CN110494013A - Electronic equipment - Google Patents
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- CN110494013A CN110494013A CN201910691534.6A CN201910691534A CN110494013A CN 110494013 A CN110494013 A CN 110494013A CN 201910691534 A CN201910691534 A CN 201910691534A CN 110494013 A CN110494013 A CN 110494013A
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- China
- Prior art keywords
- air
- heat
- fan
- radiating
- electronic equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
Abstract
The embodiment of the present application discloses a kind of electronic equipment.Electronic equipment includes: shell, is provided with accommodating cavity, is provided with air inlet and air outlet；Fan is set in the accommodating cavity；Functional unit is set in the accommodating cavity；Radiating subassembly is set in the accommodating cavity, for radiating for the functional unit；The fan can suck air from the air inlet, so that the air is blowed to the functional unit with first direction and is blowed to the radiating subassembly with second direction, and the air to exchange heat with the functional unit and the radiating subassembly is exported into the air outlet；The first direction and second direction difference.The heat on the surface of functional unit can directly be taken away by fan, significantly reduce the temperature on the surface of functional unit, to significantly reduce the temperature of electronic equipment by the electronic equipment of the embodiment of the present application.
Description
Technical field
The invention relates to a kind of electronic equipment.
Background technique
Electronic equipment is the equipment that people are commonly used, and electronic equipment generally comprises shell and the accommodating cavity for being set to shell
Interior functional unit and radiating subassembly；And passing through radiating subassembly is functional unit heat dissipation.However, the electronic equipment of the prior art is set
Meter it is more and more thinner, it is higher that the heat on the surface of functional unit can directly result in the electronic equipment temperature, influences user experience.
Summary of the invention
The embodiment of the present application provides a kind of electronic equipment to solve problems of the prior art.
The technical solution of the embodiment of the present application is achieved in that
The embodiment of the present application provides a kind of electronic equipment, and the electronic equipment includes:
Shell is provided with accommodating cavity, is provided with air inlet and air outlet；
Fan is set in the accommodating cavity；
Functional unit is set in the accommodating cavity；
Radiating subassembly is set in the accommodating cavity, for radiating for the functional unit；
The fan can suck air from the air inlet, and the air is made to blow to the functional group with first direction
Part and the radiating subassembly, and the sky that will be exchanged heat with the functional unit and the radiating subassembly are blowed to second direction
Conductance goes out the air outlet；The first direction and second direction difference.
In some optional implementations,
The blade of the fan is set to the periphery of the fan, and the inner wall of the accommodating cavity forms the fan of the fan
Frame；The fan can suck air from the air inlet, blow out the air to the periphery of the fan, and make the sky
Gas exports the air outlet along the inner wall of the accommodating cavity.
In some optional implementations,
The first space that the radiating subassembly is formed between the air outlet and the fan, the fan can be from
The air inlet sucks air, so that the air is blowed to the radiating subassembly with second direction, and will change with the radiating subassembly
The air that heat is crossed blows out the air outlet；
The functional unit is located at second space, and the fan can suck air from the air inlet, make the air
The functional unit is blowed to first direction, the air to exchange heat with the functional unit exports institute along the inner wall of the accommodating cavity
State air outlet；Wherein the second space and the first space are different.
In some optional implementations, the fan can suck air from the air inlet with third direction, make
The air is blown out with fourth direction to the periphery of the fan；First is formed between the fourth direction and the third direction
Angle；Wherein, first angle is 90 degree, and the third direction is the rotation axis direction of the fan.
In some optional implementations, the air inlet is set to the front of the shell and/or the back side of shell,
The air outlet is set to the side of the shell.
In some optional implementations,
The fan the air inlet projection on the whole form first area；The air inlet is located at the air inlet
The second area in face where mouthful；
The first area is overlapped with the second area；Or, first of the first area and the second area
Divide and is overlapped.
In some optional implementations, the air inlet includes:
First air inlet, is located at the positive first sub- second area, and the fan is formed in the positive projection
First sub- first area, the first sub- first area are overlapped with the first part of the described first sub- second area；
Second air inlet, the second sub- second area positioned at the back side；Projection of the fan at the back side is formed
Second sub- first area；The second sub- first area is overlapped with the described second sub- second area.
