CN105700652B - Radiator - Google Patents
Radiator Download PDFInfo
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- CN105700652B CN105700652B CN201610154831.3A CN201610154831A CN105700652B CN 105700652 B CN105700652 B CN 105700652B CN 201610154831 A CN201610154831 A CN 201610154831A CN 105700652 B CN105700652 B CN 105700652B
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- heat
- water
- cooled
- air
- liquid
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/202—Air convective hinge
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a radiator, which comprises a heat absorption base and a liquid cooling heat dissipation assembly, wherein a fluid channel is arranged in the heat absorption base; the liquid cooling heat dissipation assembly is in fluid communication with the fluid channel to dissipate heat of the heat absorption base in a liquid cooling mode. The radiator provided by the invention mainly dissipates heat in a liquid cooling mode and is assisted in an air cooling mode, and the radiating efficiency is further improved compared with the radiator mainly dissipates heat in an air cooling mode and assisted in a liquid cooling mode.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a radiator combining air cooling and water cooling.
Background
At present, the CPU radiator mainly comprises three types of air-cooled radiator, heat pipe radiator and water-cooled radiator.
The air-cooled radiator has become a mainstream radiator in conventional installation and configuration because of low cost, easy installation and removal, and the like.
The water-cooled radiator has very good heat load capacity, and the cooling effect is better than that of a fan radiator, so that the water-cooled radiator is pursued by a few of over-frequency fever friends.
Products using an air-cooled radiator and a water-cooled radiator are also available on the market, but the defects of complex operation structure and poor radiating effect exist.
For example, chinese patent No. CN203706117U discloses an air-cooled and water-cooled integrated radiator, which absorbs heat by contacting a heat source with a direct heat pipe 5, and radiates heat by air-cooling and water-cooling, wherein the water-cooled head 4 absorbs heat of the direct heat pipe 5 by matching the heat pipe groove 10 with the direct heat pipe 5, which is equivalent to mainly air-cooled heat radiation and is assisted by water-cooled heat radiation, and the heat radiation efficiency is still poor.
Disclosure of Invention
The invention provides a radiator, which aims to solve the technical problem of poor radiating efficiency of the radiator in the prior art.
In order to solve the technical problems, the invention adopts a technical scheme that: there is provided a heat sink including:
the heat absorption base is internally provided with a fluid channel;
and the liquid cooling radiating component is in fluid communication with the fluid channel so as to radiate the heat of the heat absorbing base in a liquid cooling mode.
According to a preferred embodiment of the present invention, the heat radiator further includes an air-cooled heat radiation assembly, and the air-cooled heat radiation assembly is in heat conduction connection with the heat absorption base, so as to further perform air-cooled heat radiation on the heat absorption base on the basis that the liquid-cooled heat radiation assembly performs heat radiation on the heat absorption base through a liquid cooling manner.
According to a preferred embodiment of the present invention, the heat absorbing base includes:
a base body provided with the fluid passage;
and the fixing body is fixed with the base body so as to tightly press and fix the air-cooled radiating component on the base body.
According to a preferred embodiment of the present invention, the heat absorbing base includes:
an intermediate;
the fixing body is fixed on one side surface of the intermediate body so as to tightly press and fix the air-cooled radiating component on the intermediate body;
the heat absorbing body is fixed on the other side face of the intermediate body, and a main water pool is formed between the heat absorbing body and the intermediate body;
the intermediate body and the fixed body are provided with communication holes, and the communication holes are communicated with the main water tank to form the fluid channel.
According to a preferred embodiment of the present invention, the liquid cooling heat dissipation assembly includes a water row, a circulating water pump and a water pipe, the water pipe communicates the water row with the fluid channel, and the circulating water pump is used for circulating the liquid in the water row.
According to a preferred embodiment of the invention, the water drain is provided with an opening, and the circulating water pump is arranged in the opening.
According to a preferred embodiment of the present invention, the liquid cooling heat dissipation assembly further includes a first fan, and the first fan is fixed on the water row to dissipate heat of the water row.
According to a preferred embodiment of the present invention, the air-cooled heat dissipation assembly includes a heat pipe and a fin module, the fin module is disposed on the heat pipe in a penetrating manner, and the heat pipe is pressed and fixed on the intermediate body by the fixing body, so as to absorb heat of the intermediate body and dissipate heat through the fin module.
According to a preferred embodiment of the present invention, the air-cooled heat dissipation assembly further includes a second fan, and the second fan is configured to dissipate heat from the fin module.
According to a preferred embodiment of the present invention, the liquid cooling heat dissipation assembly further includes a water storage tank, the water storage tank is connected to the fixed body and is communicated with the fluid channel, meanwhile, the fin module is provided with a through hole, and the water storage tank is inserted into the through hole.
