US20040108104A1 - Axial heat-dissipating device - Google Patents

Axial heat-dissipating device Download PDF

Info

Publication number
US20040108104A1
US20040108104A1 US10395933 US39593303A US2004108104A1 US 20040108104 A1 US20040108104 A1 US 20040108104A1 US 10395933 US10395933 US 10395933 US 39593303 A US39593303 A US 39593303A US 2004108104 A1 US2004108104 A1 US 2004108104A1
Authority
US
Grant status
Application
Patent type
Prior art keywords
heat
dissipating
axial
dissipating device
shell body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10395933
Inventor
Chin-Kuang Luo
Original Assignee
Chin-Kuang Luo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Images

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/001Particular heat conductive materials, e.g. superconductive elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An axial heat-dissipating device includes a heat-dissipating unit and a fan unit. The heat-dissipating unit includes an upright heat-transfer member having a lower end adapted to be disposed on a heat-generating source, a plurality of angularly spaced apart heat-dissipating fins provided on the heat-transfer member, and a hollow shell body that is disposed to surround the heat-dissipating fins. The shell body has a top end portion and a lower end portion which is formed with at least one radial air inlet that permits flow of air into the shell body. The fan unit is mounted on the top end portion of the shell body, and is operable so as to draw hot air out of the shell body.

