CN112714601A - Heat dissipation structure for intelligent terminal and intelligent terminal - Google Patents
Heat dissipation structure for intelligent terminal and intelligent terminal Download PDFInfo
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- CN112714601A CN112714601A CN202011620042.7A CN202011620042A CN112714601A CN 112714601 A CN112714601 A CN 112714601A CN 202011620042 A CN202011620042 A CN 202011620042A CN 112714601 A CN112714601 A CN 112714601A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 81
- 239000004065 semiconductor Substances 0.000 claims abstract description 56
- 238000005057 refrigeration Methods 0.000 claims abstract description 50
- 238000010438 heat treatment Methods 0.000 claims abstract description 40
- 238000005192 partition Methods 0.000 claims abstract description 38
- 238000001816 cooling Methods 0.000 claims description 8
- 230000005855 radiation Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 10
- 238000000034 method Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
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- 230000004044 response Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention provides a heat dissipation structure for an intelligent terminal and the intelligent terminal, wherein the heat dissipation structure comprises: a heat generating member; the heating part is in contact with the heat conducting part to conduct heat; the cold end of the semiconductor refrigeration module is in contact with the heat conducting piece for heat conduction; the first heat dissipation piece is in contact with the semiconductor refrigeration module for heat conduction; the fan assembly forms an air inlet end and an air outlet end which are positioned at two sides of the fan assembly when in work; the heating element, the semiconductor refrigeration module, the first heat radiating element and the fan assembly are arranged between the partition plate and the heat conducting element; the air inlet is formed in the partition plate or the support plate, the air outlet is formed in the partition plate or the support plate, and a heat dissipation path from the air inlet, the heating element, the first heat dissipation element or the semiconductor refrigeration module, the air inlet end of the fan assembly and the air outlet end of the fan assembly to the air outlet is formed. After the technical scheme is adopted, the heat dissipation effect can be improved, and the temperature inside the intelligent terminal is greatly reduced.
Description
Technical Field
The invention relates to the field of electronic equipment, in particular to a heat dissipation structure for an intelligent terminal and the intelligent terminal.
Background
In recent decades, the advent of large scale integrated circuits has driven the proliferation and development of the smart terminal industry. When the intelligent terminal runs a high-load game or other applications for a long time, the temperature of the intelligent terminal is higher and higher, the heat dissipation of a heating device (PU or a charging chip) is poor, the phenomenon of frequency reduction and blockage can occur, the game or other applications can not run smoothly, and even the intelligent terminal is halted, so that the use experience of a user is seriously influenced.
The existing intelligent terminal heat dissipation scheme is mainly realized through a heat pipe and a hot plate, or heat dissipation is performed by adding a fan inside the intelligent terminal. However, with the increase of the situations such as the upgrade of the intelligent terminal software, especially the game software, the increase of the screen refresh rate, the use of the 5G network, etc., the heat dissipation requirement of the intelligent terminal is higher and higher. For such higher heat dissipation requirements, stronger heat dissipation performance and finer heat dissipation management are required to meet the higher heat dissipation requirements.
Therefore, a novel heat dissipation structure for an intelligent terminal is needed, which can improve the heat dissipation effect.
Disclosure of Invention
In order to overcome the technical defects, the invention aims to provide a heat dissipation structure for an intelligent terminal and the intelligent terminal, which can improve the heat dissipation effect and greatly reduce the temperature inside the intelligent terminal.
The invention discloses a heat dissipation structure for an intelligent terminal, which comprises:
the heating piece is arranged in the intelligent terminal and generates heat;
the heat conducting piece is used for providing a heat conducting surface for supporting the heating piece, so that the heating piece is arranged on the heat conducting surface and is in contact with the heat conducting piece for heat conduction;
the semiconductor refrigeration module is arranged on the heat conducting surface, and the cold end of the semiconductor refrigeration module is in contact with the heat conducting piece for heat conduction;
the first heat dissipation piece is arranged on the hot end of the semiconductor refrigeration module and is in contact with the semiconductor refrigeration module for heat conduction;
the fan assembly is arranged on the heat conducting piece, and when the fan assembly works, an air inlet end and an air outlet end which are positioned at two sides of the fan assembly are formed;
the partition plate is arranged opposite to the heat conducting piece, and the heating piece, the semiconductor refrigeration module, the first heat radiating piece and the fan assembly are arranged between the partition plate and the heat conducting piece;
the supporting plate is arranged between the partition plate and the heat conducting piece to support the partition plate;
the partition board or the support board is provided with at least one air inlet, the partition board or the support board is provided with at least one air outlet, the air inlet is communicated with the heating element, the first radiating element or the semiconductor refrigeration module, and the air outlet is communicated with the air outlet end of the fan assembly so as to form a heat dissipation path from the air inlet, the heating element, the first radiating element or the semiconductor refrigeration module, the air inlet end of the fan assembly, the air outlet end of the fan assembly to the air outlet.
