation channel encircles this electronic equipment's casing setting, be used for carrying out the circulation of air, hot-blast through heat dissipation channel realization cooling, the problem of leading to the performance to descend by a wide margin because electronic equipment generates heat in the correlation technique has been solved, dispel the heat fast effectively, the power of chip has been avoided reducing because equipment generates heat, electronic equipment's stable performance has been guaranteed and has been realized.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

FIG. 1a is a hardware block diagram of an electronic device according to an embodiment of the present application;

FIG. 1b is a schematic view of a heat dissipation structure of a metal machine according to an embodiment of the present application;

FIG. 2 is a schematic view of a diverter assembly according to an embodiment of the present application;

FIG. 3 is a schematic view of a diverter structure according to an embodiment of the present application;

FIG. 4 is a schematic diagram of a heat dissipation channel according to an embodiment of the present application;

FIG. 5 is a schematic diagram of a heat dissipation structure according to an embodiment of the present application;

FIG. 6 is a schematic illustration of a front shell side aperture in accordance with an embodiment of the present application;

FIG. 7 is a schematic view of airflow within a mobile terminal according to an embodiment of the present application;

FIG. 8 is a flow chart of a method for dissipating heat from a mobile terminal according to an embodiment of the present application;

fig. 9 is a block diagram of a hardware structure of an electronic device according to an embodiment of the present application;

fig. 10 is a flowchart of a heat dissipation method of an electronic device according to an embodiment of the present application.

Detailed Description

The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.

It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

In the related art, the heat dissipation of the mobile phone is generally realized by adding various heat conduction materials such as graphite flakes, semiconductor materials, heat pipes made of phase change materials, heat conduction silica gel pads and the like into the mobile phone. Some of the devices realize auxiliary heat dissipation through an external heat dissipation device. The heat source at the chip position is led out through the metal heat conducting material, and the heat dissipation is realized by blowing the heat dissipation sheet through a fan. The embodiment of the application provides an active convection heat dissipation device, which can greatly improve the heat dissipation condition of a mobile phone, rapidly guide local high temperature to each part of a machine body, and ensure that the temperature of the whole machine is uniform and not too high.

The mobile phone heat dissipation device is arranged in a mobile phone shell and comprises an active heat dissipation unit and a passive heat dissipation unit which are communicated with each other, and convection air is guided in by the active heat dissipation unit and guided out by the passive heat dissipation unit so as to improve the cooling efficiency inside the mobile phone. Two modes of active heat dissipation of a fan and passive heat dissipation of a heat dissipation fin are adopted. Outside air is pumped into the mobile phone from the air inlet through the fan, heat inside the mobile phone is conducted to the radiating fins through the medium, the pumped air blows the radiating fins to cool the radiating fins, and then the air is exhausted from the air outlet. The heat dissipation efficiency is improved by a mode of continuously sucking air for heat exchange and discharging air. The heat dissipation rate of the mobile phone can be increased by the fan and other heat conduction materials, but the mobile phone has the following defects: 1. the scheme in the related technology is mainly characterized in that the peripheral equipment is connected for auxiliary heat dissipation, the radiator is similar to a notebook computer radiator, the speed of the airflow outside the mobile phone is only accelerated in the mode, the radiation heat dissipation from the mobile phone body to the outside is still depended on, the temperature of the heat source inside the mobile phone is not obviously reduced, the heat dissipation effect is limited in practice, and an additional device is inconvenient for a user to carry. 2. The heat pipe and other heat dissipation materials are adopted to assist in conducting and dissipating heat, so that the conduction efficiency is low, the transfer capacity is small, and the cost of the mobile phone is obviously increased by using too many heat conduction materials. 3. Although the heat dissipation rate can be increased by increasing the heat dissipation fan inside the mobile phone in the scheme, the temperature of the chip is still led out through the medium and the fan is used for assisting in heat dissipation, and the method still belongs to an indirect heat dissipation mode and does not consider the requirements of water resistance and dust resistance in the actual use process of the mobile phone. According to the scheme of the embodiment of the application, the heat dissipation channel is arranged in the shell of the electronic equipment, the volume of the electronic equipment is fully utilized, and the water resistance and the dust resistance of the equipment are guaranteed.