Description

    CROSS-REFERENCE TO RELATED APPLICATION
  • This application claims priority of Taiwanese Application No. 091132959, filed on Nov. 8, 2002. [0001]
  • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0002]
  • The invention relates to a heat-dissipating device, more particularly to an axial heat-dissipating device capable of quick heat dissipation. [0003]
  • 2. Description of the Related Art [0004]
  • FIG. 1 shows a conventional heat-dissipating device adapted to be mounted on top of a heat-generating component [0005] 12 that is disposed on a circuit board 11 of an electronic device. The heat-generating component 12 can be a central processing unit, an integrated circuit, or the like. The heat-dissipating device includes an aluminum heat-dissipating fin unit 13 disposed in thermal contact with the heat-generating component 12, and a fan 14 oriented toward the fin unit 13. The fin unit 13 has a bottom portion provided with a heat-conducting plate 15 that is formed from copper and that facilitates the transfer of heat generated by the heat-generating component 12 to the fin unit 13. However, such a conventional heat-dissipating device has the following setbacks:
  • 1. Although aluminum and copper have quite high temperature coefficients of conductivity, their combined heat-dissipating effect is not very satisfactory, resulting in that the surface temperature of the heat-generating component [0006] 12 remains higher than that of the fin unit 13. That is, currents of air blown by the fan 14 can only disperse the heat around the fin unit 13, and cannot reach the surface of the heat-generating component 12 to dissipate the heat of the heat-generating component 12.
  • 2. In view of the aforesaid, when heat gradually accumulates on the surface of the heat-generating component [0007] 12, since the conventional heat-dissipating device cannot effectively dissipate the high heat, the operation of the heat-generating component 12 will be affected, which may result in shutdown of or even damage to the electronic device.
  • SUMMARY OF THE INVENTION
  • Therefore, the object of the present invention is to provide an axial heat-dissipating device that is capable of quick heat dissipation. [0008]
  • Accordingly, an axial heat-dissipating device of the present invention includes: [0009]
  • a heat-dissipating unit including an upright heat-transfer member having a lower end adapted to be disposed on a heat-generating source, a plurality of angularly spaced apart heat-dissipating fins provided on the heat-transfer member, and a hollow shell body that is disposed to surround the heat-dissipating fins, the shell body having a top end portion and a lower end portion which is formed with at least one radial air inlet that permits flow of air into the shell body; and [0010]
  • a fan unit mounted on the top end portion of the shell body and operable so as to draw hot air out of the shell body.[0011]
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Other features and advantages of the present invention will become apparent in the following detailed description of the preferred embodiments with reference to the accompanying drawings, of which: [0012]
  • FIG. 1 is a schematic plan view of a conventional heat-dissipating device; [0013]
  • FIG. 2 is a perspective view of the first preferred embodiment of an axial heat-dissipating device according to the present invention; [0014]
  • FIG. 3 is an exploded perspective view of the first preferred embodiment; [0015]
  • FIG. 4 is another exploded perspective view of the first preferred embodiment, which is taken from a different angle; [0016]
  • FIG. 5 is a sectional view to illustrate the first preferred embodiment in part; [0017]
  • FIG. 6 is an exploded perspective view of the second preferred embodiment of an axial heat-dissipating device according to the present invention; [0018]
  • FIG. 7 is a sectional view to illustrate the third preferred embodiment of an axial heat-dissipating device according to the present invention in part; [0019]
  • FIG. 8 is an exploded sectional view of the third preferred embodiment in part, illustrating that a base member, a heat-guiding post and heat-dissipating fins are connected integrally; [0020]
  • FIG. 9 is a sectional view to illustrate the fourth preferred embodiment of an axial heat-dissipating device according to the present invention in part, showing integral connection among a base member, a heat-guiding post, and heat-dissipating fins; [0021]
  • FIG. 10 is a cross-sectional view to illustrate the fourth preferred embodiment in part; and [0022]
  • FIG. 11 is a sectional view to illustrate the fifth preferred embodiment of an axial heat-dissipating device according to the present invention in part, showing integral connection among a base member, a heat-guiding post, heat-dissipating fins, and a shell body.[0023]
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Before the present invention is described in greater detail, it should be noted that like elements are denoted by the same reference numerals throughout the disclosure. [0024]
  • Referring to FIGS. [0025] 2 to 5, the first preferred embodiment of an axial heat-dissipating device 2 according to the present invention is shown to be adapted for mounting on a heat-generating source 3 (see FIG. 5), which can be a central processing unit, an integrated circuit, or the like. In this embodiment, the heat-generating source 3 is a central processing unit. As shown, the axial heat-dissipating device 2 includes a heat-dissipating unit 4 and a fan unit 6. The heat-dissipating unit 4 includes a heat-transfer member 40 having a lower end adapted to be disposed on the heat-generating source 3, a plurality of angularly spaced apart heat-dissipating fins 400 provided on the heat-transfer member 40, and a hollow shell body 100 that is disposed to surround the heat-dissipating fins 400. The heat-transfer member 40 includes a base member 8 adapted to be disposed on the heat-generating source 3, and a heat-guiding post 91 that extends uprightly from the base member 8. In this embodiment, the base member 8 is circular, but may have any other suitable geometric shape. The base member 8 has a bottom surface 81 adapted to be disposed on the heat-generating source 3, and an upwardly converging top surface 82. The top surface 82 is formed with at least one lower cavity 83 in a central portion thereof. In this embodiment, four lower cavities 83 are provided.
  • The heat-guiding post [0026] 91 is formed with an upper cavity 911 that is registered with the lower cavity 83 and that cooperates with the lower cavity 83 to form a heat-dissipating cavity 110. In this embodiment, four upper cavities 911 are provided to be respectively registered with the four lower cavities 83 so as to form four heat-dissipating cavities 110 (see FIG. 5), respectively.
  • The heat-dissipating fins [0027] 400 extend from the heat-guiding post 91 in radial outward directions. Each adjacent pair of the heat-dissipating fins 400 define a channel 400′ therebetween. Each of the heat-dissipating fins 400 has a curved lower edge 401 that complements and that is in contact with the converging top surface 82 of the base member 8.
  • The shell body [0028] 100 has a lower end portion formed with a bottom opening 101 and a plurality of radial air inlets 103 that are in fluid communication with the channels 400′ so as to permit flow of ambient air into the shell body 100 and through the channels 400′, and a top end portion formed with a top opening 102 and a plurality of radial retaining holes 104. The air inlets 103 are also adapted to receive fasteners (not shown) for positioning the axial heat-dissipating device 2.
