CN220491249U - All-in-one base and all-in-one with same - Google Patents
All-in-one base and all-in-one with same Download PDFInfo
- Publication number
- CN220491249U CN220491249U CN202322250124.2U CN202322250124U CN220491249U CN 220491249 U CN220491249 U CN 220491249U CN 202322250124 U CN202322250124 U CN 202322250124U CN 220491249 U CN220491249 U CN 220491249U
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- base body
- heat
- host card
- base
- air
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- 238000012545 processing Methods 0.000 claims abstract description 26
- 230000017525 heat dissipation Effects 0.000 claims description 33
- 239000007787 solid Substances 0.000 claims description 29
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 17
- 238000001816 cooling Methods 0.000 abstract description 11
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 230000005855 radiation Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The utility model provides an integrated machine base and an integrated machine with the same, belonging to the technical field of integrated machine computers, comprising: the base body and the fan arranged in the base body are internally provided with a display circuit board and a host card, a central processor is arranged on a main board of the host card, the base body is provided with an air inlet and an air outlet, and the display circuit board and the central processor are arranged in parallel relative to the air inlet; according to the utility model, the display circuit board and the central processing unit on the host card are arranged in parallel relative to the air inlet, when the fan is started to radiate heat from the display circuit board and the central processing unit, external cold air enters the base body from the air inlet and is changed into hot air after passing through the display circuit board and the host card, the hot air is discharged out of the base body from the air outlet through the fan, the cascade heating phenomenon does not exist during cooling, the radiating effect of each component is better, and the performance stability of the integrated machine can be kept after the integrated machine is applied.
Description
Technical Field
The utility model relates to the technical field of all-in-one computers, in particular to an all-in-one computer base and an all-in-one computer with the same.
Background
The computer all-in-one machine is a novel computer integrating a computer host and a display, has the advantages of simplicity and convenience of a notebook computer and stability and performance of a desktop computer, and is small in internal space due to the fact that all modules are integrated together, and a host card, a display PCB and other components in the computer all-in-one machine can only be sequentially installed in an air duct.
When radiating, cold wind enters into the all-in-one from the external side inside, cools down through host card, display PCB and other parts in proper order, and after cold wind every passes through a part, its temperature will rise, and is not good to the cooling effect of follow-up part, and then leads to the performance of all-in-one unstable.
Disclosure of Invention
Therefore, the utility model aims to overcome the defect of unstable performance of the integrated machine caused by poor sequential cooling effect of the host card and the display PCB in the modularized integrated machine in the prior art, thereby providing the integrated machine base and the integrated machine with the integrated machine base.
In order to solve the technical problems, the present utility model provides an integrated machine base, comprising: the base body is internally provided with a display circuit board and a host card, a central processing unit is arranged on a main board of the host card, the base body is provided with an air inlet and an air outlet, and the display circuit board and the central processing unit are arranged in parallel relative to the air inlet;
the fan is arranged in the base body, the fan sucks cold air into the base body from the air inlet, and discharges hot air out of the base body from the air outlet.
Optionally, the method further comprises: the heat dissipation module is arranged at the air outlet of the base body and comprises a heat conduction plate and heat dissipation fins connected with the heat conduction plate, the heat conduction plate extends towards the direction of the central processing unit of the host card, and the heat dissipation fins are arranged at the air outlet of the base body.
Optionally, the heat conducting plate is connected with the heat radiating fin through a heat pipe.
Optionally, the heat pipe is of a flat structure, one side of the heat pipe is abutted against the radiating fin, and the other side of the heat pipe is abutted against the heat conducting plate.
Optionally, the air inlet of the base body is formed in the bottom surface, and the air outlet is formed in the rear side surface.
Optionally, the fan is a centrifugal fan and has two inlets therethrough, wherein the first inlet faces the motherboard of the host card and the second inlet faces the air inlet of the base body.
Optionally, the host card is detachably connected in the base body through plugging, a connector is arranged at the insertion end of the host card, and the host card is plugged and connected with the display circuit board through the connector.
Optionally, a handle is disposed on a portion of the host card exposed from the base body.
Optionally, a solid state disk is installed on a motherboard of the host card, and a first heat conduction pad is arranged between the solid state disk and the motherboard.
Optionally, a heat dissipation plate is attached to one surface, far away from the main board, of the solid state disk, and a second heat conduction pad is arranged between the solid state disk and the heat dissipation plate.
