CN111366020A - Extended water-cooled heat pipe radiator - Google Patents
Extended water-cooled heat pipe radiator Download PDFInfo
- Publication number
- CN111366020A CN111366020A CN202010235235.4A CN202010235235A CN111366020A CN 111366020 A CN111366020 A CN 111366020A CN 202010235235 A CN202010235235 A CN 202010235235A CN 111366020 A CN111366020 A CN 111366020A
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- water
- cooling
- heat pipe
- heat
- pipe
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
An extended water-cooled heat pipe radiator relates to a radiator. The invention solves the problems that the existing heat pipe radiator is restricted by the environmental temperature, has narrow application range and poor radiating effect. Processing has many heat pipe mounting grooves on the up end of hot-water tube cooling seat, the level pipe of heat pipe is located hot-water tube cooling seat and the heat pipe flushes the setting with the up end of hot-water tube cooling seat, the vertical pipe of heat pipe is worn out by radiating fin from top to bottom, processing has the water-cooling runner on the lower terminal surface of hot-water tube cooling seat, heat pipe water-cooling seat lower extreme and water-cooling fin apron sealing connection, processing has the water inlet and the delivery port of water-cooling runner on the lateral wall of hot-water tube cooling seat, the lower terminal surface of water-cooling fin apron is provided with a plurality of water-cooling fins, two inlet outlets of water-cooling runner are connected with a water-cooling tube respectively, the lower extreme of two water-cooling tubes is worn out by radiating fin from top to bottom, two fans. The invention is used for heat dissipation of the miniature electronic component.
Description
Technical Field
The invention relates to a radiator, in particular to an extended water-cooled heat pipe radiator, and belongs to the technical field of heat pipe radiation.
Background
As electronic components gradually develop toward miniaturization, high power and high performance, the power of the electronic devices also gradually increases, and thus the heat dissipation design is particularly important in the development and use of the electronic devices. The heat pipe is a novel heat transfer element with high heat conductivity, the heat pipe radiator manufactured by utilizing the heat pipe technology can rapidly transfer and diffuse a heat source with high heat density, compared with the traditional radiator, the heat pipe radiator has the advantages of extremely high heat conductivity, small volume, good isothermal property and the like, and gradually becomes an excellent choice for solving the heat dissipation problem of a high-power electronic device.
The existing heat pipe radiator is usually combined with a fan to form an integrated air-cooled heat pipe radiator, the heat pipe radiator is simple to use, does not need an additional device, is limited by the ambient temperature, and has a poor heat dissipation effect compared with water cooling. However, water cooling requires a water circulation system and cannot be used even under the condition.
In summary, the conventional heat pipe radiator is limited by the ambient temperature, and has a narrow application range and a poor heat dissipation effect.
Disclosure of Invention
The invention provides an extended water-cooled heat pipe radiator, aiming at solving the problems that the existing heat pipe radiator is limited by the environmental temperature, has narrow application range and poor radiating effect.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the invention relates to an expanded water-cooled heat pipe radiator, which comprises a heat pipe water-cooled seat 2, a water-cooled fin cover plate 3, a heat dissipation fin assembly 4, two fans 5, two water-cooled pipes 6 and a plurality of heat pipes 1, wherein the heat pipe water-cooled seat 2, the water-cooled fin cover plate 3 and the heat dissipation fin assembly 4 are sequentially arranged from top to bottom, the heat pipes 1 are in an inverted U shape, a plurality of heat pipe installation grooves 2-2 are processed on the upper end surface of the heat pipe water-cooled seat 2, the number of the heat pipes 1 is consistent with the number of the heat pipe installation grooves 2-2, a horizontal pipe of the heat pipe 1 is positioned in the heat pipe water-cooled seat 2, the heat pipe 1 is flush with the upper end surface of the heat pipe water-cooled seat 2, a vertical pipe of the heat pipe 1 penetrates through the heat dissipation fin assembly 4 from top to bottom, a water-cooled runner 2-3 is processed on the lower end surface of the heat pipe water-cooled seat 2, the lower, the lower end face of the water-cooling fin cover plate 3 is provided with a plurality of water-cooling fins 3-2, two water inlets and outlets 3-1 of the water-cooling flow channels 2-3 are respectively connected with one water-cooling pipe 6, the lower ends of the two water-cooling pipes 6 penetrate out of the heat-radiating fin component 4 from top to bottom, and two fans 5 are oppositely arranged on the front side wall and the rear side wall of the heat-radiating fin component 4.
