CN114828539A - Heat dissipation back splint and electronic equipment subassembly - Google Patents

Abstract

The embodiment of the application provides a heat dissipation back splint and electronic equipment subassembly, through set up the refrigeration passageway in the cavity of heat dissipation back splint, make the scattered hot-blast cooling become low temperature scattered hot-blast in the refrigeration passageway, through with refrigeration passageway and fresh air inlet intercommunication, can make things convenient for scattered hot-blast outside entering refrigeration passageway, through with refrigeration passageway and exhaust vent intercommunication, can make things convenient for low temperature scattered hot-blast outflow from the exhaust vent, through setting up gaseous drive arrangement, can improve scattered hot-blast flow rate, improve the efficiency of forced convection heat dissipation, the exhaust vent is located electronic equipment's installation face can make low temperature scattered hot-blast cooling effect to electronic equipment better, promote the radiating efficiency of heat dissipation back splint, improve electronic equipment's radiating effect.

Description

Heat dissipation back splint and electronic equipment subassembly

The present application claims priority from chinese patent application having application number 202110127984.X, entitled "heat dissipation clip and electronic device assembly", filed by the chinese patent office on 29/1/2021, the entire contents of which are incorporated herein by reference.

Technical Field

The application relates to the technical field of terminals, in particular to a heat dissipation back splint and an electronic equipment assembly.

Background

Along with the increasingly higher configuration and stronger performance of the terminal electronic equipment, the integration degree and the assembly density of electronic components are continuously improved, so that the terminal electronic equipment is more and more affected when the terminal electronic equipment is operated due to the fact that more and more heat is generated during operation while a strong use function is provided, and therefore the heat dissipation of the terminal electronic equipment becomes more and more important.

And the terminal electronic equipment is cooled by installing a cooling back clamp. The heat dissipation back splint comprises a shell, a groove for containing the terminal electronic equipment is formed in the shell, a semiconductor refrigeration piece and a fan are arranged at the bottom of the groove, an air outlet of the fan faces to a hot end of the semiconductor refrigeration piece, a cold end of the semiconductor refrigeration piece is abutted against part of the outer surface of the terminal electronic equipment, a heat exchange process is formed between the cold end of the semiconductor refrigeration piece and the outer surface of the terminal electronic equipment, and the temperature of the outer surface of the terminal electronic equipment is reduced. The hot end of the semiconductor refrigeration piece is cooled by the wind blown out by the fan.

However, the heat dissipation efficiency of the heat dissipation back clip is low, which results in poor heat dissipation effect of the terminal electronic device.

Disclosure of Invention

The application provides a radiating component and electronic equipment subassembly has promoted the radiating efficiency of heat dissipation back splint, and it is lower to have solved heat dissipation back splint radiating efficiency, leads to the poor technical problem of electronic equipment radiating effect.

The first aspect of the embodiment of the application provides a radiator unit, is applied to electronic equipment, wherein, including the casing, the inside cavity that has of casing, be provided with gas drive device and refrigeration passageway in the cavity, the casing is provided with fresh air inlet and exhaust vent, the fresh air inlet with the exhaust vent all with refrigeration passageway intercommunication.

At least one outer wall surface of the shell is provided with an installation surface for installing the electronic equipment, the air outlet hole is located on the installation surface, and the gas driving device is used for driving airflow in the refrigeration channel to flow to the electronic equipment through the air outlet hole.

The application provides a radiator unit, through set up the refrigeration passageway in the cavity, make the scattered hot-blast cooling become low temperature scattered hot-blast in can the refrigeration passageway, through refrigerating passageway and fresh air inlet intercommunication, can make things convenient for scattered hot-blast refrigeration passageway of getting into from the outside, refrigeration passageway and exhaust vent intercommunication, can make things convenient for low temperature scattered hot-blast outflow from the exhaust vent, through setting up gas drive arrangement, can improve scattered hot-blast flow rate, strengthen the radiating efficiency of forced convection, the exhaust vent is located electronic equipment's installation face can make low temperature scattered hot-blast cooling effect to electronic equipment better, promote the radiating efficiency of heat back splint.

In a possible implementation manner of the first aspect, a refrigerating member is disposed in the cavity, and the refrigerating member encloses the refrigerating channel.

Like this, can enclose into the passageway of heat dissipation circulation of wind through the refrigeration piece on the one hand, on the other hand, the refrigeration piece can be as the cold source to the cooling of heat dissipation wind, makes the heat dissipation wind flow become low temperature heat dissipation wind behind the refrigeration passageway.

In a possible implementation manner of the first aspect, the refrigerating element is a semiconductor refrigerating sheet, the semiconductor refrigerating sheet has a hot end and a cold end, and the hot end and the cold end are respectively located at two opposite sides of the semiconductor refrigerating sheet; the cold end faces the refrigeration channel, the hot end faces away from the refrigeration channel, and the hot end is attached to the inner wall surface of the shell.

The refrigeration piece is set to be the semiconductor refrigeration piece, refrigerant pollution can not be generated, the refrigeration piece has the advantages of high reliability and no occupied space, the cold end can cool the cooling air, the hot end and the shell are attached to enable the shell to dissipate heat of the hot end in a natural convection mode, a fan is not needed to be adopted to dissipate heat of the hot end, and loss of fan energy efficiency is reduced.

In a possible implementation manner of the first aspect, the housing includes an upper cover, a lower cover, and a middle frame, the middle frame is connected between the upper cover and the lower cover, and the inner walls of the upper cover, the lower cover, and the middle frame enclose the cavity.

The air inlet is arranged on the lower cover, the air outlet is arranged on the upper cover, and the outer wall surface of the upper cover is provided with the mounting surface.

Therefore, the assembly of the components inside the cavity of the heat dissipation back splint is facilitated, the energy management of cold-hot separation of the heat dissipation back splint is also facilitated, and the heat dissipation efficiency of the heat dissipation back splint is improved.

In a possible implementation manner of the first aspect, the material of the middle frame is a heat conducting material, and the material of the upper cover and the material of the lower cover are heat insulating materials.