An all-in-one machine, comprising: the all-in-one machine base of any one of the above schemes.
The technical scheme of the utility model has the following advantages:
1. according to the integrated machine base provided by the utility model, the display circuit board and the central processor on the host card are arranged in parallel relative to the air inlet, when the fan is started to radiate heat from the display circuit board and the central processor, external cold air enters the base body from the air inlet and is changed into hot air after passing through the display circuit board and the host card, and then the hot air is discharged out of the base body from the air outlet through the fan, so that the cascade heating phenomenon does not exist during cooling, the radiating effect of each component is better, and the stability of the integrated machine performance can be maintained after the integrated machine base is applied.
2. According to the integrated machine base provided by the utility model, the heat radiation module is arranged in the base body, the heat conduction plate of the heat radiation module extends to the central processing unit, so that heat conduction can be carried out on the central processing unit, and the heat radiation fins of the heat radiation module are arranged at the air outlet, so that heat of the central processing unit can be radiated through the air outlet, the central processing unit can be subjected to multiple cooling, and the optimal working temperature of the central processing unit is kept, so that the normal operation of the integrated machine is ensured.
3. According to the integrated machine base, the heat pipe is connected between the heat conducting plate and the radiating fins, so that the heat pipe has a good heat conducting function, and high temperature generated by the central processing unit can be quickly transmitted to the radiating fins to cool, and the radiating efficiency of the central processing unit is improved.
4. According to the integrated machine base, the radiating fins and the heat conducting plate are of the sheet-shaped structures, so that the heat pipes are correspondingly arranged to be of the flat structures, the contact area between the heat pipes and the radiating fins and the heat conducting plate is larger, the heat conducting effect is better, and the heat radiating effect of the heat radiating module is further enhanced.
5. According to the integrated machine base provided by the utility model, the air inlet of the base body is arranged on the bottom surface, the air outlet is not easy to see, the air outlet is arranged on the rear side surface, and the blown air is not easy to blow to people, so that the design is more reasonable from the angles of ergonomics and appearance aesthetics.
6. According to the integrated machine base provided by the utility model, the fan is selected as the centrifugal fan and provided with the two air inlets, and when the integrated machine base works, the two air inlets simultaneously suck air, so that the air flow rate in the base body can be accelerated, and the heat dissipation effect on the host card and the display circuit board is better.
7. According to the integrated machine base provided by the utility model, the host card can be independently developed and maintained after being detachably arranged in the base body, and when the components of the host system need to be updated, only the host card needs to be updated and replaced, and other components do not need to be replaced, so that the cost can be reduced.
8. According to the integrated machine base provided by the utility model, the host card can be driven to be separated from the base body by pulling the handle, the handle is convenient to hold and exert force, the host card is more convenient to detach and install, and the use comfort is improved.
9. According to the integrated machine base provided by the utility model, the heat generated by the solid state disk is transferred to the main board of the host card through the first heat conduction pad, and the solid state disk can be cooled when cold air blows through the main board, and the heat dissipation effect on the solid state disk is better due to the larger area of the main board.
10. According to the integrated machine base provided by the utility model, the heat generated by the solid state disk is transferred to the heat dissipation plate through the second heat conduction pad, the solid state disk can be cooled when cold air blows through the heat dissipation plate, the area of the heat dissipation plate is larger than that of the solid state disk, and the heat dissipation effect of the solid state disk can be further improved.
11. According to the integrated machine provided by the utility model, through the base in the scheme, the heat dissipation effect is good during working, so that the temperature of each part is kept in a normal range, the performance of the integrated machine in the use process is stable, the conditions of blocking, dead halt and the like are avoided, the host can be independently developed and maintained, and the use cost is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a front view of a base of an all-in-one machine provided in a first embodiment of the present utility model;
FIG. 2 is a schematic view of the bottom side of FIG. 1;
FIG. 3 is an internal schematic view of FIG. 1;
FIG. 4 is a schematic view of the hidden fan of FIG. 3;
FIG. 5 is a schematic view of the heat pipe and heat conductive plate of FIG. 4 after being hidden;
FIG. 6 is a schematic diagram of the solid state disk of FIG. 5;
fig. 7 is a front view of the integrated machine provided in the first embodiment of the present utility model.