In one embodiment, the number of the heat pipes 1 is 4-6, the plurality of heat pipes 1 are sequentially arranged in parallel along the length direction of the heat pipe radiator, the distance between every two adjacent heat pipes 1 is equal, and the distance between every two adjacent heat pipes 1 is 2 mm.
In one embodiment, the heat pipe passing hole 4-1 corresponding to the heat pipe 1 is formed in the heat dissipation fin assembly 4, the heat pipe 1 is welded to the heat pipe passing hole 4-1 of the heat dissipation fin assembly 4, and the diameter of the heat pipe passing hole 4-1 is 6 mm.
In one embodiment, the water-cooling fins 3-2 are sequentially arranged at intervals and in parallel along the length direction of the water-cooling fin cover plate 3, and the distance between two adjacent water-cooling fins 3-2 is equal.
In one embodiment, the water cooling pipe 6 is a copper pipe, two water cooling pipe passing holes 4-2 are correspondingly formed in the cooling fin assembly 4, the water cooling pipe 6 is welded to the water cooling pipe passing hole 4-2 of the cooling fin assembly 4, and the diameter of the water cooling pipe passing hole 4-2 is 6 mm.
In one embodiment, the water-cooling channels 2-3 are formed by a plurality of channels which are parallel to each other and are arranged at equal intervals, the adjacent channels are communicated with each other end to end, and the water inlet and the water outlet of the water-cooling channels 2-3 are positioned on the same side wall of the hot-pipe water-cooling seat 2.
In one embodiment, the cross section of each flow channel is rectangular, the size of the cross section of each flow channel is 4mm × 4mm, and the diameters of the water inlet and the water outlet of each water-cooling flow channel 2-3 are both 6 mm.
In one embodiment, the heat dissipation fin assembly 4 comprises a plurality of heat dissipation fins, the number of the heat dissipation fins is 38, and the distance between two adjacent heat dissipation fin assemblies 4 is 2 mm.
In one embodiment, the length of the cooling fin assembly 4 is 95mm, the width of the cooling fin assembly 4 is 50mm, and the thickness of the cooling fin assembly 4 is 0.4 mm.
Compared with the prior art, the invention has the following beneficial effects:
the extended water-cooled heat pipe radiator integrates water-cooled heat dissipation and heat pipe heat dissipation, can switch between heat pipe air cooling and water cooling, and compared with the existing radiator adopting a single heat dissipation mode, the heat dissipation effect in two heat dissipation modes can be switched and used under different use conditions, so that the expanded water-cooled heat pipe radiator is higher in practicability and wide in application range;
the extended water-cooled heat pipe radiator changes the single radiating mode of the traditional radiator, and after the lower end of the water-cooled pipe is communicated with an external water-cooling system, most heat circulates to an external water-cooling machine through a water-cooling runner, so that a good water-cooling radiating effect is achieved; compared with a single water cooling mode, the heat of the invention can be led out through the heat pipe and the radiating fins, the radiating effect is better, and the radiating efficiency is improved by more than 15%.
Drawings
FIG. 1 is a perspective view of the overall structure of an extended water-cooled heat pipe radiator according to the present invention;
FIG. 2 is a top view of the extended water-cooled heat pipe heat sink of the present invention;
FIG. 3 is a connection structure diagram of a water-cooling fin cover plate 3 of a heat pipe water-cooling base 2 according to a first embodiment of the present invention;
FIG. 4 is an exploded view of the water-cooled fin cover plate 3 of the heat pipe water-cooled base 2 according to one embodiment of the present invention;
wherein: the heat pipe 1, the heat pipe 2, the water cooling seat 3, the water cooling fin cover plate 4, the heat dissipation fin assembly 5, the fan 5 and the water cooling pipe 6 are respectively arranged on the heat pipe 1 and the heat pipe 2.