Example one

According to an embodiment of the present application, there is provided an electronic device, and fig. 1a is a hardware structure diagram of the electronic device according to the embodiment of the present application, as shown in fig. 1a, including:

a housing 10;

as for the case 10, it may include a front case 11, a middle frame 12 and a rear case of the electronic device.

A heat dissipation channel 43 disposed around the case 10 for air circulation;

as shown in fig. 1, the heat dissipation channel 43 may be disposed inside the middle frame 12 and the front housing 11, the heat dissipation channel 43 may dissipate heat of the electronic device through internal air circulation, the heat dissipation channel 43 may be formed by fastening the middle frame 12 and the front housing 11, and the two fastened together form a ventilation duct, the ventilation duct is conducted with the shunt 14,

in some embodiments of the present application, the heat dissipation channel 43 may be disposed around the edge of the body of the electronic device for one or a half of a turn, or the heat dissipation channel 43 is disposed on only one side of the electronic device, or the heat dissipation channels 43 are disposed on both sides of the electronic device, which is exemplified herein and is within the scope of the present application; the middle frame of the electronic device can be a metal middle frame or other heat conducting material middle frame. The middle frame 12 and the front shell 11 may be fastened together as shown in fig. 4, or may be formed by combining a hollow channel with a semicircular section in each of the middle frame and the front shell to form a hollow channel with a circular section. But is not limited to the above examples.

A diverter 14, wherein an air inlet of the diverter faces the heating device 16 inside the housing, and an air outlet of the diverter is communicated with the heat dissipation channel;

the splitter 14 includes a splitter air inlet 401 and a splitter air outlet (403 or 404), wherein the splitter air inlet faces the heat generating device 16 inside the electronic device, and the splitter air outlet is communicated with the heat dissipation channel 43;

in order to enhance the heat dissipation effect, the splitter air inlet 401 may be disposed toward the heat generating device 16 inside the electronic device, and in addition, in order to implement the heat dissipation function, as described above, the

splitter air outlet

403 or 404 is communicated with the heat dissipation channel 43; the heat generating device 16 may be a motherboard chip or the like, or referred to as a heat source. The diverter intake 401 and diverter body 401 are integrally formed.

Because the heat dissipation effect can be achieved only under the condition of air circulation, the fan 13 can be further arranged in the electronic equipment shell, and when the fan runs, the air flow in the electronic equipment is driven to enter the air inlet 401 of the flow divider.

To enhance the heat dissipation effect, the fan 13 may be disposed at the splitter air inlet 401, and is configured to drive the air flow inside the casing to enter the splitter air inlet 401.

In addition, the shunt 14 and the fan 13 may be disposed near the heat generating device 16, for example, near a motherboard chip, to improve heat dissipation efficiency.

The electronic device may be a mobile phone, a tablet computer, or the like, but is not limited thereto.

Through this application, at inside fan and the shunt that sets up of electronic equipment casing, the fan drives the inside hot-blast to the shunt air intake of electronic equipment, flow to heat dissipation channel through the shunt air outlet, heat dissipation channel encircles this electronic equipment setting, be used for carrying out the circulation of air, hot-blast through heat dissipation channel realization cooling, the problem of leading to the performance to descend by a wide margin because electronic equipment generates heat in the correlation technique has been solved, dispel the heat fast effectively, the power that reduces the chip because equipment generates heat has been avoided, electronic equipment's stable performance has been guaranteed and has been realized.

Fig. 1b is a schematic diagram of a heat dissipation structure of a metal machine according to an embodiment of the present application, and as shown in fig. 1b, the heat dissipation structure of the metal machine is composed of five major parts, namely a front shell 11, a middle frame 12, a fan 13, a shunt 14, and a thermal sensor 15, and may further include a heat generating device 16 and a battery 17, wherein the middle frame 12 may be made of a metal material, and the fan 13 may be embedded inside the metal machine.