  • The fan unit [0029] 6 is mounted removably on the top end portion of the shell body 100 and is operable so as to draw hot air out of the shell body 100 through the top opening 102. The fan unit 6 includes an annular frame 62, an impeller member 61 connected to the annular frame 62, and a plurality of snap fasteners 63 extending downwardly from a bottom end of the annular frame 62 so as to engage the retaining holes 104, thereby positioning the fan unit 6 on the shell body 100. Preferably, the fan unit 6 is an exhaust fan.
  • The heat-dissipating unit [0030] 4 further includes a thermal conductor 5 received in the heat-dissipating cavity 110. The thermal conductor 5 may be one of a heat-conducting rod and a heat-conducting pipe. In this embodiment, four thermal conductors 5 are received respectively in the four heat-dissipating cavities 110, and each of the thermal conductors 5 preferably has an outer surface coated with a heat-conducting paste 7. It is noted that a superconducting heat-conducting rod can achieve quick conduction of heat from the heat-generating source 3.
  • Alternatively, each of the heat-dissipating cavities [0031] 110 may be filled with a thermally conductive material or may have an inner wall surface coated with a thermally conductive material. In another alternative, the heat-dissipating cavities 110 are vacuumed to form sealed vacuum chambers which are filled with a thermally conductive material, such as water, methanol, acetone, ammonia, nitrogen, sodium, lithium, or mixtures thereof, or with a superconductor material. It is noted that the term “filled” as used herein can be construed to mean “completely filled” or “partially filled.”
  • It is further noted that each of the heat-dissipating fins [0032] 400 is preferably coated with a thermally conductive material 10.
  • In use, when the working temperature of the heat-generating source [0033] 3 rises, the heat-dissipating cavities 110 having the thermal conductors 5 or the thermally conductive material therein transfer the heat quickly from the heat-generating source 3 upwardly and across the heat-dissipating fins 400 that provide an extensive heat-dissipating area. In addition, the fan unit 6 draws relatively cold ambient air through the air inlets 103 into the shell body 100. Due to the configuration of the upwardly converging top surface 82 of the base member 8, the air is drawn quickly upward through the channels 400′ to carry away the air around the heat-dissipating unit 4. The hot air is then discharged to the ambient through the fan unit 6. Thus, the preferred embodiment provides an excellent heat-dissipating effect. It is noted that the heat-dissipating fins 400 can be configured to be spiral in shape for faster air currents.
  • With reference to FIG. 6, the second preferred embodiment of an axial heat-dissipating device [0034] 2 according to the present invention further comprises a thermoelectric generator 120 mounted on a top end of the heat-transfer member 40, and a heat-dissipating fin member 130 mounted on the top end of the heat-transfer member 40. Furthermore, the top end portion of the shell body 100 confines a recess 100′. The heat-dissipating fin member 130 includes a plurality of radial fins that define channels 400″, and is disposed in the recess 100′ such that the channels 400″ are in fluid communication with the channels 400′ and such that the shell body 100 surrounds the heat-dissipating fins 400 and the heat-dissipating fin member 130. The fan unit 6 is mounted on top of the heat-dissipating fin member 130. The thermoelectric generator 120 in this embodiment is a thermocouple that has a hot side 121 in contact with an upper end of the heat-guiding post 91 and a cold side in contact with a bottom central portion 132 of the heat-dissipating fin member 130. A heat-conducting paste can be disposed between the hot side 121 and the upper end of the heat-guiding post 91 and between the cold side 122 and the bottom central portion 132. In addition, the thermoelectric generator 120 is coupled electrically to the fan unit 6 by an electric cable 140 for supplying electric power thereto. When heat is conducted from the heat-generating source 3 through the heat-guiding post 91, a temperature difference is created between the hot and cold sides 121, 122 of the thermoelectric generator 120, thereby resulting in production of an electric current (direct current). When the temperature difference exceeds 50 degrees Celsius, the electric current thus produced is sufficient to actuate the fan unit 6 to draw ambient air into the shell body 100 through the air inlets 103 and out of the shell body 100 so as to help carry away the heat around the heat-dissipating unit 4. Two or more thermoelectric generators 120 can be connected in series to increase the output current, if desired. As such, the thermoelectric generator 120 not only provides a power source to help dissipate heat, it can also reduce power consumption of the electronic system, such as a computer system, incorporating the second preferred embodiment of this invention.
  • With reference to FIGS. 7 and 8, the third preferred embodiment of an axial heat-dissipating device according to the present invention is shown to be substantially similar to the first preferred embodiment. The major differences therebetween reside in that the base member [0035] 8′, the heat-guiding post 91′ and the heat-dissipating fins 400 are connected integrally such that the heat-dissipating cavity 110′ that is constituted by the upper cavity 911′ of the heat-guiding post 91′ and the lower cavity 83′ of the base member 8′ extends continuously through the heat-guiding post 91′ and the base member 8′. The heat-dissipating cavity 110′ preferably has an inner wall surface coated with a thermally conductive material 10.
  • With reference to FIGS. 9 and 10, the fourth preferred embodiment of an axial heat-dissipating device according to the present invention is shown to be substantially similar to the third preferred embodiment. The difference therebetween resides mainly in that each of the heat-dissipating fins [0036] 400 confines a receiving space 402 that is communicated with the upper cavity 911′ and the lower cavity 83′ so as to cooperatively constitute the heat-dissipating cavity 110′. As in the previous embodiments, the heat-dissipating cavity 110′ preferably has an inner wall surface coated with a thermally conductive material 10.
  • With reference to FIG. 11, the fifth preferred embodiment of an axial heat-dissipating device according to the present invention is shown to be substantially similar to the fourth preferred embodiment. The difference therebetween resides mainly in that the base member [0037] 8′, the heat-guiding post 91′, the heat-dissipating fins 400, and the shell body 100 are connected integrally. As in the previous embodiments, the heat-dissipating cavity 110′ is preferably filled with a thermally conductive material 10.
  • In view of the foregoing, it is apparent that the present invention is capable of overcoming the aforesaid drawbacks associated with the prior art, and can provide an enhanced heat-dissipating effect. [0038]
  • While the present invention has been described in connection with what is considered the most practical and preferred embodiments, it is understood that this invention is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements. [0039]