In some optional implementations, the electronic equipment further include:
The first component is set to the front of the shell；
The front of the shell is provided with opening, and the first component is arranged at the opening, it is described opening with it is described
Gap between the first component forms first air inlet.
In some optional implementations, the air outlet includes:
First air outlet, positioned at the side of the shell；
Second air outlet, positioned at the side of the shell；
The radiating subassembly includes:
First radiating piece, for radiating for the functional unit, between first air outlet and the fan；
Second radiating piece, for radiating for the functional unit, between second air outlet and the fan；
The air to exchange heat with first radiating piece can be blown out first air outlet by the fan；The fan
The air to exchange heat with second radiating piece can be blowed to second air outlet.
In some optional implementations, the functional unit includes: the first functor and the second functor；Described
One functor is different from the function of second functor；
The electronic equipment further include:
First heat-conducting plate is contacted with first functor, for absorbing the heat of first functor；
Second heat-conducting plate is contacted with second functor, for absorbing the heat of second functor；
First heat-conducting piece is contacted with first radiating piece and first heat-conducting plate respectively, for leading described first
The heat of hot plate is transferred to first radiating piece；
Second heat-conducting piece is contacted with second radiating piece and second heat-conducting plate respectively, for leading described second
The heat of hot plate is transferred to second radiating piece；
Third heat-conducting piece, respectively with first radiating piece, second radiating piece, first heat-conducting plate and described
Two heat-conducting plates contact, for the heat of first heat-conducting plate to be transferred to first radiating piece and second heat dissipation respectively
Part, for the heat of second heat-conducting plate to be transferred to first radiating piece and second radiating piece respectively.
In the embodiment of the present application, the fan sucks air from the air inlet, blows to the air with first direction
The functional unit and the radiating subassembly is blowed to second direction, and will be with the functional unit and the radiating subassembly
The air to exchange heat exports the air outlet；Since fan can make air directly blow to functional unit, that is, passing through fan energy
It is enough directly to take away the heat on the surface of functional unit, the temperature on the surface of functional unit is significantly reduced, thus effectively
Reduce the temperature of electronic equipment；Meanwhile radiating subassembly is also functional unit heat dissipation, namely can be by radiating subassembly
One step takes away the heat of the functional unit, greatly increases the radiating efficiency of electronic equipment, so as to set electronics
More frivolous, the raising user experience of standby design.
Detailed description of the invention
Fig. 1 is an optional structural schematic diagram of electronic equipment in the embodiment of the present application；
Fig. 2 is an optional structural schematic diagram of electronic equipment in the embodiment of the present application；
Fig. 3 is an optional structural schematic diagram of electronic equipment in the embodiment of the present application；
Fig. 4 is an optional structural schematic diagram of electronic equipment in the embodiment of the present application.
Appended drawing reference: 110, shell；111, accommodating cavity；112, the second air inlet；113, it is open；114, the first air outlet；
115, the second air outlet；116, positive；117, the first sub- second area；118, the back side；119, the second sub- second area；120, wind
Fan；131, the first functor；132, the second functor；141, the first radiating piece；142, the second radiating piece；151, first is thermally conductive
Part；152, the second heat-conducting piece；153, third heat-conducting piece；160, the first component；171, the first heat-conducting plate；172, the second heat-conducting plate.
Specific embodiment
Below in conjunction with drawings and the specific embodiments, the application is further elaborated.It should be appreciated that this place is retouched
The specific embodiment stated is only used to explain the application, is not used to limit the application.
In the embodiment of the present application record, it should be noted that unless otherwise indicated and limit, term " connection " should be done extensively
Reason and good sense solution, for example, it may be electrical connection, the connection being also possible to inside two elements can be directly connected, can also pass through
Intermediary is indirectly connected, and for the ordinary skill in the art, can understand above-mentioned term as the case may be
Concrete meaning.
It should be noted that term involved in the embodiment of the present application " first second third " be only be that difference is similar
Object, do not represent the particular sorted for object, it is possible to understand that ground, " Yi Er third " can be in the case where permission
Exchange specific sequence or precedence.It should be understood that the object that " first second third " is distinguished in the appropriate case can be mutual
Change so that embodiments herein described herein can the sequence other than those of illustrating or describing herein implement.