Preferably, the heat conducting member is disposed along a length direction of the partition plate such that the heat generating member, the semiconductor refrigeration module, the first heat dissipating member and the fan assembly are arranged in parallel on a heat conducting surface of the heat conducting member, wherein
The heating element, the semiconductor refrigeration module and the fan assembly are arranged along the direction from the starting point to the end point of the heat dissipation path.
Preferably, the heat dissipation structure further includes:
the second heat radiating piece is arranged on one side of the heating piece opposite to the heat conducting plate and is in contact with the heating piece for heat conduction;
the second heat dissipation member is disposed beside the air inlet so as to be located at a starting point of the heat dissipation path.
Preferably, the top surface of the second heat dissipation element is flush with the top surface of the hot side of the semiconductor refrigeration module and the top surface of the fan assembly, such that the portion of the heat dissipation path from the air inlet to the air inlet side of the fan assembly is substantially linear.
Preferably, the number of the air inlets is multiple, and the air inlets comprise at least one air inlet arranged on the partition plate and at least one air inlet arranged on the support plate, wherein the air inlets arranged on the partition plate are rectangular, and the air inlets arranged on the support plate are strip-shaped;
the air outlet is one and is arranged on the supporting plate, and the air outlet and the air inlet are positioned on two side edges of the supporting plate.
Preferably, the air inlet and the air outlet are trumpet-shaped;
the radial width of the air inlet is gradually reduced along the direction from the outer side to the inner side of the air inlet;
the radial width of the air outlet is gradually reduced along the direction from the inner side to the outer side of the air outlet.
The invention also discloses an intelligent terminal which comprises the heat dissipation structure.
Preferably, the intelligent terminal further comprises a power supply module electrically connected with the fan assembly and the semiconductor refrigeration module;
the power supply module comprises a power supply interface, receives electric energy after being connected with an external power supply, and supplies energy to the fan assembly and the semiconductor refrigeration module.
After the technical scheme is adopted, compared with the prior art, the method has the following beneficial effects:
1. through simulation and actual measurement of a model for simulating the environment of the whole intelligent terminal, the intelligent terminal can be refrigerated by about 10 ℃ under the conventional working state of the whole intelligent terminal (the temperature of the whole intelligent terminal is 42 ℃, and the ambient temperature is 25 ℃), and the temperature in the whole intelligent terminal can be effectively reduced;
2. the internal space of the intelligent terminal is fully utilized, and the thickness of the intelligent terminal is basically kept;
3. the original electric energy of the intelligent terminal is not utilized to support the work of the semiconductor refrigeration module and the fan assembly, and the cruising ability of the intelligent terminal is improved.
Drawings
FIG. 1 is a cross-sectional view of a heat dissipation structure in accordance with a preferred embodiment of the present invention;
fig. 2 is a cross-sectional view of a heat dissipation structure according to a preferred embodiment of the present invention.
Reference numerals:
1-heating element, 2-heat conducting element, 3-semiconductor refrigeration module, 4-first heat dissipation element, 5-fan assembly, 6-partition plate, 7-support plate, 8-air inlet, 9-air outlet, 10-second heat dissipation element and 11-intelligent terminal
Detailed Description
The advantages of the invention are further illustrated in the following description of specific embodiments in conjunction with the accompanying drawings.
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.
The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present disclosure. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
In the description of the present invention, unless otherwise specified and limited, it is to be noted that the terms "mounted," "connected," and "connected" are to be interpreted broadly, and may be, for example, a mechanical connection or an electrical connection, a communication between two elements, a direct connection, or an indirect connection via an intermediate medium, and specific meanings of the terms may be understood by those skilled in the art according to specific situations.