Detailed Description
The first embodiment is as follows: as shown in fig. 1 to 4, the extended water-cooled heat pipe radiator of the present embodiment includes a heat pipe water-cooled base 2, a water-cooled fin cover plate 3, a heat fin assembly 4, two fans 5, two water-cooled pipes 6, and a plurality of heat pipes 1, the heat pipe water-cooled base 2, the water-cooled fin cover plate 3, and the heat fin assembly 4 are sequentially disposed from top to bottom, the heat pipe 1 is in an inverted U shape, a plurality of heat pipe mounting grooves 2-2 are formed on an upper end surface of the heat pipe water-cooled base 2, the number of the heat pipes 1 is equal to the number of the heat pipe mounting grooves 2-2, a horizontal pipe of the heat pipe 1 is disposed in the heat pipe water-cooled base 2, the heat pipe 1 is flush with the upper end surface of the heat pipe water-cooled base 2, a vertical pipe of the heat pipe 1 penetrates through the heat fin assembly 4 from top to bottom, a water-cooled runner 2-3 is formed on, the side wall of the hot pipe water cooling seat 2 is provided with a water inlet and a water outlet of a water cooling flow channel 2-3, the lower end surface of the water cooling fin cover plate 3 is provided with a plurality of water cooling fins 3-2, two water inlets and two water outlets 3-1 of the water cooling flow channel 2-3 are respectively connected with a water cooling pipe 6, the lower ends of the two water cooling pipes 6 penetrate through the heat dissipation fin assembly 4 from top to bottom, and two fans 5 are oppositely arranged on the front side wall and the rear side wall of the heat dissipation fin assembly 4.
The two fans 5 are respectively buckled on the radiating surfaces at the two sides of the radiating fin component 4, and the generated heat is rapidly taken away through forced air cooling radiation;
the fin pitch and the number of the fins of the fin assembly 4 may be set according to specific environmental requirements, such as the limitation of the assembly space;
in the embodiment, four heat pipes 1 are adopted, and the heat dissipation fin assembly 4 comprises 50 layers of copper heat dissipation fins, wherein the heat pipes 1 are welded and fixed with the heat dissipation fin assembly 4, the upper surface of each heat pipe 1 is subjected to flattening treatment, the upper surface of each heat pipe 1 can be in good contact with an electronic device, and the heat dissipation effect is better; secondly, a water-cooling flow channel is designed below the heat pipe water-cooling seat 2, such as a series flow channel, a parallel flow channel or a micro-channel, the water-cooling fin cover plate 3 is welded with the heat pipe water-cooling seat 2 to achieve complete sealing performance of the water-cooling flow channel 2-3, the water-cooling pipe 6 passes through the radiating fin assembly and is welded with the radiating fin assembly, the upper end of the water-cooling pipe 6 is welded at a water inlet and a water outlet of the heat pipe water-cooling seat 2 and the water-cooling fin cover plate 3, and finally the two fans 5 are buckled on two side.
The second embodiment is as follows: as shown in fig. 1 and 2, the number of the heat pipes 1 in the present embodiment is 4 to 6, the plurality of heat pipes 1 are sequentially arranged in parallel along the length direction of the heat pipe radiator, the distance between two adjacent heat pipes 1 is equal, and the distance between two adjacent heat pipes 1 is 2 mm.
By the design, the heat pipes 1 are arranged in parallel, so that the direct contact area between the electronic device and the heat pipes 1 can be increased, and the heat dissipation effect is better. Other components and connections are the same as those in the first embodiment.
The third concrete implementation mode: as shown in fig. 1 and 2, the heat pipe passing hole 4-1 corresponding to the heat pipe 1 is formed in the heat dissipation fin assembly 4 of the present embodiment, the heat pipe 1 is welded to the heat pipe passing hole 4-1 of the heat dissipation fin assembly 4, and the diameter of the heat pipe passing hole 4-1 is 6 mm.
Due to the design, the heat pipe 1 is in good contact with the radiating fin assembly 4, and the heat pipe 1 and the radiating fin assembly 4 can exchange heat fully. Other components and connection relationships are the same as those in the first or second embodiment.
The fourth concrete implementation mode: as shown in fig. 3 and 4, the water-cooling fins 3-2 of the present embodiment are sequentially spaced and arranged in parallel along the longitudinal direction of the water-cooling fin cover plate 3, and the intervals between two adjacent water-cooling fins 3-2 are equal.
