CN210868559U - mobile phone radiator - Google Patents

Abstract

The utility model discloses a mobile phone radiator, which comprises a fan, a casing, a heat-conducting bottom cover, a semiconductor refrigerator, a heat-dissipating aluminum block, a heat-conducting glue pad, a suction cup, a circuit board, a connector and an indicator light. When in use, it can be quickly adsorbed and positioned on the back of the mobile phone through the suction cup, and the gap between the thermal conductive bottom cover and the back of the mobile phone can be fully filled by the thermal conductive pad, so as to improve the bonding effect between the thermal conductive bottom cover and the back of the mobile phone, and the fit is tight. The heat conduction effect is good; the semiconductor cooler can quickly absorb the heat of the mobile phone that is conducted through the thermal conductive pad and the thermal conductive bottom cover in turn, and generate heat exchange, so that the mobile phone can achieve the purpose of rapid cooling and ensure the normal operation of the mobile phone; in the process of continuous heat exchange During the process, the heat generated by the semiconductor cooler can quickly spread to the heat dissipation aluminum block and dissipate. At the same time, with the active heat dissipation method of the fan, the heat dissipation speed of the heat dissipation aluminum block is further accelerated, and the heat dissipation effect is good.

Description

mobile phone radiator

technical field

The utility model relates to the mobile phone accessory technology, in particular to a mobile phone radiator.

Background technique

With the rise of smart phones, the main frequency of the chip is getting higher and higher, especially the gaming phone's requirement for running speed, which will generate a lot of heat. If the heat cannot be dissipated in time, the heat source will feel strong, and the heat of the phone will not only affect Comfort, heat can also affect the performance and speed of the phone, and it can also burn out the hardware. When the mobile phone is running, the battery outputs current, and heat is generated when passing through various components. The heat generated by the operation of the machine is mainly exported through the back. The main components of mobile phones that generate heat are the CPU, electric boards and batteries. There are three main reasons for the overheating of mobile phones: first, the resistance of the components is too large; One part is overheating; the third is that the CPU runs for a long time and the power increases. The heat generated by these parts is introduced into the interlayer with large heat capacity by the heat sink, and then dissipated through the mobile phone case and the heat dissipation holes. Therefore, when we use the mobile phone, we will feel the heat on the back of the mobile phone and feel uncomfortable when holding the mobile phone, which seriously affects the mobile phone. The performance and running speed are obviously slowed down. In severe cases, there will be problems such as phone crashes and battery explosions, which will affect the life of the phone.

Utility model content

In view of the above deficiencies, the purpose of the present invention is to provide a mobile phone radiator with ingenious and reasonable structure design and good heat dissipation effect.

In order to achieve the above purpose, the technical solution provided by the utility model is: a mobile phone radiator, which includes a fan, a casing, a heat-conducting bottom cover, a semiconductor refrigerator, a heat-dissipating aluminum block, a heat-conducting glue pad and a suction cup, and the bottom surface of the casing is There is an opening, and the upper surface of the heat dissipation aluminum block is provided with a high heat dissipation fin group and a low scattered fin group, and the upper surface of the low scattered fin group is formed with a concave position adapted to the outline of the fan, The heat dissipation aluminum block is installed in the casing through the first screw, and the fan is positioned and fixed on the concave position. The top surface of the casing is provided with a top surface ventilation hole corresponding to the fan position, and the side wall of the casing is provided There are side ventilation holes, at least two limit blocks are arranged on the bottom surface of the heat dissipation aluminum block, and a accommodating cavity for placing the semiconductor refrigerator is formed between the two limit blocks. The screw is fixed on the limit block, and the semiconductor refrigerator is positioned on the accommodating cavity, and the opening of the casing is closed, the thermally conductive rubber pad is arranged on the bottom surface of the thermally conductive bottom cover, and the suction cup on the periphery of the thermally conductive bottom cover.

As an improvement of the present utility model, it further comprises a circuit board, a connector and an indicator light, the circuit board is fixed in the casing, the connector and the indicator light are fixed on the circuit board, the connector It is respectively connected with the indicator light, the fan and the semiconductor refrigerator, and the casing is provided with a socket for exposing the connector and a display port for exposing the indicator light.

As an improvement of the present utility model, two ends of the circuit board are provided with mounting holes.

As an improvement of the present invention, the limiting block is a hexagonal copper column, the upper end of the hexagonal copper column is riveted on the heat dissipation aluminum block, and the lower end surface of the hexagonal copper column is provided with threaded holes.

As an improvement of the present invention, the head of the first screw limits the positions of the left and right sides of the semiconductor refrigerator, and the limiting block limits the front and rear positions of the semiconductor refrigerator.

As an improvement of the present invention, the side ventilation holes are elongated.

As an improvement of the present invention, the heat-conducting bottom cover is an aluminum plate.

As an improvement of the present invention, the outline of the thermally conductive bottom cover is square, and the number of the suction cups is four, which are respectively located at the four corners of the thermally conductive bottom cover.

As an improvement of the present invention, the corners of the thermally conductive rubber pad are provided with arc-shaped void spaces.