Like this, can make the heat transfer in semiconductor refrigeration piece hot junction for the center, then, the center carries out natural convection and dispels the heat, need not to adopt the fan to dispel the heat to the hot junction, has improved the utilization ratio of fan efficiency, and in addition, upper cover and lower cover all insulate against heat can make refrigeration passageway and outside can not take place the heat transfer, avoid the cold volume loss in the refrigeration passageway.

In a possible implementation manner of the first aspect, all the hot ends of the semiconductor chilling plates are attached to the inner wall surface of the middle frame.

Therefore, the space of the refrigerating channel can be maximized, the refrigerating area of the semiconductor refrigerating sheet can be increased, and the refrigerating capacity of the refrigerating channel can be increased.

In a possible implementation manner of the first aspect, a part of the hot end of the semiconductor refrigeration piece is attached to an inner wall surface of the middle frame, at least one partition plate is arranged in the cavity, and the other part of the hot end of the semiconductor refrigeration piece is attached to the partition plate.

And a heat insulation piece is arranged on one side of the partition board, which is far away from the refrigerating channel.

Like this, can cut apart into at least one refrigeration chamber and at least one chamber that holds through the cavity of baffle with the back splint that dispels the heat, the setting and the arranging of other parts in the cavity of the back splint that dispels the heat of being convenient for to through setting up the baffle, also can adjust the just right best heat dissipation region of exhaust vent of the back splint that dispels the heat, make the back splint that dispels the heat carry out the adaptation according to the electronic equipment of different models, can reach optimal radiating effect. In addition, set up the heat insulating part and can avoid refrigerating the chamber and hold the chamber and take place heat transfer, avoid the hot junction to transmit the heat transfer of baffle to hold the chamber in, prevent that the heat from influencing the part that holds in the chamber.

In a possible implementation manner of the first aspect, the number of the partition board is one, the partition board partitions the cavity into a refrigeration cavity and an accommodating cavity which are mutually independent, and the air inlet hole and the air outlet hole are communicated with the refrigeration cavity.

The refrigerating channel is positioned in the refrigerating cavity, one part of the hot end is attached to the partition plate, and the other part of the hot end is attached to the inner wall surface of the middle frame positioned in the refrigerating cavity.

Like this, can make the refrigeration chamber be located the one end of cavity, hold the other end that the chamber is located the cavity, the setting of the cavity internals of being convenient for can also make the best heat dissipation region be located the tip of heat dissipation back splint like this, can satisfy the higher electronic equipment's of tip temperature heat dissipation demand.

In a possible implementation manner of the first aspect, the number of the partition plates is two, the partition plates divide the cavity into two independent refrigerating cavities and two accommodating cavities, the refrigerating cavities are located between the two accommodating cavities, and the air inlet hole and the air outlet hole are communicated with the refrigerating cavities.

The refrigerating channel is located in the refrigerating cavity, one part of the hot end is attached to the partition board, and the other part of the hot end is attached to the inner wall face of the middle frame located in the refrigerating cavity.

Therefore, the refrigeration cavity can be positioned in the middle of the cavity, the optimal heat dissipation area is positioned in the middle of the heat dissipation back clip, and the heat dissipation requirement of the electronic equipment with higher temperature in the middle can be met.

In a possible implementation manner of the first aspect, a circuit board is disposed in the accommodating cavity, and the gas driving device and the semiconductor chilling plate are electrically connected to the circuit board.

Like this, can supply power and running state management through the circuit board to gas drive arrangement and semiconductor refrigeration piece, the gas drive arrangement of being convenient for and semiconductor refrigeration piece are mutually supported, improve the stability in use of heat dissipation back splint.

In a possible implementation manner of the first aspect, an electricity storage device is disposed in the accommodating cavity, and the electricity storage device is electrically connected to the circuit board.

Like this, on the one hand electrical storage equipment can be to the circuit board power supply, and on the other hand electrical storage equipment can carry out the electric energy storage, as the emergent stand-by power supply of electronic equipment and heat dissipation back splint.

In a possible implementation manner of the first aspect, the circuit board includes a power input interface and a power output interface, and both the power input interface and the power output interface are installed on the middle frame.

Therefore, the circuit board can be directly powered through the power input interface, or the electric energy storage device can be powered through the power output interface, and the electronic device can be powered through the power output interface.

In a possible implementation manner of the first aspect, the gas driving device is a fan, at least a portion of the fan is located in the refrigeration channel, an air inlet of the fan faces the air inlet hole, and an air outlet of the fan faces the air outlet hole.

Like this, can make gas drive arrangement's occupation space less, the air intake of fan can make the windage that the cooling air got into the fan minimum towards the fresh air inlet, and the windage that the air outlet of fan can reduce the cooling air-out towards the exhaust vent, and the at utmost guarantees that the efficiency loss can not take place for the fan.

In a possible implementation manner of the first aspect, a mounting member is disposed on the mounting surface, and the mounting member is used for mounting the electronic device.

Therefore, the electronic equipment can be stably installed on the heat dissipation back splint and cannot fall off.

In a possible implementation manner of the first aspect, a magnetic member is disposed on the mounting member, and the magnetic member is configured to magnetically attract the electronic device.

And/or the surface of the mounting part is provided with a skid-proof piece.

Like this, can adsorb electronic equipment through magnetic force, increase the assembly stability of electronic equipment on the heat dissipation back splint, the anti-skidding piece can increase the frictional force between electronic equipment and the back splint, avoids electronic equipment and back splint to take place relative slip.

In a possible implementation manner of the first aspect, a clamping piece is disposed on the housing, and the clamping piece includes a clamping jaw for clamping the electronic device.

Therefore, the electronic equipment can be clamped firmly on the heat dissipation back clamp through the clamping piece and cannot fall off.

The second aspect of the embodiments of the present application further provides an electronic device assembly, including an electronic device and the heat dissipation back splint as described above, the electronic device is installed on the installation surface of the heat dissipation back splint, the electronic device is connected with the installation part of the installation surface, and a gap is provided between the electronic device and the installation surface.