Claims (21)

    I claim:
  1. 1. An axial heat-dissipating device comprising:
    a heat-dissipating unit including an upright heat-transfer member having a lower end adapted to be disposed on a heat-generating source, a plurality of angularly spaced apart heat-dissipating fins provided on said heat-transfer member, and a hollow shell body that is disposed to surround said heat-dissipating fins, said shell body having a top end portion and a lower end portion which is formed with at least one radial air inlet that permits flow of air into said shell body; and
    a fan unit mounted on said top end portion of said shell body and operable so as to draw hot air out of said shell body.
  2. 2. The axial heat-dissipating device as claimed in claim 1, wherein said heat-transfer member includes a base member adapted to be disposed on the heat-generating source, and a heat-guiding post that extends uprightly from said base member.
  3. 3. The axial heat-dissipating device as claimed in claim 2, wherein said heat-dissipating fins radiate from said heat-guiding post in radial outward directions.
  4. 4. The axial heat-dissipating device as claimed in claim 2, wherein said base member and said heat-guiding post cooperate to form a heat-dissipating cavity.
  5. 5. The axial heat-dissipating device as claimed in claim 4, wherein said base member has a top side formed with a lower cavity, and said heat-guiding post is formed with an upper cavity that is registered with said lower cavity, said upper and lower cavities cooperatively constituting said heat-dissipating cavity.
  6. 6. The axial heat-dissipating device as claimed in claim 4, wherein said heat-dissipating unit further includes a thermal conductor received in said heat-dissipating cavity.
  7. 7. The axial heat-dissipating device as claimed in claim 6, wherein said thermal conductor is a heat-conducting rod.
  8. 8. The axial heat-dissipating device as claimed in claim 6, wherein said thermal conductor is a heat-conducting pipe.
  9. 9. The axial heat-dissipating device as claimed in claim 6, wherein said thermal conductor has an outer wall surface coated with a heat-conducting paste.
  10. 10. The axial heat-dissipating device as claimed in claim 4, wherein said heat-dissipating cavity is filled with a thermally conductive material.
  11. 11. The axial heat-dissipating device as claimed in claim 4, wherein said heat-dissipating cavity has an inner wall surface coated with a thermally conductive material.
  12. 12. The axial heat-dissipating device as claimed in claim 4, wherein said heat-dissipating cavity is a sealed vacuum chamber.
  13. 13. The axial heat-dissipating device as claimed in claim 12, wherein said heat-dissipating cavity is filled with a thermally conductive material.
  14. 14. The axial heat-dissipating device as claimed in claim 2, wherein said base member, said heat-guiding post, said heat-dissipating fins, and said shell body are connected integrally.
  15. 15. The axial heat-dissipating device as claimed in claim 2, wherein said base member, said heat-guiding post and said heat-dissipating fins are connected integrally.
  16. 16. The axial heat-dissipating device as claimed in claim 2, wherein said base member and said heat-guiding post are connected integrally.
  17. 17. The axial heat-dissipating device as claimed in claim 3, wherein said heat-guiding post and said heat-dissipating fins are connected integrally.
  18. 18. The axial heat-dissipating device as claimed in claim 2, wherein said base member has an upwardly converging top surface, each of said heat-dissipating fins having a lower edge that complements and that is in contact with said top surface of said base member.
  19. 19. The axial heat-dissipating device as claimed in claim 1, further comprising a thermoelectric generator mounted on a top end of said heat-transfer member and coupled electrically to said fan unit for supplying electric power thereto.
  20. 20. The axial heat-dissipating device as claimed in claim 1, wherein said fan unit is an exhaust fan.
  21. 21. The axial heat-dissipating device as claimed in claim 1, wherein each of said heat-dissipating fins is coated with a thermally conductive material.
US10395933 2002-11-08 2003-03-24 Axial heat-dissipating device Abandoned US20040108104A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW91132959 2002-11-08
TW091132959 2002-11-08

Publications (1)

Publication Number Publication Date
US20040108104A1 true true US20040108104A1 (en) 2004-06-10

Family

ID=32466567

Family Applications (1)

Application Number Title Priority Date Filing Date
US10395933 Abandoned US20040108104A1 (en) 2002-11-08 2003-03-24 Axial heat-dissipating device

Country Status (1)

Country Link
US (1) US20040108104A1 (en)

