CN211575316U - Radiating component, radiator and air conditioner - Google Patents

Abstract

The application relates to the technical field of heat dissipation, and discloses a heat dissipation component which comprises a heat conduction substrate, wherein the heat conduction substrate comprises a groove to form a first working medium flow path; the flow guide piece is arranged in the groove; the air outlet is communicated with one end of the first working medium flow path; and the liquid return port is communicated with the other end of the first working medium flow path. The application provides a heat-conducting substrate of heat radiation component is provided with the water conservancy diversion spare including the recess that constitutes first working medium flow path in the recess, and the setting of water conservancy diversion spare has increased the area of contact of working medium and first working medium flow path, has improved heat radiation component's radiating effect. The application also discloses a radiator and an air conditioner.

Description

Radiating component, radiator and air conditioner

Technical Field

The present application relates to the field of heat dissipation technologies, and for example, to a heat dissipation member, a heat sink, and an air conditioner.

Background

The air conditioner outdoor unit is characterized in that a plurality of chips are arranged on an electric control plate of the air conditioner outdoor unit, the chips can emit heat in the working process, and the heat generated by the chips needs to be dissipated in time so as to ensure the normal operation of the chips. At present, an extruded section radiator is mostly adopted to radiate the heat of an air conditioner outdoor unit chip.

In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art: the heat dissipation capacity of the extruded profile radiator is limited, and particularly when the outdoor environment temperature is high, the temperature of the chip is increased rapidly, and the extruded profile radiator cannot dissipate heat generated by the chip in time, so that the normal operation of the air conditioner is influenced.

SUMMERY OF THE UTILITY MODEL

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.

The embodiment of the disclosure provides a heat dissipation component, a radiator and an air conditioner, and aims to solve the technical problems that in the prior art, an extruded section radiator is limited in heat dissipation capacity and normal operation of the air conditioner is influenced.

In some embodiments, the heat dissipating member comprises a thermally conductive matrix comprising: the groove forms a first working medium flow path; the flow guide piece is arranged in the groove; the air outlet is communicated with one end of the first working medium flow path; and the liquid return port is communicated with the other end of the first working medium flow path.

In some embodiments, the heat sink comprises: the heat dissipation member as described above; the condensation end is provided with a second working medium flow path; and the communication pipeline is used for communicating the first working medium flow path of the heat dissipation member with the second working medium flow path of the condensation end.

In some embodiments, the air conditioner comprises an outdoor unit of an air conditioner, and the outdoor unit of the air conditioner comprises the radiator.

The heat dissipation component, the radiator and the air conditioner provided by the embodiment of the disclosure can realize the following technical effects:

the heat conducting base body of the heat dissipation component provided by the embodiment of the disclosure comprises a groove forming the first working medium flow path, the flow guide piece is arranged in the groove, the contact area of the first working medium flow path and a working medium to flow through is increased due to the arrangement of the flow guide piece, and the heat dissipation effect of the heat dissipation component is improved.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:

fig. 1 is a schematic structural diagram of a heat dissipation member provided in an embodiment of the present disclosure;

FIG. 2 is a schematic structural view of a flow guide provided in an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a heat sink provided by an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of an outdoor unit of an air conditioner according to an embodiment of the present disclosure.

Reference numerals:

1: a heat dissipating member; 11: a groove; 12: a flow guide member; 13: an air outlet; 14: a liquid return port; 151: a first threaded bore post; 152: a second threaded bore post; 153: a third threaded bore post; 154: a fourth threaded bore post; 155: a fifth threaded bore post; 121: a flow guiding framework; 122: flow guiding ribs; 1211: a first flow directing sidewall; 16: a base cap; 17: heat dissipation fins; 2: a condensing end; 21: a heat conducting pipe; 22: a first fin end plate; 23: a second fin end plate; 231: a fixing through hole; 3: a gaseous communication line; 4: a liquid communication pipeline; 5: a fan; 6: a fan bracket; 7: an electronic control box.

Detailed Description

So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.

The terms "first," "second," and the like, herein are used solely to distinguish one element from another without requiring or implying any actual such relationship or order between such elements. In practice, a first element can also be referred to as a second element, and vice versa. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a structure, apparatus, or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such structure, apparatus, or device. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a structure, device or apparatus that comprises the element. The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. As used herein, "plurality" or "a plurality" and the like may be understood as two or more, two or more.

