CN114025578A - Heat dissipation assembly and electronic equipment - Google Patents
Heat dissipation assembly and electronic equipment Download PDFInfo
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- CN114025578A CN114025578A CN202111349996.3A CN202111349996A CN114025578A CN 114025578 A CN114025578 A CN 114025578A CN 202111349996 A CN202111349996 A CN 202111349996A CN 114025578 A CN114025578 A CN 114025578A
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/32—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from a charging set comprising a non-electric prime mover rotating at constant speed
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B40/00—Technologies aiming at improving the efficiency of home appliances, e.g. induction cooking or efficient technologies for refrigerators, freezers or dish washers
Abstract
The application relates to a heat dissipation assembly and an electronic device. Wherein, radiator unit includes: the fan is provided with an air inlet and an air outlet opposite to the air inlet; the first heat dissipation piece is used for being connected with a heat source and arranged on one side of the air outlet; the temperature difference power generation module is electrically connected with the fan and comprises a low-temperature end and a high-temperature end, the low-temperature end is located around the air inlet, the high-temperature end is located around the air outlet and connected with the first heat dissipation piece, and the temperature difference power generation module is used for converting the temperature difference between the high-temperature end and the low-temperature end into electric energy for driving the fan. In the heat dissipation assembly, heat generated by the heat source can be conducted to the high-temperature end, so that a temperature difference is formed between the high-temperature end and the low-temperature end to generate electric energy which is transmitted to the fan, and the fan blows and dissipates the heat of the heat source and the first heat dissipation part. The radiating assembly is high in radiating efficiency, can work without extra power taking from a PCB, improves the energy utilization rate, reduces the system energy consumption, can adjust the radiating effect automatically according to the temperature condition of a heat source, and achieves intelligent adjustment.
Description
Technical Field
The present application relates to the field of heat dissipation technologies, and in particular, to a heat dissipation assembly and an electronic device.
Background
At present, for electronic devices such as CPE (Customer Premise Equipment), PC (Personal Computer), and router, the fan is generally driven and controlled by taking power from a PCB (Printed Circuit board), so that the fan dissipates heat of the heat source of the electronic device. However, the fan needs to consume extra power, so that the system energy consumption of the electronic device is increased, and the endurance time of the electronic device is shortened.
Disclosure of Invention
In view of the above, there is a need for a heat dissipation assembly that can reduce system power consumption, and an electronic device having the heat dissipation assembly.
In one aspect, the present application provides a heat dissipation assembly, comprising:
the fan is provided with an air inlet and an air outlet opposite to the air inlet;
the first heat dissipation piece is used for being connected with a heat source and arranged on one side of the air outlet; and
the temperature difference power generation module is electrically connected with the fan; the temperature difference power generation module is provided with a low-temperature end and a high-temperature end, wherein the low-temperature end is located on the periphery of the air inlet, the high-temperature end is located on the periphery of the air outlet, the high-temperature end is connected with the first heat dissipation piece, and the temperature difference power generation module is used for converting the temperature difference between the high-temperature end and the low-temperature end into electric energy for driving the fan.
For above-mentioned radiator unit, the heat that the heat source produced conducts to the high temperature end of thermoelectric generation module through first radiating piece, so first radiating piece plays the radiating effect to the heat source, simultaneously, because the air current temperature of air intake one side is lower relatively, just so make the temperature of low temperature end be less than the temperature of high temperature end to produce the temperature difference between the two, under the effect of difference in temperature, thermoelectric generation module can produce the electric energy, and with electric energy transport to the fan department of being connected with it, thereby make the fan work and blow the heat dissipation to heat source and first radiating piece. Under the cooperation of the first heat dissipation member and the fan, the heat source can realize rapid heat dissipation and maintain a low temperature, so that the heat dissipation assembly has high heat dissipation efficiency. In addition, the thermoelectric generation module can fully utilize the heat of a heat source, converts the heat energy into the kinetic energy of the fan, enables the fan to work without additionally taking electricity from a PCB (printed circuit board) in the electronic equipment, improves the utilization rate of the energy, reduces the energy consumption of the electronic equipment, and prolongs the endurance time of the electronic equipment. In addition, if the heat source load is more, the temperature of the heat source load is higher, more heat is conducted to the high-temperature end through the first heat dissipation part, and the temperature difference between the high-temperature end and the low-temperature end is larger, the voltage and the current between the high-temperature end and the low-temperature end are larger, so that the rotating speed of the fan is higher, the flowing of air flow is accelerated, and the heat dissipation effect is improved. If the load of the heat source is less, the temperature of the heat source is lower, the temperature difference between the high temperature end and the low temperature end is smaller, the voltage and the current between the two ends are smaller, and the rotating speed of the fan is smaller or even the fan does not need to work. Therefore, the radiating assembly can automatically adjust the radiating effect according to the temperature condition of the heat source, and the purpose of intelligent adjustment is achieved.
