CN2622866Y - Air-liquid integrated radiator of CPU - Google Patents

Air-liquid integrated radiator of CPU Download PDF

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Publication number
CN2622866Y
CN2622866Y CN 03234717 CN03234717U CN2622866Y CN 2622866 Y CN2622866 Y CN 2622866Y CN 03234717 CN03234717 CN 03234717 CN 03234717 U CN03234717 U CN 03234717U CN 2622866 Y CN2622866 Y CN 2622866Y
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CN
China
Prior art keywords
thermal conductive
conductive cavity
heat
liquid
fan
Prior art date
Application number
CN 03234717
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Chinese (zh)
Inventor
王锐
Original Assignee
王锐
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 王锐 filed Critical 王锐
Priority to CN 03234717 priority Critical patent/CN2622866Y/en
Application granted granted Critical
Publication of CN2622866Y publication Critical patent/CN2622866Y/en

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Abstract

An air-liquid integrated radiator of CPU comprises a structural section of the main body: the lower part of the structural section of the main body is provided with a heat conduction cavity which is filled with cooling medium, the bottom plate of the heat conduction cavity is used as the heat conduction to radiate for CPU, one side of the heating conduction cavity is provided with a liquid storing box, the other side is provided with a liquid pump, the upper part of the top plate of the heating conduction cavity is provided with a fan, an air outlet of which is rightly opposite to the top plate of the heating conduction cavity; the utility model also consists of a fame which is arranged on the upper end surface of the structural section of the main body, and a radiating pipe which is arranged on the frame and is positioned on an air inlet of the fan; the utility model also consists of sealing plates which are arranged on the front and the back end surfaces of the heating conduction cavity; an inlet of the liquid pump is connected with an outlet of the heating conduction cavity, an outlet of the liquid pump is connected with an inlet of the radiating pipe, an outlet of the radiating pipe is communicated with an inlet of the liquid storing box, an outlet of the liquid storing box is connected with an inlet of the heating conduction cavity. The utility model has characteristics of simple structure, small volume, high industrialization degree, double radiating of air-liquid cooling.