The beneficial effects of the invention are as follows: compared with the prior art, the radiator provided by the invention mainly dissipates heat in a liquid cooling mode and is assisted in an air cooling mode, and the radiating efficiency is further improved compared with the radiator mainly dissipates heat in an air cooling mode and is assisted in a liquid cooling mode.
Drawings
For a clearer description of the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the description below are only some embodiments of the present invention, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art, wherein:
FIG. 1 is a schematic perspective view of a radiator according to a preferred embodiment of the present invention;
FIG. 2 is a simplified illustration of a heat sink body of a preferred embodiment of the present invention;
FIG. 3 is a schematic illustration of the fluid circuit of a radiator in accordance with a preferred embodiment of the present invention;
fig. 4 is a partially exploded view of a heat sink according to a preferred embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 4, the present invention provides a heat sink 10, and the heat sink 10 includes a heat absorbing base 100 and a liquid cooling heat dissipating assembly 200.
Wherein, a fluid channel is disposed in the heat absorption base 100, and the liquid cooling heat dissipation assembly 200 is in fluid communication with the fluid channel to dissipate heat of the heat absorption base 100 in a liquid cooling manner.
In a preferred embodiment, the radiator 10 further includes an air-cooled heat dissipation assembly 300, and the air-cooled heat dissipation assembly 300 is in heat conduction connection with the heat absorption base 100, so as to further perform air-cooled heat dissipation on the heat absorption base 100 on the basis that the liquid-cooled heat dissipation assembly 200 performs heat dissipation on the heat absorption base 100 through a liquid cooling manner. The heat absorbing base 100 is made of a material with good heat dissipation performance, for example, a copper material.
As shown in fig. 2, in an embodiment of the present invention, the heat absorbing base 100 includes a base 110 and a fixing body 119.
The base 110 is provided with the fluid channel 113, and the fluid channel 113 is preferably disposed at a position close to the surface of the heat absorbing base 100 contacting the heat source, so that the main heat absorbed by the heat absorbing base 100 is dissipated by the cooling liquid flowing through the fluid channel 113 at the first time, and part of the residual heat is dissipated continuously by air cooling.
The fixing body 119 is fixed with the base 110 to tightly fix the air-cooled heat dissipation assembly 300 on the base 110.
As shown in fig. 3 and 4, in another preferred embodiment of the present invention, the heat absorbing base 100 is divided into three layers including a fixing body 120, an intermediate body 111, and a heat absorbing body 112.
The fixing body 120 is fixed to one side of the intermediate body 111, and is used for tightly fixing the heat pipe 310 of the air-cooled heat dissipation assembly 300 on the intermediate body 111, and preferably, a heat pipe groove is formed on the lower surface of the fixing body 120 so as to be tightly matched with the heat pipe 310.
The heat absorber 112 is fixed on the other side surface of the intermediate body 111, and a main water pool is formed between the heat absorber 112 and the intermediate body 111, wherein the main water pool can be formed by at least one of the heat absorber 112 and the intermediate body 111 being provided with a concave cavity, for example, the bottom of the intermediate body 111 is provided with a concave cavity, and the heat absorber 112 is tightly matched with the intermediate body 111 in a sealing way through a countersunk screw 1121 and a sealing ring 118. The heat absorber 112 is thinner, so that the main water tank can be further connected to the heat source, so that the main heat absorbed by the heat absorbing base 100 is dissipated by the cooling liquid flowing through the main water tank at the first time, and part of the waste heat is dissipated by air cooling.
The middle body 111 may be in a slot shape, the middle area has a hollow groove 117 for loading the heat pipe 310, the two side areas are provided with communication holes 115 and 116, the fixed body 120 is also provided with communication holes, the communication holes on the fixed body 120 are connected with the water pipe 230 at the side surface and are communicated with the communication holes 115 and 116 on the middle body 111 at the lower surface, the communication holes on the fixed body 120 and the communication holes 115 and 116 on the middle body 111 form a fluid channel with a main water tank, and the cooling liquid can enter the main water tank through the communication holes on the fixed body 120 and the communication holes 115 on the middle body 111 and then be circularly discharged through the communication holes 116 on the middle body 111 and the communication holes on the fixed body 120.
As shown in fig. 1, the liquid-cooled heat sink assembly 200 includes a water row 210, a circulating water pump 220, and a water pipe 230, the water pipe 230 communicates the water row 210 with the fluid passage, and the circulating water pump 220 is used for circulating the liquid in the water row 210.