In one aspect, the present application provides an electronic device, comprising:
the air conditioner comprises a shell, a fan and a fan, wherein the shell is provided with an air inlet hole and an air outlet hole;
a heat source built in the case; and
the heat dissipation assembly is arranged in the shell and is connected with the heat source; the air inlet hole, the air inlet, the air outlet and the air outlet hole are communicated in sequence.
Among the above-mentioned electronic equipment, radiator unit can realize high-efficient heat dissipation to the heat source, and can turn into the kinetic energy of fan with the heat energy that the heat source produced, makes the fan dispel the heat to the heat source, has improved the utilization ratio of energy for electronic equipment's system energy consumption can reduce. In addition, the heat dissipation assembly can also automatically adjust the heat dissipation effect according to the temperature condition of the heat source to achieve the purpose of intelligent adjustment, so that the heat source is maintained within a certain working temperature range, the service life of the heat source is prolonged, the reliability and the user experience of the electronic equipment are improved, and the electronic equipment conforms to the development trend of energy conservation, emission reduction and intelligent adjustment.
Drawings
FIG. 1 is a schematic structural diagram of a partial structure of an electronic apparatus according to an embodiment of the present application;
FIG. 2 is a pictorial cross-sectional view of the structure shown in FIG. 1;
FIG. 3 is an isometric view of the structure shown in FIG. 2;
FIG. 4 is a schematic structural view of a heat sink assembly of the structure shown in FIG. 2;
FIG. 5 is an exploded view of the heat dissipation assembly shown in FIG. 4;
FIG. 6 is a schematic view of the heat sink assembly shown in FIG. 4 from another perspective;
fig. 7 is a schematic view of another installation state of the heat dissipation assembly in the housing of the electronic device shown in fig. 1.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, but the present application may be practiced in many ways different from those described herein, and similar modifications may be made by those skilled in the art without departing from the spirit of the present application, and the present application is therefore not limited to the specific embodiments disclosed below.
In the description of the present application, it is to be understood that the terms "upper", "lower", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are used only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "above" or "over" a second feature may be directly or obliquely above the second feature, or simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "below," and "beneath" a second feature may be directly or obliquely under the first feature or may simply mean that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1 to 3, an electronic device generally includes a heat source 100 and a PCB 200, the heat source 100 is connected to the PCB 200, and an internal power source or an external power source of the electronic device is connected to the PCB 200 and supplies power to the heat source 100 through the PCB 200. The heat source 100 consumes power during operation and generates a large amount of heat, and the generated heat may cause the temperature of the heat source 100 itself to increase, and once the temperature exceeds a certain range, the heat source 100 may be in danger of failure. Therefore, the heat source 100 is maintained within a certain working temperature range by using an efficient heat dissipation method, which is of great significance to the improvement of the reliability and the user experience of the electronic device. Generally, the heat source 100 in the electronic device is embodied as a chip.
The present application protects an electronic device having a heat dissipation assembly 300, wherein the heat dissipation assembly 300 dissipates heat from a heat source 100 in the electronic device. The electronic device may be a CPE (Customer Premise Equipment), a router, a PC (Personal Computer), or the like.
Referring to fig. 1 and 2, in some embodiments, the heat dissipation assembly 300 includes a fan 310, a first heat dissipation member 330, and a thermoelectric generation module 350. The fan 310 has an air inlet 311 and an air outlet 312 opposite to the air inlet 311. The first heat dissipation element 330 is disposed at one side of the air outlet 312. The thermoelectric generation module 350 is electrically connected to the fan 310. The thermoelectric generation module 350 has a low temperature end 352 and a high temperature end 351, wherein the high temperature end 351 is located around the air outlet 312, and the low temperature end 352 is located around the air inlet 311. The high temperature end 351 is connected to the first heat dissipation member 330, and the first heat dissipation member 330 is connected to the heat source 100. The thermoelectric generation module 350 is used to convert the temperature difference between the high temperature end 351 and the low temperature end 352 into electric energy for driving the fan 310.