Through set up the heat dissipation back splint in the electronic equipment subassembly, set up the refrigeration passageway in the cavity of heat dissipation back splint, the cooling wind can be cooled down in the refrigeration passageway and become low temperature heat dissipation wind, through with refrigeration passageway and fresh air inlet intercommunication, can make things convenient for heat dissipation wind to get into the refrigeration passageway from the outside, refrigeration passageway and exhaust vent intercommunication, can make things convenient for low temperature heat dissipation wind to flow from the exhaust vent, through setting up gas drive device, can improve heat dissipation wind's flow rate, strengthen the efficiency of forcing convection current heat dissipation, the exhaust vent is located electronic equipment's installation face, can make low temperature heat dissipation wind better to electronic equipment's cooling effect, promote the radiating efficiency of heat dissipation back splint, improve electronic equipment's radiating effect.

In a possible implementation manner of the second aspect, the heat dissipation device includes a support frame, and a connection portion of the support frame is connected to the electronic device or the heat dissipation back clip.

Like this, support electronic equipment and heat dissipation back splint through the support frame, can use under different scenes by convenience of customers.

In one possible implementation form of the second aspect, a sound component is included, and the sound component is connected with the electronic device wirelessly or in a wired manner.

Therefore, sound with higher loudness and higher quality can be provided for the electronic equipment, and the capability of the loudspeaker box of the electronic equipment can be expanded.

Drawings

Fig. 1 is a schematic structural view of a heat dissipation back clip according to an embodiment of the present application;

fig. 2A is a schematic view of a disassembled structure of a heat dissipation back clip according to an embodiment of the present application;

fig. 2B is a schematic view illustrating a flow direction of cooling air of the heat dissipation back clip according to an embodiment of the present application;

fig. 3 is a schematic structural view of a heat dissipation back clip without a clamping member according to an embodiment of the present application;

fig. 4 is a schematic structural view of a lower cover and a middle frame of a heat dissipation back clip according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of an upper cover of a heat dissipation back clip according to an embodiment of the present application;

fig. 6 is a schematic structural view of a lower cover, a middle frame and a clamping member of a heat dissipation back clip according to an embodiment of the present application from a first viewing angle;

fig. 7 is a schematic structural diagram of a lower cover, a middle frame and a clamping member of a heat dissipation back clamp according to an embodiment of the present application at a second viewing angle;

fig. 8 is a schematic structural diagram of a lower cover, a middle frame, and a clamping member of a heat dissipation back clip according to an embodiment of the present application from a third perspective.

Description of reference numerals:

100-heat dissipation back splint; 10-a housing; 11-upper cover; 12-middle frame;

13-lower cover; 14-air inlet holes; 15-air outlet holes; 16-a mounting surface;

17-a mounting member; 20-a cavity; 21-a refrigeration cavity; 22-a containment chamber;

30-a gas-driven device; 40-a refrigeration channel; 50-semiconductor refrigerating sheet; 51-a hot end;

52-cold end; 60-a separator; 70-a circuit board; 71-power input interface;

72-power output interface; 80-an electricity storage device; 90-a clamp; 91-a clamping jaw;

92-splint.

Detailed Description

The terminology used in the description of the embodiments section of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the present application.

The heat dissipation back splint generally mainly comprises a shell, a groove for containing terminal electronic equipment is formed in the shell, a semiconductor refrigeration piece and a fan are arranged at the bottom of the groove, the cold end of the semiconductor refrigeration piece is in contact with the terminal electronic equipment, the temperature of the cold end is low, the temperature of the terminal electronic equipment is high, heat exchange is carried out between the cold end and the terminal electronic equipment, the temperature of the terminal electronic equipment is reduced, the fan drives cooling air to flow, the cooling air flows through the hot end of the semiconductor refrigeration piece, the heat of the hot end is taken away by the cooling air to cool the hot end of the semiconductor refrigeration piece, in addition, the cooling air can also flow through the electronic equipment, and the heat of the terminal electronic equipment is directly dissipated.

However, such heat-dissipating back clip has the following disadvantages: on the first hand, because the hot end of the semiconductor refrigeration piece needs to dissipate heat, after part of energy efficiency of the fan needs to dissipate heat of the hot end of the semiconductor refrigeration piece, the residual energy efficiency can blow air to cool the electronic equipment, and thus the heat dissipation capacity of the fan is weakened. In the second aspect, because the air outlet of the fan is over against the semiconductor refrigerating sheet, the air outlet of the fan cannot be directly discharged and acts on the electronic equipment, and the efficiency of forced convection heat dissipation is reduced. The two disadvantages result in low heat dissipation efficiency of the heat dissipation back clip.

Example one

In order to solve the above problem, as shown in fig. 1, an embodiment of the present invention provides a heat dissipation back clip 100 applied to an electronic device, where the electronic device may include, but is not limited to, a mobile or fixed terminal such as a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, an intercom, a netbook, a POS machine, a Personal Digital Assistant (PDA), a wearable device, a virtual reality device, and the like, and the electronic device may further include an electronic component such as a chip, a circuit board, and the electronic device in this embodiment is described by taking a mobile phone as an example.

As shown in fig. 2A, the heat dissipation assembly may include a housing 10, a cavity 20 is formed inside the housing 10, a gas driving device 30 and a refrigeration channel 40 are disposed in the cavity 20, an air inlet 14 and an air outlet 15 are disposed on the housing 10, and both the air inlet 14 and the air outlet 15 are communicated with the refrigeration channel 40. At least one outer wall surface of the housing 10 has a mounting surface 16 for mounting the electronic device, the air outlet 15 is located on the mounting surface 16, and the air driving device 30 is used for driving the air flow in the refrigeration passage 40 to flow to the electronic device through the air outlet 15. As shown in fig. 2B, the arrows in the figure represent the flow direction of the cooling air, the normal temperature cooling air flows into the cooling channel 40 through the air inlet 14, and is cooled and refrigerated by the cooling channel 40, the normal temperature cooling air is changed into low temperature cooling air, the low temperature cooling air flows out from the air outlet 15 under the driving of the air driving device 30 and flows to the electronic device, heat exchange is formed between the low temperature cooling air and the electronic device, and the temperature of the electronic device is reduced.