Cited By (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050178527A1 (en) * 2004-02-12 2005-08-18 Yaxiong Wang Heat dissipation device for electronic device
US20050269060A1 (en) * 2004-03-06 2005-12-08 Hon Hai Precision Industry Co., Ltd. Heat dissipation device assembly with fan cover
US20060082972A1 (en) * 2004-10-20 2006-04-20 Kyoung-Ho Kim Heat radiating apparatus
US20060196636A1 (en) * 2005-03-02 2006-09-07 Wen-Hao Liu Cooling mechanism
US20060213642A1 (en) * 2005-03-25 2006-09-28 Tai-Sol Electroncs Co., Ltd. Method of combining heat sink and heat conductor and combination assembly of the same
US20070079954A1 (en) * 2005-10-11 2007-04-12 Chin-Wen Wang Heat-Dissipating Model
US20070103869A1 (en) * 2005-11-08 2007-05-10 Foxconn Technology Co., Ltd. Integrated liquid cooling system
US20070159798A1 (en) * 2006-01-09 2007-07-12 Chun-Chi Chen Heat dissipation device having phase-changeable medium therein
US20070251674A1 (en) * 2006-04-27 2007-11-01 Bhatti Mohinder S Capillary-assisted compact thermosiphon
US20070279862A1 (en) * 2006-06-06 2007-12-06 Jia-Hao Li Heat-Dissipating Structure For Lamp
US20070297139A1 (en) * 2006-06-22 2007-12-27 Scott Brian A Heat sink with themoelectric module
US20080078527A1 (en) * 2006-09-29 2008-04-03 Steven John Lofland Fan attachment method and apparatus for fan component assemblies
US20080110599A1 (en) * 2006-11-15 2008-05-15 Ilya Reyzin Orientation insensitive multi chamber thermosiphon
US20080173432A1 (en) * 2006-03-31 2008-07-24 Geoffrey Wen-Tai Shuy Heat Exchange Enhancement
US20090084530A1 (en) * 2006-03-31 2009-04-02 Geoffrey Wen-Tai Shuy Heat Exchange Enhancement
US20090129102A1 (en) * 2007-11-21 2009-05-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp with a heat sink
US20090135562A1 (en) * 2007-11-28 2009-05-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20090255658A1 (en) * 2008-04-10 2009-10-15 Asia Vital Components Co., Ltd. Heat dissipation module
US20100051232A1 (en) * 2008-08-27 2010-03-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus incorporating a fan
US20100116466A1 (en) * 2008-11-07 2010-05-13 Jerzy Hawranek Axial Heat Exchanger for Regulating the Temperature and Air Comfort in an Indoor Space
US20110103006A1 (en) * 2009-11-05 2011-05-05 Alcatel-Lucent Usa Inc. Infrared energy powered cooling apparatus and computer chassis comprising same
US20110122579A1 (en) * 2008-07-25 2011-05-26 Koninklijke Phiips Electronics N.V. Cooling device for cooling a semiconductor die
US20120080176A1 (en) * 2010-09-30 2012-04-05 Zhongshan Weiqiang Technology Co., Ltd High-power finned heat dissipation module
US20120113641A1 (en) * 2010-11-10 2012-05-10 Bridgelux, Inc. Light modules connectable using heat pipes
US20120168602A1 (en) * 2010-12-31 2012-07-05 Hon Hai Precision Industry Co., Ltd. Mounting apparatus for fans
US20130170231A1 (en) * 2012-01-03 2013-07-04 Davinci Industrial Inc. Spherical light bulb and heat dissipating device thereof
US20130250516A1 (en) * 2012-03-20 2013-09-26 Hamilton Sundstrand Corporation Air cooled motor controllers
US20140103947A1 (en) * 2012-04-05 2014-04-17 Huy N. PHAN Thermal reliability testing systems with thermal cycling and multidimensional heat transfer
US20140137570A1 (en) * 2012-11-19 2014-05-22 Perpetua Power Source Technologies, Inc. Variable thermal resistance mounting system
US20140319239A1 (en) * 2013-02-22 2014-10-30 Nuventix, Inc. Thermal Management System Comprising A Heat Pipe, Heat Fins And A Synthetic Jet Ejector
US20170020030A1 (en) * 2015-07-16 2017-01-19 Compal Broadband Networks Inc. Electronic Apparatus
US9850907B2 (en) * 2014-09-16 2017-12-26 Philips Lighting Holding B.V. Cooling fan