In the following description, suffixes such as "module", "component", or "unit" used to denote elements are used only for facilitating the explanation of the present invention, and have no specific meaning in themselves. Thus, "module" and "component" may be used in a mixture.
Referring to fig. 1 and fig. 2, a schematic structural diagram of a heat dissipation structure for an intelligent terminal 11 in a preferred embodiment of the present invention is shown, in which the heat dissipation structure is used for discharging heat generated inside the intelligent terminal 11, and specifically includes:
The heating element 1 is a device mainly used for processing information and generating instructions in the intelligent terminal 11, such as a CPU, a GPU and the like, and in the using process of the intelligent terminal 11, when large-scale game software is operated, a large amount of data is processed, and a fine picture is displayed, the device is in a high-speed working state, so that the device generates a large amount of heat, once the heat is accumulated in the intelligent terminal 11, the device is in a high-temperature state for a long time, so that the service life of the device is shortened, on the other hand, the overheated intelligent terminal 11 makes the user experience poor when holding the device, and therefore, the cooling requirement is always a hard requirement of the intelligent terminal 11.
A heat-conducting member 2
In order to discharge the heat generated by the heating element 1 as soon as possible, the heat dissipation structure further comprises a heat conduction element 2, wherein the heat conduction element 2 is provided with a heat conduction surface, the heat conduction surface faces the heating element 1 and is in contact heat conduction with the heating element 1, so that the heat generated by the heating element 1 is conducted to the heat conduction element 2 through contact. In order to improve the heat conduction efficiency between the heating member 1 and the heat conducting member 2, the heating member 1 and the heat conducting member 2 can be bonded by using a heat dissipation adhesive (such as heat conduction silicone grease).
After the heat is conducted to the heat conducting member 2, because the heat conducting member 2 has a certain heat absorption limit, if the heat of the heat conducting member 2 is not discharged in time, the heat absorption effect of the heat conducting member to the heat generating member 1 will be reduced. Therefore, in order to dissipate heat from the heat conducting member 2, the heat dissipating structure further includes a semiconductor refrigeration module 3 mounted on the heat conducting surface of the heat conducting member 2 and in contact with the heat conducting member 2 to conduct heat. The semiconductor cooling module 3, for example a TEC (thermoelectric semiconductor cooling device), has a cold side and a hot side, and in operation, the cold side will be cooled down extremely rapidly, so that for the heat conducting member 2 with a higher temperature, the heat thereon will be conducted to the semiconductor cooling module 3 rapidly and then to the hot side of the semiconductor cooling module 3. The semiconductor refrigeration module 3 is adopted for heat dissipation, and the heat dissipation effect and the heat dissipation time duration can be finely controlled by the working state and the working current of the semiconductor refrigeration module 3.
First heat dissipation element 4
With the above configuration, heat has been conducted from the heating element 1 to the hot end of the semiconductor cooling module 3. In turn, the first heat sink 4 is mounted on and in thermal contact with the hot end of the semiconductor refrigeration module 3, thereby conducting heat further to the first heat sink 4. The first heat dissipation member 4 may be a heat dissipation fin, and the heat dissipation effect is improved by arranging a plurality of heat dissipation fins.
-a fan assembly 5
After having first radiating element 4, the heat that conducts and go out will be around on first radiating element 4, if outside not in time discharging heat intelligent terminal 11, intelligent terminal 11 is inside still to be in high temperature environment, and is not good to the cooling effect of the piece 1 that generates heat. Therefore, heat radiation structure still includes fan assembly 5, and fan assembly 5 sets up on heat-conducting member 2, and fan assembly 5 work back will have air inlet end and air-out end, and it can be understood that the air inlet end is the one side that the air was drawn forth to the fan, and the air-out end is the one side of fan exhaust air. After the fan assembly 5 works, heat exhausted by the first heat dissipation member 4 is absorbed and exhausted from the air outlet end.
