CN212623529U - Camera heat abstractor - Google Patents
Camera heat abstractor Download PDFInfo
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- CN212623529U CN212623529U CN202021504998.6U CN202021504998U CN212623529U CN 212623529 U CN212623529 U CN 212623529U CN 202021504998 U CN202021504998 U CN 202021504998U CN 212623529 U CN212623529 U CN 212623529U
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- heat
- camera
- heat dissipation
- heat conduction
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Abstract
The utility model discloses a camera heat dissipation device, which relates to the field of heat dissipation devices and is arranged on a camera for use through a fastener, and comprises a heat conduction structure, a semiconductor refrigeration structure and a heat dissipation structure; the heat conduction structure is in contact with the camera in a laminating mode, the semiconductor refrigeration structure is fixedly connected with the heat dissipation structure, the refrigeration surface of the semiconductor refrigeration structure is in contact with the heat conduction structure, and the heating surface of the semiconductor refrigeration structure is in contact with the heat dissipation structure. The heat conducting structure absorbs the heat emitted by the camera; the semiconductor refrigerating structure utilizes the Peltier effect of the semiconductor to enable the refrigerating surface to absorb the heat conducted from the heat conducting structure and enable the heating surface to release heat; the heat radiation structure is connected with the heating surface and releases the heat emitted by the heating surface to the outside. The heat dissipation device of the camera has good heat dissipation performance and can quickly dissipate the heat generated by the camera during high-performance operation; the camera heat dissipation device is small in occupied space, compact in structure and detachably connected with a camera, and is convenient for a user to carry, install and use.
Description
Technical Field
The utility model belongs to the heat abstractor field, in particular to camera heat abstractor.
Background
At present, in the field of photography, considering factors such as manufacturing cost and product volume, a part of heat dissipation function of a camera is often sacrificed due to compact structure. The problem of power failure and the like of electronic components caused by overheating can occur when the camera works for a long time, and the camera cannot work well due to the fact that imaging of the camera is affected by external heat in high-temperature occasions. Therefore, no good heat dissipation device is matched with the camera to work, the camera cannot work well for a long time, and even the phenomenon of automatic shutdown due to overheating can occur.
The prior art "L-shaped heat sink structure" discloses an L-shaped heat sink structure applied in a surveillance camera, comprising: an L-shaped heat sink and a panel, the L-shaped heat sink contacts with the monitor camera housing. The panel is combined with the L-shaped radiating fin, heat energy is conducted to the L-shaped radiating fin, the heat energy is indirectly conducted to the monitoring camera shell by virtue of the heat radiating characteristic of aluminum, and the heat energy generated by the light-emitting element and the circuit board is quickly discharged through the monitoring camera shell, so that the aim of quickly discharging heat is fulfilled. However, the heat dissipation performance of the prior art is not good enough, and the heat generated by the camera during high-performance operation cannot be dissipated quickly, so that the problems of power failure and the like caused by overheating of electronic components of the camera are solved; the influence of external heat on the imaging of the camera in high-temperature occasions cannot be quickly reduced.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a camera heat dissipation device that has a large contact area with a camera, has good heat dissipation performance, and can quickly dissipate the heat generated by the camera during high performance operation.
Another object of the present invention is to provide a camera heat dissipation device with small occupied space, compact structure and detachable connection with a camera.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
the utility model provides a camera heat dissipation device which is arranged on a camera for use through a fastener and comprises a heat conduction structure, a semiconductor refrigeration structure and a heat dissipation structure; the heat conduction structure is in contact with the camera in a laminating mode, the semiconductor refrigeration structure is fixedly connected with the heat dissipation structure, the refrigeration surface of the semiconductor refrigeration structure is in contact with the heat conduction structure, and the heating surface of the semiconductor refrigeration structure is in contact with the heat dissipation structure. The heat conducting structure absorbs the heat emitted by the camera; the semiconductor refrigerating structure utilizes the Peltier effect of the semiconductor to enable the refrigerating surface to absorb the heat conducted from the heat conducting structure and enable the heating surface to release heat; the heat radiation structure is connected with the heating surface and releases the heat emitted by the heating surface to the outside. The camera heat dissipation device has large contact area with the camera and good heat dissipation performance, can quickly dissipate heat generated by the camera during high-performance operation, solves the problems of power failure and the like caused by overheating of electronic components of the camera, and can also reduce the influence of external heat on camera imaging in high-temperature occasions; the camera heat dissipation device is small in occupied space, compact in structure and detachably connected with a camera, and is convenient for a user to carry, install and use.