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5494098A (en) * 1994-06-17 1996-02-27 Wakefield Engineering, Inc. Fan driven heat sink
US5815921A (en) * 1994-01-26 1998-10-06 Sun Microsystems, Inc. Electronic package cooling system and heat sink with heat transfer assembly
US6085830A (en) * 1997-03-24 2000-07-11 Fujikura Ltd. Heat sink, and process and apparatus for manufacturing the same
US6143975A (en) * 1999-01-25 2000-11-07 Dell Usa, L.P. Thermoelectric regenerator
US6143977A (en) * 1992-08-06 2000-11-07 Pfu Limited Heat-generating element cooling device
US20020003690A1 (en) * 2000-07-06 2002-01-10 Bo-Yao Lin Heat sink capable of having a fan mounted aslant to the lateral side thereof
US20020006027A1 (en) * 2000-06-06 2002-01-17 Rodriguez Edward T. Thermal distribution system
US20020024797A1 (en) * 2000-08-29 2002-02-28 Chen Yun Long Heat dissipation device
US20020029868A1 (en) * 1997-02-24 2002-03-14 Fujitsu Limited Heat sink and information processor using heat sink
US20020075649A1 (en) * 2000-12-18 2002-06-20 Fargo Chou Structure of computer cpu heat dissipation module
US6411510B2 (en) * 2000-02-08 2002-06-25 Sanyo Denki Co., Ltd. Heat sink-equipped cooling apparatus
US20020080582A1 (en) * 2000-12-27 2002-06-27 Kai-Cheng Chang Heat pipe heat dissipating device
US20020121358A1 (en) * 2001-03-03 2002-09-05 Zalman Tech Co., Ltd. Heatsink and heatsink device using the heatsink
US20020126453A1 (en) * 2001-03-08 2002-09-12 Hiroshi Ubukata Apparatus for cooling an electronic component and electronic device comprising the apparatus
US20020186532A1 (en) * 2001-06-08 2002-12-12 Kentaro Tomioka Electronic apparatus having cooling unit for cooling heat-generating component
US6501652B2 (en) * 1997-02-24 2002-12-31 Fujitsu Limited Heat sink and information processor using it
US6515862B1 (en) * 2000-03-31 2003-02-04 Intel Corporation Heat sink assembly for an integrated circuit
US6538888B1 (en) * 2001-09-28 2003-03-25 Intel Corporation Radial base heatsink
US20030147213A1 (en) * 2002-02-04 2003-08-07 Acer Inc. Device for cooling CPU chip

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6143977A (en) * 1992-08-06 2000-11-07 Pfu Limited Heat-generating element cooling device
US5815921A (en) * 1994-01-26 1998-10-06 Sun Microsystems, Inc. Electronic package cooling system and heat sink with heat transfer assembly
US5494098A (en) * 1994-06-17 1996-02-27 Wakefield Engineering, Inc. Fan driven heat sink
US6501652B2 (en) * 1997-02-24 2002-12-31 Fujitsu Limited Heat sink and information processor using it
US20020029868A1 (en) * 1997-02-24 2002-03-14 Fujitsu Limited Heat sink and information processor using heat sink
US6085830A (en) * 1997-03-24 2000-07-11 Fujikura Ltd. Heat sink, and process and apparatus for manufacturing the same
US6143975A (en) * 1999-01-25 2000-11-07 Dell Usa, L.P. Thermoelectric regenerator
US6411510B2 (en) * 2000-02-08 2002-06-25 Sanyo Denki Co., Ltd. Heat sink-equipped cooling apparatus
US6515862B1 (en) * 2000-03-31 2003-02-04 Intel Corporation Heat sink assembly for an integrated circuit
US20020006027A1 (en) * 2000-06-06 2002-01-17 Rodriguez Edward T. Thermal distribution system
US20020003690A1 (en) * 2000-07-06 2002-01-10 Bo-Yao Lin Heat sink capable of having a fan mounted aslant to the lateral side thereof
US20020024797A1 (en) * 2000-08-29 2002-02-28 Chen Yun Long Heat dissipation device
US20020075649A1 (en) * 2000-12-18 2002-06-20 Fargo Chou Structure of computer cpu heat dissipation module
US20020080582A1 (en) * 2000-12-27 2002-06-27 Kai-Cheng Chang Heat pipe heat dissipating device
US20020121358A1 (en) * 2001-03-03 2002-09-05 Zalman Tech Co., Ltd. Heatsink and heatsink device using the heatsink
US20020126453A1 (en) * 2001-03-08 2002-09-12 Hiroshi Ubukata Apparatus for cooling an electronic component and electronic device comprising the apparatus
US20020186532A1 (en) * 2001-06-08 2002-12-12 Kentaro Tomioka Electronic apparatus having cooling unit for cooling heat-generating component
US6538888B1 (en) * 2001-09-28 2003-03-25 Intel Corporation Radial base heatsink
US20030063439A1 (en) * 2001-09-28 2003-04-03 Wen Wei Radial base heatsink
US20030147213A1 (en) * 2002-02-04 2003-08-07 Acer Inc. Device for cooling CPU chip

