CN203706120U - Efficient CPU radiator - Google Patents
Efficient CPU radiator Download PDFInfo
- Publication number
- CN203706120U CN203706120U CN201420044357.5U CN201420044357U CN203706120U CN 203706120 U CN203706120 U CN 203706120U CN 201420044357 U CN201420044357 U CN 201420044357U CN 203706120 U CN203706120 U CN 203706120U
- Authority
- CN
- China
- Prior art keywords
- water
- heat pipe
- cpu
- water cooling
- cooling head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 47
- 238000001816 cooling Methods 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 6
- YXLXNENXOJSQEI-UHFFFAOYSA-L Oxine-copper Chemical compound [Cu+2].C1=CN=C2C([O-])=CC=CC2=C1.C1=CN=C2C([O-])=CC=CC2=C1 YXLXNENXOJSQEI-UHFFFAOYSA-L 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The utility model relates to the technical field of radiators, in particular to an efficient CPU radiator. The efficient CPU radiator comprises an air cooling device and a water cooling device. The air cooling device comprises a fan installed on a CPU and a plurality of direct contact heat pipes which are U-shaped pipes, and the two side edges of the direct contact heat pipes are installed on the CPU. The water cooling device comprises a water drainage device and a water cooling head, and the water drainage device is connected with the water cooling head through a water drainage pipe to form a water way circulating structure, a bottom plate of the water cooling head is a water cooling copper bottom, the face, located in an inner cavity of the water cooling head, of the water cooling copper bottom is an inner surface, the inner surface is provided with thin grooves densely formed side by side, the outer surface of the water cooling copper bottom is provided with heat pipe grooves matched with the direct contact heat pipes, and the middle edges of the direct contact heat pipes are embedded in the heat pipe grooves. The width of the thin grooves ranges from 0.1 mm to 0.15 mm. The efficient CPU radiator is simple and compact in structure and capable of achieving a very good heat dissipation effect.
Description
Technical field
The utility model relates to heat sink technology field, relates in particular to a kind of CPU high-efficiency radiator.
Background technology
Cpu heat mainly contains air-cooled radiator, three kinds of heat-pipe radiator and water-filled radiators at present.Because low price, installing/dismounting be easy etc., reason becomes the main flow heating radiator of installation configuration all the time to air-cooled radiator.And water-filled radiator has good heat load ability, cooling-down effect is better than fan radiator, is all minority overclocking fan's pursuit all the time.Also there is on the market the product that uses air-cooled radiator collocation water-filled radiator, but operating structure complexity, the shortcoming that radiating effect is not good.
Summary of the invention
The purpose of this utility model is to provide a kind of CPU high-efficiency radiator for the deficiencies in the prior art, not only simple and compact for structure, also can reach extraordinary radiating effect.
For achieving the above object, the utility model adopts following technical scheme: a kind of CPU high-efficiency radiator, and it comprises air cooler and water cooler; Described air cooler comprises the fan and the some straight heat pipes that touches that are installed on CPU, and directly touching heat pipe is " U " type pipe, and the dual-side that directly touches heat pipe is installed on CPU; Described water cooler comprises water row and water-cooling head, and water row connects water-cooling head by water comb and forms channel circulation structure; At the bottom of the base plate of described water-cooling head is water-cooled copper, the one side that is positioned at water-cooling head inner chamber at the bottom of water-cooled copper is inside surface, inside surface offers the stria of intensive setting side by side, and outside surface offers and directly touches the corrugated heat pipe that heat pipe mates, and the described straight medial side of touching heat pipe embeds described corrugated heat pipe; The groove width of described stria is 0.1 ~ 0.15mm.
The groove width of described stria is 0.12mm.
Described water-cooling head is provided with water pump.
Described water row is provided with water exhaust fan.
The utility model beneficial effect is: a kind of CPU high-efficiency radiator described in the utility model, and by air-cooled and unitized construction water-cooled, simple and compact for structure, also can reach extraordinary radiating effect.
Brief description of the drawings
Accompanying drawing 1 is structural representation of the present utility model.
Accompanying drawing 2 is structural representations of water cooler of the present utility model.
Accompanying drawing 3 is the structural representations at the bottom of water-cooled copper of the present utility model.
Accompanying drawing 4 is another visual angle structural representations at the bottom of water-cooled copper of the present utility model.
Embodiment
Below in conjunction with accompanying drawing, the utility model is further described: as shown in Figures 1 to 4, a kind of CPU high-efficiency radiator described in the utility model, it comprises air cooler and water cooler; Described air cooler comprises the fan 6 and the some straight heat pipes 5 that touches that are installed on CPU, and directly touching heat pipe 5 is " U " type pipe, and the dual-side that directly touches heat pipe 5 is installed on CPU; Described water cooler comprises water row 1 and water-cooling head 4, and water row 1 arranges 1 pipe connection water-cooling head 4 by water and forms channel circulation structure; The base plate of described water-cooling head 4 is at the bottom of water-cooled copper 8, at the bottom of water-cooled copper, 8 one sides that are positioned at water-cooling head 4 inner chambers are inside surface, inside surface offers the stria 9 of intensive setting side by side, and outside surface offers and directly touches the corrugated heat pipe 10 that heat pipe 5 mates, and the described straight medial side of touching heat pipe 5 embeds described corrugated heat pipe 10; The groove width of described stria 9 is 0.1 ~ 0.15mm.Preferably, the groove width of described stria 9 is 0.1mm or 0.12mm, intensive stria 9 can increase at the bottom of water-cooled copper 8 with the contact area of water-cooled liquid, improve at the bottom of water-cooled copper 8 and water-cooled liquid between heat conduction efficiency.Described water-cooling head 4 is provided with water pump 7, for providing power to make the circulation between water row 1 pipe and water-cooling head 4 of water-cooled liquid.Described water row 1 is provided with water exhaust fan 2, and water exhaust fan 2 is arranged water-cooled liquid in 1 pipe to water and done further coolingly, improves the radiating effect of product.
