CN201174850Y - Improved construction of water cooling head of heat radiating device - Google Patents
Improved construction of water cooling head of heat radiating device Download PDFInfo
- Publication number
- CN201174850Y CN201174850Y CNU2008200085601U CN200820008560U CN201174850Y CN 201174850 Y CN201174850 Y CN 201174850Y CN U2008200085601 U CNU2008200085601 U CN U2008200085601U CN 200820008560 U CN200820008560 U CN 200820008560U CN 201174850 Y CN201174850 Y CN 201174850Y
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- CN
- China
- Prior art keywords
- water
- heat radiation
- base
- improved structure
- radiating fins
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model relates to an improved structure of a water cooling head of a radiating device, comprising a plurality of radiating protrusions, a plurality of radiating fins and a base of a groove, which are arranged on one surface. The radiating fins are circularly arranged outside the radiating protrusions, and the groove is circularly arranged outside the radiating fins and is communicated with the radiating fins and the radiating protrusions; a clapboard is covered on the radiating protrusions and the radiating fins; the center of the clapboard is provided with a through hole for communication with the radiating protrusions; an upper cover is covered on the base; the cover has an input part communicated with the through hole; and one side of the input part is provided with an output part communicated with the groove. Therefore, the fit of the base, the clapboard and the upper cover is utilized to separately guide the working flow liquid which is not subjected to heat exchange and working flow liquid which is subjected to heat exchange so that the two flow liquids can not be mixed; meanwhile, the heat exchange area is increased, thereby realizing effective heat source dissipation.
Description
Technical field
The utility model relates to a kind of water-cooled head improved structure of heat abstractor, be particularly related to a kind of will be not the work flow liquid of heat exchange and heat exchange separate guiding, the two can not produce the situation of mixing to make it, and can increase heat exchange area simultaneously, and reaches effective thermal source dissipation person.
Background technology
The water-cooling head structure of generally commonly using heat abstractor as shown in Figures 1 and 2, it includes a base 5, and covers 6 on having accommodation space 61 and being covered on the base 5, and two is located at input pipe 7 and the efferent duct 8 that loam cake 6 one sides go up and are communicated with accommodation space 61; By this, can make base 5 contact attaching with processing wafer 91 on the circuit board 9, allow the work flow liquid flow into and absorb the thermal source that base 5 is drawn in the accommodation space 61 by input pipe 7, pending heat exchange is discharged the work flow liquid that has absorbed thermal source in the accommodation space 61 by efferent duct 8 more afterwards and is cooled off, and reaches the effect of thermal source dissipation.
Though the above-mentioned water-cooling head structure of commonly using can allow the work flow liquid be flowed in the accommodation spaces 61 by input pipe 7, carry out after the heat exchange again cooling off, and reach the effect of thermal source dissipation by the efferent duct 8 flow liquid discharge of will work; But because the work flow liquid (hot water) that input pipe 7 is imported not exchanging workflows liquid (being cold water) and efferent duct 8 heat exchange of discharging is in input and when exporting, it is a shared accommodation space 61, cause the cold work flow liquid that does not absorb base 5 thermals source must absorb the thermal technology who carries out heat exchange in advance and make flow liquid, therefore, the situation that makes work flow liquid that does not absorb thermal source in this accommodation space and the work flow liquid that absorbs thermal source have hot and cold liquid to mix takes place, and make the temperature difference of heat exchange less, and then cause having the relatively poor phenomenon of heat radiation to take place.
The utility model content
The purpose of this utility model is to overcome above-mentioned weak point of the prior art, a kind of cooperation that utilizes base, dividing plate and loam cake is provided, heat exchange does not separate guiding with the work flow liquid of heat exchange, the two can not produce the situation of mixing to make it, and can increase heat exchange area simultaneously, and reach the water-cooled head improved structure of the heat abstractor of effective thermal source dissipation.
The purpose of this utility model can reach by following measure:
The water-cooled head improved structure of this heat abstractor, its special character is that it comprises:
One base, its one side is provided with plural number heat radiation protuberance, plurality of radiating fins and a groove, these radiating fin annular arrangements are side outside these heat radiation protuberances, and this groove is located on side outside these radiating fins, and is communicated with these radiating fins and these heat radiation protuberances;
One dividing plate, it is covered on these heat radiation protuberances and these radiating fins, and the centre of this dividing plate has the perforation of one of these heat radiation protuberances of connection; And
One loam cake, it is covered on this face of this base, and this loam cake has and one of is communicated with input part with this perforation, and one of this input part side has and one of is communicated with efferent with this groove.