Cited By (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050178527A1 (en) * 2004-02-12 2005-08-18 Yaxiong Wang Heat dissipation device for electronic device
US7055577B2 (en) * 2004-02-12 2006-06-06 Hon Hai Precision Ind. Co., Ltd. Heat dissipation device for electronic device
US20050269060A1 (en) * 2004-03-06 2005-12-08 Hon Hai Precision Industry Co., Ltd. Heat dissipation device assembly with fan cover
US7055578B2 (en) * 2004-03-06 2006-06-06 Hon Hai Precision Industry Co., Ltd. Heat dissipation device assembly with fan cover
US20060082972A1 (en) * 2004-10-20 2006-04-20 Kyoung-Ho Kim Heat radiating apparatus
US7333336B2 (en) * 2004-10-20 2008-02-19 Lg Electronics Inc. Heat radiating apparatus
US7156157B2 (en) * 2005-03-02 2007-01-02 Asia Vital Component Co., Ltd. Cooling mechanism
US20060196636A1 (en) * 2005-03-02 2006-09-07 Wen-Hao Liu Cooling mechanism
US20060213642A1 (en) * 2005-03-25 2006-09-28 Tai-Sol Electroncs Co., Ltd. Method of combining heat sink and heat conductor and combination assembly of the same
US20070079954A1 (en) * 2005-10-11 2007-04-12 Chin-Wen Wang Heat-Dissipating Model
US7610947B2 (en) * 2005-10-11 2009-11-03 Pyroswift Holding Co., Limited Heat-dissipating model
US20070103869A1 (en) * 2005-11-08 2007-05-10 Foxconn Technology Co., Ltd. Integrated liquid cooling system
US7379301B2 (en) * 2005-11-08 2008-05-27 Foxconn Technology Co., Ltd. Integrated liquid cooling system
US7269013B2 (en) * 2006-01-09 2007-09-11 Fu Zhun Prexision Industry (Shan Zhen) Co., Ltd. Heat dissipation device having phase-changeable medium therein
US20070159798A1 (en) * 2006-01-09 2007-07-12 Chun-Chi Chen Heat dissipation device having phase-changeable medium therein
US7826214B2 (en) * 2006-03-31 2010-11-02 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Heat exchange enhancement
US20090084530A1 (en) * 2006-03-31 2009-04-02 Geoffrey Wen-Tai Shuy Heat Exchange Enhancement
US20080173432A1 (en) * 2006-03-31 2008-07-24 Geoffrey Wen-Tai Shuy Heat Exchange Enhancement
US7800898B2 (en) * 2006-03-31 2010-09-21 Hong Kong Applied Science And Technology Research Institute Co. Ltd. Heat exchange enhancement
US20070251674A1 (en) * 2006-04-27 2007-11-01 Bhatti Mohinder S Capillary-assisted compact thermosiphon
US7406999B2 (en) * 2006-04-27 2008-08-05 Delphi Technologies, Inc. Capillary-assisted compact thermosiphon
US20070279862A1 (en) * 2006-06-06 2007-12-06 Jia-Hao Li Heat-Dissipating Structure For Lamp
US7554808B2 (en) * 2006-06-22 2009-06-30 Intel Corporation Heat sink with thermoelectric module
US20070297139A1 (en) * 2006-06-22 2007-12-27 Scott Brian A Heat sink with themoelectric module
US20080078527A1 (en) * 2006-09-29 2008-04-03 Steven John Lofland Fan attachment method and apparatus for fan component assemblies
US20100242281A1 (en) * 2006-09-29 2010-09-30 Steven John Lofland Attachment method for fan component assemblies
US7789126B2 (en) * 2006-09-29 2010-09-07 Intel Corporation Fan attachment apparatus for fan component assemblies
US8225850B2 (en) 2006-09-29 2012-07-24 Intel Corporation Attachment method for fan component assemblies
US20080110599A1 (en) * 2006-11-15 2008-05-15 Ilya Reyzin Orientation insensitive multi chamber thermosiphon
US7475718B2 (en) * 2006-11-15 2009-01-13 Delphi Technologies, Inc. Orientation insensitive multi chamber thermosiphon
US7637635B2 (en) * 2007-11-21 2009-12-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED lamp with a heat sink
US20090129102A1 (en) * 2007-11-21 2009-05-21 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led lamp with a heat sink
US7729119B2 (en) * 2007-11-28 2010-06-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20090135562A1 (en) * 2007-11-28 2009-05-28 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US20090255658A1 (en) * 2008-04-10 2009-10-15 Asia Vital Components Co., Ltd. Heat dissipation module
US8559175B2 (en) * 2008-07-25 2013-10-15 Koninlijke Philips N.V. Cooling device for cooling a semiconductor die
US20110122579A1 (en) * 2008-07-25 2011-05-26 Koninklijke Phiips Electronics N.V. Cooling device for cooling a semiconductor die
US20100051232A1 (en) * 2008-08-27 2010-03-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation apparatus incorporating a fan
US20100116466A1 (en) * 2008-11-07 2010-05-13 Jerzy Hawranek Axial Heat Exchanger for Regulating the Temperature and Air Comfort in an Indoor Space
US8208252B2 (en) * 2009-11-05 2012-06-26 Alcatel-Lucent Usa Inc. Infrared energy powered cooling apparatus and computer chassis comprising same
US20110103006A1 (en) * 2009-11-05 2011-05-05 Alcatel-Lucent Usa Inc. Infrared energy powered cooling apparatus and computer chassis comprising same
US9255743B2 (en) * 2010-09-30 2016-02-09 Zhongshan Weiqiang Technology Co., Ltd. Finned heat dissipation module
US20120080176A1 (en) * 2010-09-30 2012-04-05 Zhongshan Weiqiang Technology Co., Ltd High-power finned heat dissipation module
US20120113641A1 (en) * 2010-11-10 2012-05-10 Bridgelux, Inc. Light modules connectable using heat pipes
US8405989B2 (en) * 2010-12-31 2013-03-26 Hon Hai Precision Industry Co., Ltd. Mounting apparatus for fans
US20120168602A1 (en) * 2010-12-31 2012-07-05 Hon Hai Precision Industry Co., Ltd. Mounting apparatus for fans
US20130170231A1 (en) * 2012-01-03 2013-07-04 Davinci Industrial Inc. Spherical light bulb and heat dissipating device thereof
US20130250516A1 (en) * 2012-03-20 2013-09-26 Hamilton Sundstrand Corporation Air cooled motor controllers
US9175694B2 (en) * 2012-03-20 2015-11-03 Hamilton Sundstrand Corporation Air cooled motor controllers
US20140103947A1 (en) * 2012-04-05 2014-04-17 Huy N. PHAN Thermal reliability testing systems with thermal cycling and multidimensional heat transfer
US9360514B2 (en) * 2012-04-05 2016-06-07 Board Of Regents, The University Of Texas System Thermal reliability testing systems with thermal cycling and multidimensional heat transfer
US20140137570A1 (en) * 2012-11-19 2014-05-22 Perpetua Power Source Technologies, Inc. Variable thermal resistance mounting system
US20140319239A1 (en) * 2013-02-22 2014-10-30 Nuventix, Inc. Thermal Management System Comprising A Heat Pipe, Heat Fins And A Synthetic Jet Ejector
US9850907B2 (en) * 2014-09-16 2017-12-26 Philips Lighting Holding B.V. Cooling fan
US20170020030A1 (en) * 2015-07-16 2017-01-19 Compal Broadband Networks Inc. Electronic Apparatus