During operation, heat generated by the heat source 100 is transferred to the high-temperature end 351 of the thermoelectric generation module 350 through the first heat dissipation member 330, so that the first heat dissipation member 330 dissipates heat from the heat source 100, meanwhile, because the temperature of the air flow at the side of the air inlet 311 is relatively low, the temperature at the low-temperature end 352 is lower than that at the high-temperature end 351, and a temperature difference is generated between the two, under the effect of the temperature difference, the thermoelectric generation module 350 can generate electric energy and transmit the electric energy to the fan 310 connected with the thermoelectric generation module, so that the fan 310 operates to blow and dissipate heat from the heat source 100 and the first heat dissipation member 330. The heat source 100 can dissipate heat quickly and maintain a low temperature by the cooperation of the first heat dissipation member 330 and the fan 310, and thus the heat dissipation assembly 300 has high heat dissipation efficiency. In addition, the thermoelectric generation module 350 can fully utilize heat generated by the heat source 100, convert heat energy into kinetic energy of the fan 310, enable the fan 310 to work without additionally taking electricity from the PCB 200, improve the utilization rate of energy, reduce the energy consumption of the electronic device, and prolong the endurance time of the electronic device.
In addition, if the heat source 100 is loaded more, the temperature thereof will be higher, more heat is conducted to the high temperature end 351 through the first heat dissipation member 330, and the temperature difference between the high temperature end 351 and the low temperature end 352 is larger, the voltage and current between the high temperature end 351 and the low temperature end 352 will be larger, so that the rotation speed of the fan 310 is faster, and the flow of the air flow is accelerated, so as to improve the heat dissipation effect. If the heat source 100 is less loaded and the temperature thereof is lower, the temperature difference between the high temperature end 351 and the low temperature end 352 is smaller, the voltage and the current between the two ends are smaller, and the rotation speed of the fan 310 is smaller or even no longer required to operate. Therefore, the heat dissipation assembly 300 can adjust the heat dissipation effect according to the temperature of the heat source 100, so as to achieve the purpose of intelligent adjustment.
It should be noted that in the embodiment shown in fig. 1, the fan 310 is an axial fan. In other embodiments, the fan 310 may also be a centrifugal fan, a mixed-flow fan, or other types of fans. For each type of fan, the fan has an air inlet 311 and an air outlet 312. In the embodiment shown in fig. 1, the first heat dissipation member 330 is located in the axial direction of the axial flow fan, and in other embodiments, the positions of the fan 310 and the first heat dissipation member 330 may be adjusted according to the type of the fan 310.
As shown in fig. 1 to 5, in some embodiments, at least one heat dissipation channel 331 is formed through the first heat dissipation member 330, and the air inlet 311, the air outlet 312, and the heat dissipation channel 331 are sequentially communicated to form an air flow channel. By providing the heat dissipation channel 331 inside the first heat dissipation member 330, the surface area of the first heat dissipation member 330 can be increased, thereby facilitating rapid heat dissipation. Under the rotation action of the impeller 313 in the fan 310, the airflow can enter from the air inlet 311, flow out from the air outlet 312, and further enter the heat dissipation channel 331 so as to blow and dissipate heat of the surface of the first heat dissipation member 330, and finally the airflow is discharged from one end of the heat dissipation channel 331 far away from the air outlet 312.
In some embodiments, an end of the heat dissipating channel 331 near the air outlet 312 is spaced apart from the air outlet 312. The arrangement enables the airflow blown out from the air outlet 312 to be diffused into a larger space range, so as to realize blowing and heat dissipation of a larger area for the first heat dissipation element 330, thereby improving the heat dissipation effect. In particular, in the case where there are a plurality of heat dissipation paths 331, the arrangement is such that the airflow blown out from the air outlet 312 flows into each heat dissipation path 331, thereby accelerating heat dissipation. Further, the airflow passage is linear. It can be understood that the air inlet 311, the air outlet 312, and the heat dissipation channel 331 are substantially linearly arranged in sequence and are sequentially communicated with each other, so that the length of the air flow channel can be shortened, the circulation path of the air flow can be shortened, the air flow carrying heat can be rapidly discharged, and the heat dissipation is accelerated. Further, the air inlet 311 and the air outlet 312 are coaxially disposed, and the heat dissipation passage 331 extends in a direction parallel to the axial direction of the air inlet 311, so that the air flow passage is substantially linear.