The purpose of this utility model can also reach by following measure:
The outboard peripheries of described base is provided with plural lug.
The outboard peripheries of described loam cake is provided with plural docking section.
Described these heat radiation protuberances are respectively a heat radiation pin post.
The joint of described loam cake and described base is provided with a packing ring.
Described water-cooling head structure further comprises a deckle board, and it cooperates at least one retaining element to be located on the one side of this loam cake.
Described input part and described efferent are made of an a connecting seat and a joint respectively
The utlity model has following advantage: can utilize the cooperation of base, dividing plate and loam cake, heat exchange does not separate guiding with the work flow liquid of heat exchange, the two can not produce the situation of mixing to make it, and can increase heat exchange area simultaneously, and reaches effective thermal source dissipation.
Description of drawings
Fig. 1 is the three-dimensional appearance schematic diagram of the utility model water-cooling head structure of commonly using heat abstractor.
Fig. 2 is the user mode generalized section of the utility model water-cooling head structure of commonly using heat abstractor.
Fig. 3 is the perspective exploded view of the water-cooled head improved structure of the utility model heat abstractor.
Fig. 4 is the three-dimensional appearance schematic diagram of the water-cooled head improved structure of the utility model heat abstractor.
Fig. 5 is the water-cooled head improved structure user mode generalized section one of the utility model heat abstractor.
Fig. 6 is the water-cooled head improved structure user mode generalized section two of the utility model heat abstractor.
Main element symbol description: (commonly using part)
Base 5 loam cakes 6 accommodation spaces 61 input pipes 7 efferent ducts 8
Circuit board 9 is handled wafer 91
Main element symbol description: (this creation part)
Base 1 heat radiation protuberance 11 radiating fins 12 grooves 13 lugs 14
Joint 342,352 efferents 35 circuit boards 4 are handled wafer 41
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing:
See also Fig. 3 and shown in Figure 4, the utility model is a kind of water-cooled head improved structure of heat abstractor, and it is that a base 1, a dividing plate 2 and a loam cake 3 constitute.
The above-mentioned base of being carried 1 one side is provided with plural number heat radiation protuberance 11, plurality of radiating fins 12 and a groove 13, these heat radiation protuberances 11 can be a heat radiation pin post respectively, these radiating fin 12 annular arrangements are side outside these heat radiation protuberances 11, these groove 13 rings are established side outside these radiating fins 12, and be communicated with these radiating fins 12 and these heat radiation protuberances 11, the outboard peripheries of this base 1 is provided with plural lug 14.
This dividing plate 2 is covered on these heat radiation protuberances 11 and these radiating fins 12, and the centre cording of this dividing plate 2 has the perforation 21 of one of these heat radiation protuberances 11 of connection.
This loam cake 3 is to be covered on this face of above-mentioned base 1, and loam cake 3 is provided with a packing ring 31 with the joint of base 1, and the outboard peripheries cording of this loam cake 3 has respectively the docking section 32 corresponding with these lugs 14, and be provided with deckle board 33 in the one side of this loam cake 3, it cooperates at least one retaining element 331 to be located at this loam cake 3, and these loam cake 3 cordings have with perforation 21 and these heat radiation protuberances 11 and one of are communicated with input part 34, one of this input part 34 side-line has and one of is communicated with input part 35 with groove 13, and this input part 34 and efferent 35 are respectively by a connecting seat 341, a Connection Block 351 and a joint 342, joint 352 constitutes.Constitute a brand-new water-cooled head improved structure by above-mentioned structure.
Seeing also Fig. 5 and shown in Figure 6, is user mode generalized section one and the figure two that is respectively the utility model.When the utility model in when utilization, be can input part 34 and efferent 35 and be equipped with work flow liquid compress cell and be connected (scheming not show), and processing wafer 41 contact points on this base 1 and the circuit board 4 are attached, and finish the assembling of the utility model.