By the design, the lower end face of the water-cooling fin cover plate 3 is provided with the water-cooling fins 3-2, so that the heat dissipation capacity of the water-cooling fin cover plate 3 is improved. Other components and connection relationships are the same as those in the third embodiment.
The fifth concrete implementation mode: as shown in fig. 1 and 2, the water cooling tube 6 of the present embodiment is a copper tube, two water cooling tube passing holes 4-2 are correspondingly formed in the fin block 4, the water cooling tube 6 is welded to the water cooling tube passing hole 4-2 of the fin block 4, and the diameter of the water cooling tube passing hole 4-2 is 6 mm.
According to the design, the water-cooling pipes 6 are copper pipes, the water-cooling pipes 6 pass through the water-cooling pipe through holes 4-2 on the radiating fin assembly 4 and are welded with the water-cooling pipe through holes 4-2, and the upper ends of the two water-cooling pipes 6 are respectively welded on the water inlet and outlet 3-1, so that a good water flow channel is formed. The other components and the connection relations are the same as those of the first, second or fourth embodiment.
The sixth specific implementation mode: as shown in fig. 3 and 4, the water-cooling flow channels 2-3 of the present embodiment are formed by a plurality of flow channels that are parallel to each other and are arranged at equal intervals, adjacent flow channels are arranged to be communicated with each other end to end, and the water inlet and the water outlet of the water-cooling flow channel 2-3 are located on the same side wall of the hot-tube water-cooling seat 2.
By such design, the water-cooling flow channel 2-3 of the present embodiment can be designed with different flow channels and sizes, parallel flow channels, micro channels, etc. according to actual heat dissipation requirements. In the embodiment, the series flow channels are taken as design requirements, and the flow channel quantity and the size can be designed according to the requirement according to the electronic heating power.
The other components and the connection relationship are the same as those in the fifth embodiment.
A seventh specific embodiment is that as shown in fig. 3 and 4, the cross section of the single flow channel in the present embodiment is rectangular, the size of the cross section of the single flow channel is 4mm × 4mm, and the diameters of the water inlet and the water outlet of the water-cooling flow channel 2-3 are both 6 mm.
By such design, the water-cooling flow channel 2-3 of the present embodiment can be designed with different flow channels and sizes, parallel flow channels, micro channels, etc. according to actual heat dissipation requirements. In the embodiment, the series flow channels are taken as design requirements, and the flow channel quantity and the size can be designed according to the requirement according to the electronic heating power.
Other components and connection relations are the same as those of the sixth embodiment.
The specific implementation mode is eight: as shown in fig. 1, the heat dissipation fin assembly 4 of the present embodiment includes a plurality of heat dissipation fins, the number of the heat dissipation fins is 38, and the distance between two adjacent heat dissipation fin assemblies 4 is 2 mm.
With such a design, the heat dissipation fin assembly 4 of the present embodiment can be designed with different fin numbers and fin pitches according to actual heat dissipation requirements. Other components and connection relations are the same as those of the first, second, fourth, sixth or seventh embodiment.
The specific implementation method nine: as shown in fig. 1, the length of the heat radiation fin assembly 4 of the present embodiment is 95mm, the width of the heat radiation fin assembly 4 is 50mm, and the thickness of the heat radiation fin assembly 4 is 0.4 mm.
With such a design, the heat dissipation fin assembly 4 of the present embodiment can design the size of the fins according to the actual heat dissipation requirement. Other components and connection relationships are the same as those in the eighth embodiment.
The above is only a preferred embodiment of the present invention, and it should be noted that: it will be apparent to those skilled in the art that various modifications and equivalents can be made without departing from the spirit of the invention, and it is intended that all such modifications and equivalents fall within the scope of the invention as defined in the claims.