Through set up refrigeration passageway 40 in cavity 20, make the scattered hot-blast cooling become low temperature scattered hot-blast in refrigeration passageway 40, through with refrigeration passageway 40 and fresh air inlet 14 intercommunication, can make things convenient for scattered hot-blast outside entering refrigeration passageway 40, refrigeration passageway 40 and exhaust vent 15 intercommunication, can make things convenient for low temperature scattered hot-blast outflow from exhaust vent 15, through setting up gas drive arrangement 30, can improve scattered hot-blast flow rate, strengthen the radiating efficiency of forced convection, exhaust vent 15 is located electronic equipment's installation face 16 can make low temperature scattered hot-blast cooling effect to electronic equipment better, promote the radiating efficiency of heat dissipation back splint 100.

It should be noted that the air driving device 30 may be any one of a blower, an inflator or an air bag, wherein the inflator and the air bag mainly comprise a cylinder and a push rod, the cylinder is fixedly connected with the housing 10 of the heat dissipation back clip 100, and the push rod moves relative to the cylinder, so as to drive the heat dissipation air to flow. The fan transfers energy to the heat dissipating wind by the power action of the blades on the rotating impeller, so that the heat dissipating wind is driven to flow. The embodiment of the present application does not limit the specific type of the gas driving device 30, and the user can select the gas driving device according to the actual situation.

In a possible implementation, a refrigerating element may be provided in the cavity 20, which encloses the refrigerating channel 40. So on the one hand can enclose into the passageway that dispels the hot-blast circulation through the refrigeration piece, on the other hand refrigeration piece can be as the cold source to the cooling of scattered hot-blast, makes to dispel the hot-blast low temperature scattered hot-blast that becomes behind the refrigeration passageway 40 of flowing through of scattered hot-blast. Specifically, the refrigeration piece can select absorption refrigeration equipment, heat pump refrigeration equipment or electric heating refrigeration equipment, and the embodiment of the application does not limit the refrigeration piece.

It should be noted that "enclosing" in this application may refer to that the refrigeration pieces are connected in sequence to form a channel with a closed side, or may refer to that the refrigeration pieces are located on four sides of the channel and are not connected to each other, and this embodiment of this application does not limit the specific formation of the refrigeration channel 40.

In one possible implementation, the cooling member may be a semiconductor cooling plate 50, and the semiconductor cooling plate 50 has a hot end 51 and a cold end 52, and the hot end 51 and the cold end 52 are respectively located at two opposite sides of the semiconductor cooling plate 50. Specifically, the cold end 52 faces the cooling passage 40, the hot end 51 faces away from the cooling passage 40, and the hot end 51 is attached to the inner wall surface of the casing 10.

It should be noted that the semiconductor refrigeration sheet 50 is also called a thermoelectric refrigeration sheet, and the semiconductor refrigeration sheet 50 is a refrigeration technology generating negative thermal resistance, and is characterized by no moving parts and high reliability. The semiconductor cooling plate 50 is formed by arranging a plurality of N-type semiconductor and P-type semiconductor particles, and NP is connected with a common conductor to form a complete circuit, usually copper, aluminum or other metal conductor, and finally two ceramic plates are sandwiched like sandwich biscuits, which must be insulated and have good heat conduction. The semiconductor refrigerating sheet 50 has the advantages of no sliding part, and can be applied to occasions with limited space, high reliability requirement and no refrigerant pollution. By utilizing the Peltier effect of the semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, and the aim of refrigeration can be fulfilled.

The peltier effect means that when a current passes through a loop formed by different conductors, in addition to irreversible joule heat, heat absorption and heat release phenomena occur at joints of the different conductors along with different current directions.

In the principle of the semiconductor chilling plate 50, when a current passes through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer occurs between the two ends, and the heat is transferred from one end to the other end, so that a temperature difference is generated to form a cold end 52 and a hot end 51. But the semiconductor itself presents a resistance that generates heat when current passes through the semiconductor, thereby affecting heat transfer. But the heat between the two plates is also transferred through the air and the semiconductor material itself in a reverse direction. When the cold end 52 and the hot end 51 reach a certain temperature difference and the two heat transfers are equal in quantity, a balance point is reached, and the positive and reverse heat transfers are mutually offset. The temperatures of cold end 52 and hot end 51 will not continue to change. To achieve a lower temperature, the temperature of hot end 51 may be reduced by heat dissipation or the like.

It should be noted that the temperature difference between the cold end 52 and the hot end 51 of the semiconductor cooling plate 50 may generally reach 40 to 65 degrees, and if the temperature of the hot end 51 is reduced by active heat dissipation, the temperature of the cold end 52 may also be correspondingly reduced, so as to reach a lower temperature.

In this embodiment, the hot end 51 is attached to the housing 10, the hot end 51 transfers heat to the housing 10, and the housing 10 dissipates heat in a natural convection heat dissipation manner. It should be emphasized that the term "attached" in this embodiment may refer to that the hot end 51 directly contacts with the housing 10 for heat transfer, or a heat conductor may be disposed between the hot end 51 and the housing 10, and the heat conductor may be made of a heat-conducting silicone material or a heat-conducting metal material for indirect heat transfer between the hot end 51 and the housing 10. The embodiment of the present application is not limited to the specific implementation of heat transfer between hot end 51 and housing 10, and the user may select the implementation.

In a possible implementation manner, the housing 10 may include an upper cover 11, a lower cover 13, and a middle frame 12, the middle frame 12 is connected between the upper cover 11 and the lower cover 13, and the inner walls of the upper cover 11, the lower cover 13, and the middle frame 12 enclose a cavity 20. The air inlet 14 is arranged on the lower cover 13, the air outlet 15 is arranged on the upper cover 11, and the outer wall surface of the upper cover 11 is provided with a mounting surface 16. Through setting up upper cover 11, lower cover 13 and center 12, not only conveniently assemble the inside part of cavity 20 of heat dissipation back splint 100 like this, also conveniently dismantle and assemble heat dissipation back splint 100, and is concrete, when needing to be changed spare part, can change through dismantling upper cover 11 or lower cover 13. In addition, the upper cover 11, the lower cover 13 and the middle frame 12 can be made of different materials, so that the heat dissipation back splint 100 can be subjected to energy management of cold-hot separation, and the heat dissipation efficiency of the heat dissipation back splint 100 is improved.