The disclosed embodiment provides a heat radiation member, including the heat conduction base member, the heat conduction base member includes: the groove forms a first working medium flow path; the flow guide piece is arranged in the groove; the air outlet is communicated with one end of the first working medium flow path; and the liquid return port is communicated with the other end of the first working medium flow path.

As shown in fig. 1, the heat conducting base includes a groove 11, and the groove 11 may be a channel milled in the heat conducting base, and serves as a first working medium flow path for a flow path of a working medium. Forming the first working fluid flow path is to be understood as meaning that the groove 11 acts as the first working fluid flow path. Optionally, the heat conducting base is connected to the computer board to be cooled in a threaded connection manner, and the groove 11 of the heat conducting base is milled out of the threaded hole.

A flow guide part 12 is arranged in the groove 11. The liquid working medium enters the first working medium flow path from the liquid return port 14 to exchange heat with the flow guide part 12 with higher temperature, the flow guide part 12 transfers the heat to the liquid working medium, and the liquid working medium is heated to be changed into a gas state and flows out from the gas outlet 13 of the heat conduction base body. The arrangement of the flow guide part 12 increases the contact area of the working medium in the first working medium flow path and the heat conducting substrate, improves the heat dissipation effect of the heat dissipation member 1, and the flow guide part 12 divides the first working medium flow path, so that the working medium flowing back from the liquid return port 14 can be divided, and the heat dissipation efficiency of the heat dissipation member 1 is improved.

The number of the flow guide members 12 is not limited in the embodiments of the present disclosure, and the number of the flow guide members 12 may be one or more, for example, the number of the flow guide members 12 may be 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, etc. Optionally, two adjacent flow guiding elements 12 are not in contact with each other, or alternatively, it can be described that a gap for the working medium to flow through is provided between two adjacent flow guiding elements 12. Optionally, the material of the flow guiding element 12 is the same as that of the heat conducting substrate, and may be metal, such as aluminum or copper, to reduce the contact thermal resistance.

Optionally, the groove 11 of the heat-conducting substrate is milled out of the threaded hole, so as to obtain a threaded hole column with an internal thread on the inner wall of the hole. Alternatively, the number of the screw hole columns of the heat conductive base may be one or more, for example, the number of the screw hole columns may be 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, and the like. The threaded hole column is used for being in threaded connection with a chip to be cooled. Alternatively, the number of the threaded hole columns may be 5, as shown in fig. 1. The flow guiding element 12 is in heat conducting contact with the outer wall of the threaded bore hole, where heat conducting contact may be interpreted as a fixed connection, such as a weld, to which the flow guiding element 12 is welded. The threaded hole column is a connection point of the chip and the heat-conducting substrate, can receive heat from the chip and is high in temperature. The flow guide part 12 is in heat conduction contact with the outer wall of the threaded hole column, the threaded hole column can transmit heat to the flow guide part 12, heat is dissipated through the flow guide part 12, and the heat dissipation effect of the heat dissipation component 1 is improved.

As shown in fig. 1, the screw hole columns include a first screw hole column 151, a second screw hole column 152, a third screw hole column 153, and a fourth screw hole column 154, wherein the first screw hole column 151 is used for fixing a first chip, the second screw hole column 152 is used for fixing a second chip, the third screw hole column 153 is used for fixing a third chip, and the fourth screw hole column 154 is used for fixing a fourth chip. Optionally, the first chip is an Intelligent Power Module (IPM), the second chip is an Insulated Gate Bipolar Transistor (IGBT), the third chip is a diode, and the fourth chip is a rectifier bridge. Of the four chips, the first chip generates the largest amount of heat, which accounts for about 60-80% of the total amount of heat generated by the four chips. The first threaded hole column 151 is closer to the gas outlet 13 than the liquid return port 14; for gas outlet 13, second screw hole post 152, third screw hole post 153 and fourth screw hole post 154 are closer to liquid return port 14 more, have prevented that the first chip temperature that flows through earlier rises and becomes high temperature working medium after, and the high temperature working medium influences the radiating effect to second chip, third chip and fourth chip to the heating effect of second chip, third chip and fourth chip. Optionally, the screw hole pillar further includes a fifth screw hole pillar 155 for fixing the first chip together with the first screw hole pillar 151, thereby improving the fixing effect of the first chip.

