CN214278869U - Notebook computer cooling system - Google Patents
Notebook computer cooling system Download PDFInfo
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- CN214278869U CN214278869U CN202023181007.8U CN202023181007U CN214278869U CN 214278869 U CN214278869 U CN 214278869U CN 202023181007 U CN202023181007 U CN 202023181007U CN 214278869 U CN214278869 U CN 214278869U
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Abstract
The utility model discloses a notebook computer cooling system, including the outer pendant of notebook computer module and water-cooling. The notebook computer module is provided with a heat dissipation module which comprises a fan, a heat conduction copper plate, a heat pipe and a heat dissipation fin group, wherein a water-cooling heat dissipation pipe is acted on the chip and is provided with two opening end parts and is exposed out of the shell of the notebook computer; the water-cooling external hanging part is internally provided with a hollow cavity, a water-cooling assembly is arranged in the cavity and comprises a water-cooling fan, a water-guiding radiating pipe, a cold bar, a water tank and a water pump, the water-guiding radiating pipe is also provided with two opening end parts, and a rubber water nozzle is respectively arranged and is used for being communicated with the two opening end parts of the water-cooling radiating pipe to realize water circulation. When the notebook works, the heat can be dissipated through the built-in heat dissipation module of the notebook, and the heat can be dissipated through the water-cooling outer hanging piece, so that the effect of quickly cooling the chip is achieved.
Description
Technical Field
The utility model relates to a cooling system, especially a notebook computer cooling system.
Background
With the rapid development of science and technology, notebook computers have become an essential important tool in the work and life of people. At present, because the notebook computer is small in size, thin in thickness and poor in self heat dissipation effect, and the existing water-cooling external part is simple in structure and complex to assemble, the cold water pipe and other structures are exposed after the notebook computer is assembled, the appearance is poor, in order to enable the notebook computer to still keep good heat dissipation at high temperature, the water-cooling heat dissipation is used, the good appearance is kept, and the heat dissipation effect and the attractiveness of the computer are improved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a notebook computer cooling system aims at solving current notebook computer radiating efficiency and low and water-cooling plug-in existence equipment loaded down with trivial details, the not good enough scheduling problem of outward appearance.
The utility model provides a technical scheme as follows that its technical problem provides:
a notebook computer heat dissipation system comprises a notebook computer module and a water-cooling external hanging piece, and is characterized in that a water-cooling heat dissipation pipe is arranged in the notebook computer module and acts on a heat source, and the water-cooling heat dissipation pipe is provided with a water inlet and a water outlet which are exposed out of a shell of a notebook computer;
the water-cooling external hanging piece comprises a shell, the shell is provided with a hollow cavity, a water-cooling assembly is arranged in the hollow cavity, the water-cooling assembly comprises a water-cooling fan, a water-guiding radiating pipe and a cold bar, the water-guiding radiating pipe is provided with a water inlet end part and a water outlet end part, and the water inlet end part and the water outlet end part are exposed out of the shell;
the water outlet end and the water inlet end of the water guide radiating pipe are matched with the water inlet and the water outlet of the water cooling radiating pipe correspondingly, the cold row is combined with the water guide radiating pipe and forms a complete circulating water path with the water cooling radiating pipe correspondingly, and the water cooling fan is used for radiating the cold row.
Furthermore, a water pump and a water tank are arranged on a water path of the water guide radiating pipe.
Furthermore, the notebook computer module further comprises a heat dissipation module, wherein the heat dissipation module is provided with a fan and a heat dissipation fin group, the heat dissipation fin group is combined with the water-cooling heat dissipation pipe to realize heat transfer, the heat dissipation fin group is arranged in an air outlet area of the fan, and the fan dissipates heat to the heat dissipation fin group.
Furthermore, the notebook computer module is also provided with a heat pipe and a heat-conducting copper plate, at least part of the water-cooling radiating pipe is attached to the heat-conducting copper plate, and the heat-conducting copper plate and the heat source realize heat transfer.
Furthermore, the water-cooling radiating pipe and the heat pipe are arranged in parallel and are mutually contacted.