Reference numerals illustrate:
1. a base body; 2. a display circuit board; 3. a host card; 4. a second thermal pad; 5. a central processing unit; 6. an air inlet; 7. an air outlet; 8. a fan; 9. a heat dissipation module; 10. a heat conductive plate; 11. a heat sink; 12. a heat pipe; 13. a connector; 14. a handle; 15. a solid state disk; 16. a first thermal pad; 17. and a heat dissipation plate.
Detailed Description
The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In addition, the technical features of the different embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.
As shown in fig. 1 to 5, a specific implementation manner of the integrated machine base provided in this embodiment includes: the base body 1 and the fan 8 installed in the base body 1, the display circuit board 2 and the host card 3 are installed in the base body 1, the display circuit board 2 is a display PCB, the main board of the host card 3 is provided with the central processing unit 5, the base body 1 is provided with the air inlet 6 and the air outlet 7, and the display circuit board 2 and the central processing unit 5 are arranged in parallel relative to the air inlet 6; the fan 8 sucks cold air into the base body 1 from the air inlet 6, and discharges hot air out of the base body 1 from the air outlet 7.
In this embodiment, the host is in a flat and thin rectangular structure, so that the host can support the upper display conveniently, and in addition, as an alternative embodiment, the host may take other shapes, such as a cake shape, etc., which is not limitative.
According to the integrated machine base provided by the embodiment, because the central processing unit 5 on the display circuit board 2 and the host card 3 is arranged in parallel relative to the air inlet 6, when the fan 8 is started to radiate heat from the display circuit board 2 and the central processing unit 5, external cold air enters the base body 1 from the air inlet 6 and becomes hot air after passing through the display circuit board 2 and the host card 3, then the hot air is discharged out of the base body 1 from the air outlet 7 through the fan 8, the phenomenon of cascade heating does not exist during cooling, the radiating effect of each component is better, and the stability of the integrated machine performance can be maintained after application.
As shown in fig. 2 to 4, in the integrated machine base provided in this embodiment, the integrated machine base further includes: the heat dissipation module 9 is arranged in the base body 1, the heat dissipation module 9 comprises a heat conduction plate 10 and heat dissipation fins 11 connected with the heat conduction plate 10, the heat conduction plate 10 extends towards the direction of the central processing unit 5 of the host card 3, and the heat dissipation fins 11 are arranged at the air outlet 7 of the base body 1. In this embodiment, the heat conducting plate 10 is close to the cpu 5, and the heat dissipating fins 11 are arranged side by side at the air outlet 7, and the heat dissipating fins 11 are plate-shaped or sheet-shaped structures made of aluminum alloy, brass or bronze. Through set up heat dissipation module 9 in base body 1, heat dissipation module 9 can further utilize cold wind, connects central processing unit 5 on the host card 3 through fin 11 and heat conduction board 10, makes central processing unit 5 can carry out multiple cooling, keeps the best operating temperature of central processing unit 5 to guarantee the normal operating of all-in-one. In addition, as an alternative embodiment, when the power consumption of the cpu 5 is small, the heat dissipation module 9 may be omitted and only the heat dissipation may be performed by air cooling.
As shown in fig. 4, in the integrated chassis provided in this embodiment, the heat pipe 12 is connected to the heat sink 11 through the heat pipe 12. The interior of the heat pipe 12 is hollow, and heat is transferred by evaporating a liquid inside the heat pipe 12, i.e., the heat pipe 12 commonly used in life. By connecting the heat pipe 12 between the heat conducting plate 10 and the heat radiating fin 11, the heat pipe 12 has good heat conducting function, and can rapidly transfer the high temperature generated by the central processing unit 5 to the heat radiating fin 11 for cooling, thereby improving the heat radiating efficiency of the central processing unit 5. In addition, as an alternative embodiment, if the distance between the cpu 5 and the heat sink 11 is short, the heat pipe 12 may be omitted and the heat conductive plate 10 may be directly connected to the heat sink 11.
As shown in fig. 4, in the integrated machine base provided in this embodiment, the heat pipe 12 has a flat structure, one side thereof is abutted against the heat sink 11, and the other side thereof is abutted against the heat conducting plate 10. Since the heat sink 11 and the heat conducting plate 10 are both in a sheet structure, the heat pipe 12 is correspondingly arranged in a flat structure, the contact area between the heat sink 11 and the heat conducting plate 10 is larger, the heat conducting effect is better, and the heat radiating effect of the heat radiating module 9 is further enhanced. In addition, as an alternative embodiment, the heat pipe 12 may have a cylindrical structure, one side of which is inserted into the heat sink 11, and the other side of which is inserted into the heat conductive plate 10.
