CN210399236U - Radiating component, radiator and air conditioner - Google Patents
Radiating component, radiator and air conditioner Download PDFInfo
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- CN210399236U CN210399236U CN201921002594.4U CN201921002594U CN210399236U CN 210399236 U CN210399236 U CN 210399236U CN 201921002594 U CN201921002594 U CN 201921002594U CN 210399236 U CN210399236 U CN 210399236U
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Abstract
The application relates to the technical field of chip heat dissipation, discloses a heat radiation member, including the base member, the base member includes: an airflow heat dissipation unit configured to dissipate heat based on airflow flowing therethrough; the phase change heat dissipation part is provided with a working medium flow path through which a working medium can flow and is configured to perform phase change heat dissipation based on the working medium flow path. The application provides a radiating component's base member includes air current heat dissipation portion and phase transition heat dissipation portion simultaneously, and both have different heat-sinking capability, can carry out the pertinence heat dissipation to the chip that calorific capacity is different, have improved radiating component's radiating effect. The application also discloses a radiator and an air conditioner comprising the radiating component.
Description
Technical Field
The present application relates to the field of chip heat dissipation technologies, and for example, to a heat dissipation member, a heat sink, and an air conditioner.
Background
The chip of the outdoor unit of the air conditioner can generate a large amount of heat during operation, if the heat cannot be dissipated in time, the temperature of the chip can be continuously increased, the normal work of the chip is influenced, and even the operation stability and the service life of the air conditioner are influenced. At present, heat generated by a chip of an outdoor unit of an air conditioner is mostly dissipated by using a heat sink, such as a fin heat sink.
In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art: the existing radiator has poor radiating effect.
SUMMERY OF THE UTILITY MODEL
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.
The embodiment of the disclosure provides a heat dissipation component, a radiator and an air conditioner, so as to solve the technical problem that the heat dissipation effect of the radiator is not good.
In some embodiments, the heat dissipating member includes a base including: an airflow heat dissipation unit configured to dissipate heat based on airflow flowing therethrough; the phase change heat dissipation part is provided with a working medium flow path capable of flowing working media and is used for performing phase change heat dissipation based on the working medium flow path.
In some embodiments, the heat sink comprises a heat sink member as described above, provided with a first working fluid flow path; the condensation end is provided with a second working medium flow path; and the communication pipeline is used for communicating the first working medium flow path and the second working medium flow path.
In some embodiments, the air conditioner includes the aforementioned radiator.
The heat dissipation component, the radiator and the air conditioner provided by the embodiment of the disclosure can realize the following technical effects:
when the device needs to be controlled by a plurality of chips, the heat productivity of different chips is different. For example, the electric control board of the outdoor unit of the air conditioner is provided with a plurality of chips, wherein the frequency conversion module chip has more heat productivity and higher heat flux density.
In the process of implementing the embodiment of the present disclosure, it is found that the heat dissipation effect of the existing heat sink is not good, in part because the heat dissipation cannot be concentrated on the chip with a large heat flux density, which causes local overheating of the electronic control board and affects the heat dissipation effect.
The heat dissipation component provided by the embodiment of the disclosure comprises a substrate, wherein the substrate is provided with an airflow heat dissipation part and a phase change heat dissipation part, wherein the phase change heat dissipation part is internally provided with a working medium flow path for phase change heat dissipation, has strong heat dissipation capability, can dissipate heat of a chip with larger heat productivity, and improves the heat dissipation capability of high-density heat flow; the gas flow heat dissipation portion can dissipate heat of a chip with a small amount of heat based on the flow of gas. The heat dissipation component provided by the embodiment of the disclosure has different heat dissipation capabilities at different parts, can be used for pertinently and intensively dissipating heat of a chip with large heat productivity, and meanwhile, can dissipate heat of a chip with small heat productivity, thereby improving the heat dissipation effect.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:
fig. 1 is a schematic structural diagram of a heat dissipation member provided in an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a heat sink provided in an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of an outdoor unit of an air conditioner according to an embodiment of the present disclosure.