When heat radiation is carried out, system starts compress cell, and draw the thermal source of generation when handling wafer 41 runnings with the bottom surface of base 1, and this base 1 is when absorbing heat, this compress cell then produces pressure will work flow liquid by input part 34 inputs, make of the perforation 21 of this work flow liquid by dividing plate 2 centre, and cooperate the setting of dividing plate 2 and allow the work flow liquid flow into and flow toward the direction diffusion of these radiating fins 12 from the centre of these heat radiation protuberances 11, use utilize thermal source band that the work flow liquid draws the bottom surface of base 1 from, and when the work flow liquid flows toward the direction diffusion of these radiating fins 12, this work flow liquid system is passed through between these radiating fins 12 by crack between these heat radiation protuberances 11, and direction that can be clockwise or counterclockwise flows into to be located in the groove 13 in these radiating fin 12 outsides, is flowed out by the efferent 35 of communication groove 13 more afterwards.So, the not heat exchange and the work flow liquid of heat exchange are separated guide and do not produce the situation of mixing, and can utilize these heat radiation protuberances 11 and these radiating fins 12 to increase heat exchange area simultaneously, and reach effective thermal source dissipation, after treating that the work flow liquid is flowed out by efferent 35, then cooperate cooling unit (figure do not show) the flow liquid cooling of will work, again this work flow liquid is imported by input part 34, so circulate by this and reach the effect of efficiently radiates heat.
The above only is preferred embodiment of the present invention, and all equalizations of being done according to claim scope of the present invention change and modify, and all should belong to the covering scope of claim of the present invention.
Claims (7)
1, a kind of water-cooled head improved structure of heat abstractor is characterized in that it comprises:
One base, its one side is provided with plural number heat radiation protuberance, plurality of radiating fins and a groove, these radiating fin annular arrangements are side outside these heat radiation protuberances, and this groove is located on side outside these radiating fins, and is communicated with these radiating fins and these heat radiation protuberances;
One dividing plate, it is covered on these heat radiation protuberances and these radiating fins, and the centre of this dividing plate has the perforation of one of these heat radiation protuberances of connection; And
One loam cake, it is covered on this face of this base, and this loam cake has and one of is communicated with input part with this perforation, and one of this input part side has and one of is communicated with efferent with this groove.
2, according to the water-cooled head improved structure of the described heat abstractor of claim 1, it is characterized in that: the outboard peripheries of described base is provided with plural lug.
3, according to the water-cooled head improved structure of the described heat abstractor of claim 1, it is characterized in that: the outboard peripheries of described loam cake is provided with plural docking section.
4, according to the water-cooled head improved structure of the described heat abstractor of claim 1, it is characterized in that: described these heat radiation protuberances are respectively a heat radiation pin post.
5, according to the water-cooled head improved structure of the described heat abstractor of claim 1, it is characterized in that: the joint of described loam cake and described base is provided with a packing ring.
6, according to the water-cooled head improved structure of the described heat abstractor of claim 1, it is characterized in that: described water-cooling head structure further comprises a deckle board, and it cooperates at least one retaining element to be located on the one side of this loam cake.
7, according to the water-cooled head improved structure of the described heat abstractor of claim 1, it is characterized in that: described input part and described efferent are made of an a connecting seat and a joint respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200085601U CN201174850Y (en) | 2008-03-21 | 2008-03-21 | Improved construction of water cooling head of heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200085601U CN201174850Y (en) | 2008-03-21 | 2008-03-21 | Improved construction of water cooling head of heat radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201174850Y true CN201174850Y (en) | 2008-12-31 |
Family
ID=40201981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200085601U Expired - Lifetime CN201174850Y (en) | 2008-03-21 | 2008-03-21 | Improved construction of water cooling head of heat radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201174850Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102735074A (en) * | 2012-06-29 | 2012-10-17 | 中国华能集团清洁能源技术研究院有限公司 | Water-cooling radiator of temperature difference generating module |
| CN109244052A (en) * | 2018-09-20 | 2019-01-18 | 深圳兴奇宏科技有限公司 | Water-cooling head buckle structure |
| CN111081657A (en) * | 2018-10-19 | 2020-04-28 | 技嘉科技股份有限公司 | Liquid cooling head and liquid cooling type heat dissipation system |
-
2008
- 2008-03-21 CN CNU2008200085601U patent/CN201174850Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102735074A (en) * | 2012-06-29 | 2012-10-17 | 中国华能集团清洁能源技术研究院有限公司 | Water-cooling radiator of temperature difference generating module |
| CN109244052A (en) * | 2018-09-20 | 2019-01-18 | 深圳兴奇宏科技有限公司 | Water-cooling head buckle structure |
| CN111081657A (en) * | 2018-10-19 | 2020-04-28 | 技嘉科技股份有限公司 | Liquid cooling head and liquid cooling type heat dissipation system |
| CN111081657B (en) * | 2018-10-19 | 2021-07-27 | 技嘉科技股份有限公司 | Liquid cooling head and liquid cooling type heat dissipation system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20081231 |