As shown in fig. 2 to 5, the first heat sink 330 further includes a heat dissipating body 332 connected to the heat source 100, and a connecting plate 333 connected between the heat dissipating body 332 and the high temperature end 351, the heat dissipating body 332 is spaced apart from the fan 310, and the heat dissipating channel 331 is opened in the heat dissipating body 332. The end of the heat dissipation channel 331 close to the air outlet 312 and the air outlet 312 are spaced from each other, so that the airflow blown out from the air outlet 312 can be diffused into a larger space range, and a larger area of the heat dissipation body 332 is blown to dissipate heat, thereby improving the heat dissipation effect.
In some embodiments, the heat dissipation body 332 includes a first heat dissipation plate 332a, a second heat dissipation plate 332b, and a third heat dissipation plate 332c connected between the first heat dissipation plate 332a and the second heat dissipation plate 332 b. The first heat sink 332a is connected to the heat source 100, and the second heat sink 332b is connected to the connection plate 333. The number of the third heat dissipation plates 332c is at least two, the third heat dissipation plates 332c are arranged at intervals, the first heat dissipation plate 332a, the second heat dissipation plate 332b and two adjacent third heat dissipation plates 332c enclose a heat dissipation channel 331 together, and thus the first heat dissipation plate 332a, the second heat dissipation plate 332b and more than two third heat dissipation plates 332c enclose a plurality of heat dissipation channels 331 together. Thus, at least two third heat dissipation plates 332c may be combined with the first and second heat dissipation plates 332a and 332b to obtain at least one heat dissipation path 331. With this configuration, the surface area of the heat dissipating body 332 can be increased, and the heat dissipating capability of the heat dissipating body 332 can be improved.
Further, more than two third heat dissipation plates 332c are uniformly distributed between the first heat dissipation plate 332a and the second heat dissipation plate 332b, so that a plurality of heat dissipation passages 331 with uniform calibers and uniform extension directions can be obtained. Further, the air inlet 311 and the air outlet 312 are coaxially disposed, and the third heat dissipation plate 332c, the first heat dissipation plate 332a, and the second heat dissipation plate 332b extend in a direction parallel to the axial direction of the air inlet 311, so that the heat dissipation passage 331 extends in the axial direction of the air inlet 311.
In some embodiments, the heat dissipation assembly 300 includes two first heat dissipation members 330 spaced apart from each other, and a receiving gap 380 for receiving the heat source 100 is formed between the two first heat dissipation members 330. By disposing the heat source 100 between the two first heat dissipation members 330, the two first heat dissipation members 330 can dissipate heat from the heat source 100 together, so as to improve the heat dissipation effect. Further, in the embodiment where the heat dissipation body 332 includes the first heat dissipation plate 332a, two first heat dissipation plates 332a are shared in the two first heat dissipation members 330, and the two first heat dissipation plates 332a are arranged in parallel and spaced apart to form the receiving gap 380. It can be understood that the air outlet 312 is communicated with one end of the receiving gap 380, and the air flow blown out from the air outlet 312 can enter the receiving gap 380 to directly blow and dissipate heat of the heat source 100. In the embodiment shown in fig. 2, the number of the first heat dissipation elements 330 is two, and in other embodiments, the number of the first heat dissipation elements 330 may be set to other numbers such as 4, 6, 8, etc. according to the number of the heat sources 100 in the electronic device.
Further, the heat sources 100 are mounted on both sides of the PCB 200, and the PCB 200 and the heat sources 100 are located in the receiving gap 380. The two first heat dissipation members 330 correspond to both sides of the PCB board 200, respectively. Thus, a greater number of heat sources 100 can be mounted on the PCB 200, thereby improving the utilization of the PCB 200. Meanwhile, the two first heat dissipation members 330 can also fully dissipate the heat of the heat source 100 at the two sides of the PCB 200, respectively. Further, a plurality of heat sources 100 may be installed on the same side of the PCB 200, and the plurality of heat sources 100 are disposed at intervals, so that the airflow can fully flow through each heat source 100, and a good heat dissipation effect is achieved.
