CN212696421U - PCB with good heat dissipation performance - Google Patents
PCB with good heat dissipation performance Download PDFInfo
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- CN212696421U CN212696421U CN202021832251.3U CN202021832251U CN212696421U CN 212696421 U CN212696421 U CN 212696421U CN 202021832251 U CN202021832251 U CN 202021832251U CN 212696421 U CN212696421 U CN 212696421U
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Abstract
The utility model discloses a PCB board with good heat dissipation in the technical field of PCB board heat dissipation, the bottom of the heat conduction layer is fixedly provided with a heat dissipation plate, the bottom of the heat dissipation plate is uniformly provided with a heat dissipation groove, one side wall of the heat dissipation groove far away from the opening is provided with a wind guide channel, the top of the heat dissipation plate is provided with a heat collection groove communicated with the wind guide channel, a heat conduction column fixedly assembled on the bottom of the heat conduction layer is arranged in the heat collection groove, the outer wall of the heat conduction column is uniformly and fixedly provided with a spoiler, the inner wall of the heat collection groove is fixedly provided with a fixed frame, the fixed frame is provided with an annular heat exchange cooling pipe, the inner wall of the wind guide channel is fixedly provided with a heat conduction ring, the heat dissipation groove is fixedly provided with a heat dissipation fan, the inner wall of the heat, thereby the heat-sinking capability of PCB board body has been improved, and PCB board body job run stability and reliability are guaranteed.
Description
Technical Field
The utility model relates to a PCB board heat dissipation technical field specifically is a good heat dissipation's PCB board.
Background
The PCB board is an electronic component widely applied to various electronic devices, along with the continuous progress of science and technology, the PCB board is always towards high power, miniaturization and centralized development of high density of components, so the heat dissipation effect of the PCB board becomes an important factor for determining the stability and reliability of the electronic devices, a double-layer PCB board causes more heat generation during operation because connecting circuits on the surface of the double-layer PCB board are more than single-layer PCB boards, the double-layer PCB board assembly on the existing market does not have a good heat dissipation effect, the accumulation of surface heat can not be dissipated during long-time use, the operation resistance of the PCB board is too large, the normal use of the PCB board is influenced, meanwhile, the accelerated aging of electronic elements is easily caused by the work under the high-temperature condition, the long-term use of the PCB board is not facilitated, and the heat dissipation effect is limited, therefore, the PCB board with.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a good heat dissipation's PCB board to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a PCB with good heat dissipation performance comprises a PCB body, wherein a protective shell is fixedly assembled on the outer wall of the PCB body, a heat conduction layer attached to the bottom of the PCB body is fixedly arranged at the bottom of the protective shell, a heat dissipation plate is fixedly assembled at the bottom of the heat conduction layer, heat dissipation grooves are uniformly formed in the bottom of the heat dissipation plate, a wind guide channel is formed in one side wall, away from an opening, in the heat dissipation groove, a heat collection groove communicated with the wind guide channel is formed in the top of the heat dissipation plate, heat conduction columns fixedly assembled on the bottom of the heat conduction layer are arranged in the heat collection groove, spoilers are uniformly and fixedly arranged on the outer walls of the heat conduction columns, a fixing frame is fixedly arranged on the inner walls of the heat collection groove, an annular heat exchange cooling pipe is assembled on the fixing frame, a heat conduction ring is fixedly assembled on, the movable clamping on the inner wall of the heat dissipation groove is provided with a dustproof filter screen arranged below the heat dissipation fan.
Preferably, the heat conduction layer is fixedly assembled at the bottom of the PCB body, the size of the heat conduction layer is matched with that of the PCB body, and the heat conduction layer is a heat conduction aluminum foil.
Preferably, the radiating grooves are evenly arranged into three groups along the length direction of the radiating plate, the radiating grooves are tapered heat conducting grooves with narrow inner parts and wide outer parts, and the minimum size of the radiating grooves is the same as the aperture of the air guide channel.
Preferably, the size of the heat collecting groove is larger than that of the heat radiating groove, the fixing frames are uniformly distributed on the inner wall of the heat collecting groove, and the heat exchange cooling pipe is annularly assembled on the inner wall of the heat collecting groove.
Preferably, the heat conduction columns are opposite to the air guide channels, the spoilers are uniformly arranged along the length directions of the heat conduction columns in a reverse direction, a single group of the spoilers are uniformly arranged along the circumferential direction of the heat conduction columns, and the spoilers are inclined plates with deflection angles of 30 degrees.