The water row 210 is provided with an opening, the circulating water pump 220 is arranged in the opening, and the opening can be arranged at any position on the water row panel, so that the liquid cooling heat dissipation assembly 200 is more compact in structure. In the prior art, the circulating water pump 220 is generally disposed outside the water row 210, and is combined with the heat absorbing base to form an integrated water cooling head, which results in a large volume and is inconvenient for the heat pipe 310 to be thermally connected again.
In addition, the liquid cooling heat dissipation assembly 200 further includes a first fan 240, and the first fan 240 is fixed on the water row 210 to dissipate heat from the water row 210.
The air-cooled heat dissipation assembly 300 comprises a heat pipe 310 and a fin module 320, wherein the fin module 320 is arranged on the heat pipe 310 in a penetrating manner, and the heat pipe 310 is tightly fixed on the intermediate body 111 by the fixing body 120 so as to absorb heat of the intermediate body 111 and dissipate heat through the fin module 320.
In addition, the air-cooled heat dissipation assembly 300 further includes a second fan 330, and the second fan 330 is configured to dissipate heat from the fin module 320.
As shown in fig. 3 and 4, in the preferred embodiment of the present invention, the liquid cooling heat dissipation assembly 200 further includes a water storage tank 250, the water storage tank 250 is connected to the fixed body 120 and is in communication with the fluid circuit, meanwhile, the fin module 320 is provided with a through hole, the water storage tank 250 is inserted into the through hole, so that the structure is compact, and the second fan 330 can simultaneously dissipate heat of cooling liquid, typically water, in the water storage tank 250.
The water storage tank 250 may be connected with the connection port 121 on the fixed body 120 in a spiral manner and through the sealing ring 251, and the connection port 121 on the fixed body 120 and the communication hole on the fixed body 120 form a three-way pipe.
The top of the water storage tank 250 can be provided with a cover body so as to be convenient for adding water, the fixing body 120 can be further provided with a water drain hole 122, the water storage tank is fixed through a water plug screw 123, and when water is needed to be drained, the water plug screw 123 is unscrewed.
In summary, as will be understood by those skilled in the art, the radiator 10 provided by the present invention mainly uses a liquid cooling method to dissipate heat, and uses an air cooling method to dissipate heat as an auxiliary, so that the heat dissipation efficiency is further improved compared with a radiator mainly uses an air cooling method to dissipate heat and uses a liquid cooling method to dissipate heat as an auxiliary.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.
Claims (5)
1. A heat sink, comprising:
the heat absorption base is internally provided with a fluid channel;
the liquid cooling heat dissipation assembly comprises a water row, a circulating water pump and a water pipe; the water row is provided with an opening, and the circulating water pump is arranged in the opening; the water pipe is used for communicating the water row with the fluid channel, and the circulating water pump is used for circulating the liquid in the water row; fluid communication with the fluid channel to dissipate heat from the heat sink base by liquid cooling;
the air cooling heat dissipation assembly is in heat conduction connection with the heat absorption base so as to further conduct air cooling heat dissipation on the heat absorption base on the basis that the liquid cooling heat dissipation assembly conducts heat dissipation on the heat absorption base in a liquid cooling mode;
wherein, the heat absorption base includes: an intermediate; the fixing body is fixed on one side surface of the intermediate body so as to tightly press and fix the air-cooled radiating component on the intermediate body; the heat absorbing body is fixed on the other side face of the intermediate body, and a main water pool is formed between the heat absorbing body and the intermediate body; the intermediate body and the fixed body are provided with communication holes, and the communication holes are communicated with the main water tank to form the fluid channel;
the main water tank is formed by a concave cavity arranged at the bottom of the middle body, so that the main heat absorbed by the heat absorbing base is radiated by cooling liquid flowing through the main water tank at the first time.
2. The heat sink of claim 1 wherein the liquid cooled heat sink assembly further comprises a first fan secured to the water row to dissipate heat from the water row.
3. The heat sink of claim 1, wherein the air-cooled heat dissipation assembly comprises a heat pipe and a fin module, the fin module is arranged on the heat pipe in a penetrating manner, and the heat pipe is pressed and fixed on the intermediate body by the fixing body so as to absorb heat of the intermediate body and dissipate heat through the fin module.
4. The heat sink of claim 3, wherein the air-cooled heat dissipation assembly further comprises a second fan for dissipating heat from the fin module.