The first working medium flow path provides a path for the flowing of the working medium, the working medium can be a working medium capable of phase change, such as a working medium capable of phase change between a gas state and a liquid state, and the working medium can be a refrigerant. The heat dissipation method of the heat dissipation member 1 provided by the embodiment of the present disclosure may be: the liquid working medium enters the first working medium flow path from the liquid return port 14, flows through the flow guide part 12, is heated and turns into a gaseous working medium, and the gaseous working medium flows out from the gas outlet 13.

Optionally, a flow guide 12 is arranged at the bottom of the recess 11.

Optionally, the flow guide member 12 is fixedly connected to the bottom of the groove 11, so that the connection stability of the flow guide member 12 and the groove 11 of the heat conducting base body is improved, and the connection mode of the fixed connection can be welding; alternatively, the deflector 12 may be detachably attached to the bottom of the recess 11, which improves the flexibility of the attachment position of the deflector 12 in the recess 11. The flow guide part 12 is arranged at the bottom of the groove 11, part of heat can be transferred to the bottom of the heat conduction base body by the flow guide part 12, and the bottom of the heat conduction base body can be simultaneously radiated. As shown in fig. 3, the heat dissipating member 1 further comprises heat dissipating ribs 17 in heat conductive contact with the bottom of the heat conductive base. The heat dissipation fins 17 disposed at the bottom of the heat conductive base can dissipate heat, thereby improving the heat dissipation effect of the heat dissipation member 1. Alternatively, the heat conducting base is integrally formed with the heat dissipating ribs 17.

Optionally, the flow guide comprises: a flow guiding framework; and the flow guide ribs are in heat conduction contact with the flow guide framework.

As shown in fig. 1 and 2, a plurality of diversion ribs 122 are disposed on the diversion framework 121, and a plurality here may be understood as two or more. Optionally, the guide frame 121 of the guide member 12 is connected to the bottom of the groove 11. The flow direction of the working medium in the first working medium flow path from the liquid return port 14 to the gas outlet 13 is defined as the working medium flow direction, and the flow guiding framework 121 is parallel to the working medium flow direction. Optionally, the guide rib 122 is connected to the guide frame 121 in an inclined manner. The oblique connection is understood to mean that the guide rib 122 and the guide frame 121 form an acute angle or an obtuse angle.

Optionally, the diversion framework 121 is a strip with a certain thickness and a certain height, and the diversion fins 122 may also be a strip with a certain thickness, which is beneficial to the stability of the structure of the diversion fins 122, so that the diversion fins 122 are not deformed in the diversion process, and the diversion performance and the heat conduction performance of the diversion member 12 are not affected. Optionally, the length of the flow guiding frame 121 is greater than the length of the flow guiding rib 122, and the thickness of the flow guiding frame 121 is greater than the thickness of the flow guiding rib 122. Optionally, the flow guiding frame 121 includes a flow guiding head portion close to the liquid return port 14 and a flow guiding tail portion close to the air outlet 13, a direction from the flow guiding head portion to the flow guiding tail portion is a flow guiding direction of the flow guiding frame 121, and an included angle between the flow guiding rib 122 and the flow guiding direction is an acute angle. The arrangement of the flow guiding ribs 122 can make the working medium form turbulent flow in the first working medium flow path, thereby realizing effective heat transfer between the working medium and the flow guiding member 12 and improving the heat dissipation efficiency of the heat dissipation member 1.