Reference numerals:
1: a heat dissipating member; 11: an airflow heat dissipation part; 111: a working medium channel; 12: a phase change heat dissipating section; 121: a working medium flow path; 122: a fin; 123: a through hole; 2: a condensing end; 3: a first communicating pipe; 4, a second communicating pipeline; 5: a chip; 6: a fan; 7: a blower bracket.
Detailed Description
So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.
The terms "first," "second," and the like, herein are used solely to distinguish one element from another without requiring or implying any actual such relationship or order between such elements. In practice, a first element can also be referred to as a second element, and vice versa. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a structure, apparatus, or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such structure, apparatus, or device. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a structure, device or apparatus that comprises the element. The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like herein, as used herein, are defined as orientations or positional relationships based on the orientation or positional relationship shown in the drawings, and are used for convenience in describing and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application. In the description herein, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may include, for example, mechanical or electrical connections, communications between two elements, direct connections, and indirect connections via intermediary media, where the specific meaning of the terms is understood by those skilled in the art as appropriate.
The disclosed embodiment provides a heat radiation member, including the base member, the base member includes: an airflow heat dissipation unit configured to dissipate heat based on airflow flowing therethrough; the phase change heat dissipation part is provided with a working medium flow path through which a working medium can flow and is configured to perform phase change heat dissipation based on the working medium flow path.
As shown in fig. 1, the heat dissipation member 1 provided by the embodiment of the present disclosure includes an airflow heat dissipation portion 11 and a phase change heat dissipation portion 12, where the airflow heat dissipation portion 11 is configured to dissipate heat of an element to be dissipated based on gas flowing through the airflow heat dissipation portion 11, for example, the element to be dissipated is dissipated by using convection gas generated by natural wind or wind of a fan flowing through the airflow heat dissipation portion 11; the phase change heat dissipation portion 2 is provided with a working medium flow path 121 capable of flowing a working medium, and is configured to perform phase change heat dissipation based on the working medium flow path 121, the working medium flowing through the working medium flow path 121 may be a phase change working medium, such as a refrigerant of an air conditioner, and the heat generated by a component to be cooled is taken away by the flowing working medium. Optionally, a working medium flow path 121 is disposed on a portion of the base of the heat dissipation member 1 to obtain the phase change heat dissipation portion 12, and the remaining portion of the base not disposed with the working medium flow path is the airflow heat dissipation portion 11.
Optionally, the heat dissipation method of the phase-change heat dissipation part 12 provided by the embodiment of the present disclosure is: the phase change heat dissipation part 12 receives heat of an element to be dissipated through a direct contact mode, the working medium flows in from one end of the working medium flow path 121 in the phase change heat dissipation part 12, phase change is carried out in the process of flowing through the whole working medium flow path 121, heat is absorbed, the working medium is changed into a gas state from a liquid state in the process, flows out from the other end of the working medium flow path 121, and the heat is taken away.
The base body of the heat dissipation member 1 provided in the embodiment of the present disclosure includes an airflow heat dissipation portion 11 and a phase change heat dissipation portion 12 having two heat dissipation capabilities, which have different heat dissipation capabilities, and can perform targeted heat dissipation on heat sources having different heat generation amounts in components to be dissipated. For example, the element to be radiated includes a first chip group with high heat generation and a second chip group with low heat generation, the first chip group is in heat conduction contact with the phase change heat dissipation part 12, the phase change heat dissipation part 12 is adopted to dissipate heat of the chips in the first chip group, the second chip group is in heat conduction contact with the airflow heat dissipation part 11, and the airflow heat dissipation part 11 is adopted to dissipate heat of the chips in the second chip group. The heat generation amount is obtained by comparing the heat generation amount with the heat generation amount, and the number of chips in the first chip set and the second chip set is not particularly limited, the number of chips in the first chip set may be one or more than one, and similarly, the number of chips in the second chip set may be one or more than one.