The electronic equipment recorded below in conjunction with Fig. 1 to Fig. 4 to the embodiment of the present application is described in detail.
The electronic equipment includes: shell 110, fan 120, functional unit and radiating subassembly.Shell 110 is provided with accommodating
Chamber 111, shell 110 are provided with air inlet and air outlet.Fan 120 is set in the accommodating cavity 111.Functional unit is set to
In the accommodating cavity 111.Radiating subassembly is set in the accommodating cavity 111, and radiating subassembly is used to radiate for the functional unit.
The fan 120 can suck air from the air inlet, and the fan 120 makes the air blow to the function with first direction
Component and the radiating subassembly can be blowed to second direction, the fan 120 simultaneously will be with the functional unit and the heat dissipation
The air that component exchanged heat exports the air outlet；The first direction and second direction difference.
In the embodiment of the present application, the structure of electronic equipment is not construed as limiting.For example, electronic equipment can be computer, it can also
Think game machine, can also be mobile phone.
In the embodiment of the present application, the structure of shell 110 is not construed as limiting.For example, shell 110 is the keyboard of laptop
The shell 110 at place.
Here, air inlet and air outlet are connected to accommodating cavity 111 respectively, and the shape and position of air inlet and air outlet are not made
It limits.
For example, the fan 120 can suck air from the air inlet with third direction, make the air with four directions
It is blown out to the periphery of the fan 120；The first angle is formed between the fourth direction and the third direction.
Here, the value of the first angle is not construed as limiting.As an example, first angle is 90 degree.That is, the third
Direction and the fourth direction are vertical.
Here, third direction is not construed as limiting.As an example, third direction is the rotation axis direction of the fan 120,
That is, air is entered from air inlet with the rotation axis direction of the fan 120.Certainly, air can also be with it from air inlet
He enters in direction.
In the embodiment of the present application, the structure of fan 120 is not construed as limiting.As long as fan 120 can be sucked from the air inlet
Air makes the air blow to the functional unit with first direction and blow to the radiating subassembly with second direction, and will
The air outlet is exported with the air that the functional unit and the radiating subassembly exchanged heat.Here, first direction and
Two directions are different, that is, fan 120 can blow air to two different directions.For example, the electronic equipment can also wrap
It includes: the first air-guiding aisle and the second air-guiding aisle.First air-guiding aisle is arranged along first direction, the first end of the first air-guiding aisle
Positioned at the wind outlet of the fan 120, the second end of the first air-guiding aisle is located at the functional unit；Second air-guiding aisle edge
Second direction setting, the first end of the second air-guiding aisle are located at the wind outlet of the fan 120, the second end of the second air-guiding aisle
At the radiating subassembly；The fan 120 can suck air from the air inlet, keep the air logical through the first wind-guiding
Road blows to the functional unit with first direction, and blows to the radiating subassembly through the second air-guiding aisle with second direction.
Here, the position of fan 120 is not construed as limiting.For example, fan 120 is located at the middle part of the accommodating cavity 111；
Here, the setting direction of fan 120 is not construed as limiting.For example, the rotation axis of fan 120 and the shell 110
Front 116 forms the second angle.Here, the front 116 of shell 110 refers to that electronic equipment is in running order, and user can be straight
Connect the surface seen.For example, the front 116 of shell 110 can be the surface where the keyboard of laptop.In another example shell
The front 116 of body 110 can be the surface where the display screen of laptop.Here, the value of the second angle is not construed as limiting.The
Two angles can be more than or equal to 45 degree and be less than or equal to 90 degree.As an example, the second angle is 90 degree, that is, fan 120
Rotation axis is vertical with the front 116 of the shell 110.
In the embodiment of the present application, the structure of functional unit is not construed as limiting, as long as functional unit can generate heat.
For example, functional unit may include: at least one of processor, memory, video card, sound card, resistance and capacitor.
Here, the position of functional unit is not construed as limiting.For example, the first space is formed between fan 120 and air outlet, it is described
Functional unit is located at the second space, and here, second space is different with first space, and the fan 120 can be from institute
Air inlet sucking air is stated, so that the air is blowed to the functional unit with first direction, exchanged heat with the functional unit
Air exports the air outlet along the inner wall of the accommodating cavity 111, to lengthen the time of contact of air and functional unit.