It should be noted that the first heat dissipation element 330 is mainly used for dissipating heat from the heat source 100 and conducting part of the heat to the high temperature end 351, and thus is required to have a high thermal conductivity. Specifically, the material of the first heat dissipation element 330 may be a high thermal conductive metal, such as aluminum, aluminum alloy, copper alloy, etc. The material of the first heat dissipation element 330 may also be a high thermal conductive material, such as high thermal conductive graphite. The first heat dissipating member 330 may also be a Vapor Chamber (VC). Further, in order to ensure high heat conduction performance of the first heat dissipation member 330, the first heat dissipation member 330 is required to have a heat conduction coefficient greater than 150W/m · K.
Referring to fig. 1 to 6, in some embodiments, the heat dissipation assembly 300 further includes a second heat dissipation member 360, and the second heat dissipation member 360 is disposed at one side of the air inlet 311 and connected to the low temperature end 352. By providing the second heat dissipation element 360, the heat at the low temperature end 352 can be dissipated quickly, the heat at the low temperature end 352 is prevented from being accumulated, and the low temperature end 352 is maintained at a lower temperature, so as to facilitate the formation of a temperature difference between the low temperature end 352 and the high temperature end 351. Further, in order to achieve rapid heat dissipation, the second heat dissipation member 360 needs to have high heat conduction performance. The material of the second heat dissipation element 360 may be metal, such as aluminum, aluminum alloy, copper alloy, etc. The material of the second heat dissipation element 360 may also be a high thermal conductive material, such as high thermal conductive graphite. The second heat dissipating member 360 may also be a Vapor Chamber (VC). Further, in order to ensure high heat conduction performance of the second heat dissipation member 360, the second heat dissipation member 360 is required to have a heat conduction coefficient greater than 150W/m · K.
In some embodiments, the thermoelectric generation module 350 includes a first panel 353, a second panel 354, and a power generation semiconductor 355, wherein the first panel 353 and the second panel 354 are respectively connected to both ends of the power generation semiconductor 355. The first panel 353 is connected to the first heat sink 330 to form a high temperature end 351; the second panel 354 is connected to the second heat dissipating member 360 to form the low temperature end 352. The first panel 353 and the second panel 354 are both insulating panels. Through setting up first panel 353 and second panel 354, can make things convenient for first radiating element 330 and second radiating element 360 to be connected in thermoelectric generation module 350, but also can play the insulating effect, avoid the electric energy that thermoelectric generation module 350 produced to first radiating element 330 and the transmission of second radiating element 360. Specifically, the power generating semiconductor 355 has a pillar shape, which is formed by combining P-type semiconductor cells and N-type semiconductor cells in an array manner by combining them in series and parallel.
Further, in order to realize the rapid heat transfer from the first heat sink 330 to the first panel 353 and the rapid heat transfer from the second panel 354 to the second heat sink 360, the first panel 353 and the second panel 354 need to have high thermal conductivity, and therefore, the first panel 353 may be made of a ceramic material such as alumina ceramic and aluminum nitride, and the second panel 354 may be made of a ceramic material such as alumina ceramic and aluminum nitride.
In some embodiments, the first heat dissipation element 330 is welded to the first panel 353 and the second heat dissipation element 360 is welded to the second panel 354. Thus, seamless connection is realized between the first heat dissipation member 330 and the first panel 353, and between the second heat dissipation member 360 and the second panel 354, so that higher heat conduction performance can be achieved between the first heat dissipation member 330 and the first panel 353, and between the second heat dissipation member 360 and the second panel 354. Specifically, the first heat dissipation element 330 is welded to the first panel 353 to be welded to the first panel 353, and the second heat dissipation element 360 is welded to the second panel 354 to be welded to the second panel 354. In other embodiments, the first heat dissipation element 330 and the first panel 353 may be fixed by, for example, screw locking, and in this case, the first heat dissipation element 330 and the surface of the first panel 353 are only in contact and not welded, so that there is a micro-gap between the first heat dissipation element 330 and the surface of the first panel 353, and the existence of the micro-gap will block the heat transfer of the first heat dissipation element 330 to the first panel 353. By filling the thermal interface material between the first heat dissipation member 330 and the surface of the first panel 353, the micro-voids can be filled, thereby improving the thermal conductivity. In other embodiments, the surfaces of the second heat dissipation element 360 and the second panel 354 may be merely in contact with each other, rather than being welded, and the micro-gap between the two may also be filled by filling the thermal interface material therebetween, so as to improve the thermal conductivity. Further, the thermal interface material may be of the silicone grease, thermal gel, thermal pad, or the like type.
