CN220105648U

CN220105648U - Computer radiator with three-face radiating structure

Info

Publication number: CN220105648U
Application number: CN202320806423.7U
Authority: CN
Inventors: 林義銘; 方安定
Original assignee: Guangzhou Zero Degree Heat Dissipation Technology Co ltd
Current assignee: Jiete Technology Guangdong Co ltd
Priority date: 2023-04-12
Filing date: 2023-04-12
Publication date: 2023-11-28
Anticipated expiration: 2033-04-12

Abstract

The utility model relates to the technical field of heat dissipation equipment, in particular to a computer radiator with a three-face heat dissipation structure, which comprises a shell and a heat conduction plate, wherein a cooling chamber is arranged in the shell, the upper end of the heat conduction plate is fixedly provided with a heat conduction piece arranged in the cooling chamber, the upper end and two sides of the heat conduction piece are respectively provided with a heat dissipation component for transferring heat of the heat conduction piece, and the upper end and two sides of the heat conduction piece are respectively provided with a plurality of heat dissipation fins, so that the heat dissipation efficiency of the heat conduction piece is improved, and the heat dissipation efficiency of the heat conduction plate and an electronic element is further improved; through set up heat conduction post and fin in the logical inslot of heat conduction spare, increase the radiating area of heat conduction spare, the radiating area of heat conduction spare is about: the effective heat dissipation area is larger than that of a common radiator, and the heat dissipation and cooling efficiency is improved.

Description

Computer radiator with three-face radiating structure

Technical Field

The utility model relates to the technical field of heat dissipation equipment, in particular to a computer radiator with a three-face heat dissipation structure.

Background

Since the electronic component generates heat when consuming power, the longer the electronic component is used, the more heat is generated. The electronic component has a normal operating temperature range, and if the temperature of the electronic component exceeds the operating temperature range, the service life of the electronic component is reduced, and the electronic component burns out, and a radiator is generally adopted to radiate the heat of the electronic component, so that the electronic component is ensured to be in the normal operating temperature range.

The heat radiation performance of the radiator is improved at the present stage, which is an important research direction in the heat radiation industry, and the heat conduction area of many existing radiators is smaller, so that the heat radiation effect is affected, the radiator can not quickly radiate and cool the electronic element in actual use, and the normal work of the electronic element is affected;

as disclosed in chinese patent publication No. CN204362497U, a bidirectional flow channel fin radiator for water cooling, which improves the heat dissipation and temperature uniformity of the water cooling radiator by providing a bidirectional flow channel fin radiator, and ensures the temperature balance of electronic components, but in practical use, the effective heat dissipation area is smaller than the sum of the surface areas of the first fin and the second fin, resulting in a decrease in heat dissipation efficiency.

Disclosure of Invention

The present utility model is directed to a computer radiator with three-sided heat dissipation structure, which solves the above drawbacks in the prior art.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model provides a computer radiator with trilateral heat radiation structure, includes shell and heat-conducting plate, the inside of shell is provided with the cooling chamber, the heat-conducting plate sets up in the lower extreme of cooling chamber, just the upper end of heat-conducting plate is fixed to be provided with the built-in heat-conducting piece in the cooling chamber, the upper end and the both sides of heat-conducting piece all are provided with the radiator unit that is used for transmitting heat of heat-conducting piece, the both ends of shell all are fixed to be provided with the connecting pipe that is used for pegging graft with the circulating pipe of liquid cooling circulating device;

wherein, the cooling chamber is indoor fixedly provided with two isolation posts, two the isolation posts with the heat conduction spare cooperation is in order to form two side runners and an upper runner that supply the liquid to flow.

Further, the heat dissipation assembly comprises a plurality of heat dissipation fins which are arranged on the heat conduction piece at intervals and fixedly connected with the heat conduction piece.

Further, one end of the heat dissipation fin far away from the heat conduction piece is abutted with the inner wall of the cooling chamber.

Further, a sealing gasket is fixedly arranged at the upper end of the heat conducting plate, and the upper end of the sealing gasket is abutted to the shell.