In the embodiment of the present application, the structure of radiating subassembly is not construed as limiting, as long as radiating subassembly can dissipate for functional unit
Heat.For example, radiating subassembly includes at least two cooling fins, abutting fins connection at least two cooling fins.
Here, the position of radiating subassembly is not construed as limiting.For example, the radiating subassembly is located at the air outlet.In another example
The first space that the radiating subassembly is formed between the air outlet and fan 120, the fan 120 can from it is described into
Air port sucks air, the air is made to blow to the radiating subassembly with second direction, and will exchange heat with the radiating subassembly
Air directly blows out the air outlet.
Here, the quantity of radiating piece is not construed as limiting in radiating subassembly.For example, radiating subassembly may include a radiating piece,
It also may include at least two radiating pieces.
Here, radiating subassembly is that the implementation of functional unit heat dissipation is not construed as limiting.
For example, electronic equipment can also include heat-conducting plate and heat-conducting piece.Heat-conducting plate is contacted with functional unit, and heat-conducting plate is used for
The heat of absorption function component.Heat-conducting piece divides and does not contact with radiating subassembly and the heat-conducting plate, and heat-conducting piece by described for leading
The heat of hot plate is transferred to the radiating subassembly.
Here, the structure of heat-conducting plate and heat-conducting piece is not construed as limiting.For example, heat-conducting plate is copper sheet, heat-conducting piece is copper pipe.
In some optional implementations of the embodiment of the present application, the blade of the fan 120 is set to the fan
120 periphery, the inner wall of the accommodating cavity 111 form the fan frame of the fan 120；The fan 120 can be from the air inlet
Mouth sucking air, the fan 120 blow out the air to the periphery of the fan 120, and the fan 120 simultaneously makes the sky
Gas exports the air outlet along the inner wall of the accommodating cavity 111.
In this implementation, the fan 120 can make the air in 0 degree to 360 degree of range to the fan
120 periphery blowout；The fan 120 can be realized 360 degree of blowings, and the fan 120 can also be by its in accommodating cavity 111
The heat on the surface of his heater element is taken away, and the temperature on the surface of heater element is significantly reduced, to significantly reduce
The temperature of electronic equipment.Here, other heater elements refer to the fever except 111 remove function component of accommodating cavity and radiating subassembly
Element.
Above-mentioned that radiating subassembly and functional unit are described in this implementation, details are not described herein.
In some optional implementations of the embodiment of the present application, the air outlet is set to the side of the shell 110
Face；The air inlet can be set in the front 116 of the shell 110.The air inlet can be set in the shell 110
The back side 118；The air inlet can not only be set to the front 116 of the shell 110, but also be set to the back side of the shell 110
118, that is, there is air inlet in the front 116 and the back side 118 of shell 110.
In this implementation, the back side 118 of shell 110 refers to that electronic equipment is in running order, back to the table of user
Face.For example, the back side 118 of shell 110 is laptop and the surface for carrying face contact, here, loading end refers to support pen
Remember the face of this computer.In another example the back side 118 of shell 110 be laptop be in closed state, user it can be seen that outside
Sight face.
In this implementation, air outlet be can be set in a side of shell 110, also can be set in shell 110
At least two sides.
In this implementation, the position of the air inlet and fan 120 is not construed as limiting.For example, the fan 120 is in institute
State air inlet projection on the whole form first area；The second area in face where the air inlet is located at the air inlet；
The first area is overlapped with the second area；Or, the first area is overlapped with the first part of the second area.
Example one, as shown in figure 3, the air inlet includes: the first air inlet.First air inlet is located at described positive 116
The first sub- second area 117, the fan 120 positive 116 projection formed the first sub- first area, described first
Sub- first area is overlapped with the first part of the described first sub- second area 117；That is, the first sub- first area is located at the first son
Within second area 117.
Here, the structure of the first air inlet is not construed as limiting.
For example, the first air inlet includes that can be set in multiple through-holes in the first sub- second area 117.