Furthermore, the heat-conducting copper plate is provided with an upper surface and a lower surface, the upper surface of the heat-conducting copper plate is fixedly attached to a heat source inside the computer, the heat absorption end of the heat pipe is attached to and fixed on the lower surface of the heat-conducting copper plate, and the heat release end of the heat pipe is combined on the heat-radiating fin group.
Furthermore, the notebook computer module is provided with two fans, two heat-conducting copper plates, two heat pipes and two radiating fin groups, wherein the two heat-conducting copper plates are arranged in a formation, the upper surfaces of the two heat-conducting copper plates are fixedly attached to a heat source inside the computer respectively, the heat absorption ends of the two heat pipes are in alignment setting and are not in contact with each other, the two heat pipes are attached to the lower surfaces of the two heat-conducting copper plates respectively, the heat release ends of the two heat pipes are far away from each other and are combined on the two radiating fin groups respectively, and the two radiating fin groups are fixed in the air outlet area of each fan respectively.
Furthermore, the water-cooling radiating pipe is provided with two opening end parts, the extending path of the water-cooling radiating pipe is in a rectangular ring shape, and the water-cooling radiating pipe is in a flat shape.
Further, the shell is provided with a shell and a bottom shell, an air inlet is formed in the upper surface of the shell, a water-cooling fan is arranged at the air inlet, the air inlet of the water-cooling fan faces the air inlet of the upper surface of the shell, the cold row is vertically fixed to one side of the water-cooling fan, the air outlet of the water-cooling fan faces the cold row, two through holes are further formed in the upper surface of the shell and used for containing the water inlet end portion and the water outlet end portion of the water guide radiating pipe, an air outlet is formed in the bottom shell, and the cold row is arranged at the air outlet.
Furthermore, two water-cooling connectors are formed in the bottom of the notebook computer shell and used for containing water outlets and water inlets of the water-cooling radiating pipes, and the water outlets and the water inlets of the water-cooling radiating pipes are connected with water inlet end portions and water outlet end portions of the water-guiding radiating pipes through two rubber water nozzles.
The beneficial effects of the utility model reside in that:
for users, the design is simple and attractive in mechanism, excellent in heat dissipation effect, free of water cooling structures such as exposed water pipes and convenient to use, and the water cooling heat dissipation can be realized simultaneously only by placing the computer on the outer hanging piece.
Drawings
The invention will be further explained with reference to the drawings and examples, in which:
fig. 1 is a schematic structural diagram of a notebook computer cooling system disclosed in the present application;
FIG. 2 is an exploded view of the heat dissipation system of the notebook computer shown in FIG. 1;
fig. 3 is a bottom view of the notebook computer module of the notebook computer heat dissipation system shown in fig. 1 with the bottom of the housing removed;
fig. 4 is an exploded view of a notebook computer module of the notebook computer cooling system shown in fig. 1;
FIG. 5 is an enlarged view of the structure within the dashed circle A in FIG. 4;
fig. 6 is a schematic structural view of the notebook computer cooling system shown in fig. 1, and an exploded view of a water-cooling external hanger is highlighted;
fig. 7 is a top view of the notebook computer cooling system shown in fig. 6 with the housing removed.
Description of reference numerals: 1-notebook computer module, 11-notebook computer shell, 111-water-cooling connecting port, 12-water-cooling radiating pipe, 121-water inlet, 122-water outlet, 13-radiating module, 14-fan, 15-heat-conducting copper plate, 16-heat pipe, 17-radiating fin group, 2-water-cooling external hanging piece, 21-shell, 211-central control cavity, 22-shell, 221-air inlet, 222-through hole, 23-bottom shell, 231-air outlet, 24-water-cooling component, 25-water-cooling fan, 26-water-guiding radiating pipe, 261-water inlet end, 262-water outlet end, 27-cold discharge, 28-water pump and 29-rubber water nozzle
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. It is to be understood that the specific embodiments described herein are merely illustrative of the present invention and are not to be construed as limiting the invention, and that structural, methodological, or functional changes to be made by those skilled in the art in light of the present description are within the scope of the invention.
In order to explain the technical solution of the present invention, the following description is made by using specific examples.