As shown in fig. 2, in the integrated machine base provided in this embodiment, the air inlet 6 of the base body 1 is formed in the bottom surface, and the air outlet 7 is formed in the rear side surface. The air inlet 6 of the base body 1 is arranged on the bottom surface, the air outlet 7 is arranged on the rear side surface, blown air is not easy to blow to people, and the design is more reasonable from the angles of ergonomics and appearance aesthetics. In addition, as an alternative embodiment, the air inlet 6 may be opened at one side of the base body 1, and the air outlet 7 is opened at the other side of the base body 1.
As shown in fig. 3, in the integrated chassis provided in this embodiment, the fan 8 is a centrifugal fan 8 and has two through air inlets 6, wherein the first air inlet 6 faces the motherboard of the host card 3, and the second air inlet 6 faces the air inlet 6 of the chassis body 1. In the present embodiment, the centrifugal fan 8 has a rotating portion in the middle, and sucks air through the rotating portion in the middle, and then sends the air to the air outlet 7 through the surrounding air duct. Through selecting fan 8 as centrifugal fan 8 and having two air intakes 6, during operation, two air intakes 6 induced draft simultaneously, can make the air velocity of flow in the base body 1 accelerate, better to the radiating effect of host card 3 and display circuit board 2. In addition, as an alternative embodiment, the centrifugal fan 8 may also have only one air inlet 6, i.e. facing the main board of the host card 3.
As shown in fig. 4, in the integrated chassis provided in this embodiment, the host card 3 is detachably connected in the chassis body 1 by plugging, the insertion end of the host card 3 is provided with a connector 13, and the host card 3 is connected with the display circuit board 2 by the connector 13. In this embodiment, the two sides of the base body 1 are provided with sliding grooves, the two sides of the host card 3 are inserted into the sliding to realize the disassembly of the host card 3, the connector 13 is provided with an interface, the display circuit board 2 is also provided with an interface, and the connection between the host card 3 and the display circuit board 2 is realized through the plugging of the two interfaces. Through setting up host card 3 detachably in base body 1 back, can develop and maintain host card 3 alone, when host system part needs to update, only need upgrade and change host card 3, need not to change other parts, can reduce cost. In addition, as an alternative embodiment, the host card 3 may be detachably connected to the base body 1 in a clamping manner, a clamping groove is formed in the base body 1, a buckle matched with the clamping groove is formed on the host card 3, and the host card 3 is installed in the base body 1 through the buckle.
As shown in fig. 3, in the integrated chassis provided in this embodiment, a handle 14 is provided on a portion of the host card 3 exposed to the chassis body 1. In this embodiment, the handle 14 is a plate structure with a rectangular slot, and the host card 3 can be driven to move by inserting a hand into the rectangular slot. The host card 3 and the base body 1 can be driven to be separated by pulling the handle 14, the handle 14 is convenient to hold and exert force, the host card 3 is convenient to detach and the host card 3 is convenient to install, and the use comfort is improved. In addition, as an alternative embodiment, the handle 14 may also have a ring structure, and the host card 3 may be driven to move by inserting a hand into the hollow portion in the middle.
As shown in fig. 6, in the integrated chassis provided in this embodiment, a solid state disk 15 is mounted on a motherboard of a host card 3, and a first thermal pad 16 is disposed between the solid state disk 15 and the motherboard. The thermal pad is a high performance gap-fill thermal conductive material capable of achieving heat transfer. The heat that solid state disk 15 produced is transmitted to on the mainboard of host card 3 through first heat conduction pad 16, can cool down solid state disk 15 when cold wind blows through the mainboard, because the area of mainboard is bigger, so better to solid state disk 15's radiating effect. In addition, as an alternative embodiment, the heat-conducting pad may be replaced by other means, such as directly cooling the solid state disk 15 by water cooling.