The material of the middle frame 12 may be a heat conducting material, and the material of the upper cover 11 and the lower cover 13 may be a heat insulating material, where the heat conducting material may be a metal with relatively good heat conducting property, such as: aluminum, copper or copper aluminum alloy, etc., and the heat insulating material may be plastic, rubber or resin with poor heat conductivity, such as: polystyrene foam, rigid polyurethane foam or high temperature resistant phenolic resin, etc., the specific types of the heat conducting material and the heat insulating material are not limited in the embodiment of the application, and the user can select the heat conducting material and the heat insulating material according to the actual situation.

In the present application, the heat of the hot end 51 of the semiconductor chilling plate 50 is transferred to the middle frame 12, then the outside of the middle frame 12 contacts with the natural wind, the middle frame 12 performs natural convection heat dissipation, and when the middle frame dissipates heat, as shown in fig. 4, the arrow in the figure indicates that the heat of the middle frame is transferred to the outside. The mode has the advantages that the hot end 51 is not required to be radiated by the fan, so that the whole energy efficiency of the fan acts on the surface of the electronic equipment, no energy efficiency loss exists, the utilization rate of the energy efficiency of the fan is improved, in addition, the upper cover 11 and the lower cover 13 are insulated, heat transfer between the refrigeration channel 40 and the outside cannot occur, and the refrigeration loss in the refrigeration channel 40 is avoided.

In an implementation, all the hot ends 51 of the semiconductor cooling fins 50 are attached to the inner wall surface of the middle frame 12. Therefore, the inner wall surface of the middle frame 12 inside the cavity 20 is attached to the hot end 51 of the semiconductor refrigeration sheet 50, and the space of the whole cavity 20 after attachment becomes the space of the refrigeration channel 40, so that the space of the refrigeration channel 40 is maximized, the refrigeration area of the semiconductor refrigeration sheet 50 can be increased, the refrigeration capacity of the refrigeration channel 40 is further increased, the space of the refrigeration channel 40 is increased to increase the storage capacity of low-temperature heat dissipation air, and the heat dissipation effect of the heat dissipation back clip 100 is prevented from being influenced by insufficient air volume of the low-temperature heat dissipation air.

As another practical implementation, as shown in fig. 4 and 6, a part of the hot end 51 of the semiconductor chilling plate 50 is attached to the inner wall surface of the middle frame 12, at least one partition plate 60 is disposed in the cavity 20, and another part of the hot end 51 of the semiconductor chilling plate 50 is attached to the partition plate 60. Can cut apart into at least one refrigeration chamber 21 and at least one chamber 22 that holds through baffle 60 with the cavity 20 of heat dissipation back splint 100 like this, be convenient for the setting and the arranging of other parts in the cavity 20 of heat dissipation back splint 100, and can be through setting up baffle 60, adjust the position of refrigeration chamber 21 on heat dissipation back splint 100, because refrigeration chamber 21 and exhaust vent 15 intercommunication, also can adjust the just right best heat dissipation region of exhaust vent 15 of heat dissipation back splint 100 like this, make heat dissipation back splint 100 can carry out the adaptation according to the electronic equipment of different models, can reach the optimal radiating effect.

In a possible implementation, the partition 60 can be made of a metal with good thermal conductivity, such as: aluminum, copper or copper aluminum alloy, etc., so that the spacer 60 can transfer heat transferred from the hot end 51 to the spacer 60 to the middle frame 12. The side of the partition 60 remote from the refrigeration passage 40 is provided with a heat insulating member, which may be made of plastic, rubber or resin with poor heat conductivity, such as: polystyrene foam, rigid polyurethane foam or high temperature resistant phenolic resin etc. set up heat-proof component and can avoid refrigeration chamber 21 and hold the chamber 22 and take place heat transfer, avoid hot junction 51 to transmit the heat transfer of baffle 60 to hold the chamber 22 in, prevent that the heat from influencing the part that holds in the chamber 22.

In a particular arrangement, the insulation may be bonded to the spacer 60 using a high temperature resistant adhesive, which may be pressure sensitive, hot melt or water based evaporation, wherein the pressure sensitive adhesive is relatively simple to handle and typically can be adhered by slight pressure with a finger. The hot melt adhesive has a certain requirement on the operating temperature, and generally needs to be melted and evaporated, and then cooled to a certain temperature for bonding. The water-based evaporation type adhesive comprises a polyvinyl alcohol aqueous solution, an ethylene-ethyl acetate copolymer emulsion type and the like, the type of the high-temperature-resistant adhesive is not limited in the embodiment of the application, and a user can select the high-temperature-resistant adhesive according to the actual situation.

Specifically, the number and arrangement of the partition plates 60 may be as follows:

as a first practical implementation mode, the number of the partition boards 60 is one, so that the partition board 60 divides the cavity 20 into the refrigeration cavity 21 and the accommodating cavity 22 which are independent of each other, and the air inlet hole 14 and the air outlet hole 15 on the casing 10 are both communicated with the refrigeration cavity 21. The refrigerating channel 40 is positioned in the refrigerating cavity 21, one part of the hot end 51 of the semiconductor refrigerating sheet 50 is attached to the partition plate 60, and the other part of the hot end 51 of the semiconductor refrigerating sheet 50 is attached to the inner wall surface of the middle frame 12 positioned in the refrigerating cavity 21.

It should be noted that, compared with the arrangement manner in the prior art, the arrangement manner of the semiconductor refrigeration sheet 50 in this embodiment does not additionally increase the area of the semiconductor refrigeration sheet 50, that is, does not increase additional power consumption, it can be understood that "the area" of the semiconductor refrigeration sheet 50 can also be understood as the size of the semiconductor refrigeration sheet 50, in this embodiment, only one original semiconductor refrigeration sheet 50 needs to be divided into four pieces, and the four semiconductor refrigeration sheets 50 are four sides of the refrigeration channel 40 respectively.