Further, in the embodiment where the first heat sink 330 includes the connection plate 333, the connection plate 333 is connected between the heat sink body 332 and the first panel 353, so that it is required to effectively transfer heat to the first panel 353, and therefore, the connection plate 333 may be made of a high thermal conductive material such as a high thermal conductive metal, high thermal conductive graphite, and the like. The connection plate 333 may also be a heat pipe.
Further, the connection plate 333 includes a first connection part 333a and a second connection part 333b, and the first connection part 333a is connected to the second connection part 333 b. The first connection part 333a is connected to the heat dissipation body 332. Specifically, the first connection part 333a is integrally formed with the second heat dissipation plate 332 b. The second connection portion 333b is in a flat plate shape and is surface-bonded to the flat plate-shaped first panel 353, so that the connection plate 333 and the first panel 353 have a large contact area, heat is rapidly transferred from the first heat sink 330 to the first panel 353, and heat transfer efficiency is improved. Specifically, the second connection part 333b is welded to the first panel 353, or is filled with a heat conductive interface material with the first panel 353.
As shown in fig. 4 to 5, in some embodiments, the first panel 353 is connected to the periphery of the air outlet 312, and extends in a ring shape along the circumferential direction of the air outlet 312. The second panel 354 is connected to the periphery of the air inlet 311 and extends in a ring shape along the circumferential direction of the air inlet 311. The plurality of power generation semiconductors 355 are arranged in an array between the first panel 353 and the second panel 354. The annular first panel 353 and the annular second panel 354 are arranged, so that the temperature of the first panel 353 can be improved, the second panel 354 can be rapidly cooled to maintain a lower temperature, and more power generation semiconductors 355 can be arranged between the first panel 353 and the second panel 354, so that a better power generation effect is achieved. The first panel 353 and the second panel 354 are specifically connected to the outermost casing of the fan 310. The first panel 353 and the second panel 354 jointly support the power generation semiconductor 355 by the supporting function of the outermost casing of the fan 310, and simultaneously avoid the electric conduction between the power generation semiconductor 355 and the casing of the fan 310. In addition, the first panel 353, the second panel 354 and the power generation semiconductor 355 connected therebetween can block the airflow around the fan 310, so as to force the airflow to enter from the air inlet 311 and flow out from the air outlet 312 as much as possible.
As shown in fig. 3 to 6, in some embodiments, the second heat sink 360 extends in a ring shape along the circumferential direction of the air inlet 311, and is formed with a plurality of flow guide grooves 361 extending in a radial direction of the air inlet 311 and communicating with the air inlet 311. The arrangement of the plurality of flow guide grooves 361 can increase the surface area of the second heat dissipation member 360, improve the heat dissipation capability of the second heat dissipation member 360, and guide the air flow from the periphery to the air inlet 311 together, thereby maintaining the low temperature end 352 at a lower temperature.
Further, the second heat sink 360 includes a first heat-conducting plate 362 and a second heat-conducting plate 363. The first heat conduction plate 362 extends in a ring shape along the circumferential direction of the intake opening 311 and is in surface-to-surface engagement with the second panel 354, so that a contact area is increased, and rapid heat transfer from the second panel 354 to the second heat sink 360 is achieved. Further, it is necessary to weld the first heat-conductive plate 362 to the second panel 354 or to fill a heat-conductive interface material between the first heat-conductive plate 362 and the second panel 354. The second heat conduction plate 363 is connected to the first heat conduction plate 362, and extends in a plate shape along a radial direction of the air inlet 311. The number of the second heat conduction plates 363 is plural, and the plural second heat conduction plates 363 are arranged at intervals along the circumferential direction of the air inlet 311. Thus, the gap between two adjacent second heat conducting plates 363 extends along the radial direction of the air inlet 311 and communicates with the air inlet 311 to form a guiding groove 361, a plurality of guiding grooves 361 can be formed between a plurality of second heat conducting plates 363, and the plurality of guiding grooves 361 are distributed along the circumferential direction of the air inlet 311 at intervals to guide the air flow from the periphery to the air inlet 311 together, and at the same time, the heat transfer from the first heat conducting plate 362 to the second heat conducting plates 363 can be accelerated to maintain the low temperature end 352 at a lower temperature together. In other embodiments, the first thermal conductive plate 362 may also be omitted, in which case the plurality of second thermal conductive plates 363 are directly connected to the second panel 354.