Further, through grooves for increasing heat dissipation area are formed in the heat conducting piece along the length direction, and a plurality of groups of heat conducting columns are fixedly arranged in the through grooves.

Further, a plurality of groups of radiating fins are further arranged in the through groove, and a plurality of groups of arc-shaped bulges for increasing the radiating area are arranged on the radiating fins.

The utility model provides a computer radiator with a three-side radiating structure, which has the beneficial effects that:

in the utility model, the heat dissipation efficiency of the heat conduction piece is improved by arranging the plurality of heat dissipation fins at the upper end and the two sides of the heat conduction piece and dissipating heat from the three surfaces facing the heat conduction piece, so that the heat dissipation efficiency of the heat conduction plate and the electronic element is improved;

secondly, in the utility model, the heat dissipation area of the heat conduction member is increased by arranging the heat conduction column and the heat dissipation fin in the through groove of the heat conduction member, and the heat dissipation area of the heat conduction member is about: the effective heat dissipation area is larger than that of a common radiator, and the heat dissipation and cooling efficiency of the electronic element is improved.

Drawings

Fig. 1 is a schematic structural diagram of a computer radiator with a three-sided heat dissipation structure according to the present utility model;

fig. 2 is a schematic structural diagram of a heat sink fin according to the present utility model;

FIG. 3 is a schematic view of the cooling chamber of the present utility model;

fig. 4 is an enlarged schematic view of the a portion of the present utility model.

In the figure: 1. a housing; 2. a heat conductive plate; 21. a sealing gasket; 3. a cooling chamber; 31. a separation column; 32. a side flow channel; 33. an upper flow passage; 4. a heat conductive member; 41. a through groove; 42. a heat conducting column; 43. a heat sink; 44. arc-shaped bulges; 5. a heat dissipation assembly; 51. a heat radiation fin; 6. and (5) connecting pipes.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1-4, a computer radiator with a three-sided radiating structure comprises a shell 1 and a heat conducting plate 2, wherein a cooling chamber 3 is arranged in the shell 1, the heat conducting plate 2 is arranged at the lower end of the cooling chamber 3, a heat conducting piece 4 arranged in the cooling chamber 3 is fixedly arranged at the upper end of the heat conducting plate 2, radiating components 5 used for transmitting heat of the heat conducting piece 4 are arranged at the upper end and two sides of the heat conducting piece 4, and connecting pipes 6 used for being spliced with circulating pipes of a liquid cooling circulating device are fixedly arranged at two ends of the shell 1;

wherein, the cooling chamber 3 is fixedly provided with two isolation columns 31, and the two isolation columns 31 are matched with the heat conducting piece 4 to form two side channels 32 for liquid to flow and an upper channel 33.

In the present utility model, the heat dissipation components 5 disposed at the upper end and both sides of the heat conduction member 4 dissipate heat at the upper end and both sides of the heat conduction member 4, thereby forming a multi-surface cooling, rapidly cooling the heat conduction member 4, and the isolation column 31 is matched with the heat conduction member 4 to form two side flow channels 32 and one upper flow channel 33, thereby cooling each heat dissipation component 5.

Further, in the present utility model, the heat dissipating assembly 5 includes a plurality of heat dissipating fins 51, and the plurality of heat dissipating fins 51 are disposed on the heat conducting member 4 at intervals and fixedly connected to the heat conducting member 4, so that when the liquid flows through the heat dissipating fins 51, heat on the heat dissipating fins 51 is taken away to achieve cooling.

Further, in the present utility model, the ends of the heat dissipation fins 51 far from the heat conduction member 4 are all abutted against the inner wall of the cooling chamber 3, so that the length of the heat dissipation fins 51 is the longest, and the heat dissipation effect is increased.

In the present utility model, a gasket 21 is fixedly provided at the upper end of the heat conductive plate 2, and the upper end of the gasket 21 abuts against the housing 1 to prevent liquid leakage.