As an improvement of the present invention, the lower surface of the semiconductor refrigerator is a cooling surface, which is closely attached to the upper surface of the heat-conducting bottom cover; the upper surface of the semiconductor refrigerator is a heating surface, which is closely attached to the lower surface of the heat-dissipating aluminum block. surface.

The beneficial effects of the utility model are as follows: the structural design of the utility model is ingenious and reasonable. When in use, the suction cup can be quickly absorbed and positioned on the back of the mobile phone, and the thermal conductive rubber pad can fully fill the coordination between the thermal conductive bottom cover and the back of the mobile phone. gap, improve the bonding effect between the thermal conductive bottom cover and the back of the mobile phone, the cooperation is tight, and the heat conduction effect is good; the semiconductor cooler can quickly absorb the heat of the mobile phone conducted through the thermal conductive pad and the thermal conductive bottom cover in turn, and generate heat exchange, so that the The mobile phone achieves the purpose of rapid cooling to ensure the normal operation of the mobile phone; in the process of continuous heat exchange, the heat generated by the semiconductor cooler can quickly spread to the heat dissipation aluminum block and dissipate. At the same time, with the active heat dissipation method of the fan, the heat dissipation aluminum The heat dissipation speed of the block is good, and the heat dissipation effect is good.

Description of drawings

Fig. 1 is a three-dimensional structure schematic diagram of the present invention.

FIG. 2 is a schematic diagram 1 of the exploded structure of the present invention.

Figure 3 is a second schematic diagram of the exploded structure of the present invention.

Detailed ways

Embodiment: Referring to FIG. 1 , FIG. 2 and FIG. 3 , this embodiment provides a mobile phone radiator, which includes a fan 1 , a casing 2 , a thermally conductive bottom cover 3 , a semiconductor refrigerator 4 , a heat-dissipating aluminum block 5 , and a thermally conductive rubber pad 6 , suction cup 7, circuit board 8, connector 9 and indicator light 10. In this embodiment, the thermally conductive bottom cover 3 is preferably an aluminum plate. In other embodiments, the thermally conductive bottom cover 3 may also be a copper plate or other plate with high thermal conductivity. The connector 9 may be a connector with a connection function such as Mini-USB, Micro USB or Type-C.

The bottom surface of the casing 2 has an opening 23 . The upper surface of the heat-dissipating aluminum block 5 is provided with a high heat-dissipating fin group 51 and a low-scattering fin group 52 . Position 53 , the heat dissipation aluminum block 5 is installed in the casing 2 by the first screw, and the fan 1 is positioned and fixed on the concave position 53 by the clamping force between the heat dissipation aluminum block 5 and the inner wall of the casing 2 . The fan 1 is arranged through the recess 53, and the fit is compact, the occupied space is reduced, the thickness is reduced, and the convenience of use is improved. Preferably, four corners of the fan 1 are provided with through holes, and the first screw passes through the through holes and is then screwed into the casing 2 , which can further improve the fixing stability of the fan 1 .

The top surface of the housing 2 is provided with a top surface ventilation hole 21 corresponding to the position of the fan 1, and the side wall of the housing 2 is provided with a side ventilation hole 22. In this embodiment, the side ventilation hole 22 is in the shape of a long strip. In other embodiments, the side ventilation holes 22 may also be mesh-shaped or the like.

At least two limit blocks 54 are arranged on the bottom surface of the heat dissipation aluminum block 5, and a accommodating cavity for placing the semiconductor refrigerator 4 is formed between the two limit blocks 54. In this embodiment, the limit blocks 54 is a hexagonal copper column, the upper end of the hexagonal copper column is riveted on the heat dissipation aluminum block 5, and the lower end surface of the hexagonal copper column is provided with threaded holes. In other embodiments, the limiting block 54 may also be a boss, and a surface of the boss is provided with a threaded hole.

The heat-conducting bottom cover 3 is fixed on the limiting block 54 by a second screw, and the semiconductor refrigerator 4 is positioned on the accommodating cavity, and the opening 23 of the casing 2 is closed. Specifically, the lower surface of the semiconductor refrigerator 4 is a cooling surface, which is closely attached to the upper surface of the heat-conducting bottom cover 3 ; Preferably, the head of the first screw is used to limit the position of the left and right sides of the semiconductor refrigerator 4, and the limit block 54 is used to limit the front and rear positions of the semiconductor refrigerator 4, and the positioning effect is good.

The thermally conductive rubber pad 6 is arranged on the bottom surface of the thermally conductive bottom cover 3 , and the suction cup 7 is arranged on the periphery of the thermally conductive bottom cover 3 . Specifically, the outline of the thermally conductive bottom cover 3 is square, and the number of the suction cups 7 is four, which are respectively located at four corners of the thermally conductive bottom cover 3 . The thermally conductive rubber pad 6 is preferably a thermally conductive silicone pad, which covers the bottom surface of the thermally conductive bottom cover 3 , wherein the corners of the thermally conductive rubber pad 6 are provided with arc-shaped void spaces 61 to avoid the suction cup 7 and the thermally conductive bottom cover 3 . The opening for mounting the suction cup 7 is for interference blocking.