In another example as shown in figure 4, the electronic equipment can also include: the first component 160.The first component 160 is set to
The front 116 of the shell 110；The front 116 of the shell 110 is provided with opening 113, and the first component 160 is set to
At the opening 113, the gap between the opening 113 and the first component 160 forms first air inlet.
Here, the structure of the first component 160 is not construed as limiting.For example, the first component 160 is input key.
Here, the quantity of the first component 160 is not construed as limiting.The first component 160 can be one, or at least two
It is a, as shown in Fig. 4.
Example two, as shown in Fig. 2, the air inlet may include: the second air inlet 112.Second air inlet 112 is located at institute
State the second sub- second area 119 at the back side 118；Projection of the fan 120 at the back side 118 forms the second sub firstth area
Domain；The second sub- first area is overlapped with the described second sub- second area 119.
Here, the structure of the second air inlet 112 is not construed as limiting.For example, as shown in Fig. 2, the second air inlet 112 includes can be with
The multiple through-holes being set in the second sub- second area 119.
Certainly, electronic equipment can include the first air inlet and the second air inlet 112 simultaneously.
In some optional implementations of the embodiment of the present application, the air outlet may include: the first air outlet 114
With the second air outlet 115.First air outlet 114 is located at the side of the shell 110；Second air outlet 115 is located at the shell
110 side；So that fan 120 exports the air to exchange heat from two air outlets.
In this implementation, the structure of the first air outlet 114 and the second air outlet 115 is not construed as limiting.For example, such as Fig. 1
With shown in Fig. 2, the first air outlet 114 and the second air outlet 115 include at least two apertures.
Here, the position of the first air outlet 114 and the second air outlet 115 is not construed as limiting.For example, 114 He of the first air outlet
Second air outlet 115 can be with the ipsilateral of position shell 110, as shown in Figure 2.In another example the first air outlet 114 and the second air outlet
115 can be located at the sides adjacent of shell 110, can also be located at the opposite side of shell 110.
In this implementation, the structure of radiating subassembly is not construed as limiting.For example, radiating subassembly includes: the first radiating piece 141
With the second radiating piece 142, the first radiating piece 141 and the second radiating piece 142 are used to as functional unit heat dissipation.First heat dissipation
The position of part 141 and the second radiating piece 142 is not construed as limiting.As an example, the first radiating piece 141 is located at first air outlet
Between 114 and the fan 120；Second radiating piece 142 is between second air outlet 115 and the fan 120；It is described
The air to exchange heat with first radiating piece 141 can be blown out first air outlet 114 by fan 120；The fan 120
The air to exchange heat with second radiating piece 142 can be blowed to second air outlet 115.
In this implementation, the structure of functional unit is not construed as limiting.
For example, the functional unit includes: the first functor 131 and the second functor 132；First functor 131
It is different from the function of second functor 132.As an example, first functor 131 is processor, second function
Energy part 132 is memory.As another example, first functor 131 is video card, and second functor 132 is sound card.
As another example, first functor 131 is resistance, and second functor 132 is capacitor.
Here, in the state that radiating subassembly includes the first radiating piece 141 and the second radiating piece 142.First radiating piece 141
It can radiate for the first functor 131；Or the second functor 132 heat dissipation；It can also both be dissipated for the first functor 131
Heat, and radiate for the second functor 132.Second radiating piece 142 can radiate for the first functor 131；It may be the second function
It can the heat dissipation of part 132；It can also not only radiate for the first functor 131, but also radiate for the second functor 132.