Referring to fig. 1 to 7, a heat dissipation system for a notebook computer according to a preferred embodiment of the present invention includes: the notebook computer module 1 and the water-cooling outer hanging piece 2.
Referring to fig. 1, a notebook computer module 1 is disposed on an inclined surface of a water-cooling outer hanger 2, and the water-cooling outer hanger 2 is horizontally disposed in a desktop.
Referring to fig. 2, the notebook computer module 1 has a heat dissipation module 13 and a fan 14. The heat dissipation module 13 includes a heat conduction copper plate 15, a heat pipe 16, and a heat dissipation fin set 17. The notebook computer module 1 further has a water-cooling heat pipe 12, and both open ends of the water-cooling heat pipe 12 are exposed out of the housing of the notebook computer.
The water-cooling outer hanging part 2 is provided with a shell 21, the shell is provided with a hollow cavity 211, a water cooling assembly 24 is arranged in the hollow cavity 211, the water cooling assembly 24 is provided with a water guide radiating pipe 26 and a cold row 27, the water guide radiating pipe 26 is communicated with the cold row 27, two port parts of the water guide radiating pipe 26 are respectively provided with a rubber water nozzle 29, the water guide radiating pipe 26 is communicated with two opening ends of the water cooling radiating pipe 12 through the two rubber water nozzles 29, and water circulation is realized.
Fig. 3 and 4 show a first preferred embodiment of a notebook computer module 1 in a notebook computer cooling system. In the first preferred embodiment, the notebook computer module 1 has a notebook computer housing 11, and two water-cooling connectors 111 are formed at the bottom of the notebook computer housing 11 for receiving two open ends of the water-cooling heat pipe 12.
Specifically, the notebook computer module 1 further has two fans 14, two heat-conducting copper plates 15, two heat pipes 16, and two sets of heat-dissipating fins 17, as shown in fig. 3. The heat-conducting copper plates 15 have upper surfaces and lower surfaces, the two heat-conducting copper plates 15 are arranged in a formation, the upper surfaces of the two heat-conducting copper plates 15 are fixedly attached to a heat source inside the computer respectively, heat absorption ends of the two heat pipes 16 are aligned and do not contact with each other, the heat absorption ends are fixedly attached to the lower surfaces of the two heat-conducting copper plates 15 respectively, heat release ends of the two heat pipes 16 are far away from each other and are combined on the two heat-radiating fin groups 17 respectively, and the two heat-radiating fin groups 17 are fixed to air outlet regions of the two fans 14 respectively. The number of the fans 14, the heat pipes 16 and the heat dissipating fin sets 17 is not limited thereto.
The heat dissipation module 13 has the following heat dissipation modes: the heat generated inside the computer is absorbed by the heat-conducting copper plate 15 (especially the heat source contacting with the heat-conducting copper plate 15), then the heat is conducted to the heat pipe 16, then the heat pipe 16 conducts the heat to the heat-dissipating fin set 17, and finally the heat is quickly blown out of the notebook computer shell 11 by the fan 14, so as to achieve the purpose of heat dissipation, which is a common heat dissipation method for the notebook computer at present.
Specifically, the notebook computer module 1 further has a water-cooling heat dissipation tube 12, the water-cooling heat dissipation tube 12 has two open ends, the extending path of the water-cooling heat dissipation tube 12 is rectangular and annular, and the water-cooling heat dissipation tube 12 is flat. The two open ends of the water-cooling heat pipe 12 are a water inlet 121 and a water outlet 122, and the water inlet 121 and the water outlet 122 are exposed out of the notebook computer housing 11 through the two water-cooling connectors 111. The water-cooled radiating pipe 12 is formed in a flat shape so as to increase a contact area with a heat source, thereby increasing heat transfer efficiency.
In the present embodiment, the water-cooled heat pipe 12 is attached to the two heat-conducting copper plates 15 at a local position, and is also parallel to and in contact with the heat pipes 16, and the portion of the water-cooled heat pipe 12 in contact with the heat radiating ends of the heat pipes 16 is also attached to the heat radiating fin group 17, as shown in fig. 5. The water-cooled radiating pipe 12 is arranged in parallel with and contacts with each heat pipe 16, so that the heat conduction efficiency of the water-cooled radiating pipe 12 is increased; the water-cooling radiating pipe 12 is in contact with the radiating fin group 17, so that the water-cooling radiating pipe 12 can radiate a part of heat through the radiating fin group 17, and the radiating efficiency of the water-cooling external hanging part is enhanced.