Alternatively, the baffle frame 121 is divided into a first part close to the liquid return port 14 and a second part close to the air outlet 13, and it is understood that the baffle frame 121 is divided into two parts, namely a first part and a second part in the length direction, wherein the number of the baffle ribs 122 of the first part is larger than that of the baffle ribs 122 of the second part. Alternatively, the flow guiding ribs 122 on the flow guiding frame 121 gradually decrease along the flow guiding direction. The first part of the diversion framework 121 is close to the liquid return port 14, and the diversion fins 122 are more in number, so that the diversion fins 122 can better exchange heat with the liquid working medium; the liquid working medium after heat exchange becomes gaseous and is closer to the gas outlet 13, the number of the flow guide ribs 122 in the second part is small, the flow guide ribs 122 are prevented from blocking the gaseous working medium, the flowing space of the gaseous working medium is increased, the gaseous working medium can flow out from the gas outlet 13, and the heat dissipation efficiency of the heat dissipation member 1 is improved.

Optionally, the flow guiding element 12 may be prepared by forming relieved teeth on the side wall of the flow guiding frame 121, and bending the ribs obtained by the relieved teeth at a certain angle, so as to obtain the flow guiding element 12. That is, the flow guiding ribs 122 are formed by relieving the flow guiding frame 121, so that the contact heat between the flow guiding frame 121 and the flow guiding ribs 122 is greatly reduced, heat exchange between the flow guiding member 12 and the working medium is facilitated, and the heat dissipation effect of the heat dissipation member 1 is improved.

Optionally, the flow guiding frame 121 includes a first flow guiding sidewall 1211 and a second flow guiding sidewall opposite to each other, and the first flow guiding sidewall 1211 and the second flow guiding sidewall are both provided with flow guiding ribs 122, as shown in fig. 2, where the second flow guiding sidewall is opposite to the first flow guiding sidewall 1211, which is marked in fig. 2.

The flow guiding frame 121 includes a first flow guiding sidewall 1211 and a second flow guiding sidewall perpendicular to the bottom of the groove 11, the first flow guiding sidewall 1211 and the second flow guiding sidewall are both provided with flow guiding fins 122, so as to increase a contact area between the flow guiding member 12 and the working medium and improve a heat exchange effect of the heat dissipating member 1, and optionally, the number of the flow guiding fins 122 provided on the first flow guiding sidewall 1211 and the second flow guiding sidewall is the same. Optionally, the diversion framework 121 includes a plurality of setting points provided with diversion fins 122, and both ends of the first diversion sidewall 1211 and the second diversion sidewall of the setting points are provided with diversion fins 122, that is, the diversion fins 122 on the first diversion sidewall 1211 and the second diversion sidewall are symmetrically arranged, so as to obtain the diversion member 12 shaped like a fishbone, and improve the uniformity of heat exchange at both sides of the diversion member 12.

Optionally, the heat dissipating member 1 includes a plurality of flow guiding members 12, and the flow guiding skeletons 121 of the plurality of flow guiding members 12 are parallel to each other, so as to improve a guiding effect on the working medium in the first working medium flow path.

Alternatively, the first guide sidewall 1211 is provided with a plurality of guide ribs 122 parallel to each other, or the second guide sidewall is provided with a plurality of guide ribs 122 parallel to each other.

The plurality of guide ribs 122 disposed on the first guide sidewall 1211 and parallel to each other improve a guiding effect of the working medium flowing along the first guide sidewall 1211, and similarly, the plurality of guide ribs 122 disposed on the second guide sidewall and parallel to each other improve a guiding effect of the working medium flowing along the second guide sidewall.

Optionally, the heat dissipating member 1 further comprises a base cover 16 attached to the top surface of the thermally conductive base.

As shown in fig. 3, the heat conducting base includes a bottom surface where the bottom of the groove 11 is located and a top surface where the opening of the groove 11 is located, the heat dissipating member 1 further includes a base cover 16 connected to the top surface of the heat conducting base, and the base cover 16 covers the opening of the groove 11 to seal the top opening of the groove 11. It will be appreciated that the base cap 16 herein does not seal the aforementioned fluid return port 14 and air outlet port 13. The base cap 16 may be attached to the top surface of the thermally conductive base by welding or gluing with a thermally conductive adhesive. The base cover 16 can be in direct contact with a chip to be connected, the heat of the chip is transferred to the base cover 16 of the heat dissipation member 1 in a direct contact mode, the base cover 16 transfers the heat to the flow guide part 12 in the groove 11, the flow guide part 12 transfers the heat to a working medium in contact with the flow guide part 12, and the working medium is subjected to heat exchange to further exert a heat dissipation effect, or a heat dissipation fin 17 arranged at the bottom of the heat conduction base body is adopted for further heat dissipation. Optionally, the base cap 16 is the same size as the top or bottom surface of the thermally conductive base. Optionally, the base cap 16 is made of the same material as the thermally conductive base.