Example one, as shown in Figure 1, electronic equipment further include: the first heat-conducting plate 171, the second heat-conducting plate 172, first are thermally conductive
Part 151, the second heat-conducting piece 152 and third heat-conducting piece 153.First heat-conducting plate 171 is contacted with first functor 131, and first
Heat-conducting plate 171 is used to absorb the heat of first functor 131；Second heat-conducting plate 172 connects with second functor 132
Touching, the second heat-conducting plate 172 are used to absorb the heat of second functor 132；First heat-conducting piece 151 is dissipated with described first respectively
Warmware 141 and first heat-conducting plate 171 contact, the first heat-conducting piece 151 are used to shift the heat of first heat-conducting plate 171
To first radiating piece 141；Second heat-conducting piece 152 connects with second radiating piece 142 and second heat-conducting plate 172 respectively
Touching, the second heat-conducting piece 152 are used to the heat of second heat-conducting plate 172 being transferred to second radiating piece 142；Third is thermally conductive
Part 153 is led with first radiating piece 141, second radiating piece 142, first heat-conducting plate 171 and described second respectively
Hot plate 172 contacts, and third heat-conducting piece 153 is used to for the heat of first heat-conducting plate 171 being transferred to first heat dissipation respectively
Part 141 and second radiating piece 142, third heat-conducting piece 153 is for the heat of second heat-conducting plate 172 to be transferred to respectively
First radiating piece 141 and second radiating piece 142.
In example one, the structure of the first heat-conducting plate 171 and the second heat-conducting plate 172 is not construed as limiting.For example, the first heat-conducting plate
171 and second heat-conducting plate 172 be copper sheet.
In example one, the structure of the first heat-conducting piece 151, the second heat-conducting piece 152 and third heat-conducting piece 153 is not construed as limiting.
For example, the first heat-conducting piece 151, the second heat-conducting piece 152 and third heat-conducting piece 153 are copper pipe.
In example one, it is based on third heat-conducting piece 153, the first radiating piece 141 and second radiating piece 142 can either
It radiates for the first functor 131, and energy the second functor 132 much of that radiates, during electronic device works, the first function
It, can be simultaneously by the work of two radiating pieces, to make the when a calorific value in part 131 and the second functor 132 is more
One radiating piece 141 and second radiating piece 142 can equilibrium be the first functor 131 and the heat dissipation of the second functor 132, mention
The heat-sinking capability of high electronic equipment.
In the embodiment of the present application, the fan 120 sucks air from the air inlet, blows the air with first direction
The radiating subassembly is blowed to the functional unit and with second direction, and will be with the functional unit and the heat dissipation group
The air that part exchanged heat exports the air outlet；Since fan 120 can make air directly blow to functional unit, that is, passing through
Fan 120 can directly take away the heat on the surface of functional unit, significantly reduce the temperature on the surface of functional unit, from
And significantly reduce the temperature of electronic equipment；Meanwhile radiating subassembly is also the functional unit heat dissipation, namely passes through heat dissipation group
Part can further take away the heat of the functional unit, greatly increase the radiating efficiency of electronic equipment, so as to
Make the more frivolous of electronic device design, improves user experience.
The above, the only specific embodiment of the application, but the protection scope of the application is not limited thereto, it is any
Those familiar with the art within the technical scope of the present application, can easily think of the change or the replacement, and should all contain
Lid is within the scope of protection of this application.Therefore, the protection scope of the application should be based on the protection scope of the described claims.
Claims (10)
1. a kind of electronic equipment, the electronic equipment include:
Shell is provided with accommodating cavity, is provided with air inlet and air outlet；
Fan is set in the accommodating cavity；
Functional unit is set in the accommodating cavity；
Radiating subassembly is set in the accommodating cavity, for radiating for the functional unit；
The fan can from the air inlet suck air, make the air with first direction blow to the functional unit, with
And the radiating subassembly is blowed to second direction, and the air to exchange heat with the functional unit and the radiating subassembly is exported
The air outlet；The first direction and second direction difference.
2. electronic equipment according to claim 1,
The blade of the fan is set to the periphery of the fan, and the inner wall of the accommodating cavity forms the fan frame of the fan；Institute
Air can be sucked from the air inlet by stating fan, blow out the air to the periphery of the fan, and make the air edge
The inner wall of the accommodating cavity exports the air outlet.
3. electronic equipment according to claim 1,
The first space that the radiating subassembly is formed between the air outlet and the fan, the fan can be from described
Air inlet sucks air, so that the air is blowed to the radiating subassembly with second direction, and will exchange heat with the radiating subassembly
Air blow out the air outlet；
The functional unit is located at second space, and the fan can suck air from the air inlet, makes the air with the
One direction blows to the functional unit, and the air to exchange heat with the functional unit is described out along the inner wall export of the accommodating cavity
Air port；Wherein the second space and the first space are different.