Preferably, the heat conduction ring comprises a copper heat dissipation fin fixed on the inner wall of the air guide channel, and a heat conduction silicone grease layer is fixedly assembled on the inner side wall of the copper heat dissipation fin.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model has the advantages of reasonable design, the protective housing can realize the protection to the PCB board body, the heat-conducting layer can accelerate the heat conduction on the PCB board body, the heat is convenient for spread into the heat-collecting groove through the heat-conducting layer, simultaneously the heat on the heat-conducting layer can spread into the heat-collecting groove through the heat-conducting post, the heat conduction can be accelerated, the heat exchange cooling tube can carry out the heat exchange cooling to the heat in the heat-collecting groove, the heat absorption is convenient for realize, the spoiler can carry out the external dissipation to the heat on the heat-conducting post, thus the heat can be promoted to be evenly filled in the heat-collecting groove, when the radiator fan works, the air flow in the heat-collecting groove can be accelerated, thus the air in the heat-collecting groove can be dissipated through the wind-guiding channel and the heat-dissipating groove, thus the external dissipation efficiency of the heat is improved, the heat-conducting ring in the wind-guiding channel can, the stability and the reliability of the work operation of the PCB body are ensured.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic view of the sectional structure of the heat conduction ring of the present invention.
In the figure: 1. a PCB body; 2. a protective shell; 3. a heat conductive layer; 4. a heat dissipation plate; 5. a heat sink; 6. an air guide channel; 7. a heat collection tank; 8. a heat-conducting column; 9. a spoiler; 10. a fixing frame; 11. a heat exchange cooling tube; 12. a heat conducting ring; 121. a copper heat sink; 122. a thermally conductive silicone layer; 13. a heat radiation fan; 14. dustproof filter screen.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 and fig. 2, the present invention provides a technical solution: a PCB with good heat dissipation performance comprises a PCB body 1, a protective shell 2 is fixedly assembled on the outer wall of the PCB body 1, a heat conduction layer 3 attached to the bottom of the PCB body 1 is fixedly arranged at the bottom of the protective shell 2, a heat dissipation plate 4 is fixedly assembled at the bottom of the heat conduction layer 3, heat dissipation grooves 5 are uniformly formed in the bottom of the heat dissipation plate 4, a wind guide channel 6 is formed in one side wall, away from an opening, in the heat dissipation groove 5, a heat collection groove 7 communicated with the wind guide channel 6 is formed in the top of the heat dissipation plate 4, a heat conduction column 8 fixedly assembled at the bottom of the heat conduction layer 3 is arranged in the heat collection groove 7, a spoiler 9 is uniformly and fixedly arranged on the outer wall of the heat conduction column 8, a fixed frame 10 is fixedly arranged on the inner wall of the heat collection groove 7, an annular heat exchange cooling pipe 11 is assembled on the fixed frame 10, the inner wall of the heat radiating groove 5 is movably clamped and assembled with a dustproof filter screen 14 arranged below the heat radiating fan 13.
Referring to fig. 1, the heat conducting layer 3 is fixedly assembled at the bottom of the PCB body 1, the size of the heat conducting layer 3 is matched with the size of the PCB body 1, and the heat conducting layer 3 is a heat conducting aluminum foil, which can accelerate heat conduction;
referring to fig. 1, three groups of heat dissipation grooves 5 are uniformly arranged along the length direction of the heat dissipation plate 4, and the heat dissipation grooves 5 are tapered heat conduction grooves with a narrow inner part and a wide outer part, and the minimum size of the heat dissipation grooves 5 is the same as the aperture of the air guide channel 6;
referring to fig. 1, the size of the heat collecting slot 7 is larger than that of the heat dissipating slot 5, the fixing frames 10 are uniformly distributed on the inner wall of the heat collecting slot 7, and the heat exchange cooling pipe 11 is annularly mounted on the inner wall of the heat collecting slot 7, so that the heat exchange cooling pipe 11 can perform heat exchange cooling on the heat in the heat collecting slot 7, thereby facilitating heat absorption;
the heat conduction column 8 is opposite to the air guide channel 6, the spoilers 9 are oppositely and uniformly arranged along the length of the heat conduction column 8, the single group of spoilers 9 are uniformly arranged along the circumferential direction of the heat conduction column 8, the spoilers 9 are inclined plates with the deflection angle of 30 degrees, and the spoilers 9 can dissipate heat on the heat conduction column 8 outwards, so that the heat can be uniformly filled in the heat collection groove 7;
the heat conduction ring 12 comprises a copper heat radiation fin 121 fixed on the inner wall of the air guide channel 6, a heat conduction silicone grease layer 122 is fixedly assembled on the inner side wall of the copper heat radiation fin 121, the heat conduction efficiency is improved through the copper heat radiation fin 121, and meanwhile, the heat conduction effect can be improved through the heat conduction silicone grease layer 122.