The working principle is as follows:
the invention relates to an extended water-cooled heat pipe radiator, which extends the liquid cooling function on the basis of the heat pipe radiator as the name implies, and relates to two working modes as follows: heat pipe air-cooled heat dissipation and water-cooled heat dissipation. The heat pipe air cooling heat dissipation effect is equal to that of a conventional heat pipe radiator, heat is directly added on the heat pipe water cooling seat 2 and the heat pipe 1 through an electronic device, part of the heat is transferred to the water cooling fin cover plate 3 through the heat pipe water cooling seat 2, most of the heat is transferred to the heat dissipation fin assembly 4 through efficient heat transfer of the heat pipe 1, and the heat is taken away through forced air cooling of the fans 5 on two sides, so that efficient heat transfer of the heat pipe under air cooling is realized;
secondly, the water cooling mode can be adopted under the condition that the heating value of the electronic device is higher or water circulation equipment is arranged, the fan can be not used under the water cooling mode, the situation that the larger vibration is caused by the simultaneous use of the fan and water cooling to influence the normal work of the device is avoided, the heat is directly added on the heat pipe water cooling seat 2 and the heat pipe 1 through the electronic device, part of the heat is transferred to the water cooling fin through the heat pipe and then to the atmosphere, after the lower end of the water cooling pipe 6 is communicated with an external water cooling system, most of the heat is circulated to an external water cooling machine through a water cooling runner 2-3, and a good water cooling heat dissipation effect is achieved.
The technical aspects provided by the invention can be known as follows: on the premise of ensuring the structure of the conventional heat pipe radiator, the whole structure has stronger applicability, two heat dissipation modes of water cooling and heat pipe air cooling are designed simultaneously, the heat dissipation effect is better, selection modes in different environments are provided, and the applicability is better.
Claims (9)
1. The utility model provides an extension water-cooled heat pipe radiator, extension water-cooled heat pipe radiator includes hot pipe water-cooling seat (2), water-cooled fin apron (3), radiating fin subassembly (4), two fan (5), two water-cooled tube (6) and many heat pipes (1), and hot pipe water-cooling seat (2), water-cooled fin apron (3) and radiating fin subassembly (4) set gradually its characterized in that from top to bottom: the heat pipe (1) is inverted U-shaped, a plurality of heat pipe installation grooves (2-2) are processed on the upper end surface of the heat pipe water cooling seat (2), the number of the heat pipes (1) is consistent with that of the heat pipe installation grooves (2-2), the horizontal pipe of the heat pipe (1) is positioned in the heat pipe water cooling seat (2), the heat pipe (1) is flush with the upper end surface of the heat pipe water cooling seat (2), the vertical pipe of the heat pipe (1) penetrates out of the heat radiating fin component (4) from top to bottom, a water cooling runner (2-3) is processed on the lower end surface of the heat pipe water cooling seat (2), the lower end of the heat pipe water cooling seat (2) is hermetically connected with the water cooling fin cover plate (3), the water inlet and the water outlet of the water cooling runner (2-3) are processed on the side wall of the heat pipe water cooling seat (2), a plurality of water cooling fins (3-2) are arranged on the lower end, two water inlets and outlets (3-1) of the water-cooling flow passages (2-3) are respectively connected with a water-cooling pipe (6), the lower ends of the two water-cooling pipes (6) penetrate out of the radiating fin assembly (4) from top to bottom, and two fans (5) are oppositely arranged on the front side wall and the rear side wall of the radiating fin assembly (4).
2. The extended water-cooled heat pipe radiator according to claim 1, wherein: the quantity of heat pipe (1) is 4 ~ 6, and many heat pipes (1) are parallel arrangement in proper order along heat pipe radiator length direction, and the interval between two adjacent heat pipes (1) equals to set up, and the interval between two adjacent heat pipes (1) is 2 mm.
3. The extended water-cooled heat pipe radiator according to claim 1 or 2, wherein: the heat pipe through holes (4-1) corresponding to the heat pipes (1) are processed on the heat dissipation fin assembly (4), the heat pipes (1) are welded on the heat pipe through holes (4-1) of the heat dissipation fin assembly (4), and the diameter of each heat pipe through hole (4-1) is 6 mm.
4. The extended water-cooled heat pipe radiator according to claim 3, wherein: the water-cooling fins (3-2) are sequentially arranged in parallel at intervals along the length direction of the water-cooling fin cover plate (3), and the distance between every two adjacent water-cooling fins (3-2) is equal.