In detail, in the present utility model, the heat conducting member 4 is provided with the through groove 41 for increasing the heat dissipation area along the length direction, the plurality of groups of heat conducting columns 42 are fixedly arranged in the through groove 41, and the heat dissipation area is increased by arranging the through groove 41 and the heat conducting columns 42, so that the heat dissipation and cooling effects are improved.

More specifically, in the present utility model, a plurality of groups of heat dissipation fins 43 are further disposed in the through groove 41, a plurality of groups of arc-shaped protrusions 44 for increasing the heat dissipation area are disposed on the heat dissipation fins 43, the heat dissipation area is increased by disposing the heat dissipation fins 43, and the arc-shaped protrusions 44 are further disposed on the heat dissipation fins 43, so that the surface area of the heat dissipation fins 43 is increased, and arc-shaped grooves are formed on the heat dissipation fins 43 when the arc-shaped protrusions 44 are formed, so that the surface area of the heat dissipation fins 43 is further increased, and the heat dissipation effect is greatly improved.

The working mode is as follows; during operation, the heat dissipation components 5 arranged at the upper end and the two sides of the heat conduction piece 4 dissipate heat at the upper end and the two sides of the heat conduction piece 4, so that multiple faces are formed to cool down, the temperature of the heat conduction piece 4 is quickly lowered, the isolation column 31 is matched with the heat conduction piece 4 to form two side flow channels 32 and one upper flow channel 33, heat on the heat fins 51 of each heat dissipation component 5 can be taken away when liquid flows, in the process, the liquid flows through the through grooves 41 to take away the heat on the heat conduction column 42 and the heat dissipation fins 43, the temperature of the heat conduction piece 4 is quickly lowered, the temperature of the heat conduction plate 2 and the electronic element is lowered, a large amount of heat is absorbed, and the heat dissipation of the electronic element with high probability is realized.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides a computer radiator with trilateral heat radiation structure, includes shell (1) and heat conduction board (2), its characterized in that: the cooling device is characterized in that a cooling chamber (3) is arranged inside the shell (1), the heat conducting plate (2) is arranged at the lower end of the cooling chamber (3), a heat conducting piece (4) arranged in the cooling chamber (3) is fixedly arranged at the upper end of the heat conducting plate (2), heat radiating components (5) used for transmitting heat of the heat conducting piece (4) are arranged at the upper end and two sides of the heat conducting piece (4), and connecting pipes (6) used for being spliced with circulating pipes of the liquid cooling circulating device are fixedly arranged at two ends of the shell (1);

wherein, two isolation columns (31) are fixedly arranged in the cooling chamber (3), and the two isolation columns (31) are matched with the heat conducting piece (4) to form two side channels (32) for liquid to flow and an upper channel (33).

2. A computer radiator with three-sided heat dissipation structure as defined in claim 1, wherein: the heat dissipation assembly (5) comprises a plurality of heat dissipation fins (51), and the plurality of heat dissipation fins (51) are arranged on the heat conduction piece (4) at intervals and fixedly connected with the heat conduction piece (4).

3. A computer radiator with three-sided heat dissipation structure as defined in claim 2, wherein: one end of the heat radiation fin (51) far away from the heat conduction piece (4) is abutted with the inner wall of the cooling chamber (3).

4. A computer radiator with three-sided heat dissipation structure as defined in claim 1, wherein: the upper end of the heat conducting plate (2) is fixedly provided with a sealing gasket (21), and the upper end of the sealing gasket (21) is abutted with the shell (1).

5. A computer radiator with three-sided heat dissipation structure as defined in claim 1, wherein: through grooves (41) for increasing heat dissipation area are formed in the heat conducting piece (4) along the length direction, and a plurality of groups of heat conducting columns (42) are fixedly arranged in the through grooves (41).

6. A computer radiator with three-sided heat dissipation structure as defined in claim 5, wherein: a plurality of groups of radiating fins (43) are further arranged in the through groove (41), and a plurality of groups of arc-shaped protrusions (44) for increasing the radiating area are arranged on each radiating fin (43).