At heat-conducting piece 2, for example the opposite side of heat-conducting plate, be equipped with a baffle 6, generate heat a 1, semiconductor refrigeration module 3, first heat dissipation piece 4 and fan subassembly 5 and locate between baffle 6 and heat-conducting piece 2 for generate heat a 1, semiconductor refrigeration module 3, first heat dissipation piece 4 and fan subassembly 5 and separate with the inside other devices of intelligent terminal 11, generate heat the heat that a 1 produced will not influence other devices. The partition plate 6 is provided not to serve a heat conduction function, and thus the partition plate 6 is separated from the heat generating member 1, the semiconductor refrigeration module 3, the first heat sink 4, and the fan assembly 5 to form an air layer therebetween.
Between the partition plate 6 and the heat conducting plate, a support plate 7 is further provided to support the partition plate 6 on the heat conducting plate. The support board 7 may be formed by a holder inside the smart terminal 11 and may be integrally formed with the housing of the smart terminal 11.
At least one air inlet 8 and at least one air outlet 9 are respectively arranged on the partition board 6 or the support board 7, the air inlet 8 and the air outlet 9 are communicated with the air layer between the partition board 6 and the heating element 1, the semiconductor refrigeration module 3, the first heat dissipation element 4 and the fan component 5, after the fan component 5 works, the air outlet end discharges the sucked air out of the intelligent terminal 11 from the air outlet 9, therefore, other parts of the air layer are in a negative pressure state, the air outside the partition board 6 is sucked from the air inlet 8 by utilizing the negative pressure state, the air circulates from the air inlet 8, the heating element 1, the first heat dissipation element 4 or the semiconductor refrigeration module 3, the air inlet end of the fan component 5, the air outlet end of the fan component 5 to the air outlet 9, and forms a flow from the air inlet 8, the heating element 1, the first heat dissipation element 4 or the semiconductor refrigeration module 3, the air inlet end of the fan component 5, the, The heat dissipation path from the air outlet end of the fan assembly 5 to the air outlet 9 discharges the heat from the heat dissipation path to the intelligent terminal 11.
Through the configuration, the heat dissipation efficiency in the intelligent terminal 11 is greatly improved by utilizing the common heat dissipation of the first heat dissipation piece 4, the semiconductor refrigeration module 3 and the fan assembly 5.
In a preferred embodiment, the heat conducting member 2 is disposed along the length direction of the partition 6, and the length of the heat conducting member 2 can be the same as that of the partition 6, i.e. the length of the partition 6 is the same as that of the entire width of the intelligent terminal 11, so that the heat generating member 1, the semiconductor refrigeration module 3, the first heat dissipating member 4 and the fan assembly 5 are arranged in parallel on the heat conducting surface of the heat conducting member 2, and a manufacturer of the intelligent terminal 11 does not need to provide an additional space for placing the above-mentioned components. And the parallel arrangement mode and the arrangement of the heat conducting pieces 2 with large area improve the heat dissipation efficiency, accumulate the heat in the limited space, and can be discharged together during heat dissipation, thereby further enhancing the heat dissipation effect. And the heating element 1, the semiconductor refrigeration module 3 and the fan component 5 are arranged along the direction from the starting point to the end point of the heat dissipation path, the heat of the heating element 1 is completely discharged, and the situation that the heat is maintained in the intelligent terminal 11 cannot be caused.
Preferably or optionally, the heat dissipation structure further comprises: and the second heat radiating piece 10, the second heat radiating piece 10 is arranged on one side of the heating piece 1 relative to the heat conducting plate, and is in contact with the heating piece 1 for heat conduction. By the arrangement of the second heat sink 10, the heat of the heat generating member 1 can be further dispersed, and the pressure of the heat conducting member 2 can be reduced. And the second heat sink 10 is located beside the air inlet 8 to be located at the starting point of the heat dissipation path, i.e. when air is sucked into the air inlet 8, the heat on the second heat sink 10 is taken away at first, and when the second heat sink 10 is cooled, the heat of the heating element 1 can be further sucked. It is understood that the width of the second heat dissipation member 10 may be set as long as possible, and also be in the shape of heat dissipation fins, so as to improve the heat dissipation effect of the second heat dissipation member 10 itself.