Both ends of the circuit board 8 are provided with mounting holes, which are fixed in the housing 2 through the mounting holes by screws. The connector 9 and the indicator light 10 are fixed on the circuit board 8. The connectors 9 are respectively Connected with the indicator light 10 , the fan 1 and the semiconductor refrigerator 4 , the housing 2 is provided with a socket 24 for exposing the connector 9 and a display port 25 for exposing the indicator light 10 .

When in use, the mobile phone radiator of the present invention can be quickly adsorbed and positioned on the back of the mobile phone through the suction cup 7, and the matching gap between the thermal conductive bottom cover 3 and the back of the mobile phone can be fully filled by the thermal conductive adhesive pad 6, and the thermal conductive bottom cover 3 and the mobile phone can be lifted. The fit effect on the back is tight. Connect the power plug to the connector 9 to achieve the purpose of providing power. After the power is turned on, the indicator light 10 lights up, the fan 1 rotates, and the semiconductor refrigerator 4 starts to cool. The semiconductor refrigerator 4 can quickly absorb the heat of the mobile phone that is conducted through the thermal conductive pad 6 and the thermal conductive bottom cover 3 in turn to generate heat. exchange, so that the mobile phone can achieve the purpose of rapid cooling and ensure the normal operation of the mobile phone; in the process of continuous heat exchange, the heat generated by the semiconductor cooler 4 can be quickly spread to the heat dissipation aluminum block 5 and dissipated. The heat dissipation method effectively speeds up the heat dissipation speed of the heat dissipation aluminum block 5, and the heat dissipation effect is good.

According to the disclosure and teaching of the above specification, those skilled in the art to which the present invention pertains can also make changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should also fall within the protection scope of the claims of the present invention. In addition, although some specific terms are used in this specification, these terms are only for the convenience of description and do not constitute any limitation of the present invention, and the use of other heat sinks that are the same or similar to it is within the protection scope of the present invention.

Claims (10)

1. a mobile phone radiator, it comprises a fan, it is characterized in that, it also comprises a casing, a heat-conducting bottom cover, a semiconductor refrigerator, a heat-dissipating aluminum block, a heat-conducting glue pad and a suction cup, the bottom surface of the casing has an opening, and the heat-dissipating The upper surface of the aluminum block is provided with a group of high heat dissipation fins and a group of low scattered fins, the upper surface of the low scattered fin group is formed with a concave position adapted to the outline of the fan, and the heat dissipation aluminum block passes through. The first screw is installed in the casing, and the fan is positioned and fixed on the concave position, the top surface of the casing is provided with a top surface ventilation hole corresponding to the position of the fan, and the side wall of the casing is provided with a side ventilation hole, so the The bottom surface of the heat-dissipating aluminum block is provided with at least two limit blocks, a accommodating cavity for placing the semiconductor refrigerator is formed between the two limit blocks, and the heat-conducting bottom cover is fixed to the limit block by a second screw and the semiconductor refrigerator is positioned on the accommodating cavity, the opening of the casing is closed, the thermally conductive rubber pad is arranged on the bottom surface of the thermally conductive bottom cover, and the suction cup is arranged on the periphery of the thermally conductive bottom cover Location. 2. The mobile phone radiator according to claim 1, characterized in that, it further comprises a circuit board, a connector and an indicator light, the circuit board is fixed in the casing, and the connector and the indicator light are fixed on the On the circuit board, the connector is respectively connected with the indicator light, the fan and the semiconductor refrigerator, and the casing is provided with a socket for exposing the connector and a display port for exposing the indicator light. 3 . The mobile phone radiator according to claim 2 , wherein the two ends of the circuit board are provided with mounting holes. 4 . 4. The mobile phone radiator according to claim 1, wherein the limiting block is a hexagonal copper column, the upper end of the hexagonal copper column is riveted on the heat dissipation aluminum block, and the lower end surface of the hexagonal copper column is provided with Threaded hole. 5. The mobile phone radiator according to claim 1 or 4, wherein the head of the first screw limits the positions of the left and right sides of the semiconductor refrigerator, and the limit blocks limit the position of the semiconductor refrigerator. The front and rear positions are limited. 6 . The mobile phone radiator according to claim 1 , wherein the side ventilation holes are elongated. 7 . 7 . The mobile phone radiator according to claim 1 , wherein the thermally conductive bottom cover is an aluminum plate. 8 . 8. The mobile phone radiator according to claim 1 or 7, wherein the outline of the thermally conductive bottom cover is square, and the number of the suction cups is four, which are respectively located at four corners of the thermally conductive bottom cover Department location. 9 . The mobile phone radiator according to claim 7 , wherein the corners of the thermally conductive rubber pad are provided with arc-shaped void spaces. 10 . 10. The mobile phone radiator according to claim 1, wherein the lower surface of the semiconductor refrigerator is a cooling surface, which is closely attached to the upper surface of the heat-conducting bottom cover; the upper surface of the semiconductor refrigerator is a heating surface, It is tightly attached to the lower surface of the heat-dissipating aluminum block.

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