5. The extended water-cooled heat pipe radiator according to claim 1, 2 or 4, wherein: the water-cooling pipe (6) adopts a copper pipe, two water-cooling pipe through holes (4-2) are correspondingly processed on the radiating fin assembly (4), the water-cooling pipe (6) is welded on the water-cooling pipe through holes (4-2) of the radiating fin assembly (4), and the diameter of each water-cooling pipe through hole (4-2) is 6 mm.
6. The extended water-cooled heat pipe radiator according to claim 5, wherein: the water-cooling flow channels (2-3) are formed by a plurality of flow channels which are parallel to each other and are arranged at equal intervals, the adjacent flow channels are communicated with each other end to end, and the water inlet and the water outlet of the water-cooling flow channels (2-3) are positioned on the same side wall of the hot pipe water-cooling seat (2).
7. The extended water-cooled heat pipe radiator according to claim 6, wherein the cross section of the single flow passage is rectangular, the size of the cross section of the single flow passage is 4mm × 4mm, and the diameters of the water inlet and the water outlet of the water-cooled flow passage (2-3) are both 6 mm.
8. The extended water-cooled heat pipe radiator according to claim 1, 2, 4, 6 or 7, wherein: the radiating fin assemblies (4) comprise a plurality of radiating fins, the number of the radiating fins is 38, and the distance between every two adjacent radiating fin assemblies (4) is 2 mm.
9. The extended water-cooled heat pipe radiator according to claim 8, wherein: the length of the heat dissipation fin assembly (4) is 95mm, the width of the heat dissipation fin assembly (4) is 50mm, and the thickness of the heat dissipation fin assembly (4) is 0.4 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010235235.4A CN111366020A (en) | 2020-03-30 | 2020-03-30 | Extended water-cooled heat pipe radiator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010235235.4A CN111366020A (en) | 2020-03-30 | 2020-03-30 | Extended water-cooled heat pipe radiator |
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| CN111366020A true CN111366020A (en) | 2020-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010235235.4A Pending CN111366020A (en) | 2020-03-30 | 2020-03-30 | Extended water-cooled heat pipe radiator |
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| CN1652328A (en) * | 2004-02-03 | 2005-08-10 | 山洋电气株式会社 | Electronic component cooling apparatus |
| CN101080158A (en) * | 2006-05-26 | 2007-11-28 | 华硕电脑股份有限公司 | Heat radiator |
| CN201039637Y (en) * | 2007-01-10 | 2008-03-19 | 讯凯国际股份有限公司 | Composite heat exchange device |
| CN102128517A (en) * | 2010-01-13 | 2011-07-20 | 林义民 | Cold and hot exchange device |
| CN203706120U (en) * | 2014-01-24 | 2014-07-09 | 东莞仁海科技股份有限公司 | Efficient CPU radiator |
| CN104932648A (en) * | 2015-07-17 | 2015-09-23 | 中国移动通信集团广东有限公司 | Water-cooled type heat pipe radiator and manufacturing method thereof |
| CN206833355U (en) * | 2017-03-30 | 2018-01-02 | 恩斯迈电子(深圳)有限公司 | Air-cooling and liquid-cooling combined radiator |
-
2020
- 2020-03-30 CN CN202010235235.4A patent/CN111366020A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1652328A (en) * | 2004-02-03 | 2005-08-10 | 山洋电气株式会社 | Electronic component cooling apparatus |
| CN101080158A (en) * | 2006-05-26 | 2007-11-28 | 华硕电脑股份有限公司 | Heat radiator |
| CN201039637Y (en) * | 2007-01-10 | 2008-03-19 | 讯凯国际股份有限公司 | Composite heat exchange device |
| CN102128517A (en) * | 2010-01-13 | 2011-07-20 | 林义民 | Cold and hot exchange device |
| CN203706120U (en) * | 2014-01-24 | 2014-07-09 | 东莞仁海科技股份有限公司 | Efficient CPU radiator |
| CN104932648A (en) * | 2015-07-17 | 2015-09-23 | 中国移动通信集团广东有限公司 | Water-cooled type heat pipe radiator and manufacturing method thereof |
| CN206833355U (en) * | 2017-03-30 | 2018-01-02 | 恩斯迈电子(深圳)有限公司 | Air-cooling and liquid-cooling combined radiator |
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Application publication date: 20200703 |