Optionally, the base cover 16 is provided with a connection hole for fixing the chip, which is matched with the threaded hole column. The connection may be made in such a manner that a screw is screwed with the inner side thread of the threaded hole post through the connection hole of the base cap 16.

Optionally, the height of the guide frame 121 is greater than or equal to the depth of the groove 11.

The guide frame 121 includes a connection end connected to the bottom of the groove 11, and a free end opposite to the connection end, and the height of the guide frame 121 may be understood as a vertical distance from the connection end to the free end. The height of water conservancy diversion skeleton 121 equals the degree of depth of recess 11 for the one end of water conservancy diversion skeleton 121 is connected with the bottom of recess 11, and the other end is connected with base lid 16, makes the heat of base lid 16 can effectual transmission to water conservancy diversion spare 12, has improved the heat transferability of radiating component 1. The height of the flow guiding framework 121 is greater than the depth of the groove 11, so that the flow guiding framework 121 and the base cover 16 form interference fit, the contact thermal resistance between the base cover 16 and the flow guiding element 12 is reduced, the base cover 16 and the flow guiding element 12 can be regarded as a whole, and the heat transfer performance between the base cover 16 and the flow guiding element 12 is improved.

The disclosed embodiment also provides a heat sink, which includes: the heat dissipation member as described above; the condensation end is provided with a second working medium flow path; and the communication pipeline is used for communicating the first working medium flow path of the heat dissipation member with the second working medium flow path of the condensation end.

As shown in fig. 3, the communication pipeline includes a gas communication pipeline 3 and a liquid communication pipeline 4, the gas communication pipeline 3 communicates the first working medium flow path and the second working medium flow path, and the liquid communication pipeline 4 communicates the first working medium flow path and the second working medium flow path. The aforementioned heat radiation member 1 may be referred to as an evaporation end, and the heat radiation member 1 is hereinafter referred to as an evaporation end.

The first working medium flow path in the evaporation end, the second working medium flow path in the condensation end 2, the gaseous communication pipeline 3 and the liquid communication pipeline 4 form a working medium loop, and the phase change working medium is filled in the working medium loop. The evaporation end, the condensation end 2 and the communicating pipeline form the radiator provided by the disclosed embodiment.

The heat dissipation method of the heat sink provided by the embodiment of the disclosure may be: the evaporation end receives heat from the chip, part of heat is dissipated through air cooling action of a fan or natural wind, heat which is not dissipated is absorbed by working media in a first working medium flow path of the evaporation end, the working media are quickly vaporized and taken away after being heated, the heat enters a second working medium flow path of the condensation end 2 through the gaseous communication pipeline 3, the condensation end 2 can simultaneously carry out air cooling heat dissipation and natural convection, gaseous working media in the second working medium flow path dissipate the heat through the condensation end 2, the working media are changed into liquid after the temperature of the working media is reduced, and the liquid working media flow back to the first working medium flow path of the evaporation end through the liquid communication pipeline 4 to carry out next circulation of changing heat absorption into gaseous state. Therefore, when the radiator provided by the embodiment of the disclosure is used for radiating, the heat can be radiated simultaneously through the evaporation end and the condensation end 2, so that the radiating capacity of the radiator is improved, the heat can be effectively dissipated, the smooth operation of the chip is ensured, and the operation reliability of the air conditioner is further ensured.

In the radiator provided by the embodiment of the disclosure, the first working medium flow path, the second working medium flow path, the gaseous communication pipeline 3 and the liquid communication pipeline 4 form a working medium loop, and a phase change working medium is filled in the working medium loop. Optionally, the radiator provided by the embodiment of the disclosure can be prepared through the preparation processes of welding, vacuumizing, working medium pouring and the like. The present embodiment is not limited to the type of the working medium, and may be, for example, a fluid capable of performing a phase change, such as a refrigerant. The embodiment does not specifically limit the filling amount of the working medium in the working medium circuit.