The metal machine heat radiation structure provided in the above embodiment, the metal middle frame is assembled around the front shell of the machine body, the front shell and the metal middle frame form an external air duct with a circular, square or other cross section after being assembled, that is, the heat radiation channel 43, the opening of the position, close to the main board chip, inside the front shell 11 is communicated with the external air duct, when the temperature of the internal heat source detected by the mobile phone itself is higher than the threshold, the cooling mechanism starts to be started, the internal gas inside the mobile phone is driven to circulate inside the mobile phone, the heat near the internal heat source of the mobile phone is quickly taken away, and enters the external air duct between the front shell and the metal middle frame, the hot air flows along the external air duct, a part of the heat is uniformly conducted to the front shell 11 of the mobile phone, and then is conducted to. The other part of heat is absorbed through the metal decoration frame and is radiated with the outside heat conduction radiation, thereby ensuring that the heat in the mobile phone can be quickly and uniformly dissipated. The hot air in the machine body entering the outer air duct can be physically cooled after being radiated by the metal middle frame and the front shell in two stages, and the circulated air flow is guided into the machine body again for the next cooling circulation by an opening at the bottom of the middle frame 12 close to the USB position.

Optionally, the splitter 14 includes a first splitter air inlet 401, a first splitter air outlet 403, and a second splitter air outlet 404, wherein the first splitter air inlet 401 is communicated to the first splitter air outlet 403 and the second splitter air outlet 404 through a splitter internal channel, the first splitter air outlet 403 and the second splitter air outlet 404 are respectively connected to the heat dissipation channel 43, and the first splitter air outlet 403 and the second splitter air outlet 404 are not communicated. The two air outlets of the flow divider are not communicated, and the heat dissipation channel is also interrupted at the position. Fig. 2 is a schematic diagram of a diverter assembly according to an embodiment of the present disclosure, and as shown in fig. 2, the diverter 14 is composed of a diverter body 401, a cover plate 402, a first diverter outlet 403 and a second diverter outlet 404. The first splitter outlet 403 and the second splitter outlet 404 are mounted on the cover plate 402 by dispensing or foaming with a cotton glue or the like. The splitter body 401 has an air inlet, which is integrally assembled with the fan 13. The diverter main body 401 and the cover plate 402 are integrally assembled through dispensing, ultrasonic welding or foam rubber, and good sealing between the diverter main body 401 and the cover plate 402 is guaranteed. Because the outer surfaces of the diverter main body 401 and the cover plate 402 are wrapped by soft glue, the assembly surface of the diverter 14 and the front shell can also ensure the sealing performance.

Fig. 3 is a schematic diagram of a diverter structure according to an embodiment of the present application, and as shown in fig. 3, a structure diagram of a diverter after the diverter is assembled is shown, which includes a diverter main body 401 having an air inlet 4011, a cover plate 402, a first diverter outlet 403 and a second diverter outlet 404, where the diverter air inlet 4011 and the diverter main body 401 are integrally disposed.

Fig. 4 is a schematic diagram of the heat dissipation channel composition according to an embodiment of the present application, and as shown in fig. 4, the front shell 11 and the middle frame 12 are machined so that the heat dissipation channel 43 with a circular, square or other cross section can be formed after the two are assembled.

Optionally, in the heat dissipation process, the heat is dissipated and cooled through the middle frame 12 and air radiation, and the heat is uniformly conducted through the metal front shell 11 to achieve cooling.

Fig. 5 is a schematic diagram of a heat dissipation structure according to an embodiment of the present application, and as shown in fig. 5, in order to improve the heat dissipation efficiency, the channel cannot be conducted at the diversion position, and it is ensured that the external channel is two branch channels 54, the two branch channels are respectively opened and assembled with the diverter outlet ports (403 and 404), the diverter 14 is assembled with the fan 13 and the front shell 11, and the diverter 14 is wrapped with silicone to ensure the assembly tightness. In particular, the middle frame 12 and the front shell 11 may be assembled together by welding, dispensing, etc. to form a main heat dissipation frame.

Optionally, the electronic device further includes a first electronic device air inlet 61 and a second electronic device air inlet 62, and the first electronic device air inlet 61 and the second electronic device air inlet 62 are respectively connected to the heat dissipation channel, here, two air inlets of the same electronic device are provided, the first electronic device air inlet 61 and the second electronic device air inlet 62 are not conducted through the heat dissipation channel, and the first electronic device air inlet 61 and the second electronic device air inlet 62 conduct the air flow in the heat dissipation channel to enter the inside of the housing 10.