In the present application, the notebook computer module 1 further includes a second embodiment, which is different from the first preferred embodiment in the number of the heat pipes 16, and only 1 heat pipe 16 is provided in the second embodiment. The middle position of the heat pipe 16 is a heat absorption end, the two ends of the heat pipe 16 are heat release ends, and the two ends of the heat pipe 16 are respectively combined with a heat radiation fin group 17. The water-cooling radiating pipe 12 and the heat pipe 16 are in parallel contact with each other, and the contact part of the two heat radiating ends of the water-cooling radiating pipe 12 and the heat pipe 16 is also attached to the radiating fin group 17. The heat dissipation method and the heat dissipation effect are similar to those of the first preferred embodiment.
In the present application, there is a third embodiment of the notebook computer module 1, which is different from the first preferred embodiment in that there are no heat-conducting copper plates 15 and heat pipes 16, and the notebook computer module 1 in the third embodiment has one fan 14 and one heat-dissipating fin group 17. The local position of the water-cooling radiating pipe 12 is attached to the heat source, the radiating fin group 17 is combined with the water-cooling radiating pipe 12 to realize heat transfer, the radiating fin group 17 is arranged in the air outlet area of the fan 14, and the fan 14 can be used for radiating the radiating fin group 17, so that the effect of locally radiating the water-cooling radiating pipe 12 is achieved.
In the present application, there is a fourth embodiment of the notebook computer module 1, and the fourth embodiment is different from the first preferred embodiment in that there is no fan 14, no heat-conducting copper plate 15 and no heat-radiating fin set 17, and the notebook computer module 1 in the fourth embodiment has one heat pipe 16. The local position of the water-cooling heat dissipation tube 12 is attached to the heat source, the heat pipe 16 is in parallel contact with the water-cooling heat dissipation tube 12, and the local position of the heat pipe 16 is attached to the heat source inside the computer, so that the efficiency of rapid conduction of the heat pipe 16 is used for assisting the liquid in the water-cooling heat dissipation tube 12 to rapidly absorb heat, and the efficiency of water-cooling heat dissipation is enhanced.
In the present application, there is a fifth embodiment of the notebook computer module 1, which is different from the first preferred embodiment in that there are no fans 14, heat pipes 16 and heat dissipation fin sets 17, and the notebook computer module 1 in the fifth embodiment has a heat conduction copper plate 15. Wherein, one surface of the heat conducting copper plate 15 is attached to the heat source inside the computer, and at least one part of the water-cooling heat dissipation tube 12 is attached to the other surface of the heat conducting copper plate 15 for increasing the heat conduction area between the water-cooling heat dissipation tube 12 and the heat source and enhancing the efficiency of the water-cooling heat dissipation.
In the present application, there is a sixth embodiment of the notebook computer module 1, which is different from the first preferred embodiment in that there are no fans 14 and no heat-radiating fin sets 17, and the notebook computer module 1 in the sixth embodiment has a heat-conducting copper plate 15 and a heat pipe 16. Wherein, the water-cooled heat pipe 12 is attached to one surface of the heat conducting copper plate 15 at a local position, and the other surface of the heat conducting copper plate 15 is in contact with a heat source to realize heat transfer. Wherein, the heat absorbing end of the heat pipe 16 is attached to the heat conducting copper plate 15 and contacts with the water-cooling heat dissipation pipe 12 in parallel.
The sixth embodiment can increase the heat conduction area between the water-cooled heat pipe 12 and the heat source by combining the water-cooled heat pipe 12 and the heat conductive copper plate 15, and can also assist the liquid in the water-cooled heat pipe 12 to absorb heat quickly by the quick conduction performance of the heat pipe 16, thereby enhancing the efficiency of water-cooled heat dissipation.
In all embodiments of the present application, the shape of the water-cooled radiating pipe 12 may be represented as having two open ends, the extending path is a rectangular ring shape, and the cross section is a circular shape.