In the matrix of the heat dissipation member 1 provided by the embodiment of the present disclosure, the proportion of the airflow heat dissipation part 11 and the phase change heat dissipation part 12 on the matrix is not particularly limited, for example, the airflow heat dissipation part 11 occupies 1/4 to 3/4 of the matrix volume, the phase change heat dissipation part 12 occupies 1/4 to 3/4 of the matrix volume, optionally, the airflow heat dissipation part 11 occupies 1/3 of the matrix volume, the phase change heat dissipation part 12 occupies 2/3 of the matrix volume, optionally, the airflow heat dissipation part 11 occupies 1/2 of the matrix volume, and the phase change heat dissipation part 12 also occupies 1/2 of the matrix volume. The position of this disclosed embodiment to gas flow heat dissipation part 11 and phase transition heat dissipation part 12 at the base member does not do specific limitation, and is optional, gas flow heat dissipation part 11 sets up in a part of base member, and phase transition heat dissipation part 12 sets up in another part of base member, and is optional, gas flow heat dissipation part 11 includes two parts, set up respectively in the part at the both ends of base member, and phase transition heat dissipation part 12 sets up in the middle part of base member, and is optional, gas flow heat dissipation part 11 sets up in the part in the middle of the base member, and phase transition heat dissipation part 12 includes two parts, set up respectively in the part at the both ends of. Specifically, the heat generating capacity can be set according to the position of the chip and the size of the substrate, which have different heat generating capacities.
In this embodiment, the shape and the inner diameter of the working medium flow path 121 in the phase change heat dissipation portion 12 are not particularly limited, for example, the working medium flow path 121 may be linear, and the inner diameter of the working medium flow path 121 may be set according to the thickness of the substrate, for example, the inner diameter of the working medium flow path 121 is 4/5 or 3/4 of the thickness of the substrate. The number of working medium flow paths 121 in the embodiment of the present disclosure is not particularly limited, and may be any number of 2 to 20, such as 2, 4, 5, 6, 7, 8, 10, 12, 13, 15, 17, 20, and the like.
In some embodiments, working fluid flow path 121 may be a heat pipe disposed inside the substrate.
In some embodiments, working fluid flow path 121 is disposed through the interior of phase change heat sink 12.
The working medium flow path 121 is obtained by penetrating the substrate, that is, the working medium flow path 121 and the substrate are integrally formed, so that the heat conductivity of the working medium in the working medium flow path 121 and the substrate is improved, and the heat dissipation capability of the heat dissipation member 1 is improved. "through" is understood herein with respect to "damascene", e.g., a heat pipe is embedded within a substrate.
In some embodiments, the gas-flow heat sink 11 is integrally formed with the phase-change heat sink 12.
The term "integrally molded" as used herein means that the heat sink 11 and the phase change heat sink 12 are integrally molded. For example, the portion embedded with the heat pipe or penetrated with the working medium flow path 121 is the phase change heat dissipation portion 12 of the substrate, and the remaining portion not embedded with the heat pipe or penetrated with the working medium flow path is the airflow heat dissipation portion 11 of the substrate. The airflow heat dissipation part 11 and the phase change heat dissipation part 12 are integrally formed, so that the preparation process of the heat dissipation member 1 is simplified, and the heat dissipation capacity of the element to be dissipated is improved. Under the normal condition, a plurality of chips with different functions are all welded on the same electric control board, the airflow heat dissipation part 11 and the phase change heat dissipation part 12 are integrally formed, heat transfer can be carried out between the two heat dissipation parts, when the heat borne by one of the heat dissipation parts is large, the heat can be conducted to the other heat dissipation part for heat dissipation, for example, when the heat borne by the phase change heat dissipation part 12 is large and the heat cannot be dissipated in time, the airflow heat dissipation part 11 and the phase change heat dissipation part 12 are integrally formed, and partial heat can be transferred to the airflow heat dissipation part 11 for heat dissipation.
As shown in FIG. 1, in some embodiments, the base is stepped, the steps including adjacent low-level steps and high-level steps; the airflow heat dissipation part 11 is formed as a low-order step, and the phase change heat dissipation part 12 is formed as a high-order step.