Description

The whole central processing unit heat abstractor of wind liquid
Technical field
The utility model relates to electronic circuit integrated package heat abstractor, especially for the heat abstractor of computer cpu.
Background technology
Along with the continuous lifting of CPU (central processing unit) processing speed, its caloric value also increases with regard to positive correlation ground is mad.With performance radiator preferably, make a stable heat dissipation environment, we can say that the performance when CPU worked plays a decisive role.The largest benefit that the improvement of CPU and radiator manufacturing process brings to the user is exactly that the overclocking ability of CPU is further mentioned raising.After the overclocking, CPU must be with producing more heat, if cooling measure is undesirable, the heat that can not in time CPU be produced is taken away, and CPU inside will go out to manage the electron transfer phenomenon, and the result that it directly causes is the aging promptly dead of CPU.
The mode that the present CPU of help dispels the heat has a variety of, and what the user knew most should calculate wind-cooling heat dissipating, and it is made of fin and fan.As, Chinese patent literature discloses a kind of " CPU heat abstractor " (942220145), and its CPU is embedded among skeleton frame, is close on the fin, adopts fan, utilizes moving air to take away the heat of fin.The principle of this radiating mode is very simple, and the heat that CPU produces is directly delivered to fin, and the heat that the rotation generation air-flow of fan is accumulated fin is taken away.The low cost of manufacture of wind-cooling heat dissipating amount, workable, use also safer, so the popularity height.But owing to be limited by air-cooled principle self, the improvement of radiating effect is less.
Discontented for to the air-cooled radiator effect, market engenders semiconductor cooler and water-filled radiator, and both equipment of share." water-cooling heat radiating system of waterproof data processing equipment " (992016215) that disclose as, Chinese patent literature are used to absorb on the heat conduction body of CPU heat a collecting space and at least one waterway, can cool off catchmenting, and discharge out-of-bounds through water channel.But, this radiating mode need effectively solve frosting problem and dew problem, if these water droplets drop on CPU, the mainboard, that can produce short circuit, lose very big, so will consider carefully when using.Subsequently, the water-filled radiator of improvement---liquid cooling heat radiator also comes into the market, and liquid cooling heat radiator begins to consider to use the better liquid of thermal capacitance to replace water.
Now, the continuous appearance of the CPU of computer overclocking and high frequency, make wind-cooling heat dissipating reach the limit, and the huge volume of liquid cooling heat radiation system, high cost, complex installation has limited most computer users, market a kind of volume of urgent urgent need is little, noise is little, cost is low, the normal use that simple a kind of CPU heat abstractor ensures high frequency and overclocking CPU is installed, and brings higher radiating effect with lower use cost.
The utility model content
The purpose of this utility model provides the whole central processing unit heat abstractor of a kind of wind liquid, and it adopts air-cooled and the liquid cooling mode is dispelled the heat to CPU.The purpose of this utility model is achieved in that the whole central processing unit heat abstractor of a kind of wind liquid, comprise fan, fit, take away the conducting strip of its heat with the integrated package of central processing unit, also have the main body section bar: its underpart is provided with the base plate of the described conducting strip of the thermal conductive cavity that is used for the splendid attire coolant as thermal conductive cavity, its inner thermal conductive cavity one side is provided with liquid reserve tank, the thermal conductive cavity opposite side is provided with liquor pump, and heat conduction inner chamber top board top is provided with fan, and the air outlet of fan is over against the thermal conductive cavity top board; Also comprise the hush panel that is arranged on the thermal conductive cavity front and rear end; Also has the framework that places main body section bar upper surface; Also comprise and be erected on the framework, be positioned at the radiating tube on the wind inlet of fan; The import of liquor pump is connected with the thermal conductive cavity outlet, and the liquid delivery side of pump is connected with the radiating tube import, and the radiating tube outlet is communicated with the liquid reserve tank import, and the liquid reserve tank outlet is connected with the thermal conductive cavity import.By above design as seen, with a special-purpose section is main component, dexterously conducting strip is combined with thermal conductive cavity therebetween, and liquor pump and liquid reserve tank and fan settled wherein, with the radiating tube on the framework (being erected on the main component), whole formation one is the closed liquid peripheral passage of power with the liquor pump.During work, the air stream that fan outlet comes directly blows on the thermal conductive cavity top board, liquid in the thermal conductive cavity (coolant) is dispelled the heat, from fact, be the heat that has absorbed CPU module (or other integrated circuit) through conducting strip, play thermolysis CPU; The air stream that the temperature of coming from wind inlet of fan is lower directly blows on radiating tube, through partition heat conduction, absorbs the heat of the higher cooling fluid of temperature in the radiating tube; Above-mentioned to CPU air-cooled in, cooling fluid circulates among thermal conductive cavity, radiating tube, tank body case through liquor pump, we can say, coolant is absorbed CPU institute caloric value through heat conduction by the conducting strip of thermal conductive cavity, its heat is taken away by the air stream of fan through radiating tube again, realized liquid cooling process CPU.