It should be noted that, hold and to place circuit board 70 in the chamber 22, accumulate equipment 80 etc, place gaseous drive arrangement 30 in the refrigeration chamber 21, this kind of mode of setting makes refrigeration chamber 21 be located the one end of cavity 20, it is located the other end of cavity 20 to hold chamber 22, be convenient for refrigeration chamber 21 with hold arranging and being connected of the internals of chamber 22, make refrigeration chamber 21 and hold chamber 22 and avoid mutual interference, furthermore, because refrigeration chamber 21 is close to the one end of heat dissipation back splint 100, can make the best heat dissipation region be located the tip of heat dissipation back splint 100 like this, can satisfy the higher electronic equipment's of tip temperature heat dissipation demand.

As a second practical implementation manner, there may be two partition boards 60, and the two partition boards 60 partition the cavity 20 into two independent refrigerating cavities 21 and two accommodating cavities 22, the refrigerating cavity 21 is located between the two accommodating cavities 22, and the air inlet 14 and the air outlet 15 are both communicated with the refrigerating cavity 21. The refrigeration passage 40 is positioned in the refrigeration cavity 21, one part of the hot end 51 is attached to the partition plate 60, and the other part of the hot end 51 is attached to the inner wall surface of the middle frame 12 positioned in the refrigeration cavity 21.

This arrangement allows the refrigeration cavity 21 to be located in the middle of the cavity 20, and the air outlet 15 is also located in the middle of the heat dissipation back clip 100, and the optimal heat dissipation area is located in the middle of the heat dissipation back clip 100. In the use process of the electronic device, the electronic components with the highest calorific value are usually the circuit board 70 and the battery, the circuit board 70 has a heating component, and the heating component may be a main chip on the electronic device, such as a Power amplifier, a Central Processing Unit (CPU), a Power Management IC (PMIC), or a radio frequency chip. Because the battery of the electronic equipment with different models and the setting position of the circuit board 70 are different, the high-temperature areas of the electronic equipment are different, and the setting mode can meet the heat dissipation requirement of the electronic equipment with higher temperature in the middle.

In a possible implementation manner, a circuit board 70 is disposed in the accommodating cavity 22, and the gas driving device 30 and the semiconductor chilling plate 50 are electrically connected to the circuit board 70. Therefore, the gas driving device 30 and the semiconductor refrigeration piece 50 can be powered and managed in the running state through the circuit board 70, the gas driving device 30 and the semiconductor refrigeration piece 50 can be matched with each other conveniently, the work can be carried out simultaneously, and the use stability of the heat dissipation back splint 100 can be improved.

In a possible implementation manner, an electric storage device 80 may be disposed in the accommodating cavity 22, and the electric storage device 80 is electrically connected to the circuit board 70.

The power storage device 80 may be a battery, and specifically, the battery may be a lithium ion battery (Li-ion), a lithium polymer battery (Li-Po), or a nickel-metal hydride battery (Ni-MH), and the specific type of the power storage device 80 is not limited in the embodiment of the present application.

Thus, on the one hand, the power storage device 80 can be used as a power source for the circuit board 70, the circuit board 70 supplies power to the gas driving device 30 and the semiconductor refrigeration sheet 50, and on the other hand, the power storage device 80 can store electric energy as an emergency standby power source for the electronic equipment and the heat dissipation back clip 100, specifically, when the electric energy is stored, the electric energy is input and stored in a chemical energy form, and when power needs to be supplied, the battery provides energy to generate electric energy, the electric energy is converted to required voltage through the voltage converter, and the required equipment is supplied through the output port.

In one possible implementation, as shown in fig. 8, the circuit board 70 may include a power input interface 71 and a power output interface 72, the middle frame 12 may be provided with mounting holes, and the power input interface 71 and the power output interface 72 are both mounted on the middle frame 12.

Thus, the circuit board 70 can be directly powered through the power input interface 71, or the power storage device 80 can be stored with electric energy, and the electronic device can be powered through the power output interface 72. It should be noted that the power input interface 71 and the power output interface 72 may be TYPE-C, micro-USB or lighting interfaces, so that the heat dissipation back clip 100 can be matched with different TYPEs of mobile phones, and can meet the requirements of different users.

In a possible implementation manner, due to the use of an inflator and an air bag, the housing 10 of the heat dissipation back clip 100 needs to reserve enough space for the push rod to move, and therefore, the space occupied inside the cavity 20 of the heat dissipation back clip 100 is relatively large, and therefore, in an alternative embodiment, the gas driving device 30 may be a fan, in this scheme, the fan drives the heat dissipation wind to move by the rotation of the blades, and the structural size of the fan is relatively small, so that the space occupied by the fan in the cavity 20 of the heat dissipation back clip 100 is relatively small.

When the air conditioner is arranged, at least part of the fan can be positioned in the refrigeration channel 40, the air inlet of the fan faces the air inlet hole 14, and the air outlet of the fan faces the air outlet hole 15. Can make gaseous drive arrangement 30's occupation space less like this, the air intake of fan is towards fresh air inlet 14, can make the windage that the cooling air got into the fan minimum, the air outlet of fan is towards exhaust vent 15, can reduce the windage of cooling air-out, in addition, the arrangement of this application embodiment compares with prior art, do not have semiconductor refrigeration piece 50 and shelter from the problem of exhaust vent 15, also do not have other parts and shelter from exhaust vent 15, can guarantee like this that the efficiency loss can not take place for the fan by the at utmost, promote the radiating efficiency of fan.

It should be noted that the fan can be an axial flow fan or a centrifugal fan, and the axial flow fan has the main advantages of simple structure, large air volume and airflow direction perpendicular to the rotation direction of the blades. The centrifugal fan has the main advantages of low noise, high pressure and airflow direction tangential to the rotation direction of the blades.