Referring to fig. 1 to 3 again, in the present application, the electronic device further includes a housing 500, and the heat source 100 and the heat dissipation assembly 300 are all disposed in the housing 500. The casing 500 is provided with an air inlet 510 and an air outlet 520, and the air inlet 510, the air inlet 311, the air outlet 312 and the air outlet 520 are sequentially communicated, so that the air flow enters the casing 500 through the air inlet 510, and further passes through the air inlet 311 and the air outlet 312 in sequence under the rotation action of the impeller 313 in the fan 310, and then is blown to the first heat sink 330 and the heat source 100, and finally flows out through the air outlet 520 with a part of heat.
Further, the air inlet holes 510 are plural, and the plural air inlet holes 510 extend along the axial direction of the air inlet 311 and are uniformly distributed to correspond to the entire air inlet 311. The air outlet holes 520 are plural, and the plural air outlet holes 520 extend along the axial direction of the air outlet 312 and are uniformly distributed to correspond to the entire air outlet 312.
Further, the thermoelectric generation module 350 is located between the outer circumference of the fan 310 and the case 500, and is spaced apart from the case 500. The thermoelectric generation module 350 is spaced apart from the case 500, so that the temperature of the high temperature end 351 and the low temperature end 352 can be prevented from being affected by heat exchange with the case 500, and the thermoelectric generation module can be prevented from being electrically connected to the case 500. The thermoelectric power generation module 350 can fill a gap between the casing 500 and the fan 310, block the airflow from passing through the gap, and reduce the mutual influence between the high temperature end 351 and the low temperature end 352. In addition, the gap between the housing 500 and the fan 310 can be fully utilized, the space utilization rate is improved, and the waste of the internal space of the housing 500 is avoided.
In the present application, the power generating semiconductor 355 is connected between the first panel 353 and the second panel 354 and is connected to the periphery of the fan 310 through the first panel 353 and the second panel 354, so that the first panel 353 and the fan 310, the second panel 354 and the fan 310 are hermetically connected without any gap for allowing airflow to pass through, the first panel 353 and the housing 500, the second panel 354 and the housing 500 are disposed at an interval, the gaps between the first panel 353 and the housing 500, and the gaps between the second panel 354 and the housing 500 are smaller, the housing 500 can block the airflow entering from the air inlet 510 from passing through the gaps, so as to force the airflow entering from the air inlet 311 as far as possible and flowing out from the air outlet 312, so that the periphery of the air inlet 311 and the periphery of the air outlet 312 are isolated, and the mutual influence between the high temperature end 351 and the low temperature end 352 is reduced. In addition, the second heat dissipation member 360 maintains substantially the same temperature as the ambient temperature due to the proximity to the air inlet holes 510, so that the low temperature end 352 can be maintained at a relatively low temperature.
Further, the housing 500 is spaced apart from the first heat dissipation member 330, so that heat exchange between the first heat dissipation member 330 and the housing 500 may be prevented.
For the electronic device, according to the requirement of the internal installation environment, the air inlet 510 can be opened at any position of the housing 500, and only the air inlet 311 of the fan 310 needs to be arranged corresponding to the air inlet 510, and the first heat dissipation member 330 is arranged at one side of the air outlet 312 of the fan 310, and the air outlet 520 corresponds to one side of the first heat dissipation member 330 far away from the air outlet 312, so that the consistent use effect can be achieved. For example, as shown in fig. 1, the air inlet 510 can be located below the electronic device and the air outlet 520 can be located above the electronic device, so that the air flows from bottom to top. As shown in fig. 7, the air outlet 520 is located at the lower side of the electronic device, and the air inlet 510 is located at the upper side, so that the air flow can flow from the top to the bottom.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (13)
1. A heat sink assembly, comprising:
the fan is provided with an air inlet and an air outlet opposite to the air inlet;
the first heat dissipation piece is used for being connected with a heat source and arranged on one side of the air outlet; and
the temperature difference power generation module is electrically connected with the fan; the temperature difference power generation module is provided with a low-temperature end and a high-temperature end, wherein the low-temperature end is located on the periphery of the air inlet, the high-temperature end is located on the periphery of the air outlet, the high-temperature end is connected with the first heat dissipation piece, and the temperature difference power generation module is used for converting the temperature difference between the high-temperature end and the low-temperature end into electric energy for driving the fan.