This novel groundwork principle is:
The liquid cooling heat radiation is to utilize the circulation of radiator internal heat dissipating liquid to make CPU institute distribute heat finish directed the transfer.Its main feature is: 1, thermal capacity is big: the thermal capacity of liquid is thousands of times of air.2, mobile can the realize orientation of heat of liquid in pipeline shifts.3, can utilize less power consumption, reach the circulating of liquid, work noise is very little.Wind-cooling heat dissipating is to utilize flowing fast of air to take away the heat that CPU distributes, and can finish the heat radiation to liquid, can directly dispel the heat to CPU again.Liquid-wind heat radiation combines, and has brought into play the heat radiation potential of radiator more fully.Double selection when not being very high, adopts air-cooled heat radiation at cpu temperature automatically, when CPU reaches relevant temperature, switches to dual heat radiation, has effectively prolonged the useful life of radiator.Compare with existing heat dissipation technology, this is novel to have following advantage: 1, volume is little.Its volume and weight and common air-cooled fan are basic identical, and this point is that common liquid cooling fan can't be compared.2, cost is low.Its cost is that 1/5 and middle-grade air-cooled fan of present liquid cooling fan is very nearly the same.3, industrialization degree height.The all existing air-cooled fan of the critical piece that fan uses can be produced, the interface of system and movable part seldom, rate of finished products is very high.4, install simply.It is just the same with present air-cooled fan.5, vitality is strong.Its appearance is exactly for satisfying present high frequency CPU and take into account most of economic players' overclocking needs, and can estimate now that afterwards the CPU that occurs also can be satisfied fully.6, efficient height.Utilized two kinds of air-flows that fan produced to dispel the heat fully.
Description of drawings
Fig. 1 is this novel profile;
Fig. 2 is the stereogram of main body section bar shown in Figure 1;
Fig. 3 is the stereogram after dissecing along the A-A line shown in Figure 1;
Fig. 4 is the vertical view of framework shown in Figure 1 and radiating tube;
Fig. 5 is the left view of card article shown in Figure 4;
Fig. 6 Fig. 7 is respectively the front view and the left view of hush panel.
Embodiment
Fig. 1 Fig. 2 Fig. 3 illustrates, the bottom of main body section bar is provided with the thermal conductive cavity 2 of splendid attire coolant, conducting strip is as base plate (CPU or other integrated package to be dispelled the heat and the conducting strip applying of thermal conductive cavity 2, its heat is pulled away), inner thermal conductive cavity one side of section bar is provided with liquid reserve tank 5, and the thermal conductive cavity opposite side is provided with liquor pump 6, is fixedly connected with the heat-dissipating fin 7 that polylith is arranged in parallel on the thermal conductive cavity top board, the heat-dissipating fin top is provided with fan 8, and the air outlet of fan is over against the thermal conductive cavity top board; The import of liquor pump 6 is connected with thermal conductive cavity 2 outlets 4, and the liquor pump outlet is connected with radiating tube 9 imports, and the radiating tube outlet is communicated with liquid reserve tank 5 imports, and the liquid reserve tank outlet is connected with thermal conductive cavity import 3.Framework 10 places main body section bar upper surface; Radiating tube 9 is erected on the framework, is positioned at above the wind inlet of fan.Referring to Fig. 4 Fig. 5, framework 10 is provided with a plurality of draw-in groove 10a, and card article 11 engaging maintenances are among draw-in groove 10a, and the bayonet socket 11a on the card article 11 will be radiating tube 9 cutting ferrules of serpentine shape to be fixed.Thermal conductive cavity 2 front and rear ends are provided with hush panel, and hush panel can connect firmly thereon, also can connect by removably.Referring to Fig. 6 Fig. 7, hush panel 12 fronts are fixedly connected with two projection 12a, 12b, leave gap 12c between two projections, and the hush panel back side is provided with bloated hole 12d more than 2 over against interstitial site, and rubber ring 13 is enclosed within on two projections, seals.During use, hush panel is buckled on the thermal conductive cavity end face, screws in screw from the hole 12d that expands again; Two protruding envelope pieces are outwards opened, and similar swell fixture is the same, plays the maintenance effect.Above-mentioned coolant can adopt methyl-silicone oil or modified methyl silicone oil.Main body section bar and radiating tube can adopt copper material, and card article 11 can adopt aluminium material.
This novel CPU that is not only applicable to dispels the heat, and is suitable for the heat radiation of other similar integrated circuit modules equally.
It is to be noted especially,, should belong to this patent protection range if this novel liquid reserve tank and liquor pump is installed in outside the main body section bar.