Above-mentioned a kind of CPU high-efficiency radiator, its air cooler is embedded corrugated heat pipe 10 and is directly touched heat conduction by the straight heat pipe 5 that touches, and by the bottom of water-cooled copper 8 and fan 6 dispel the heat; Its water cooler is by 8 heat conduction at the bottom of water-cooled copper, 8 stria 9(FIN sheet at the bottom of water-cooled copper) flow through water-cooled liquid, hot-fluid is brought to water row 1 by water-cooled liquid-circulating, more cooling by water exhaust fan 2, and cooled water-cooled liquid is recycled to 8 circulation coolings at the bottom of water-cooled copper.This structure band heat-pipe air-cooling collocation water-cooled, compatible water-cooling and wind-cooling heat dissipating at the bottom of the copper of water-cooled, at the bottom of water-cooled copper, 8 adopt shovel FIN and heat pipe directly to touch technique, not only simple and compact for structure, also can reach extraordinary radiating effect.
The above is only preferred embodiments of the present utility model, and the equivalence of doing according to structure, feature and principle described in the utility model patent claim therefore all changes or modifies, and is included in the utility model patent claim.
Claims (4)
1. a CPU high-efficiency radiator, is characterized in that: it comprises air cooler and water cooler; Described air cooler comprises the fan (6) and the some straight heat pipes (5) that touches that are installed on CPU, and directly touching heat pipe (5) is " U " type pipe, and the dual-side that directly touches heat pipe (5) is installed on CPU; Described water cooler comprises water row (1) and water-cooling head (4), and water row (1) arranges (1) pipe by water and connects water-cooling head (4) formation channel circulation structure; The base plate of described water-cooling head (4) is (8) at the bottom of water-cooled copper, at the bottom of water-cooled copper, (8) to be positioned at the one side of water-cooling head (4) inner chamber be inside surface, inside surface offers the stria (9) of intensive setting side by side, outside surface offers and directly touches the corrugated heat pipe (10) that heat pipe (5) mates, and the described straight medial side of touching heat pipe (5) embeds described corrugated heat pipe (10); The groove width of described stria (9) is 0.1 ~ 0.15mm.
2. a kind of CPU high-efficiency radiator according to claim 1, is characterized in that: the groove width of described stria (9) is 0.12mm.
3. a kind of CPU high-efficiency radiator according to claim 2, is characterized in that: described water-cooling head (4) is provided with water pump (7).
4. a kind of CPU high-efficiency radiator according to claim 3, is characterized in that: described water row (1) is provided with water exhaust fan (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420044357.5U CN203706120U (en) | 2014-01-24 | 2014-01-24 | Efficient CPU radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420044357.5U CN203706120U (en) | 2014-01-24 | 2014-01-24 | Efficient CPU radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203706120U true CN203706120U (en) | 2014-07-09 |
Family
ID=51056526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420044357.5U Expired - Fee Related CN203706120U (en) | 2014-01-24 | 2014-01-24 | Efficient CPU radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203706120U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105700652A (en) * | 2016-03-16 | 2016-06-22 | 深圳市超频三科技股份有限公司 | Cooler |
| CN106383561A (en) * | 2016-09-21 | 2017-02-08 | 陕西理工学院 | Computer CPU cooling apparatus |
| CN108334179A (en) * | 2018-03-21 | 2018-07-27 | 华南理工大学 | It is a kind of can intelligent temperature control laptop CPU water cooling micro-channel radiators |
| CN111366020A (en) * | 2020-03-30 | 2020-07-03 | 厦门大学 | Extended water-cooled heat pipe radiator |
-
2014
- 2014-01-24 CN CN201420044357.5U patent/CN203706120U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105700652A (en) * | 2016-03-16 | 2016-06-22 | 深圳市超频三科技股份有限公司 | Cooler |
| CN105700652B (en) * | 2016-03-16 | 2023-08-11 | 深圳市超频三科技股份有限公司 | Radiator |
| CN106383561A (en) * | 2016-09-21 | 2017-02-08 | 陕西理工学院 | Computer CPU cooling apparatus |
| CN108334179A (en) * | 2018-03-21 | 2018-07-27 | 华南理工大学 | It is a kind of can intelligent temperature control laptop CPU water cooling micro-channel radiators |
| CN111366020A (en) * | 2020-03-30 | 2020-07-03 | 厦门大学 | Extended water-cooled heat pipe radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: An efficient heat sink for CPU Effective date of registration: 20201016 Granted publication date: 20140709 Pledgee: Dongguan branch of Bank of Dongguan Co.,Ltd. Pledgor: INHERE (DONGGUAN) TECHNOLOGY Co.,Ltd. Registration number: Y2020980006856 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231206 Granted publication date: 20140709 Pledgee: Dongguan branch of Bank of Dongguan Co.,Ltd. Pledgor: INHERE (DONGGUAN) TECHNOLOGY CO.,LTD. Registration number: Y2020980006856 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140709 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |