CN112146178A - Radiating component, radiator and air conditioner - Google Patents

Abstract

The application relates to the technical field of chip heat dissipation, discloses a heat radiation member, including the base member, the base member includes: an airflow heat dissipation unit configured to dissipate heat based on airflow flowing therethrough; the phase change heat dissipation part is provided with a working medium flow path through which a working medium can flow and is configured to perform phase change heat dissipation based on the working medium flow path. The application provides a radiating component's base member includes air current heat dissipation portion and phase transition heat dissipation portion simultaneously, and both have different heat-sinking capability, can carry out the pertinence heat dissipation to the chip that calorific capacity is different, have improved radiating component's radiating effect. The application also discloses a radiator and an air conditioner comprising the radiating component.

Description

Heat-dissipating components, radiators and air conditioners

technical field

The present application relates to the technical field of chip heat dissipation, for example, to a heat dissipation member, a radiator and an air conditioner.

Background technique

The chip of the outdoor unit of the air conditioner will generate a lot of heat during operation. If the heat cannot be dissipated in time, the temperature of the chip will continue to rise, which will affect the normal operation of the chip, and even affect the operating stability and life of the air conditioner. At present, radiators, such as finned radiators, are mostly used to dissipate heat generated by the chips of the outdoor unit of the air conditioner.

In the process of implementing the embodiments of the present disclosure, it is found that there are at least the following problems in the related art: the heat dissipation effect of the current radiator is not good.

SUMMARY OF THE INVENTION

In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended to be an extensive review, nor to identify key/critical elements or delineate the scope of protection of these embodiments, but rather serves as a prelude to the detailed description that follows.

Embodiments of the present disclosure provide a heat dissipation member, a radiator and an air conditioner to solve the technical problem of poor heat dissipation effect of the radiator.

In some embodiments, the heat dissipation member includes a base body, and the base body includes: an air flow heat dissipation part configured to dissipate heat based on the air flowing therethrough; a phase change heat dissipation part provided with a working medium flow path capable of circulating a working medium, It is configured to perform phase change heat dissipation based on the working medium flow path.

In some embodiments, the radiator includes the aforementioned heat dissipation member, which is provided with a first working medium flow path; a condensation end, which is provided with a second working medium flow path; and a communication pipeline, which is set to communicate with the first working medium. The working medium flow path and the second working medium flow path.

In some embodiments, the air conditioner includes the aforementioned radiator.

A heat dissipation member, a radiator and an air conditioner provided by the embodiments of the present disclosure can achieve the following technical effects:

When the device needs to use multiple chips for control, the heat generation of different chips is different. For example, the electric control board of the outdoor unit of the air conditioner is provided with multiple chips, among which, the frequency conversion module chip generates more heat and has a greater heat flux density.

In the process of implementing the embodiments of the present disclosure, it is found that the heat dissipation effect of the existing heat sink is not good. Part of the reason is that the heat dissipation of the chip with a large heat flow density cannot be centralized, which leads to local overheating of the electric control board and affects the heat dissipation effect.

The heat dissipation component provided by the embodiment of the present disclosure includes a base body, and an airflow heat dissipation part and a phase change heat dissipation part are arranged on the base body, wherein the phase change heat dissipation part is provided with a working medium flow path for performing phase change heat dissipation, and has strong heat dissipation capability and can be used for heat dissipation. The heat dissipation of the chip with a large amount of heat improves the heat dissipation capability of the high-density heat flow; the airflow heat dissipation part can dissipate the heat of the chip with a small amount of heat based on the flow of the gas. The heat dissipation member provided by the embodiment of the present disclosure has different heat dissipation capabilities at different parts, and can focus heat dissipation on chips with large heat generation, while taking into account the heat dissipation of chips with small heat generation, thereby improving the heat dissipation effect.

The foregoing general description and the following description are exemplary and explanatory only and are not intended to limit the application.

Description of drawings

One or more embodiments are exemplified by the accompanying drawings, which are not intended to limit the embodiments, and elements with the same reference numerals in the drawings are shown as similar elements, The drawings do not constitute a limitation of scale, and in which:

1 is a schematic structural diagram of a heat dissipation member provided by an embodiment of the present disclosure;

2 is a schematic structural diagram of a heat sink provided by an embodiment of the present disclosure;

FIG. 3 is a schematic structural diagram of an outdoor unit of an air conditioner provided by an embodiment of the present disclosure.

Reference number:

1: heat dissipation member; 11: airflow heat dissipation part; 111: working medium channel; 12: phase change heat dissipation part; 121: working medium flow path; 122: fin; 123: through hole; 2: condensation end; 3: first Connecting pipeline; 4: Second connecting pipeline; 5: Chip; 6: Fan; 7: Fan bracket.

Detailed ways

In order to have a more detailed understanding of the features and technical contents of the embodiments of the present disclosure, the implementation of the embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. In the following technical description, for the convenience of explanation, numerous details are provided to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawings.

Herein, the terms "first," "second," etc. are only used to distinguish one element from another, and do not require or imply any actual relationship or order between the elements. In fact the first element can also be called the second element and vice versa. Furthermore, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a structure, device or device comprising a list of elements includes not only those elements, but also others not expressly listed elements, or elements inherent to such structures, devices, or equipment. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in the structure, apparatus or device that includes the element. The various embodiments herein are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and it is sufficient to refer to each other for the same and similar parts between the various embodiments.

The terms "portrait", "landscape", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top", " The orientation or positional relationship indicated by "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the text and simplifying the description, rather than indicating or implying that the indicated device or element must be It has a specific orientation, is constructed and operates in a specific orientation, and therefore should not be construed as a limitation of the present application. In the description herein, unless otherwise specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a mechanical connection or an electrical connection, or it may be the internal communication between two elements, It can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific situations.

The embodiment of the present disclosure provides a heat dissipation member, including a base body, the base body includes: an air flow heat dissipation part, which is configured to dissipate heat based on the air flowing therethrough; Set to phase change heat dissipation based on the working fluid flow path.

As shown in FIG. 1 , the heat dissipation member 1 provided by the embodiment of the present disclosure includes both an air flow heat dissipation part 11 and a phase change heat dissipation part 12 , wherein the air flow heat dissipation part 11 is set to be a heat dissipation element based on the gas flowing through the air flow heat dissipation part 11 . For heat dissipation, for example, the convective gas generated by the natural wind or the wind of the fan flowing through the airflow heat dissipation part 11 is used to dissipate heat from the heat dissipation element; Based on the phase change heat dissipation of the working medium flow path 121, the working medium flowing in the working medium flow path 121 can be a phase change working medium, such as a refrigerant of an air conditioner, etc., and the flowing working medium is used to take away the heat generated by the element to be radiated. Optionally, a working fluid flow path 121 is provided on the base portion of the heat dissipation member 1 to obtain a phase change heat dissipation portion 12 , and the remaining portion of the base body without the working medium flow path is the airflow heat dissipation portion 11 .

Optionally, the heat dissipation method of the phase change heat dissipation part 12 provided by the embodiment of the present disclosure is as follows: the phase change heat dissipation part 12 receives the heat of the element to be dissipated by direct contact, and the working medium flows from the working medium in the phase change heat dissipation part 12 . One end of the flow path 121 flows into the flow path 121 and undergoes a phase change during the process of flowing through the entire working medium flow path 121, absorbing heat. take away.

The base body of the heat dissipation member 1 provided in the embodiment of the present disclosure simultaneously includes an airflow heat dissipation part 11 and a phase change heat dissipation part 12 with two heat dissipation capabilities. heat source for targeted cooling. For example, the components to be dissipated include a first chip set with high heat generation and a second chip set with low heat generation, the first chip set is thermally contacted with the phase change heat dissipation part 12, and the phase change heat dissipation part 12 is used to radiate heat from the first chip set The chips in the second chip group are dissipated, and the two chip groups are in thermal contact with the airflow heat dissipation part 11 , and the airflow heat dissipation part 11 is used to dissipate heat from the chips in the second chip group. The high and low heat production here are obtained by comparing each other, and the number of chips in the first chipset and the second chipset is not specifically limited, and the number of chips in the first chipset may be one or more than one. Similarly, the number of chips in the second chipset may be one or more than one.

In the base body of the heat dissipation member 1 provided by the embodiment of the present disclosure, the proportions of the airflow heat dissipation part 11 and the phase change heat dissipation part 12 on the base body are not specifically limited, for example, the airflow heat dissipation part 11 accounts for 1/4-3 of the volume of the base body /4, the phase change heat dissipation part 12 occupies 1/4-3/4 of the volume of the base body. Optionally, the airflow heat dissipation part 11 occupies 1/3 of the volume of the base body, and the phase change heat dissipation part 12 occupies 2/3 of the volume of the base body. Optionally, the airflow heat dissipation part 11 occupies 1/2 of the volume of the base body, and the phase change heat dissipation part 12 also occupies 1/2 of the volume of the base body. The embodiments of the present disclosure do not specifically limit the positions of the airflow heat dissipation part 11 and the phase change heat dissipation part 12 on the base body. Optionally, the airflow radiating portion 11 includes two parts, which are respectively arranged at the two ends of the base body, and the phase-change radiating portion 12 is arranged at the middle portion of the base body. The variable heat sink 12 includes two parts, parts respectively provided at both ends of the base body, and the like. Specifically, it can be set according to the position of the chip with different heat generating capacity and the size of the substrate.

In this embodiment, the shape and inner diameter of the working medium flow path 121 in the phase change heat dissipation part 12 are not specifically limited. For example, the working medium flow path 121 may be linear, and the inner diameter of the working medium flow path 121 may be determined according to the thickness of the substrate. It is set, for example, that the inner diameter of the working medium flow path 121 is 4/5 or 3/4 of the thickness of the substrate. The embodiment of the present disclosure does not specifically limit the number of working medium flow paths 121 , for example, it can be any value from 2 to 20, such as 2, 4, 5, 6, 7, 8, 10, 12, 13, 15, 17 , 20, etc.

In some embodiments, the working medium flow path 121 may be a heat pipe disposed inside the substrate.

In some embodiments, the working medium flow path 121 is disposed through the inside of the phase change heat dissipation part 12 .

The working fluid passage 121 is obtained by penetrating the base body, that is, the working fluid passage 121 and the base body are integrally formed, which improves the thermal conductivity of the working fluid and the base body in the working fluid passage 121 and improves the heat dissipation capability of the heat dissipation member 1 . The "penetration" here can be understood relative to "inlay", for example, the heat pipe is inlaid in the base.

In some embodiments, the airflow heat dissipation part 11 and the phase change heat dissipation part 12 are integrally formed.

The "integrated molding" here can be understood as that the airflow heat dissipation part 11 and the phase change heat dissipation part 12 are integrated. For example, the part where the heat pipe is embedded or penetrates the working medium flow path 121 is the phase change heat dissipation part 12 of the base body, and the remaining parts without heat pipe embedding or passing through the working medium flow path are the air flow heat dissipation part 11 of the base body. The airflow heat dissipation part 11 and the phase change heat dissipation part 12 are integrally formed, which simplifies the preparation process of the heat dissipation member 1 and improves the heat dissipation capability of the heat dissipation element. Usually, multiple chips with different functions are soldered on the same electronic control board, the airflow heat dissipation part 11 and the phase change heat dissipation part 12 are integrally formed, and heat can be transferred between the two heat dissipation parts. When the heat received by one part is large, it can be conducted to another heat dissipation part for heat dissipation. For example, when the heat received by the phase change heat dissipation part 12 is large and it is too late to dissipate the heat in time, the airflow heat dissipation part 11 and the phase change heat dissipation part 12 It is integrally formed, and part of the heat can be transferred to the airflow heat dissipation part 11 for heat dissipation.

As shown in FIG. 1 , in some embodiments, the base body is in the shape of steps, and the steps include adjacent low-step steps and high-step steps; wherein, the airflow heat dissipation portion 11 forms a low-step step, and the phase-change heat-dissipating portion 12 forms a high-step step .

When there are multiple chips on the same electronic control board, the thickness of the multiple chips may be different, or some chips have special requirements, for example, some chips cannot be in direct thermal contact with the heat dissipation member 1, and need to Set a certain safe distance. The base body provided in the embodiment of the present disclosure is in a stepped shape and has two parts with different heights, which can be suitable for heat dissipation of chips with different thicknesses, or can make a certain safety distance between the base body of the heat dissipation member 1 and a specific chip, The specific chip at this time may be the aforementioned chip that cannot be in direct contact with the heat dissipation member 1 .

Optionally, the steps include adjacent low-level steps and high-level steps, wherein the airflow heat dissipation portion 11 constitutes a low-level step, and the phase-change heat dissipation portion 12 constitutes a high-level step. The low-order step here can be understood as the part with a smaller thickness in the base body, and the high-order step can be understood as the part with a larger thickness in the base body. The base part with a smaller thickness is used as the air flow heat dissipation part 11, which is beneficial to the dissipation of heat, and the base part with a larger thickness is used as the phase change heat dissipation part 12, which is conducive to the setting of the working medium flow path 121 in the base, which can improve the working medium flow. The thickness and number of channels 121 , for example, the working medium flow channels 121 in the phase change heat sink 12 can be provided with two or more layers, which increases the number of working medium flow channels 121 and improves the heat dissipation capability of the phase change heat sink 12 . Optionally, the thickness of the phase change heat dissipation part is 8-15mm, such as 8mm, 9mm, 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, and the thickness of the airflow heat dissipation part is 3-7mm, such as 3mm, 4mm, 5mm, 6mm , 7mm.

In some embodiments, the airflow cooling part 11 is provided with a working medium channel 111 , and the working medium channel 111 communicates with the working medium flow path 121 .

The airflow radiating part 11 is provided with a working medium channel 111 that communicates with the working medium flow channel 121 , and the working medium in the working medium flow channel 121 can flow into or out of the substrate through the working medium channel 111 . The working fluid channel 111 here can be directly used as a pipeline for working fluid. In this case, the inner diameter of the working fluid channel 111 can be the same as the inner diameter of the working fluid channel 121 in the phase change heat dissipation part, or the working fluid channel 111 and the working fluid channel 111. The mass flow path 121 is vertical, or an acute angle or an obtuse angle is formed between the working medium channel 121 and the working medium flow path 111 . The working fluid channel 111 can also be used as a dredging channel for the communication pipeline to accommodate the communication pipeline. Here, the working medium channel 111 is communicated with the working medium flow channel 121, and the working medium channel 111 may be directly communicated with the working medium flow channel 121, or, when there are multiple working medium flow channels 121, there are multiple working medium flow channels. 121 has a confluence flow path, and the working medium channel 111 is in direct communication with the confluence flow path of the working medium flow path 121 .

In some embodiments, the working medium channel includes a first working medium channel and a second working medium channel; wherein the first working medium channel is communicated with one end of the working medium flow channel 121 , and the second working medium channel is connected with the working medium flow channel 121 connected to the other end.

Under normal circumstances, the working medium in the working medium flow path 121 needs to circulate in the working medium flow path 121 to exert the heat dissipation capability of the phase change heat dissipation part. Ingress and egress two ports. When the working medium channel 111 includes a first working medium channel and a second working medium channel, the first working medium channel can be communicated with one end of the working medium flow path 121, such as the inlet end, and the second working medium channel can be connected with the working medium flow channel 121. The other end of the road 121 is connected, such as the outlet end, so as to improve the circulating fluidity of the working medium.

As shown in FIG. 1 , in some embodiments, the working medium channel 111 is a groove, and the groove is configured to accommodate a communication pipeline that communicates with the working medium flow path.