As shown in fig. 6, in the integrated machine base provided in this embodiment, a heat dissipation plate 17 is attached to a surface of the solid state disk 15 away from the motherboard, and a second heat conduction pad 4 is disposed between the solid state disk 15 and the heat dissipation plate 17. The second thermal pad 4 is the same as the first thermal pad 16 in the above-described embodiment, and the heat dissipation plate 17 is the same as the heat dissipation plate 11 in the above-described embodiment. The heat that solid state disk 15 produced passes through second heat conduction pad 4 and transmits to heating panel 17, can cool down solid state disk 15 when cold wind blows through heating panel 17, and the area of heating panel 17 is greater than the area of solid state disk 15, can further improve the radiating effect of solid state disk 15. In addition, as an alternative embodiment, the heat dissipation plate 17 may be omitted, so that the heat conduction pipe 12 and the second heat conduction pad 4 are abutted together.
As shown in fig. 7, a specific implementation manner of the all-in-one machine provided in this embodiment includes the all-in-one machine base in any one of the above schemes.
The all-in-one that this embodiment provided through the base in the above-mentioned scheme, the radiating effect of during operation is better to keep the temperature of each part to be in normal range, the performance of all-in-one in the use is comparatively stable, can not appear the condition such as card stop, dead halt, and can develop and maintain the host computer alone, has reduced use cost.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present utility model.
Claims (11)
1. The utility model provides an all-in-one base which characterized in that includes:
the base body (1) is internally provided with a display circuit board (2) and a host card (3), a central processing unit (5) is arranged on a main board of the host card (3), the base body (1) is provided with an air inlet (6) and an air outlet (7), and the display circuit board (2) and the central processing unit (5) are arranged in parallel relative to the air inlet (6);
the fan (8) is arranged in the base body (1), the fan (8) sucks cold air from the air inlet (6) into the base body (1), and discharges hot air from the air outlet (7) out of the base body (1).
2. The all-in-one base of claim 1, further comprising: the heat dissipation module (9) is arranged in the base body (1), the heat dissipation module (9) comprises a heat conduction plate (10) and heat dissipation fins (11) connected with the heat conduction plate (10), the heat conduction plate (10) extends towards the direction of the central processing unit (5) of the host card (3), and the heat dissipation fins (11) are arranged at the air outlet (7) of the base body (1).
3. The integrated machine base according to claim 2, characterized in that the heat conducting plate (10) and the heat sink (11) are connected by a heat pipe (12).
4. A machine base according to claim 3, characterized in that said heat pipe (12) is of flat construction, one side bearing against said heat sink (11) and the other side bearing against said heat-conducting plate (10).
5. The all-in-one machine base according to any one of claims 1-4, wherein an air inlet (6) of the base body (1) is formed in the bottom surface, and an air outlet (7) is formed in the rear side surface.
6. The all-in-one base of claim 5, wherein the fan (8) is a centrifugal fan (8) and has two inlets therethrough, wherein a first inlet is directed towards the motherboard of the host card (3) and a second inlet is directed towards the air inlet (6) of the base body (1).
7. The all-in-one chassis according to any one of claims 1-4, wherein the host card (3) is detachably connected in the chassis body (1) by plugging, the insertion end of the host card (3) is provided with a connector (13), and the host card (3) is plugged with the display circuit board (2) by the connector (13).
8. The all-in-one machine base according to claim 7, wherein a handle (14) is provided on a portion of the host card (3) that exposes the base body (1).
9. The all-in-one machine base according to any one of claims 1-4, wherein a solid state disk (15) is mounted on a motherboard of the host card (3), and a first heat conduction pad (16) is arranged between the solid state disk (15) and the motherboard.
10. The integrated machine base according to claim 9, wherein a heat dissipation plate (17) is attached to a surface, away from the main board, of the solid state disk (15), and a second heat conduction pad (4) is arranged between the solid state disk (15) and the heat dissipation plate (17).
11. An all-in-one machine, characterized by comprising: the all-in-one machine base of any one of claims 1-10.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322250124.2U CN220491249U (en) | 2023-08-21 | 2023-08-21 | All-in-one base and all-in-one with same |
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CN202322250124.2U CN220491249U (en) | 2023-08-21 | 2023-08-21 | All-in-one base and all-in-one with same |
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CN220491249U true CN220491249U (en) | 2024-02-13 |
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CN202322250124.2U Active CN220491249U (en) | 2023-08-21 | 2023-08-21 | All-in-one base and all-in-one with same |
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- 2023-08-21 CN CN202322250124.2U patent/CN220491249U/en active Active
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