5. The heat sink of claim 3 wherein said liquid cooled heat sink assembly further comprises a water reservoir connected to said stationary body and in communication with said fluid passage, and wherein said fin module is provided with a through hole into which said water reservoir is inserted.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610154831.3A CN105700652B (en) | 2016-03-16 | 2016-03-16 | Radiator |
Applications Claiming Priority (1)
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CN201610154831.3A CN105700652B (en) | 2016-03-16 | 2016-03-16 | Radiator |
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CN105700652A CN105700652A (en) | 2016-06-22 |
CN105700652B true CN105700652B (en) | 2023-08-11 |
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CN201610154831.3A Active CN105700652B (en) | 2016-03-16 | 2016-03-16 | Radiator |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106774746A (en) * | 2016-12-28 | 2017-05-31 | 曙光信息产业(北京)有限公司 | For the liquid cooling system module and graphics workstation of graphics workstation |
CN109814691A (en) * | 2019-01-28 | 2019-05-28 | 合肥清若科技有限公司 | A kind of computer CPU acceleration radiator |
CN111103958B (en) * | 2020-02-26 | 2021-06-01 | 邢台职业技术学院 | Circulation cooling device for improving heat dissipation efficiency of computer |
CN111857270A (en) * | 2020-07-21 | 2020-10-30 | 重庆电力高等专科学校 | Device beneficial to heat dissipation of computer |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2622866Y (en) * | 2003-06-03 | 2004-06-30 | 王锐 | Air-liquid integrated radiator of CPU |
CN2760756Y (en) * | 2004-12-15 | 2006-02-22 | 宣普科技股份有限公司 | Biphase liquid regurgitating type radiator |
CN1828875A (en) * | 2005-02-28 | 2006-09-06 | 台达电子工业股份有限公司 | Liquid cooling type heat radiation module |
CN1877828A (en) * | 2005-06-08 | 2006-12-13 | 富准精密工业(深圳)有限公司 | Radiator |
CN101227809A (en) * | 2007-01-19 | 2008-07-23 | 元山科技工业股份有限公司 | Liquid cooling heat radiating device |
CN201993010U (en) * | 2010-12-07 | 2011-09-28 | 深圳市超频三科技有限公司 | Radiator |
CN202168321U (en) * | 2011-08-11 | 2012-03-14 | 北京奇宏科技研发中心有限公司 | Integrated liquid cooling radiator |
CN202310445U (en) * | 2011-11-11 | 2012-07-04 | 惠州智科实业有限公司 | Water-cooled radiator |
CN202585391U (en) * | 2012-03-28 | 2012-12-05 | 深圳市研派科技有限公司 | Liquid-cooling heat dispassion system |
CN203706117U (en) * | 2014-01-24 | 2014-07-09 | 东莞仁海科技股份有限公司 | Air-cooling and water-cooling integrated radiator |
CN203706120U (en) * | 2014-01-24 | 2014-07-09 | 东莞仁海科技股份有限公司 | Efficient CPU radiator |
CN205644413U (en) * | 2016-03-16 | 2016-10-12 | 深圳市超频三科技股份有限公司 | Heat sink |
-
2016
- 2016-03-16 CN CN201610154831.3A patent/CN105700652B/en active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2622866Y (en) * | 2003-06-03 | 2004-06-30 | 王锐 | Air-liquid integrated radiator of CPU |
CN2760756Y (en) * | 2004-12-15 | 2006-02-22 | 宣普科技股份有限公司 | Biphase liquid regurgitating type radiator |
CN1828875A (en) * | 2005-02-28 | 2006-09-06 | 台达电子工业股份有限公司 | Liquid cooling type heat radiation module |
CN1877828A (en) * | 2005-06-08 | 2006-12-13 | 富准精密工业(深圳)有限公司 | Radiator |
CN101227809A (en) * | 2007-01-19 | 2008-07-23 | 元山科技工业股份有限公司 | Liquid cooling heat radiating device |
CN201993010U (en) * | 2010-12-07 | 2011-09-28 | 深圳市超频三科技有限公司 | Radiator |
CN202168321U (en) * | 2011-08-11 | 2012-03-14 | 北京奇宏科技研发中心有限公司 | Integrated liquid cooling radiator |
CN202310445U (en) * | 2011-11-11 | 2012-07-04 | 惠州智科实业有限公司 | Water-cooled radiator |
CN202585391U (en) * | 2012-03-28 | 2012-12-05 | 深圳市研派科技有限公司 | Liquid-cooling heat dispassion system |
CN203706117U (en) * | 2014-01-24 | 2014-07-09 | 东莞仁海科技股份有限公司 | Air-cooling and water-cooling integrated radiator |
CN203706120U (en) * | 2014-01-24 | 2014-07-09 | 东莞仁海科技股份有限公司 | Efficient CPU radiator |
CN205644413U (en) * | 2016-03-16 | 2016-10-12 | 深圳市超频三科技股份有限公司 | Heat sink |
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