When a plurality of chips are disposed on the same electronic control board, the thickness of the plurality of chips may be different, or some chips have special requirements, for example, some chips may not be in direct heat conduction contact with the heat dissipation member 1, and a certain safety distance needs to be set between the chips and the heat dissipation member 1. The base body provided by the embodiment of the disclosure is in a step shape, has two parts with different heights, and can be suitable for radiating chips with different thicknesses, or a certain safety distance can be provided between the base body of the radiating member 1 and a specific chip, and the specific chip at this time can be the chip which cannot be in direct contact with the radiating member 1.
Alternatively, the steps include adjacent low-order steps and high-order steps, wherein the airflow heat sink 11 constitutes the low-order steps and the phase-change heat sink 12 constitutes the high-order steps. The low-order step here can be understood as a portion of the base body having a smaller thickness, and the high-order step can be understood as a portion of the base body having a larger thickness. The substrate part with small thickness is used as the airflow heat dissipation part 11, so that heat dissipation is facilitated, the substrate part with large thickness is used as the phase change heat dissipation part 12, the arrangement of the working medium flow paths 121 in the substrate is facilitated, and the thickness and the number of the working medium flow paths 121 can be improved. Optionally, the thickness of the phase change heat dissipation part is 8-15mm, such as 8mm, 9mm, 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, and the thickness of the airflow heat dissipation part is 3-7mm, such as 3mm, 4mm, 5mm, 6mm, 7 mm.
In some embodiments, gas flow heat dissipation portion 11 is provided with working medium channel 111, and working medium channel 111 communicates with working medium flow path 121.
The air flow heat dissipation part 11 is provided with a working medium channel 111 communicated with the working medium flow path 121, and the working medium in the working medium flow path 121 can flow into or out of the substrate through the working medium channel 111. The working medium channel 111 can be directly used as a pipeline for working medium to flow, at this time, the inner diameter of the working medium channel 111 can be the same as the inner diameter of the working medium flow path 121 in the phase change heat dissipation part, or the working medium channel 111 is perpendicular to the working medium flow path 121, or an acute angle or an obtuse angle is formed between the working medium channel 121 and the working medium flow path 111. The working medium channel 111 can also be used as a dredging channel of the communicating pipeline for accommodating the communicating pipeline. The working medium channel 111 is in communication with the working medium flow path 121, and may be that the working medium channel 111 is in direct communication with the working medium flow path 121, or, when the working medium flow path 121 has a plurality of channels, the plurality of working medium flow paths 121 have a confluence flow path, and the working medium channel 111 is in direct communication with the confluence flow path of the working medium flow path 121.
In some embodiments, the working fluid passages include a first working fluid passage and a second working fluid passage; the first working medium channel is communicated with one end of the working medium flow path 121, and the second working medium channel is communicated with the other end of the working medium flow path 121.
In general, the working medium in the working medium flow path 121 needs to circularly flow in the working medium flow path 121 to exert the heat dissipation capability of the phase change heat dissipation part, and this "circular flow" requires that the working medium flow path 121 has two ports, i.e., an inlet and an outlet, of the working medium. When the working medium channel 111 includes a first working medium channel and a second working medium channel, the first working medium channel may be communicated with one end of the working medium flow path 121, such as an inlet end, and the second working medium channel may be communicated with the other end of the working medium flow path 121, such as an outlet end, so as to improve the circulation fluidity of the working medium.
As shown in FIG. 1, in some embodiments, working fluid passage 111 is a groove configured to receive a communication conduit in communication with a working fluid flow path.
When the working medium channel 111 is used for accommodating a communication pipeline communicated with a working medium flow path, the base body of the heat dissipation member 1 is in a step shape, the airflow heat dissipation part 11 forms a low-order step, and when the thickness of the airflow heat dissipation part 11 is smaller, the working medium channel 111 of the airflow heat dissipation part 11 can be set to be in a groove shape, at the moment, part of the communication pipeline is positioned in the groove, and part of the communication pipeline is exposed outside the base body.
In some embodiments, the grooves are semi-circular in cross-section.
Optionally, the size of the groove is defined as the size of the outer surface of the communication conduit received. When the outer surface of the communicating pipeline is circular, the cross section of the groove is semicircular, and the groove can be better matched with the communicating pipeline, as shown in figure 1.