Optionally, the first electronic device air inlet 61 and the second electronic device air inlet 62 may be disposed on left and right sides of a charging interface of the electronic device, the charging interface may include a Universal Serial Bus (USB) interface, or a Type-C interface, or when the electronic device is wirelessly charged, two electronic device air inlets may be disposed on one side away from the shunt 14, so as to ensure that the length of the heat dissipation channel is sufficiently reduced in temperature. The two electronic equipment air inlets are respectively communicated with the heat dissipation channel, wherein the first electronic equipment air inlet and the second electronic equipment air inlet are not communicated through the heat dissipation channel, and the first electronic equipment air inlet and the second electronic equipment conduct airflow in the heat dissipation channel to enter the electronic equipment. The two inlets for electronic equipment may be arranged as shown in fig. 6, i.e., inlet 61 and inlet 62.

Fig. 6 is a schematic diagram of a side opening of a front case according to an embodiment of the present application, and as shown in fig. 6, an opening of the front case near a heat source position of a motherboard guides internal air out to an external heat dissipation channel, and two holes are formed in the left and right sides of a USB position of a mobile phone, for a first electronic device air inlet 61 and a second electronic device air inlet 62, air flow with reduced temperature enters the mobile phone again, so that a cycle is realized, and thus, the heat inside the mobile phone can be guided out timely and uniformly through the heat dissipation structure of the present application.

Optionally, the first electronic device air inlet 61 and the second electronic device air inlet 62 are both provided with openings communicating with the outside of the housing 10. The external air flow of the electronic device enters the inside of the electronic device through the first electronic device air inlet 61 and the second electronic device air inlet 62. An opening communicating with the outside is provided to be exchangeable with an external air flow. However, as mentioned above, the heat dissipation channel is closed when reaching the air inlets of the two electronic devices to block the airflow to ensure that the airflow turns to flow into the electronic devices or to flow out of the housing 10, and the flow direction of the airflow can be as shown in fig. 7.

Optionally, the heat dissipation channel 43 includes a first heat dissipation channel and a second heat dissipation channel, the first heat dissipation channel starts from the second splitter outlet 404 and ends at the first electronic device inlet 61, the second heat dissipation channel starts from the first splitter outlet 403 and ends at the second electronic device inlet 62, and two heat dissipation channels are not conducted. I.e. the air flow direction of the two heat dissipation channels is opposite, as can be understood in connection with fig. 7 in the subsequent embodiment. The two sections of heat dissipation channels can increase the heat dissipation efficiency. The specific structure of the two sections of heat dissipation channels can be shown in fig. 6, that is, the second splitter air outlet 404 to the first electronic device air inlet 61 are one section of heat dissipation channel, and the first splitter air outlet 403 to the second electronic device air inlet 62 are one section of heat dissipation channel.

Optionally, after the air flow generated by the heat generating device 16 is cooled by heat dissipation through the heat dissipation channel, the air flow flows into the inside of the housing 10 through the first electronic device air inlet 61 and the second electronic device air inlet 62 for air flow circulation, or flows out of the housing 10.

Optionally, the inner side of the middle frame 12 is concave, the side of the front shell 11 facing the middle frame is concave, and the two are fastened to form the closed heat dissipation channel. Sealing may be ensured by glue or welding. The solution here can be illustrated in fig. 4, in which the heat dissipation channel 43 is formed by the front shell 11 and the middle frame 12.

Optionally, the cross-sectional shape of the heat dissipation channel 43 includes one of: circular, rectangular. The cross section of the heat dissipation channel 43 may be other shapes, such as a polygon, an ellipse, a combination of a semicircle and a half square, etc., as long as the channel for air circulation is formed, and is not limited to the above examples.

Optionally, the front shell 11 is made of metal, and is used for absorbing heat of the airflow in the heat dissipation channel 43 and radiating the heat to the outside of the housing 10. On one hand, the hot air is transmitted to the air through the heat dissipation channel 43 for radiation heat dissipation, on the other hand, because the front shell 11 is made of metal, the hot air uniformly transmits the temperature to the front shell and the whole mobile phone, and the temperature can be uniformly and effectively reduced.