Claims (7)

1, the whole central processing unit heat abstractor of a kind of wind liquid, comprise fan, fit, take away the conducting strip of its heat with the integrated package of central processing unit, it is characterized in that, also have the main body section bar: its underpart is provided with the described conducting strip of thermal conductive cavity (2) (1) that is used for the splendid attire coolant base plate as thermal conductive cavity (2), its inner thermal conductive cavity one side is provided with liquid reserve tank (5), the thermal conductive cavity opposite side is provided with liquor pump (6), heat conduction inner chamber top board top is provided with fan (8), and the air outlet of fan is over against the thermal conductive cavity top board; Also comprise the hush panel that is arranged on thermal conductive cavity (2) front and rear end; Also has the framework (10) that places main body section bar upper surface; Comprise that also being erected at framework (10) goes up, is positioned at the radiating tube (9) on the wind inlet of fan; The import of liquor pump (6) is connected with thermal conductive cavity (2) outlet, and the liquid delivery side of pump is connected with radiating tube (9) import, and the radiating tube outlet is communicated with liquid reserve tank (5) import, and the liquid reserve tank outlet is connected with thermal conductive cavity (2) import.
2, heat abstractor according to claim 1 is characterized in that, is fixedly connected with the heat-dissipating fin (7) that polylith is arranged in parallel on described thermal conductive cavity (2) top board.
3, heat abstractor according to claim 1 and 2 is characterized in that, described radiating tube (9) is the serpentine shape.
4, heat abstractor according to claim 1 and 2 is characterized in that, also comprises many card articles (11), is provided with a plurality of draw-in grooves (10a) for card article (11) clamping on the described framework (10) accordingly; Be useful on the fixedly bayonet socket (11a) of radiating tube (9) of chucking on the card article (11).
5, heat abstractor according to claim 1 and 2 is characterized in that, described hush panel (12) is connected with removably with the thermal conductive cavity (2) of main body section bar; This hush panel front is fixedly connected with two projections (12a, 12b), and two protrudingly leave gap (12c) between fast, and the hush panel back side is provided with the bloated hole (12d) more than 2 over against position, gap (12c), also comprises being enclosed within two protruding rubber rings (13) on fast.
6, heat abstractor according to claim 1 and 2 is characterized in that, described main body section bar and radiating tube (9) adopt copper material; Described card article (11) is an aluminium material.
7, heat abstractor according to claim 1 and 2 is characterized in that, described coolant is a methyl-silicone oil.
CN 03234717 2003-06-03 2003-06-03 Air-liquid integrated radiator of CPU CN2622866Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 03234717 CN2622866Y (en) 2003-06-03 2003-06-03 Air-liquid integrated radiator of CPU

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Application Number Priority Date Filing Date Title
CN 03234717 CN2622866Y (en) 2003-06-03 2003-06-03 Air-liquid integrated radiator of CPU

Publications (1)

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CN2622866Y true CN2622866Y (en) 2004-06-30

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7418996B2 (en) 2005-08-12 2008-09-02 Foxconn Technology Co., Ltd. Integrated liquid cooling system for electronic components
CN100444368C (en) * 2005-08-03 2008-12-17 富准精密工业(深圳)有限公司 Integrated liquid cooling heat abstractor
US7472743B2 (en) 2005-05-07 2009-01-06 Foxconn Technology Co., Ltd. Liquid cooling system suitable for removing heat from electronic components
US7537048B2 (en) 2005-08-10 2009-05-26 Foxconn Technology Co., Ltd. Integrated liquid cooling system for electronic components
CN101977489A (en) * 2010-11-09 2011-02-16 廖维秀 Cooling device and method for heating elements
CN102902326A (en) * 2011-07-26 2013-01-30 江苏宏力光电科技有限公司 Radiating tube used for laptops
CN103148679A (en) * 2012-12-10 2013-06-12 龙文兴 Convenient and fast temperature control and time control herbarium fast drying instrument
CN104914949A (en) * 2015-05-27 2015-09-16 广州番禺职业技术学院 Combined type computer water-cooling heat dissipation device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7472743B2 (en) 2005-05-07 2009-01-06 Foxconn Technology Co., Ltd. Liquid cooling system suitable for removing heat from electronic components
CN100444368C (en) * 2005-08-03 2008-12-17 富准精密工业(深圳)有限公司 Integrated liquid cooling heat abstractor
US7537048B2 (en) 2005-08-10 2009-05-26 Foxconn Technology Co., Ltd. Integrated liquid cooling system for electronic components
US7418996B2 (en) 2005-08-12 2008-09-02 Foxconn Technology Co., Ltd. Integrated liquid cooling system for electronic components
CN101977489A (en) * 2010-11-09 2011-02-16 廖维秀 Cooling device and method for heating elements
CN101977489B (en) * 2010-11-09 2013-01-30 廖维秀 Cooling device and method for heating elements
CN102902326A (en) * 2011-07-26 2013-01-30 江苏宏力光电科技有限公司 Radiating tube used for laptops
CN103148679A (en) * 2012-12-10 2013-06-12 龙文兴 Convenient and fast temperature control and time control herbarium fast drying instrument
CN103148679B (en) * 2012-12-10 2015-11-11 龙文兴 Portable temp-controlling and time-controlling plant specimen Quick drying instrument
CN104914949A (en) * 2015-05-27 2015-09-16 广州番禺职业技术学院 Combined type computer water-cooling heat dissipation device

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