In this embodiment, the fan is an axial flow fan, the air inlet 14 and the air outlet 15 are respectively located at two ends of the refrigeration channel 40, and the refrigeration channel 40 is a straight channel, so that the advantage of large air volume of the axial flow fan can be exerted. As another realizable implementation, the fan may also be a centrifugal fan, an air outlet of the centrifugal fan may face an inner wall surface of the middle frame 12, and the heat dissipation air flows through the inner wall surface of the middle frame 12 and then changes the flow direction to flow out from the air outlet 15, and in addition, the positions of the air inlet 14 and the air outlet 15 may also be adjusted, so that an air inlet of the centrifugal fan faces the air inlet 14, and an air outlet faces the air outlet 15, which may reduce the wind resistance of the heat dissipation air. The embodiment of the application does not limit the type of the fan, and a user can select the fan according to the requirement.

In one possible implementation, as shown in fig. 3, the mounting surface 16 may be provided with a mounting member 17, and the mounting member 17 is used for mounting an electronic device. Can make electronic equipment installation firm on heat dissipation back splint 100 like this, can not drop, in addition, installed part 17 can have certain bulge height for installation face 16, can make like this have the clearance between electronic equipment and the installation face 16, and the back is flowed out from exhaust vent 15 to scattered hot-blast like this, strikes the back on the electronic equipment, and the flow direction deflection can take place for the scattered hot-blast, and the clearance can make scattered hot-blast other surfaces flow towards electronic equipment, dispels the heat to other regions.

Specifically, the mounting member 17 may be a protrusion, as shown in fig. 5, in this embodiment, a circular protrusion is adopted, the circular protrusion may increase a contact surface between the housing 10 of the heat dissipation back clip 100 and the electronic device, and in addition, a side wall surface of the circular protrusion is arc-shaped, which is beneficial for heat dissipation wind to flow along the side wall surface, reduces resistance of the heat dissipation wind to flow, and improves heat dissipation efficiency of the heat dissipation wind. It should be noted that the shape of the protrusion may also be an oval shape or other special shapes, which is not limited in the embodiments of the present application.

In a possible implementation manner, the mounting member 17 may be provided with a magnetic member for magnetically attracting the electronic device, and the surface of the mounting member 17 may be provided with an anti-slip member. Specifically, the magnetic member can be embedded in the circular protrusion or adhered to the surface of the circular protrusion, and the anti-slip member is adhered to the magnetic member.

It should be noted that some electronic devices are metal shells, the surfaces of the shells are smooth, the magnetic members are arranged to adsorb the electronic devices through magnetic force, the anti-slip members can increase the friction force between the electronic devices and the back clip, so as to prevent the electronic devices and the back clip from sliding relatively, and the arrangement can increase the assembly stability of the electronic devices on the heat dissipation back clip 100.

In a possible implementation manner, a clamping member 90 may be disposed on the housing 10, and the clamping member 90 may include a clamping jaw 91, the clamping jaw 91 is used for clamping the electronic device, wherein the number of the clamping jaws 91 may be one or more, and one clamping jaw 91 may cooperate with the mounting member 17 to clamp; the clamping jaws 91 can be symmetrically arranged, and the clamping jaws 91 are mutually matched for clamping.

Specifically, as shown in fig. 7, the clamping member 90 may be disposed on the lower cover 13, a connecting rod for extending and retracting the two clamping jaws 91 is disposed on the mounting portion of the clamping member 90, the two clamping jaws 91 are disposed on two sides of the heat dissipation back clamp 100, and the electronic devices with different sizes may be clamped on the heat dissipation back clamp 100. This allows the electronic device to be held firmly on the heat sink clip 100 without falling off.

In a possible implementation manner, the accommodating space between the clamping jaws 91 can be controlled by adjusting the telescopic length of the connecting rod, soft rubber pads can be arranged on the clamping jaws 91, and the clamping jaws 91 can be prevented from scratching the surface of the electronic equipment by the soft rubber pads. The space for accommodating the mobile phone is adjusted by utilizing the telescopic function of the connecting rod, so that the electronic equipment and the heat dissipation back clip 100 are conveniently operated when combined, and the heat dissipation back clip 100 can be suitable for electronic equipment with different sizes.

In a possible implementation manner, as shown in fig. 7, the clamping member 90 may further include a clamping plate 92, the clamping plate 92 may be disposed on an installation portion of the clamping member 90, and the heat dissipation back clip 100 may be clamped on a belt or a pocket through the clamping plate 92 and the installation portion, so as to facilitate users to use in different scenes.

Example two

On the basis of the first embodiment, the second embodiment of the present application provides an electronic device assembly, which includes an electronic device and the heat dissipation back clip 100, wherein the electronic device is mounted on the mounting surface 16 of the heat dissipation back clip 100, the electronic device is connected to the mounting part 17 of the mounting surface 16, and a gap is formed between the electronic device and the mounting surface 16.

Specifically, electronic equipment can adsorb on installed part 17, also can be through clamping jaw 91 centre gripping, electronic equipment's shell and installed part 17 butt, installed part 17 can make the clearance between electronic equipment's shell and the installation face 16, because exhaust vent 15 is located installation face 16, a large amount of scattered hot-blast flows out from exhaust vent 15, at first act on electronic equipment and be close to exhaust vent 15 department, scattered hot-blast flow can take place to flow to the deflection after that, this clearance can make scattered hot-blast circulation passageway has between electronic equipment and heat dissipation back splint 100, be convenient for scattered hot-blast dispel the heat to other regions of electronic equipment.

In one possible implementation, the electronic device assembly may include a support frame, and a connecting portion of the support frame is connected to the electronic device or the heat dissipation back clip 100. Thus, the electronic equipment and the heat dissipation back clip 100 are supported by the support frame, and the electronic equipment and the heat dissipation back clip can be conveniently used by a user in different scenes.

Exemplarily, the support frame can be a triangular support frame, and the height and the angle of the triangular support frame can be adjusted, so that the electronic equipment can be adjusted by a user on different occasions as required, and the use requirements of different users on different electronic equipment can be met.

In one possible implementation, the electronic device components may include a sound component that is wirelessly or wired to the electronic device.

It should be noted that the sound component may be connected to the electronic device in a wired manner or in a wireless manner, where the wired manner may be a data line, and the wireless manner may be bluetooth and/or 2.4GHz and/or WIFI. Specifically, the pairing connection with the electronic equipment is established through Bluetooth, so that the audio data can be transmitted; the wireless connection with the electronic equipment is established through 2.4GHz and/or WIFI, so that the same effect is achieved; the user may be provided with a variety of options for wireless connectivity over short distances.