Optionally, the electronic device further comprises: the thermal sensor 15 is also called a mainboard integrated thermal sensor, is arranged on the surface of the heating device 16 of the electronic equipment, and is used for monitoring the temperature of the mainboard chip and transmitting the temperature to the processor (902); the processor (902) is used for controlling the fan 13 according to the temperature of the mainboard chip. The manner of starting the fan 13 is not limited to the above example, and for example, the fan may be started when the occupancy rate of the motherboard chip exceeds a threshold, or the fan may be started at a fixed time to cool down, or the fan may be turned on when the user touches the machine to generate heat. The mobile phone is internally provided with a thermal sensing device, such as the thermal sensor 15 in fig. 1, which can convert a thermal signal into an electrical signal by using a thermistor or the like. When the system detects that the temperature of the heat source of the main board exceeds a set value, the fan in the mobile phone starts to rotate, and the rotating speed of the fan can be determined according to the fact that the actual temperature exceeds the set value. In the actual use process, the fan needs to be set to be N (N1, N2 and N3 … …) gear in the system, the rotating speed of the fan is adjusted in real time according to the actual temperature value of the heat source, and the overall heat dissipation condition in the mobile phone and the stability of the performance of the mobile phone are guaranteed.

Optionally, the thermal sensor 15 is used for converting the thermal signal of the heat generating device 16 into an electrical signal and transmitting the electrical signal to the processor (902).

Optionally, the processor (902) is further configured to adjust the gear of the fan according to the temperature of the heat generating device 16. For example, when the temperature of the heat generating device 16 is high, the fan 13 is in a high gear for fast operation, and when the temperature of the heat generating device 16 is low, the fan 13 is in a low gear for slow operation.

Optionally, each interface of the internal channel of the flow divider 14 and each interface of the heat dissipation channel 43 are hermetically sealed. The specific sealing treatment may include dispensing, ultrasonic welding, or foaming with cotton glue.

Fig. 7 is a schematic diagram of the flow of the airflow inside the mobile terminal according to the embodiment of the application, and as shown in fig. 7, the fan 13 drives the air inside the mobile phone to circulate rapidly to take away the heat near the heat generating device 16. Hot air enters the flow divider 14 under the driving of the fan and is divided into two air channels entering the external air duct of the mobile phone, heat is transferred to the front shell 11 body and the middle frame 12, the heat is evenly transferred to all positions of the mobile phone body by the front shell 11, and the heat is transferred to the external environment by the middle frame 12.

Fig. 8 is a flowchart of a heat dissipation method of a mobile terminal according to an embodiment of the present application, as shown in fig. 8, including the following steps:

s801: is it detected whether the temperature inside the mobile terminal reaches the set temperature threshold? If yes, go to the next step, if not, repeat S801;

s802: starting a built-in fan, and performing multi-gear temperature control according to the real-time temperature;

s803: after a few seconds, detect if the temperature is still above the temperature threshold? If yes, repeatedly executing S803, if not, going to S804;

s804: and powering off the fan, stopping rotating and finishing heat dissipation.

By adopting the scheme, the following technical effects are realized: 1. when the mobile phone is heated seriously, the heat can be actively dissipated and cooled; 2. the appearance effect of the existing equipment is not influenced, and the mobile phone is novel in structure; 3. similar heat dissipation structures can be adopted for various types of mobile phones in the market; 4. the requirements of the whole mobile phone on water resistance and dust resistance are not influenced, and the structural consistency is good.

The scheme can be applied to mobile phones, tablets, navigation equipment, other touch screens and display equipment.

Optionally, the technical scheme can be realized by replacing the metal middle frame with the metal decorative strip, or replacing the metal middle frame with a middle frame made of other materials, or forming an air duct design with other cross-sectional effects.