Further, the top surface of the second heat sink 10 is flush with the top surface of the hot end of the semiconductor refrigeration module 3 and the top surface of the fan assembly 5, so that the air layer is configured to be entirely planar without having a bend or curve. In the planar configuration, the heat dissipation path from the air inlet 8 to the air inlet end of the fan assembly 5 is substantially linear, and the fan assembly 5 can suck air with only a small power rotation, so that the air flow rate can be increased and the energy consumption of the fan assembly 5 can be reduced compared to the case where the air layer has a bent portion.
Preferably or optionally, the number of the air inlets 8 is multiple, and includes at least one air inlet 8 formed in the partition plate 6 and at least one air inlet 8 formed in the support plate 7, for example, 2 air inlets 8 formed in the partition plate 6 and 1 air inlet 8 formed in the support plate 7, where the air inlets 8 formed in the partition plate 6 are rectangular and the air inlets 8 formed in the support plate 7 are strip-shaped, so as to satisfy the air inlet direction when the air inlet position and the air layer are in the relative position relationship. For example, the air direction entering from the air inlet 8 on the partition plate 6 is perpendicular to the air layer, the air inlet 8 on the partition plate 6 should be opened to a larger extent, and the air direction entering from the air inlet 8 on the support plate 7 is the same as the air layer, so the air inlet 8 on the support plate 7 can be opened to a smaller extent. On the other hand, the air outlet 9 is one and is arranged on the supporting plate 7, and the air outlet 9 and the air inlet 8 are positioned on two side edges of the supporting plate 7. The opening of the air outlet 9 is also small, so that the space in the intelligent terminal 11 is saved.
Furthermore, the air inlet 8 and the air outlet 9 are trumpet-shaped; the radial width of the air inlet 8 is gradually reduced along the direction from the outer side to the inner side of the air inlet 8; the radial width of the air outlet 9 gradually decreases along the direction from the inner side to the outer side of the air outlet 9. Through the above configuration, because the width is different for when the air gets into air intake 8 from the outside, its velocity of flow will increase, and when the air was discharged from air outlet 9, its velocity of flow will also increase, through increasing air velocity in order to improve the radiating effect.
With the above-described embodiment in any configuration, the heat dissipation structure may be applied to the smart terminal 11, and the heat dissipation structure may be enclosed in the housing of the smart terminal 11.
Because the semiconductor refrigeration module 3 and the fan assembly 5 have certain energy consumption when working, the intelligent terminal 11 further comprises a power supply module, which is different from a built-in battery or a drive module of the intelligent terminal 11, is a drive element specially used for the semiconductor refrigeration module 3 and the fan assembly 5, and is electrically connected with the fan assembly 5 and the semiconductor refrigeration module 3. The power supply module is provided with a power supply interface and can be externally connected with an external power supply, such as a charging head, to supply power to the fan assembly 5 and the semiconductor refrigeration module 3. During the use, utilize power module and intelligent terminal 11's control module electricity to be connected to it configures into, starts fan assembly 5 and semiconductor refrigeration module 3 and refrigerates when intelligent terminal 11 or the temperature that generates heat 1 reach the threshold value, and the mode of cooperation external power supply does not consume the electric energy of battery at fan assembly 5 and semiconductor refrigeration module 3 when work, can reduce the influence to the continuation of the journey of battery.
The smart terminal may be implemented in various forms. For example, the terminal described in the present invention may include an intelligent terminal such as a mobile phone, a smart phone, a notebook computer, a PDA (personal digital assistant), a PAD (tablet computer), a PMP (portable multimedia player), a navigation device, etc., and a fixed terminal such as a digital TV, a desktop computer, etc. In the following, it is assumed that the terminal is a smart terminal. However, it will be understood by those skilled in the art that the configuration according to the embodiment of the present invention can be applied to a fixed type terminal in addition to elements particularly used for moving purposes.
It should be noted that the embodiments of the present invention have been described in terms of preferred embodiments, and not by way of limitation, and that those skilled in the art can make modifications and variations of the embodiments described above without departing from the spirit of the invention.