Other technical features are the same as those of the first embodiment and can achieve the same technical effects, and are not described in detail herein.

The electronic equipment assembly that this application embodiment two provided, through set up heat dissipation back splint 100 in the electronic equipment assembly, set up refrigeration passageway 40 in cavity 20 of heat dissipation back splint 100, make the cooling wind can cool down in refrigeration passageway 40 and become low temperature heat dissipation wind, through communicating refrigeration passageway 40 with fresh air inlet 14, can make things convenient for the heat dissipation wind to get into refrigeration passageway 40 from the outside, refrigeration passageway 40 and exhaust vent 15 communicate, can make things convenient for low temperature heat dissipation wind to flow from exhaust vent 15, through setting up gas drive arrangement 30, can improve the flow rate of heat dissipation wind, strengthen the efficiency of forcing convection, exhaust vent 15 is located electronic equipment's installation face 16 can make low temperature heat dissipation wind better to electronic equipment's cooling effect, promote the radiating efficiency of heat dissipation back splint 100, improve electronic equipment's radiating effect.

In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the embodiments of the application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the embodiments of the present application, and are not limited thereto; although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (19)

1. A heat dissipation back splint is applied to electronic equipment and is characterized by comprising a shell, wherein a cavity is arranged in the shell, a gas driving device and a refrigeration channel are arranged in the cavity, the shell is provided with an air inlet hole and an air outlet hole, and the air inlet hole and the air outlet hole are communicated with the refrigeration channel;

at least one outer wall surface of the shell is provided with an installation surface for installing the electronic equipment, the air outlet hole is located on the installation surface, and the gas driving device is used for driving airflow in the refrigeration channel to flow to the electronic equipment through the air outlet hole.

2. The heat dissipating clip of claim 1, wherein a cooling member is disposed within the cavity, the cooling member enclosing the cooling channel.

3. The heat dissipating clip of claim 2, wherein said cooling member is a semiconductor cooling plate having a hot end and a cold end, said hot end and said cold end being located on opposite sides of said semiconductor cooling plate; the cold end faces the refrigeration channel, the hot end faces away from the refrigeration channel, and the hot end is attached to the inner wall surface of the shell.

4. The heat dissipation back clip of claim 3, wherein the housing comprises an upper cover, a lower cover and a middle frame, the middle frame is connected between the upper cover and the lower cover, and the inner walls of the upper cover, the lower cover and the middle frame enclose the cavity;

the air inlet is arranged on the lower cover, the air outlet is arranged on the upper cover, and the outer wall surface of the upper cover is provided with the mounting surface.

5. The heat dissipating back clip of claim 4, wherein the material of the center frame is a thermally conductive material and the material of the upper cover and the lower cover is a thermally insulating material.

6. The heat dissipation back clip of claim 4 or 5, wherein all of the hot ends of the semiconductor chilling plates are attached to the inner wall surface of the middle frame.

7. The heat dissipation back splint according to claim 4 or 5, wherein a part of the hot end of the semiconductor refrigeration sheet is attached to the inner wall surface of the middle frame, at least one partition plate is arranged in the cavity, and another part of the hot end of the semiconductor refrigeration sheet is attached to the partition plate;

and a heat insulation piece is arranged on one side of the partition board, which is far away from the refrigerating channel.

8. The heat dissipation back splint according to claim 7, wherein the number of the partition plates is one, the partition plates divide the cavity into a refrigeration cavity and an accommodating cavity which are independent of each other, and the air inlet hole and the air outlet hole are both communicated with the refrigeration cavity;

the refrigerating channel is positioned in the refrigerating cavity, one part of the hot end is attached to the partition plate, and the other part of the hot end is attached to the inner wall surface of the middle frame positioned in the refrigerating cavity.

9. The heat dissipation back clip of claim 7, wherein the number of the partition plates is two, the two partition plates divide the cavity into a refrigeration cavity and two containing cavities which are independent of each other, the refrigeration cavity is located between the two containing cavities, and the air inlet hole and the air outlet hole are both communicated with the refrigeration cavity;

the refrigerating channel is positioned in the refrigerating cavity, one part of the hot end is attached to the partition plate, and the other part of the hot end is attached to the inner wall surface of the middle frame positioned in the refrigerating cavity.

10. The heat dissipation back clip of claim 8 or 9, wherein a circuit board is disposed in the accommodating cavity, and the gas driving device and the semiconductor chilling plate are electrically connected to the circuit board.

11. The heat dissipating clip of claim 10, wherein an electrical storage device is disposed in the receiving cavity, the electrical storage device being electrically connected to the circuit board.

12. The heat dissipation back clip of claim 10 or 11, wherein the circuit board comprises a power input interface and a power output interface, both of which are mounted on the center frame.

13. The heat sink clip as recited in any one of claims 1 to 12, wherein the air driving device is a fan, at least a portion of the fan is located in the cooling channel, an air inlet of the fan faces the air inlet opening, and an air outlet of the fan faces the air outlet opening.

14. The heat dissipating clip according to any one of claims 1 to 13, wherein a mounting member is provided on the mounting surface for mounting the electronic device.

15. The heat dissipation back clip of claim 14, wherein the mounting member is provided with a magnetic member for magnetically attracting the electronic device;

and/or the surface of the mounting part is provided with a skid-proof piece.

16. The heat sink clip as recited in any one of claims 1-15, wherein the housing has a clamping member disposed thereon, the clamping member comprising a clamping jaw for clamping the electronic device.

17. An electronic device assembly comprising an electronic device and the heat dissipation back clip of any of claims 1-16, the electronic device mounted on a mounting surface of the heat dissipation back clip, the electronic device coupled to a mounting member of the mounting surface with a gap therebetween.

18. The electronic device assembly of claim 17, comprising a support frame, wherein the connecting portion of the support frame is connected to the electronic device or the heat dissipation back clip.

19. The electronic device assembly of claim 18, comprising an audio assembly, wherein the audio assembly is wirelessly or wired to the electronic device.

Images