Example two

The method provided by the first embodiment of the present application may be executed in an electronic device or a similar computing device. Taking an electronic device as an example, fig. 9 is a hardware structure block diagram of an electronic device according to an embodiment of the present application, and as shown in fig. 9, the electronic device may include one or more processors 902 (only one is shown in fig. 9) (the processors 902 may include, but are not limited to, a processing device such as a microprocessor MCU or a programmable logic device FPGA), and a memory 904 for storing data, and optionally, the electronic device may further include a transmission device 906 for a communication function and an input/output device 908. It will be understood by those skilled in the art that the structure shown in fig. 9 is merely an illustration and is not intended to limit the structure of the electronic device. For example, the electronic device may also include more or fewer components than shown in FIG. 9, or have a different configuration than shown in FIG. 9.

The memory 904 may be configured to store software programs and modules of application software, such as program instructions/modules corresponding to the heat dissipation method of the electronic device in the embodiment of the present application, and the processor 902 executes various functional applications and data processing by running the software programs and modules stored in the memory 904, so as to implement the method described above. The memory 904 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some examples, the memory 904 may further include memory located remotely from the processor 902, which may be connected to the electronic device through a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.

The transmitting means 906 is used for receiving or sending data via a network. Specific examples of the network described above may include a wireless network provided by a communication provider of the electronic device. In one example, the transmission device 906 includes a Network adapter (NIC) that can be connected to other Network devices through a base station to communicate with the internet. In one example, the transmission device 906 can be a Radio Frequency (RF) module, which is used for communicating with the internet in a wireless manner.

In this embodiment, a heat dissipation method for an electronic device operating in the above electronic device is provided, and fig. 10 is a flowchart of the heat dissipation method for the electronic device according to the embodiment of the present application, and as shown in fig. 10, the flowchart includes the following steps:

step S1002, detecting whether the state of the current electronic equipment meets a preset condition;

step S1004, when the satisfaction is determined, a fan built in the electronic equipment is started; the fan drives the hot air flow to a heat dissipation channel for heat dissipation, wherein the heat dissipation channel is arranged around a shell of the electronic equipment.

The preset condition may be an internal temperature of the electronic device, such as a chip temperature, and more specifically, may be considered in combination with a time, for example, if the chip temperature is higher than a temperature threshold for more than 5 minutes, the fan is turned on.

The fan can be arranged near a mainboard chip of the electronic equipment, and the high-efficiency cooling can be guaranteed when the fan is close to a heat source.

Through the steps, the fan and the shunt are arranged inside the electronic equipment shell, the fan drives hot air inside the electronic equipment to the air inlet of the shunt, the hot air flows to the heat dissipation channel through the air outlet of the shunt, the heat dissipation channel surrounds the electronic equipment and is used for air circulation, the hot air is cooled through the heat dissipation channel, the problem that the performance of the electronic equipment is greatly reduced due to the fact that the electronic equipment generates heat in the related technology is solved, heat dissipation is rapidly and effectively conducted, the problem that the power of a chip is reduced due to the fact that the equipment generates heat is avoided, and the stable performance of the electronic equipment is.

Through the above description of the embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but the former is a better implementation mode in many cases. Based on such understanding, the technical solutions of the present application may be embodied in the form of a software product, which is stored in a storage medium (e.g., ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal device (e.g., a mobile phone, a computer, a server, or a network device) to execute the method according to the embodiments of the present application.

EXAMPLE III

Embodiments of the present application also provide a storage medium. Alternatively, in the present embodiment, the storage medium may be configured to store program codes for performing the following steps:

s1, when the preset condition is met, a fan built in the electronic equipment is started;

s2, wherein the fan drives the hot airflow to a heat dissipation channel for heat dissipation, and the heat dissipation channel surrounds the housing of the electronic device.

Optionally, in this embodiment, the storage medium may include, but is not limited to: a U-disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a removable hard disk, a magnetic or optical disk, and other various media capable of storing program codes.

Embodiments of the present application further provide an electronic device comprising a memory having a computer program stored therein and a processor configured to execute the computer program to perform the steps of any of the above method embodiments.

Optionally, the electronic apparatus may further include a transmission device and an input/output device, wherein the transmission device is connected to the processor, and the input/output device is connected to the processor.

Optionally, in this embodiment, the processor may be configured to execute the following steps by a computer program:

Optionally, the specific examples in this embodiment may refer to the examples described in the above embodiments and optional implementation manners, and this embodiment is not described herein again.