The working principle is as follows: the protective shell 2 can protect the PCB body 1, the heat conduction layer 3 can accelerate heat conduction on the PCB body 1, heat can be conveniently transmitted into the heat collection groove 7 through the heat conduction layer 3, meanwhile, heat on the heat conduction layer 3 can be transmitted into the heat collection groove 7 through the heat conduction column 8, heat conduction can be accelerated, the heat exchange cooling pipe 11 can carry out heat exchange cooling on heat in the heat collection groove 7, heat absorption is convenient, the spoiler 9 can carry out external radiation on heat on the heat conduction column 8, heat can be uniformly filled in the heat collection groove 7, when the radiating fan 13 works, air flow in the heat collection groove 7 can be accelerated, air in the heat collection groove 7 can be radiated out through the air guide channel 6 and the radiating groove 5, heat external radiation efficiency is improved, the heat conduction ring 12 in the air guide channel 6 can conduct heat rapidly, the heat dissipation effect is improved, so that the heat dissipation capacity of the PCB body 1 is improved, and the stability and the reliability of the working operation of the PCB body 1 are ensured.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A PCB board with good heat dissipation performance comprises a PCB board body (1) and is characterized in that: the heat-conducting type heat-conducting plate is characterized in that a protective shell (2) is fixedly assembled on the outer wall of the PCB body (1), a heat-conducting layer (3) attached to the bottom of the PCB body (1) is fixedly arranged at the bottom of the protective shell (2), a heat-radiating plate (4) is fixedly assembled at the bottom of the heat-conducting layer (3), heat-radiating grooves (5) are uniformly formed in the bottom of the heat-radiating plate (4), a wind-guiding channel (6) is formed in the side wall, far away from an opening, of the heat-radiating groove (5), a heat-collecting groove (7) communicated with the wind-guiding channel (6) is formed in the top of the heat-radiating plate (4), heat-conducting columns (8) fixedly assembled at the bottom of the heat-conducting layer (3) are arranged in the heat-collecting grooves (7), spoilers (9) are uniformly and fixedly arranged on the outer wall of the heat-conducting columns (8, fixed being equipped with heat conduction ring (12) on wind-guiding passageway (6) inner wall, radiating groove (5) internal fixation is equipped with radiator fan (13), the activity joint is equipped with dustproof filter screen (14) of setting in radiator fan (13) below on radiating groove (5) inner wall.
2. The PCB board with good heat dissipation performance of claim 1, wherein: the heat conduction layer (3) is fixedly assembled at the bottom of the PCB body (1), the size of the heat conduction layer (3) is matched with that of the PCB body (1), and the heat conduction layer (3) is a heat conduction aluminum foil.
3. The PCB board with good heat dissipation performance of claim 1, wherein: the radiating grooves (5) are evenly arranged into three groups along the length direction of the radiating plate (4), the radiating grooves (5) are tapered heat conducting grooves with narrow inner parts and wide outer parts, and the minimum size of the radiating grooves (5) is the same as the aperture of the air guide channel (6).
4. The PCB board with good heat dissipation performance of claim 3, wherein: the size of the heat collecting groove (7) is larger than that of the heat radiating groove (5), the fixing frames (10) are uniformly distributed on the inner wall of the heat collecting groove (7), and the heat exchange cooling pipe (11) is annularly assembled on the inner wall of the heat collecting groove (7).
5. The PCB board with good heat dissipation performance of claim 1, wherein: the heat conduction columns (8) are opposite to the air guide channel (6), the spoilers (9) are uniformly arranged along the length directions of the heat conduction columns (8) in the opposite direction, the spoilers (9) are uniformly arranged along the circumferential direction of the heat conduction columns (8) in a single group, and the spoilers (9) are inclined plates with deflection angles of 30 degrees.
6. The PCB board with good heat dissipation performance of claim 1, wherein: the heat conduction ring (12) comprises copper radiating fins (121) fixed on the inner wall of the air guide channel (6), and a heat conduction silicone grease layer (122) is fixedly assembled on the inner side walls of the copper radiating fins (121).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021832251.3U CN212696421U (en) | 2020-08-28 | 2020-08-28 | PCB with good heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021832251.3U CN212696421U (en) | 2020-08-28 | 2020-08-28 | PCB with good heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212696421U true CN212696421U (en) | 2021-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021832251.3U Active CN212696421U (en) | 2020-08-28 | 2020-08-28 | PCB with good heat dissipation performance |
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| CN (1) | CN212696421U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114348814A (en) * | 2021-11-30 | 2022-04-15 | 上海索迪龙自动化有限公司 | Safe type elevator position sensor |
-
2020
- 2020-08-28 CN CN202021832251.3U patent/CN212696421U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114348814A (en) * | 2021-11-30 | 2022-04-15 | 上海索迪龙自动化有限公司 | Safe type elevator position sensor |
| CN114348814B (en) * | 2021-11-30 | 2024-07-19 | 上海索迪龙自动化股份有限公司 | Safety elevator position sensor |
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