Furthermore, the semiconductor refrigeration structure comprises a semiconductor heat conduction wafer, a power interface and a circuit board, wherein the semiconductor heat conduction wafer and the power interface are connected with the circuit board. When the camera is used, the current is connected through the power interface, and the semiconductor refrigeration structure refrigerates the camera, so that the camera is convenient and practical. Preferably, the power interface is a type-c interface.
Furthermore, the heat dissipation structure comprises a metal heat dissipation frame, a heat dissipation fan and a fan shell, wherein the metal heat dissipation frame and the fan shell are enclosed to form a heat dissipation fan accommodating cavity, and the heat dissipation fan is arranged in the heat dissipation fan accommodating cavity. The metal heat dissipation frame rapidly absorbs heat emitted by the heating surface of the semiconductor refrigeration structure, and the heat dissipation fan utilizes air flow to perform physical heat dissipation and cooling on the metal heat dissipation frame. Preferably, the metal radiating frame is an aluminum alloy radiating frame, so that the radiating effect is better; the number of the heat radiation fans is two, so that the heat radiation speed is improved.
Furthermore, one side of the metal radiating frame is provided with a radiating column which is arranged around the radiating fan, and radiating holes are arranged around the fan shell. The heat dissipation column is arranged to enlarge the heat dissipation area, improve the heat dissipation efficiency, and the heat dissipation holes are arranged to accelerate air circulation, so that the metal heat dissipation frame and the heat dissipation column can dissipate heat more quickly through air flow. Preferably, the heat dissipation column is provided in plurality, and is disposed around the heat dissipation fan.
Furthermore, the metal heat dissipation frame extends towards the other side all around to form the fixed fender that encloses, and the fixed fender that encloses combines with the camera to form heat conduction structure and holds the chamber. When the camera heat dissipation device is installed on a camera, the heat conduction structure is arranged in the heat conduction structure accommodating cavity, the position is fixed, the structure is simple and stable, and heat dissipation is facilitated.
Furthermore, a refrigeration structure groove is formed in one side of the metal heat dissipation frame, and the semiconductor refrigeration structure is arranged in the refrigeration structure groove. The camera heat dissipation device is compact and stable in structure.
Further, the heat conduction structure comprises a heat conduction silica gel sheet and a heat conduction copper sheet, the outer surface of the heat conduction silica gel sheet is in contact with the camera in a fitting mode, the inner surface of the heat conduction silica gel sheet is in contact with the heat conduction copper sheet in a fitting mode, and the heat conduction silica gel sheet and the heat conduction copper sheet are both arranged in the heat conduction structure accommodating cavity. The heat conducting silica gel sheet absorbs heat emitted by the camera and conducts the absorbed heat to the heat conducting copper sheet, and the heat in the heat conducting copper sheet is absorbed by the semiconductor refrigeration structure so as to realize heat dissipation of the camera.
Furthermore, the metal heat dissipation frame, the fan shell and the heat conduction structure are provided with through holes, and the fasteners penetrate through the through holes to fixedly connect the camera heat dissipation device with the camera. Preferably, the through holes are all located in the middle of the metal heat dissipation frame, the fan shell and the heat conduction structure, a user can use fasteners to penetrate through the through holes to be fixedly connected with the bottom of the camera, the camera heat dissipation device is installed at the bottom of the camera to dissipate heat of parts located at the bottom of the camera, operation is simple, and the camera heat dissipation device is convenient for the user to use.
Further, the fan shell side is provided with the screw hole. The user can use the locking screw to fix this camera heat abstractor and the piece of plugging into through the screw hole, and later reuse locking screw will plug into piece and camera bottom fixed, makes this camera heat abstractor hug closely the back of camera, for the part heat dissipation that is in the camera back, easy operation, convenience of customers uses.