Claims (8)
1. The utility model provides a heat radiation structure for intelligent terminal which characterized in that, heat radiation structure includes:
the heating piece is arranged in the intelligent terminal and generates heat;
the heat conducting piece is used for providing a heat conducting surface for supporting the heating piece, so that the heating piece is arranged on the heat conducting surface and is in contact with the heat conducting piece for heat conduction;
the semiconductor refrigeration module is arranged on the heat conduction surface, and the cold end of the semiconductor refrigeration module is in contact with the heat conduction piece for heat conduction;
the first heat dissipation piece is arranged on the hot end of the semiconductor refrigeration module and is in contact with the semiconductor refrigeration module for heat conduction; the fan assembly is arranged on the heat conducting piece, and when the fan assembly works, an air inlet end and an air outlet end which are positioned at two sides of the fan assembly are formed;
the partition plate is arranged opposite to the heat conducting piece, and the heating piece, the semiconductor refrigeration module, the first heat radiating piece and the fan assembly are arranged between the partition plate and the heat conducting piece;
the supporting plate is arranged between the partition plate and the heat conducting piece so as to support the partition plate;
the partition board or the supporting board is provided with at least one air inlet, the partition board or the supporting board is provided with at least one air outlet, the air inlet is communicated with the heating element, the first radiating element or the semiconductor refrigeration module, and the air outlet is communicated with the air outlet end of the fan assembly so as to form a heat dissipation path from the air inlet, the heating element, the first radiating element or the semiconductor refrigeration module, the air inlet end of the fan assembly, the air outlet end of the fan assembly to the air outlet.
2. The heat dissipating structure of claim 1,
the heat conducting piece is arranged along the length direction of the partition board, so that the heating piece, the semiconductor refrigeration module, the first heat radiating piece and the fan assembly are arranged on the heat conducting surface of the heat conducting piece in parallel, wherein the heat conducting piece is arranged on the heat conducting surface of the heat conducting piece in parallel
The heating element, the semiconductor refrigeration module and the fan assembly are arranged along the direction from the starting point to the end point of the heat dissipation path.
3. The heat dissipating structure of claim 1,
the heat dissipation structure further includes:
the second heat dissipation piece is arranged on one side of the heating piece, which is opposite to the heat conduction plate, and is in contact with the heating piece for heat conduction;
the second heat dissipation member is arranged beside the air inlet so as to be positioned at the starting point of the heat dissipation path.
4. The heat dissipating structure of claim 3,
the top surface of the second heat dissipation element is flush with the top surface of the hot end of the semiconductor refrigeration module and the top surface of the fan assembly, so that the portion of the heat dissipation path from the air inlet to the air inlet end of the fan assembly is basically linear.
5. The heat dissipating structure of claim 1,
the air inlets are multiple and comprise at least one air inlet formed in the partition plate and at least one air inlet formed in the supporting plate, wherein the air inlets formed in the partition plate are rectangular, and the air inlets formed in the supporting plate are strip-shaped;
the air outlet is one and is arranged on the supporting plate, and the air outlet and the air inlet are positioned on two side edges of the supporting plate.
6. The heat dissipating structure of claim 5,
the air inlet and the air outlet are trumpet-shaped;
the radial width of the air inlet is gradually reduced along the direction from the outer side to the inner side of the air inlet;
the radial width of the air outlet is gradually reduced along the direction from the inner side to the outer side of the air outlet.
7. An intelligent terminal, characterized in that it comprises a heat dissipation structure according to any one of claims 1 to 6.
8. The intelligent terminal according to claim 7, wherein the intelligent terminal further comprises a power supply module electrically connected to the fan assembly and the semiconductor cooling module;
the power supply module comprises a power supply interface, receives electric energy after being connected with an external power supply, and supplies energy to the fan assembly and the semiconductor refrigeration module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011620042.7A CN112714601B (en) | 2020-12-31 | 2020-12-31 | A heat radiation structure and intelligent terminal for intelligent terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011620042.7A CN112714601B (en) | 2020-12-31 | 2020-12-31 | A heat radiation structure and intelligent terminal for intelligent terminal |
Publications (2)
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| CN113873803A (en) * | 2021-09-18 | 2021-12-31 | 科陆国际技术有限公司 | Composite heat dissipation structure and electronic electric energy meter box |
| CN113939160A (en) * | 2021-10-25 | 2022-01-14 | 国网山东省电力公司东营市垦利区供电公司 | Heat dissipation and ventilation device for electric device |
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| CN112714601B (en) | 2024-01-02 |
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