Optionally, when the number of the working medium flow paths 121 of the phase change heat dissipation portion 12 of the substrate is two or more, the phase change heat dissipation portion 12 is provided with a confluence portion or a confluence piece for converging the two or more working medium flow paths 121, and the working medium channel 111 is communicated with the confluence portion or the confluence piece.
Optionally, as shown in fig. 1, one or more fins 122 are further disposed on the base of the heat dissipation member 1, and optionally, the base and the fins are integrally formed. Optionally, the fins have a thickness of 1.0-2.0mm, e.g., 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, 2.0 mm. Optionally, the height of the fin is 30-50mm, for example, 30mm, 32mm, 34mm, 36mm, 38mm, 40mm, 42mm, 44mm, 46mm, 48mm, 50mm, and the height of the fin is defined as that one end of the fin directly contacting with the substrate is a connection end, one end of the fin not contacting with the substrate is a free end, and the height of the fin is the length from the connection end to the free end, or the perpendicular distance between the connection end and the free end.
Alternatively, the base body of the heat dissipation member 1 is provided with a connection hole 123, as shown in fig. 1. Optionally, the number of the connection holes is one or more, for example, the number of the connection holes 123 is the same as the number of the chips to be cooled. Optionally, the connection hole 123 is arranged to be away from the working medium flow path 121, or the connection hole 123 is arranged to be away from the fin 122. Optionally, the connection hole 123 is an internal threaded hole.
The disclosed embodiment also provides a heat sink, which includes: the heat dissipation member is provided with a first working medium flow path; the condensation end is provided with a second working medium flow path; and the communication pipeline is arranged to communicate the first working medium flow path and the second working medium flow path.
As shown in fig. 2, the heat sink provided by the embodiment of the present disclosure includes the aforementioned heat dissipating member 1, a condensation end 2 and a communication pipeline. The heat dissipation member 1 can be used as an evaporation end of a heat sink, and the working medium flow path 121 in the phase change heat dissipation portion 12 of the substrate of the heat dissipation member 1 is the first working medium flow path. The communication line may include a first communication line 3 and a second communication line 4.
The heat dissipation method of the heat sink to the heat dissipation element provided by the embodiment of the disclosure can be as follows: the heat dissipation member 1 serves as an evaporation end, receives heat from an element to be dissipated, dissipates part of the heat through air cooling action of a fan or natural wind, such as part of heat of the airflow heat dissipation part 11 and part of heat of the phase change heat dissipation part 12, the heat which is not dissipated by the phase change heat dissipation part 12 is absorbed by a working medium in the first working medium flow path, the working medium is quickly vaporized and takes away the heat after being heated, the working medium enters the second working medium flow path of the condensation end 2 through the first communication pipeline 3, the condensation end 2 can simultaneously perform air cooling heat dissipation and natural convection, gaseous working medium in the second working medium flow path dissipates the heat through the condensation end 2, the gaseous working medium is changed into liquid after the temperature is reduced, and the liquid working medium flows back into the first working medium flow path of the heat dissipation member 1 through the second communication pipeline 4 to perform next cycle of changing. Therefore, when the radiator provided by the embodiment of the disclosure is used for radiating the element to be radiated, the element to be radiated can be radiated simultaneously through the radiating member 1 and the condensing end 2, so that the radiating capacity of the radiator is improved, heat generated by the element to be radiated can be effectively dissipated, the smooth operation of the element to be radiated is ensured, and the operation reliability of the air conditioner is further ensured.
In the radiator provided by the embodiment of the disclosure, the first working medium flow path, the second working medium flow path, the first communicating pipeline 3 and the second communicating pipeline 4 form a working medium loop, and a phase change working medium is filled in the working medium loop. Optionally, the radiator provided by the embodiment of the disclosure can be prepared through the preparation processes of welding, vacuumizing, working medium pouring and the like. The present embodiment is not limited to the type of the working medium, and may be, for example, a fluid capable of performing a phase change, such as a refrigerant. The embodiment does not specifically limit the filling amount of the working medium in the working medium circuit.
Optionally, the first communicating pipe 3 is made of metal, and similarly, the second communicating pipe 4 is made of metal.