4. electronic equipment according to claim 1, the fan can suck air from the air inlet with third direction,
Blow out the air to the periphery of the fan with fourth direction；Is formed between the fourth direction and the third direction
One angle；Wherein, first angle is 90 degree, and the third direction is the rotation axis direction of the fan.
5. electronic equipment according to claim 1, the air inlet is set to the front of the shell and/or the back of shell
Face, the air outlet are set to the side of the shell.
6. electronic equipment according to claim 5,
The fan the air inlet projection on the whole form first area；The air inlet is located at the air inlet institute
Second area in face；
The first area is overlapped with the second area；Or, the first part of the first area and second area weight
It closes.
7. electronic equipment according to claim 5, the air inlet include:
First air inlet, is located at the positive first sub- second area, and the fan forms first in the positive projection
Sub- first area, the first sub- first area are overlapped with the first part of the described first sub- second area；
Second air inlet, the second sub- second area positioned at the back side；Projection of the fan at the back side forms second
Sub- first area；The second sub- first area is overlapped with the described second sub- second area.
8. electronic equipment according to claim 7, the electronic equipment further include:
The first component is set to the front of the shell；
The front of the shell is provided with opening, and the first component is arranged at the opening, the opening and described first
Gap between component forms first air inlet.
9. electronic equipment according to any one of claims 1 to 8, the air outlet include:
First air outlet, positioned at the side of the shell；
Second air outlet, positioned at the side of the shell；
The radiating subassembly includes:
First radiating piece, for radiating for the functional unit, between first air outlet and the fan；
Second radiating piece, for radiating for the functional unit, between second air outlet and the fan；
The air to exchange heat with first radiating piece can be blown out first air outlet by the fan；The fan can
The air to exchange heat with second radiating piece is blowed into second air outlet.
10. electronic equipment according to claim 9, the functional unit includes: the first functor and the second functor；Institute
It is different from the function of second functor to state the first functor；
The electronic equipment further include:
First heat-conducting plate is contacted with first functor, for absorbing the heat of first functor；
Second heat-conducting plate is contacted with second functor, for absorbing the heat of second functor；
First heat-conducting piece is contacted with first radiating piece and first heat-conducting plate respectively, is used for first heat-conducting plate
Heat be transferred to first radiating piece；
Second heat-conducting piece is contacted with second radiating piece and second heat-conducting plate respectively, is used for second heat-conducting plate
Heat be transferred to second radiating piece；
Third heat-conducting piece is led with first radiating piece, second radiating piece, first heat-conducting plate and described second respectively
Hot plate contact, for the heat of first heat-conducting plate to be transferred to first radiating piece and second radiating piece respectively,
For the heat of second heat-conducting plate to be transferred to first radiating piece and second radiating piece respectively.
Priority Applications (1)
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| TWI711367B (en) * | 2019-11-28 | 2020-11-21 | 英業達股份有限公司 | Heat dissipation system |
| CN112714601A (en) * | 2020-12-31 | 2021-04-27 | 南昌黑鲨科技有限公司 | Heat dissipation structure for intelligent terminal and intelligent terminal |
| CN113672063A (en) * | 2021-07-28 | 2021-11-19 | 荣耀终端有限公司 | Electronic device |
| CN113939152A (en) * | 2021-09-30 | 2022-01-14 | 联想(北京)有限公司 | Water-cooling heat dissipation module and electronic equipment |
| CN113966159A (en) * | 2021-11-30 | 2022-01-21 | 联想(北京)有限公司 | Water-cooling heat dissipation module, electronic equipment and control method of electronic equipment |
| US11397453B2 (en) * | 2019-11-15 | 2022-07-26 | Inventec (Pudong) Technology Corporation | Heat dissipation system |
| CN115003100A (en) * | 2021-10-14 | 2022-09-02 | 荣耀终端有限公司 | Electronic device |
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| CN115003100A (en) * | 2021-10-14 | 2022-09-02 | 荣耀终端有限公司 | Electronic device |
| CN113966159A (en) * | 2021-11-30 | 2022-01-21 | 联想(北京)有限公司 | Water-cooling heat dissipation module, electronic equipment and control method of electronic equipment |
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Application publication date: 20191122 |
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