The utility model has the advantages that: compared with the prior art, the camera heat dissipation device has large contact area with the camera and good heat dissipation performance, can quickly dissipate the heat generated by the camera during high-performance operation, solves the problems of power failure and the like caused by overheating of electronic components of the camera, and can also reduce the influence of external heat on the imaging of the camera in high-temperature occasions; the camera heat dissipation device is small in occupied space, compact in structure and detachably connected with a camera, and is convenient for a user to carry, install and use.
Drawings
Fig. 1 is an exploded view of the present invention.
Fig. 2 is a schematic view of the overall structure of the present invention.
Fig. 3 is a schematic structural diagram of the first installation position of the present invention.
Fig. 4 is a schematic structural view of a second installation position of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
the utility model provides a camera heat abstractor installs and uses on the camera.
The utility model discloses a heat conduction silica gel piece 1, heat conduction copper sheet 2, semiconductor heat conduction wafer 3, circuit board 4, type-c interface 5, aluminum alloy heat dissipation frame 6, radiator fan 7, fan housing 8.
The outer surface of the heat-conducting silica gel sheet 1 is in contact with the camera 13 in an attaching mode, the inner surface of the heat-conducting silica gel sheet 1 is in contact with the heat-conducting copper sheet 2 in an attaching mode, the heat-conducting copper sheet 2 is in contact with the semiconductor heat-conducting wafer 3 in an attaching mode, the semiconductor heat-conducting wafer 3 is connected with the circuit board 4, and the circuit board 4 is connected with the type-c interface 5.
One side of the aluminum alloy heat dissipation frame 6 is fixedly connected with the fan shell 8 through a fixing screw 11, and forms a heat dissipation fan accommodating cavity (not shown) by being enclosed with the fan shell 8, and the number of the heat dissipation fans 7 is two and the two heat dissipation fans are arranged in the heat dissipation fan accommodating cavity; the aluminum alloy heat dissipation frame 6 is provided with a plurality of heat dissipation columns 9, the heat dissipation columns 9 surround the heat dissipation fan 7, and a plurality of heat dissipation holes 81 are formed in the periphery of the fan shell 8; a refrigeration structure groove 61 is formed in the other side of the aluminum alloy heat dissipation frame 6, the semiconductor heat conduction wafer 3, the circuit board 4 and the type-c interface 5 are arranged in the refrigeration structure groove 61, and the circuit board 4 is fixedly connected with the aluminum alloy heat dissipation frame 6 through a fixing screw 11; the periphery of the aluminum alloy radiating frame 6 extends towards the other side to form a fixed surrounding barrier 62, the fixed surrounding barrier 62 and the camera 13 are combined to form a heat conducting structure accommodating cavity (not shown), and when the camera radiating device is installed on the camera 13, the heat conducting silicon sheet 1 and the heat conducting copper sheet 2 are placed in the heat conducting structure accommodating cavity.
The heat conducting silicon sheet 1 absorbs the heat emitted by the camera 13, then conducts the heat into the heat conducting copper sheet 2, and the heat in the heat conducting copper sheet 2 is absorbed by the semiconductor heat conducting wafer 3; the current is input from the type-c interface 5 and is adjusted by the circuit board 4, and the current generates the Peltier effect through the semiconductor heat conducting wafer 3, so that the cooling surface absorbs the heat conducted from the heat conducting copper sheet 2, and the heating surface releases the heat; the aluminum alloy heat dissipation frame 6 is connected with the heating surface, releases the heat that the heating surface emitted away, and a plurality of heat dissipation posts 9 absorb the heat from the heating surface emitted fast, and a plurality of louvres 81 accelerate the circulation of air, and two radiator fan 7 rotate fast for the air flows, promotes the radiating efficiency.
The middle parts of the aluminum alloy radiating frame 6, the fan shell 8, the heat-conducting silica gel sheet 1 and the heat-conducting copper sheet 2 are all provided with through holes 10, and the side surface of the fan shell 8 is provided with a threaded hole 82. A user can fixedly connect the camera heat dissipation device with the bottom of the camera 13 by using the locking screw 12 to penetrate through the through hole 10, so that the camera heat dissipation device is tightly attached to the bottom of the camera 13 to dissipate heat of parts at the bottom of the camera 13; the user can also use the locking screw 12 to fix the heat sink of the camera with the docking member 14 through the threaded hole 82, and then use the locking screw 12 to fix the docking member 14 with the bottom of the camera 13, so that the heat sink of the camera is tightly attached to the back of the camera 13 to dissipate heat of the parts on the back of the camera 13.