Optionally, the condensation end 2 may be a temperature equalization plate, for example, an inflation type temperature equalization plate, and is formed by laminating two layers of aluminum plates, and a second working medium flow path communicated with each other is arranged inside the condensation end. The condensation end 2 provided with the second working medium pipeline has the functions of the working medium pipeline and the radiating fin, can perform natural convection and air cooling radiation simultaneously, and has the advantages of high heat transfer capacity, high heat conductivity, light weight and the like.
The embodiment of the disclosure also provides an air conditioner comprising the radiator.
The air conditioner comprises an air conditioner indoor unit and an air conditioner outdoor unit, wherein the air conditioner outdoor unit is shown in fig. 3, and the installation positions of the radiator in the air conditioner outdoor unit can be as follows: the heat dissipation component 1 of the heat sink is in contact with the chip 5, and obtains the heat of the chip 5 in a direct contact manner, so as to dissipate the heat.
Optionally, the condensation end 2 may be mounted on a fan bracket 7 of the outdoor unit of the air conditioner, and compared with the existing mounting on the side of the fan 6, the mounting position provided by this embodiment has a larger space in the outdoor unit of the air conditioner, so as to increase the heat dissipation area of the heat sink, and the airflow on the upper portion of the fan 6 flows more smoothly, thereby further improving the heat dissipation capability of the condensation end 2.
Claims (10)
1. A heat dissipating member comprising a base body, the base body comprising:
an airflow heat dissipation unit configured to dissipate heat based on airflow flowing therethrough;
the phase change heat dissipation part is provided with a working medium flow path capable of flowing working media and is used for performing phase change heat dissipation based on the working medium flow path.
2. The heat dissipating member according to claim 1, wherein the working fluid flow path is provided through the inside of the phase change heat dissipating portion.
3. The heat dissipating member according to claim 1, wherein the airflow heat dissipating portion is integrally molded with the phase change heat dissipating portion.
4. The heat dissipating member according to any one of claims 1 to 3, wherein the base body is stepped, the step comprising a lower step and an upper step adjacent to each other;
wherein the airflow heat dissipation part forms the low-order step, and the phase change heat dissipation part forms the high-order step.
5. The heat dissipating member according to claim 4, wherein the heat dissipating portion is provided with a working medium passage, the working medium passage communicating with the working medium flow path.
6. The heat sink member of claim 5, wherein the working fluid channel comprises a first working fluid channel and a second working fluid channel;
the first working medium channel is communicated with one end of the working medium flow path, and the second working medium channel is communicated with the other end of the working medium flow path.
7. The heat sink member of claim 5, wherein the working fluid passage is a groove configured to receive a communication conduit communicating with the working fluid flow path.
8. The heat dissipating member according to claim 7,
the cross section of the groove is semicircular.
9. A heat sink, comprising:
the heat dissipating member of any of claims 1-8, provided with a first working fluid flow path;
the condensation end is provided with a second working medium flow path;
and the communication pipeline is used for communicating the first working medium flow path and the second working medium flow path.
10. An air conditioner characterized by comprising the radiator as claimed in claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921002594.4U CN210399236U (en) | 2019-06-28 | 2019-06-28 | Radiating component, radiator and air conditioner |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921002594.4U CN210399236U (en) | 2019-06-28 | 2019-06-28 | Radiating component, radiator and air conditioner |
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| CN210399236U true CN210399236U (en) | 2020-04-24 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111578391A (en) * | 2020-04-27 | 2020-08-25 | 青岛海尔空调器有限总公司 | Radiator and air condensing units |
| CN111578392A (en) * | 2020-04-27 | 2020-08-25 | 青岛海尔空调器有限总公司 | Radiator and air condensing units |
-
2019
- 2019-06-28 CN CN201921002594.4U patent/CN210399236U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111578391A (en) * | 2020-04-27 | 2020-08-25 | 青岛海尔空调器有限总公司 | Radiator and air condensing units |
| CN111578392A (en) * | 2020-04-27 | 2020-08-25 | 青岛海尔空调器有限总公司 | Radiator and air condensing units |
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