Referring to fig. 6 and 7, the water-cooling external hanger 2 in the heat dissipation system of the notebook computer is shown, the water-cooling external hanger 2 has a housing 21, which includes a shell 22 and a bottom shell 23, and the shell 22 and the bottom shell 23 form a hollow chamber 211. The upper surface of shell 22 is provided with an air intake 221 and two through-holes 222, and air intake 21 sets up in the fixed area, and air intake 21 department is provided with water-cooling fan 24, and water-cooling fan 24's air intake orientation the air intake department of shell 22 upper surface, water-cooling fan 24 sets up in well cavity 211. The cold row 27 is vertically fixed on one side of the water-cooling fan 24, and the air outlet of the water-cooling fan 24 faces the cold row 27.
Specifically, the water guiding and heat dissipating tube 26 has a water inlet end portion 261 and a water outlet end portion 262, the water inlet end portion 261 is disposed with the water pump 28 and a water tank, and the water inlet of the water inlet end portion 261 and the water outlet of the water outlet end portion 262 are exposed out of the housing 21 through the two through holes 222; the housing 21 is provided with an air outlet 231, and the cold row 27 is disposed at the air outlet 231. The plurality of water-cooling fans 24 are attached to the surface of the cold row 27 side by side. The water inlet end portion 261 and the water outlet end portion 262 of the water guiding and heat dissipating pipe 26 are connected to the water outlet 122 and the water inlet 121 of the water cooling and heat dissipating pipe 12 through two rubber water nozzles 29, which is a preferred connection manner. The water-guiding heat-radiating pipe 26 can also be connected with the water-cooling heat-radiating pipe 12 by other connection methods, so as to realize water circulation.
In the present embodiment, the water-cooling fan 24 may be any one of an axial flow fan, a centrifugal fan, and a diagonal flow fan.
To sum up, the utility model discloses an optimize the notebook heat dissipation for forced air cooling and water-cooling act on integrative radiating mode, when the notebook during operation under low pressure state, can through the built-in fan of notebook computer, through the single heat pipe heat dissipation can, this radiating mode for current notebook is commonly used, when the notebook during operation under high load state, also can directly place the notebook on the external radiator of water-cooling, two rubber water injection well choke of radiator are direct to form sealed butt joint with the inside water-cooling tube of notebook, dispel the heat to the notebook simultaneously. At this moment, the USB power supply is realized, the water pump and the water-cooling fan of the outer hanging piece work to form water circulation, when the water circulation reaches the chip position, the water temperature can rise due to the high temperature of the chip, and when the water circulates to the cold drainage of the outer hanging piece through the loop, the fan can supply water and cool down, so that the water temperature is always kept in a low-temperature state, and the effect of cooling the chip is achieved. The chip is cooled by the water-cooling external radiator, so that the heat dissipation efficiency is greatly improved.
For users, the design is simple and attractive in mechanism, excellent in heat dissipation effect, free of water cooling structures such as exposed water pipes and convenient to use, and the water cooling heat dissipation can be realized simultaneously only by placing the computer on the outer hanging piece.
Claims (10)
1. A notebook computer heat dissipation system comprises a notebook computer module and a water-cooling external hanging piece, and is characterized in that a water-cooling heat dissipation pipe is arranged in the notebook computer module and acts on a heat source, and the water-cooling heat dissipation pipe is provided with a water inlet and a water outlet which are exposed out of a shell of a notebook computer;
the water-cooling external hanging piece comprises a shell, the shell is provided with a hollow cavity, a water-cooling assembly is arranged in the hollow cavity, the water-cooling assembly comprises a water-cooling fan, a water-guiding radiating pipe and a cold bar, the water-guiding radiating pipe is provided with a water inlet end part and a water outlet end part, and the water inlet end part and the water outlet end part are exposed out of the shell;
the water outlet end and the water inlet end of the water guide radiating pipe correspond to the water inlet and the water outlet of the water cooling radiating pipe in a matched mode, the water guide radiating pipe is combined with the cold row and is communicated with the water cooling radiating pipe to form a circulating water path, and the water cooling fan is used for radiating the cold row.