2. The heat dissipation assembly of claim 1, wherein the heat dissipation assembly comprises a second heat dissipation element disposed at a side of the air inlet and connected to the low temperature end.
3. The heat dissipation assembly of claim 2, wherein the thermoelectric generation module comprises a first panel, a second panel and a power generation semiconductor, and the first panel and the second panel are respectively connected to two ends of the power generation semiconductor; the first panel is connected with the first heat dissipation piece to form the high-temperature end; the second panel is connected with the second heat dissipation part to form the low-temperature end; the first panel and the second panel are both insulating panels.
4. The heat dissipation assembly of claim 3, wherein the first heat dissipation element is welded to the first panel, or wherein the first heat dissipation element is in contact with a surface of the first panel and a thermally conductive interface material is filled therebetween; the second heat dissipation member is welded to the second panel, or the second heat dissipation member is in contact with the surface of the second panel, and a heat conduction interface material is filled between the second heat dissipation member and the second panel.
5. The heat dissipation assembly of claim 3, wherein the first panel is connected to the periphery of the air outlet and extends in a ring shape along the circumferential direction of the air outlet; the second panel is connected to the periphery of the air inlet and extends in a ring shape along the circumferential direction of the air inlet; the power generation semiconductors are arranged between the first panel and the second panel in an array mode.
6. The heat dissipating assembly of claim 2, wherein the second heat dissipating member extends in a circumferential direction of the air inlet and is formed with a plurality of flow guiding grooves extending in a radial direction of the air inlet and communicating with the air inlet.
7. The heat dissipating assembly of claim 1, wherein the first heat dissipating member has at least one heat dissipating channel formed therethrough, and the air inlet, the air outlet and the heat dissipating channel are sequentially communicated to form an air flow channel.
8. The heat dissipating assembly of claim 7, wherein an end of the heat dissipating channel adjacent to the air outlet is spaced from the air outlet.
9. The heat dissipation assembly of claim 7, wherein the airflow channels are linear.
10. The heat dissipation assembly of claim 1, wherein the heat dissipation assembly comprises two first heat dissipation members arranged at intervals, and a receiving gap is formed between the two first heat dissipation members for receiving the heat source.
11. An electronic device, comprising:
the air conditioner comprises a shell, a fan and a fan, wherein the shell is provided with an air inlet hole and an air outlet hole;
a heat source built in the case; and
the heat removal assembly of any of claims 1-10, being disposed within the housing and being coupled to the heat source; the air inlet hole, the air inlet, the air outlet and the air outlet hole are communicated in sequence.
12. The electronic device of claim 11, wherein the thermoelectric generation module is located between an outer periphery of the fan and the housing and spaced apart from the housing.
13. The electronic device of claim 11, comprising a PCB board, both sides of which are mounted with the heat source; the heat dissipation assembly comprises two first heat dissipation pieces arranged at intervals, and the two first heat dissipation pieces correspond to two sides of the PCB respectively.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111349996.3A CN114025578A (en) | 2021-11-15 | 2021-11-15 | Heat dissipation assembly and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111349996.3A CN114025578A (en) | 2021-11-15 | 2021-11-15 | Heat dissipation assembly and electronic equipment |
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| CN114025578A true CN114025578A (en) | 2022-02-08 |
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| CN202111349996.3A Pending CN114025578A (en) | 2021-11-15 | 2021-11-15 | Heat dissipation assembly and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116916633A (en) * | 2023-09-11 | 2023-10-20 | 深圳市德兰明海新能源股份有限公司 | Resonant converter and energy storage power supply |
| TWI824835B (en) * | 2022-02-11 | 2023-12-01 | 神基科技股份有限公司 | Electronic device |
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| CN210956588U (en) * | 2019-12-27 | 2020-07-07 | 广东威特真空电子制造有限公司 | Magnetron assembly and cooking equipment |
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