The camera heat dissipation device has large contact area with the camera 13 and good heat dissipation performance, can quickly dissipate heat generated by the camera 13 during high-performance operation, solves the problems of power failure and the like caused by overheating of electronic components of the camera 13, and can also reduce the influence of external heat on imaging of the camera 13 in high-temperature occasions; the camera heat dissipation device is small in occupied space, compact in structure and detachably connected with the camera 13, and brings convenience to users to carry, install and use.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. The utility model provides a camera heat abstractor, uses on the camera through the fastener is installed which characterized in that: the heat dissipation structure comprises a heat conduction structure, a semiconductor refrigeration structure and a heat dissipation structure; the heat conduction structure is in contact with the camera in a laminating mode, the semiconductor refrigeration structure is fixedly connected with the heat dissipation structure, the refrigeration surface of the semiconductor refrigeration structure is in contact with the heat conduction structure, and the heating surface of the semiconductor refrigeration structure is in contact with the heat dissipation structure.
2. The heat dissipating device of claim 1, wherein: the semiconductor refrigeration structure comprises a semiconductor heat conduction wafer, a power interface and a circuit board, wherein the semiconductor heat conduction wafer and the power interface are connected with the circuit board.
3. A heat sink for a camera according to claim 2, wherein: the heat dissipation structure comprises a metal heat dissipation frame, a heat dissipation fan and a fan shell, wherein the metal heat dissipation frame and the fan shell are enclosed to form a heat dissipation fan accommodating cavity, and the heat dissipation fan is arranged in the heat dissipation fan accommodating cavity.
4. A heat sink for a camera according to claim 3, wherein: one side of the metal radiating frame is provided with a radiating column which is arranged around the radiating fan, and radiating holes are arranged around the fan shell.
5. The heat dissipating device of claim 4, wherein: the metal heat dissipation frame extends towards the other side all around to form the fixed fender that encloses, and the fixed fender that encloses combines with the camera to form heat conduction structure and holds the chamber.
6. The heat dissipating device of claim 5, wherein: one side of the metal heat dissipation frame is provided with a refrigeration structure groove, and the semiconductor refrigeration structure is arranged in the refrigeration structure groove.
7. The heat sink for camera as claimed in claim 6, wherein: the heat conduction structure comprises a heat conduction silica gel sheet and a heat conduction copper sheet, the outer surface of the heat conduction silica gel sheet is in contact with the camera in a fitting mode, the inner surface of the heat conduction silica gel sheet is in contact with the heat conduction copper sheet in a fitting mode, and the heat conduction silica gel sheet and the heat conduction copper sheet are arranged in the heat conduction structure accommodating cavity.
8. The heat sink for camera as claimed in claim 7, wherein: the metal heat dissipation frame, the fan shell and the heat conduction structure are all provided with through holes, and the fasteners penetrate through the through holes to fixedly connect the camera heat dissipation device with the camera.
9. The heat sink for camera as claimed in claim 8, wherein: the side of the fan shell is provided with a threaded hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021504998.6U CN212623529U (en) | 2020-07-27 | 2020-07-27 | Camera heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021504998.6U CN212623529U (en) | 2020-07-27 | 2020-07-27 | Camera heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212623529U true CN212623529U (en) | 2021-02-26 |
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ID=74729064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021504998.6U Active CN212623529U (en) | 2020-07-27 | 2020-07-27 | Camera heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212623529U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113946087A (en) * | 2021-09-14 | 2022-01-18 | 上海肆和文化传媒有限公司 | Portable external heat dissipation patch suitable for multiple types of cameras |
-
2020
- 2020-07-27 CN CN202021504998.6U patent/CN212623529U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113946087A (en) * | 2021-09-14 | 2022-01-18 | 上海肆和文化传媒有限公司 | Portable external heat dissipation patch suitable for multiple types of cameras |
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