2. The heat dissipation system of claim 1, wherein a water pump and a water tank are disposed on the water path of the water-guiding heat dissipation pipe.
3. The heat dissipation system of claim 1, wherein the notebook computer module further comprises a heat dissipation module having a fan and a set of heat dissipation fins, the set of heat dissipation fins being combined with the water-cooling heat dissipation pipe to achieve heat transfer, the set of heat dissipation fins being disposed at an air outlet region of the fan, and the fan dissipating heat from the set of heat dissipation fins.
4. The heat dissipation system of claim 3, wherein the notebook computer module further comprises a heat pipe and a heat conducting copper plate, at least a part of the water-cooling heat dissipation pipe is attached to the heat conducting copper plate, and the heat conducting copper plate is in heat transfer with the heat source.
5. The heat dissipating system of claim 4, wherein the water-cooled heat dissipating pipe and the heat pipe are parallel and in contact with each other.
6. The heat dissipating system of claim 5, wherein the heat conducting copper plate has an upper surface and a lower surface, the upper surface of the heat conducting copper plate is fixedly attached to a heat source inside the computer, the heat absorbing end of the heat pipe is fixedly attached to the lower surface of the heat conducting copper plate, and the heat dissipating end of the heat pipe is bonded to the heat dissipating fin set.
7. The heat dissipation system of claim 1, wherein the notebook computer module comprises two fans, two heat-conducting copper plates, two heat pipes, and two sets of heat dissipation fins, wherein the two heat-conducting copper plates are arranged in a formation, upper surfaces of the two heat-conducting copper plates are respectively and fixedly attached to a heat source inside the computer, heat absorption ends of the two heat pipes are aligned and are not in contact with each other, and are respectively and fixedly attached to lower surfaces of the two heat-conducting copper plates, heat dissipation ends of the two heat pipes are away from each other and are respectively combined to the two sets of heat dissipation fins, and the two sets of heat dissipation fins are respectively and fixedly attached to air outlet regions of the fans.
8. The heat dissipating system of a notebook computer as claimed in claim 1, wherein the water-cooled heat dissipating pipe has two open ends, the extending path of the water-cooled heat dissipating pipe is rectangular and ring-shaped, and the shape of the water-cooled heat dissipating pipe is flat.
9. The heat dissipation system of claim 1, wherein the housing has a housing and a bottom shell, the housing has an air inlet on an upper surface thereof, the air inlet is provided with a water cooling fan, the air inlet of the water cooling fan faces the air inlet on the upper surface of the housing, the cold row is vertically fixed on one side of the water cooling fan, the air outlet of the water cooling fan faces the cold row, the upper surface of the housing further has two through holes for receiving the water inlet end and the water outlet end of the water guiding and heat dissipating tube, the bottom shell is provided with an air outlet, and the cold row is disposed at the air outlet.
10. The heat dissipation system of claim 1, wherein two water-cooling connectors are formed at the bottom of the housing of the notebook computer for receiving the water outlets and the water inlets of the water-cooling heat dissipation pipes, and the water outlets and the water inlets of the water-cooling heat dissipation pipes are connected to the water inlet end and the water outlet end of the water-guiding heat dissipation pipes through two rubber water nozzles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023181007.8U CN214278869U (en) | 2020-12-25 | 2020-12-25 | Notebook computer cooling system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023181007.8U CN214278869U (en) | 2020-12-25 | 2020-12-25 | Notebook computer cooling system |
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| CN214278869U true CN214278869U (en) | 2021-09-24 |
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| CN202023181007.8U Active CN214278869U (en) | 2020-12-25 | 2020-12-25 | Notebook computer cooling system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113985995A (en) * | 2021-11-02 | 2022-01-28 | 袁桂华 | External radiator of notebook computer |
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2020
- 2020-12-25 CN CN202023181007.8U patent/CN214278869U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113985995A (en) * | 2021-11-02 | 2022-01-28 | 袁桂华 | External radiator of notebook computer |
| CN113985995B (en) * | 2021-11-02 | 2024-05-17 | 北京神州数码云科信息技术有限公司 | External radiator of notebook computer |
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