When the working fluid channel 111 is used for accommodating the communication pipeline that communicates with the working fluid flow path, and the base of the heat dissipation member 1 is stepped, the airflow heat dissipation part 11 forms a low-level step, and the thickness of the airflow heat dissipation part 11 is small, the airflow The working fluid channel 111 of the heat dissipation part 11 is set in a groove shape. At this time, part of the communication pipeline is located in the groove, and part of the communication pipeline is exposed outside the base body. At this time, the accommodating effect of the communication pipeline can be realized. In addition, the exposed communication pipeline can be brought into contact with the electric control board to receive the force of the electric control board, so that part of the electric control board will not be suspended.

In some embodiments, the grooves are semicircular in cross-section.

Optionally, the size of the groove is defined as the size of the outer surface of the received communication conduit. When the outer surface of the communication pipeline is circular, the shape of the cross section of the groove is a semicircle, which can better fit the communication pipeline, as shown in FIG. 1 .

Optionally, when the number of working medium flow paths 121 of the phase change heat dissipation part 12 of the base body is two or more, the phase change heat dissipation part 12 is provided with two or more working medium flow paths 121 for confluence. The confluence part or the confluence piece, the working fluid channel 111 communicates with the confluence part or the confluence piece.

Optionally, as shown in FIG. 1 , the base body of the heat dissipation member 1 is further provided with one or more fins 122 . Optionally, the base body and the fins are integrally formed. Optionally, the thickness of the fins is 1.0-2.0mm, for example, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, 1.6mm, 1.7mm, 1.8mm, 1.9mm, 2.0mm. Optionally, the height of the fin is 30-50mm, for example, 30mm, 32mm, 34mm, 36mm, 38mm, 40mm, 42mm, 44mm, 46mm, 48mm, 50mm. The contact end is the connection end, the end of the fin not in contact with the base is the free end, and the height of the fin is the length from the connection end to the free end, or the vertical distance between the connection end and the free end.

Optionally, the base body of the heat dissipation member 1 is provided with connection holes 123 , as shown in FIG. 1 . Optionally, the number of connection holes is one or more, for example, the number of connection holes 123 is the same as the number of chips to be dissipated. Optionally, the connection holes 123 are arranged to avoid the working medium flow path 121 , or the connection holes 123 are arranged to avoid the fins 122 . Optionally, the connecting hole 123 is an internal thread hole.

The embodiment of the present disclosure also provides a radiator, including: the aforementioned heat dissipation member, provided with a first working medium flow path; a condensation end, provided with a second working medium flow path; a communication pipeline, which is set to communicate with the first working medium The working medium flow path and the second working medium flow path.

As shown in FIG. 2 , the radiator provided by the embodiment of the present disclosure includes the aforementioned heat dissipation member 1 , a condensation end 2 and a communication pipeline. The heat dissipation member 1 can be used as the evaporation end of the heat sink, and the working medium flow path 121 in the phase change heat dissipation portion 12 of the base of the heat dissipation member 1 is the first working medium flow path here. The communication line may include a first communication line 3 and a second communication line 4 .

A method for dissipating heat from the element to be dissipated by using the heat sink provided by the embodiment of the present disclosure may be as follows: the heat dissipating member 1 serves as an evaporating end, receives heat from the element to be dissipated, and dissipates part of the heat through the air cooling effect of a fan or natural wind, such as airflow dissipating heat. The heat of the heat dissipation part 11 and part of the heat of the phase change heat dissipation part 12, the heat not dissipated by the phase change heat dissipation part 12 is absorbed by the working medium in the first working medium flow path. A communication pipeline 3 enters the second working medium flow path of the condensing end 2. The condensing end 2 can perform air cooling and natural convection at the same time. The gaseous working medium in the second working medium flow path dissipates heat through the condensing end 2, reducing the After the temperature, it becomes liquid, and the liquid working medium flows back into the first working medium flow path of the heat dissipation member 1 through the second communication pipeline 4 to perform the next cycle of absorbing heat and turning into a gaseous state. It can be seen that when the heat sink provided by the embodiment of the present disclosure is used to dissipate heat from the heat dissipation element, the heat dissipation member 1 and the condensation end 2 can be used to dissipate heat from the heat dissipation element at the same time, which improves the heat dissipation capability of the heat sink and can dissipate the heat generated by the heat dissipation element. The effective dissipation ensures the smooth operation of the components to be radiated, thereby ensuring the reliability of the operation of the air conditioner.