It will be apparent to those skilled in the art that the modules or steps of the present application described above may be implemented by a general purpose computing device, they may be centralized on a single computing device or distributed across a network of multiple computing devices, and alternatively, they may be implemented by program code executable by a computing device, such that they may be stored in a storage device and executed by a computing device, and in some cases, the steps shown or described may be performed in an order different than that described herein, or they may be separately fabricated into individual integrated circuit modules, or multiple ones of them may be fabricated into a single integrated circuit module. Thus, the present application is not limited to any specific combination of hardware and software.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An electronic device, comprising:

a housing;

the heat dissipation channel is arranged around the shell and used for air circulation;

the air inlet of the flow divider faces to the heating device in the shell, and the air outlet of the flow divider is communicated with the heat dissipation channel;

and the fan is arranged in the shell and used for driving the airflow in the shell to enter the air inlet of the flow divider.

2. The electronic device of claim 1,

the fan is arranged at the air inlet of the flow divider.

3. The electronic device of claim 1, further comprising:

the first electronic equipment air inlet and the second electronic equipment air inlet are respectively communicated with the heat dissipation channel, the first electronic equipment air inlet and the second electronic equipment air inlet are not communicated through the heat dissipation channel, and the first electronic equipment air inlet and the second electronic equipment air inlet conduct airflow in the heat dissipation channel to enter the shell.

4. The electronic device of claim 3,

and the first electronic equipment air inlet and the second electronic equipment air inlet are both provided with openings communicated with the outside of the shell.

5. The electronic device of claim 3,

the diverter comprises a first diverter air inlet, a first diverter air outlet and a second diverter air outlet, wherein the first diverter air inlet is communicated with the first diverter air outlet and the second diverter air outlet through a diverter internal channel, the first diverter air outlet and the second diverter air outlet are respectively connected with the heat dissipation channel, and the first diverter air outlet and the second diverter air outlet are not communicated.

6. The electronic device of claim 5,

the heat dissipation channel comprises a first heat dissipation channel and a second heat dissipation channel, the first heat dissipation channel is started from the second shunt air outlet to the first electronic equipment air inlet, the second heat dissipation channel is started from the first shunt air outlet to the second electronic equipment air inlet, and the two heat dissipation channels are not communicated with each other.

7. The electronic device of claim 3,

after the air flow generated by the heating device is subjected to heat dissipation and cooling through the heat dissipation channel, the air flow flows into the shell through the first electronic equipment air inlet and the second electronic equipment air inlet to perform air flow circulation, or flows to the outside of the shell.

8. The electronic device of claim 1, wherein the housing comprises a middle frame and a front shell, and the heat dissipation channel is disposed inside the middle frame and the front shell.

9. The electronic device of claim 8,

the inner side of the middle frame is sunken, the side surface of the front shell facing the middle frame is sunken, and the front shell and the side surface of the middle frame are buckled to form the closed heat dissipation channel.

10. The electronic device of claim 9,

the front shell is made of metal and is used for absorbing heat of airflow in the heat dissipation channel and radiating the heat to the outside of the shell.

11. The electronic device of claim 1, further comprising:

the heat sensor is arranged on the surface of the heating device and used for monitoring the temperature of the heating device and transmitting the temperature to the processor;

the processor is used for controlling the fan according to the temperature of the heating device.

12. The electronic device of claim 11,

the heat sensor is used for converting a heat signal of the heat generating device into an electric signal and transmitting the electric signal to the processor.

13. The electronic device of claim 12,

the processor is also used for adjusting the gear of the fan according to the temperature of the heating device.

14. The electronic device of claim 1,

and each interface of the internal channel of the flow divider and each interface of the heat dissipation channel are subjected to sealing treatment.

15. A method for dissipating heat from an electronic device, comprising:

when a preset condition is met, a fan arranged in the electronic equipment is started, wherein the fan drives hot air flow to a heat dissipation channel for heat dissipation, and the heat dissipation channel surrounds a shell of the electronic equipment.

16. A storage medium, in which a computer program is stored, wherein the computer program is arranged to perform the method of claim 15 when executed.

17. An electronic device comprising a memory and a processor, wherein the memory has stored therein a computer program, and wherein the processor is arranged to execute the computer program to perform the method of claim 15.