Optionally, the phase change working medium filled in the working medium loop may be a refrigerant, and the filling amount of the refrigerant may be 5-50g, such as 5g, 10g, 15g, 20g, 25g, 30g, 35g, 40g, 45g, and 50g, so that the self-circulation popularity of the phase change working medium in the working medium loop and the distribution uniformity of the phase change working medium in the first working medium flow path at the evaporation end are improved.

Alternatively, the material of the gas communication pipe 3 is metal, and similarly, the material of the liquid communication pipe 4 is metal.

Optionally, the condensation end is a tube and fin heat exchanger.

The fin-and-tube heat exchanger includes a plurality of radiating fins arranged side by side, and a heat conductive pipe 21 inserted into the plurality of radiating fins. The flow path inside the heat pipe 21 can be used as the aforementioned second working medium flow path. One end opening of the heat conduction pipe 21 communicates with the gas communication pipe, and the other end opening communicates with the liquid communication pipe. Alternatively, the heat conductive pipes 21 are copper pipes. The tube and fin heat exchanger further includes a first fin end plate 22 and a second fin end plate 23 for preventing deformation of the radiating fins. Optionally, the first fin end plate 22 and/or the second fin end plate 23 are provided with fixing through holes 231, and the fixing through holes 231 are used for fixing the tube-fin heat exchanger. Optionally, the thickness of the heat dissipation fins of the evaporation end is greater than or equal to the thickness of the heat dissipation fins of the condensation end.

The embodiment of the present disclosure also provides an air conditioner, which includes an outdoor unit of the air conditioner, wherein the outdoor unit of the air conditioner includes the radiator as described above.

As shown in fig. 4, the condensing end 2 of the heat sink is mounted at the fan bracket 6 of the outdoor unit, which is beneficial for the condensing end 2 to dissipate heat by using the fan of the outdoor unit, and improves the heat dissipation effect of the condensing end 2; optionally, the condensation end 2 is horizontally installed in the outdoor unit, so that the heat dissipation effect of the condensation end 2 is improved. Optionally, the evaporation end is installed inside the electric control box 7 or at the bottom of the electric control box 7, and the installation height of the evaporation end in the outdoor unit is lower than that of the condensation end 2 in the outdoor unit, so that a loop is formed between the evaporation end and the condensation end 2 by the working medium in the radiator, the flow rate of the working medium is improved, and the heat dissipation efficiency of the radiator is improved.

Claims (10)

1. A heat dissipating member comprising a thermally conductive base, the thermally conductive base comprising:

the groove forms a first working medium flow path;

the flow guide piece is arranged in the groove;

the air outlet is communicated with one end of the first working medium flow path;

and the liquid return port is communicated with the other end of the first working medium flow path.

2. The heat dissipating member according to claim 1,

the flow guide piece is arranged at the bottom of the groove.

3. The heat dissipating member of claim 1, wherein the flow guide comprises:

a flow guiding framework;

and the flow guide rib is in heat conduction contact with the flow guide framework.

4. The heat dissipating member of claim 3, wherein the air handling frame comprises first and second opposing air handling sidewalls,

the first flow guide side wall and the second flow guide side wall are both provided with flow guide ribs.

5. The heat dissipating member according to claim 4,

the first flow guide side wall is provided with a plurality of flow guide ribs which are parallel to each other, or,

the second flow guide side wall is provided with a plurality of flow guide ribs which are parallel to each other.

6. The heat dissipating member according to claim 3,

the height of the diversion framework is larger than or equal to the depth of the groove.

7. The heat dissipating member of claim 1, further comprising a base cap coupled to the top surface of the thermally conductive base.

8. A heat sink, comprising:

the heat dissipating member as claimed in any one of claims 1 to 7;

the condensation end is provided with a second working medium flow path; and the combination of (a) and (b),

and the communication pipeline is used for communicating the first working medium flow path of the heat dissipation member with the second working medium flow path of the condensation end.

9. The heat sink of claim 8,

and the condensation end is a tube-fin heat exchanger.

10. An air conditioner comprising an outdoor unit of an air conditioner, wherein the outdoor unit of the air conditioner comprises the heat sink of claim 8 or 9.

Images