In the radiator provided by the embodiment of the present disclosure, the first working medium flow path, the second working medium flow path, the first communication line 3 and the second communication line 4 constitute a working medium loop, and the working medium loop is filled with phase change Working quality. Optionally, the heat sink provided in the embodiment of the present disclosure may be prepared through a preparation process such as welding, vacuuming, and pouring a working medium. The type of the working medium is not specifically limited in this embodiment, for example, it may be a fluid that can undergo phase change, such as a refrigerant. This embodiment does not specifically limit the filling amount of the working medium in the working medium circuit.

Optionally, the material of the first communication pipeline 3 is metal, and similarly, the material of the second communication pipeline 4 is metal.

Optionally, the condensing end 2 may be a temperature equalizing plate, for example, an inflatable temperature equalizing plate, which is formed by pressing two layers of aluminum plates, and is provided with a second working medium flow path that communicates with each other. The condensing end 2 of the second working medium pipeline is arranged, and it has the functions of working medium pipeline and heat sink at the same time, which can carry out natural convection and air-cooling heat dissipation at the same time, and has the advantages of high heat transfer capacity, high thermal conductivity and light weight.

The embodiments of the present disclosure also provide an air conditioner including the aforementioned radiator.

The air conditioner includes an air conditioner indoor unit and an air conditioner outdoor unit. The air conditioner outdoor unit is shown in Figure 3. The installation position of the radiator in the air conditioner outdoor unit can be: the heat dissipation member 1 of the radiator is in contact with the chip 5. In this way, the heat of the chip 5 is obtained, and then the heat is dissipated.

Optionally, the condensing end 2 can be installed on the fan support 7 of the outdoor unit of the air conditioner. Compared with the existing installation on the side of the fan 6, the installation position provided in this embodiment has a larger space in the outdoor unit of the air conditioner, which increases The heat dissipation area of the radiator and the air flow on the upper part of the fan 6 are smoother, which further improves the heat dissipation capacity of the condensing end 2 .

Claims (10)

1. A heat-dissipating component, characterized in that it comprises a base, the base comprising: The airflow cooling part is configured to dissipate heat based on the airflow passing through; The phase-change heat dissipation unit is provided with a working medium flow channel through which a working medium can flow, and is provided to perform phase change heat dissipation based on the working medium flow channel. 2 . The heat dissipating member according to claim 1 , wherein the working medium flow path is arranged through the inside of the phase change heat dissipating part. 3 . 3 . The heat dissipation member according to claim 1 , wherein the airflow heat dissipation portion and the phase change heat dissipation portion are integrally formed. 4 . 4. The heat dissipating member according to any one of claims 1 to 3, wherein the base body is in the shape of a step, and the step comprises adjacent low-step steps and high-step steps; Wherein, the airflow heat dissipation part constitutes the low-level step, and the phase-change heat dissipation part constitutes the high-level step. 5 . The heat dissipation member according to claim 4 , wherein the air flow heat dissipation part is provided with a working medium channel, and the working medium channel communicates with the working medium flow path. 6 . 6. The heat dissipation member according to claim 5, wherein the working medium channel comprises a first working medium channel and a second working medium channel; Wherein, the first working medium channel is communicated with one end of the working medium flow channel, and the second working medium channel is communicated with the other end of the working medium flow channel. 7 . The heat dissipation member according to claim 5 , wherein the working medium channel is a groove, and the groove is configured to accommodate a communication pipeline that communicates with the working medium flow path. 8 . 8. The heat dissipation member according to claim 7, wherein The cross section of the groove is semicircular. 9. A radiator, characterized in that, comprising: The heat dissipation member according to any one of claims 1-8, provided with a first working medium flow path; The condensation end is provided with a second working medium flow path; A communication pipeline is provided to communicate the first working medium flow path and the second working medium flow path. 10. An air conditioner, characterized by comprising the radiator of claim 9.

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