Similar Documents

Publication Publication Date Title
US2984774A (en) Transistor heat sink assembly
US6351382B1 (en) Cooling method and device for notebook personal computer
US5535094A (en) Integrated circuit package with an integral heat sink and fan
US20110026264A1 (en) Electrically isolated heat sink for solid-state light
US6851467B1 (en) Heat sink assembly
US5975194A (en) Fan assisted heat sink device
US6256201B1 (en) Plate type heat pipe method of manufacturing same and cooling apparatus using plate type heat pipe
US6798659B2 (en) CPU cooling structure
US5288203A (en) Low profile fan body with heat transfer characteristics
US7079394B2 (en) Compact cooling device
US6487076B1 (en) Compact heat sink module
US6118658A (en) Heat sink fan for cooling an electronic apparatus
US5309983A (en) Low profile integrated heat sink and fan assembly
US20070261822A1 (en) Heat-Dissipating Device having Air-Guiding Structure
US6542359B2 (en) Apparatus and method for cooling a wearable computer
US5898568A (en) External heat dissipator accessory for a notebook computer
US7193849B2 (en) Heat dissipating device
US6205025B1 (en) Heat sink structure adapted for use in a computer
US6698499B1 (en) Cooling device and method
US6560104B2 (en) Portable computer and docking station cooling
US6196300B1 (en) Heat sink
US6542370B1 (en) Heat dissipating device for a CPU
US6774450B2 (en) Semiconductor device with thermoelectric heat dissipating element
US20060203451A1 (en) Heat dissipation apparatus with second degree curve shape heat pipe
US20050024830A1 (en) Liquid-cooled heat sink assembly