CN203105038U - Composite baffling pore plate type boiling heat transfer reinforcement structure - Google Patents
Composite baffling pore plate type boiling heat transfer reinforcement structure Download PDFInfo
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- CN203105038U CN203105038U CN 201320062040 CN201320062040U CN203105038U CN 203105038 U CN203105038 U CN 203105038U CN 201320062040 CN201320062040 CN 201320062040 CN 201320062040 U CN201320062040 U CN 201320062040U CN 203105038 U CN203105038 U CN 203105038U
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- orifice plate
- baffling
- heat transfer
- baffling orifice
- plate type
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Abstract
The utility model relates to a composite baffling pore plate type boiling heat transfer reinforcement structure which is suitable for cooling high-power electronic equipment. The composite baffling pore plate type boiling heat transfer reinforcement structure is characterized by comprising a heat exchange surface (1), a baffling pore plate (2) adhered to the heat exchange surface (1) and a multi-pore top plate (3) adhered to an outer side of the baffling pore plate (2), wherein the cross section of the baffling pore plate (2) is shaped like triangular waves, a plurality of small holes are formed in the baffling pore plate (2), the multi-pore top plate (3) is a flat plate, and a plurality of large holes (7) are formed in the multi-pore top plate (3). The composite baffling pore plate type boiling heat transfer reinforcement structure has the following beneficial effects that an effect of surface tension of liquid in conduits is fully utilized, helping to increasing wetability of the heat exchange surface; large steam bubbles formed on the heat exchange surface can be effectively broken, and a steam film is prevented from forming on the heat exchange surface; and internal and external enclosed conduits are arranged at intervals, helping to form circulation of liquid supply and gas drainage and increase the capability of washing the heat exchange surface by liquid.
Description
Technical field
The utility model relates to a kind of compound baffling orifice plate type boiling heat transfer reinforced structure, is applicable to the cooling of high power electronic equipment.
Background technology
Boiling heat transfer is a heat transfer process common in the modern industry, especially is common in high power electronic apparatus cools field.Large scale electronic equipment work the time can be distributed a large amount of heats, as can not in time dispelling the heat, can cause the electronic equipment part working temperature too high and cause fault, and then cause the serious consequence of electronic equipment total system paralysis.Therefore, how high power electronic equipment is effectively cooled, prevent that serious accident from taking place, and becomes one of problem of modern electronic equipment industrial circle important research.
High power electronic equipment being immersed in the dielectric fluid, carrying out the boiling heat transfer cooling, is one of effective measures that reduce wall surface temperature.Yet, be limited by the influence of boiling heat transfer critical heat flux density, when electronic equipment wall density of heat flow rate surpasses the critical heat flux density of outside wall surface dielectric fluid boiling heat transfer, steam film will cover the heat exchange wall, heat can't transmit by the mode of nucleate boiling and convective heat transfer, can only rely on the mode of steam film heat conduction to dispel the heat, thereby causes the gathering of short time internal face heat and the rising of temperature, when temperature surpassed wall safety permissible value, accident just can take place.
Therefore, how effectively promoting the wall critical heat flux density, is the key issue of effectively carrying out the boiling heat transfer cooling.Existing reinforcement boiling heat transfer, improve the method for critical heat flux density, the main employing installed fin additional at heat exchange surface, projection, pit, measures such as etching and interpolation coating, use is the result show, above method can improve heat exchange wall and face boundary's density of heat flow rate, but effect is limited, and complex process, in addition, consider from the angle that improves the electronic device design margin of safety, still be not enough to satisfy the requirement of high power electronic equipment safety operation, therefore, development new technologies effectively improve critical heat flux density to satisfy the urgent task that the electronic equipments safety requirements of one's work are exactly the hyundai electronics industrial development.
The utility model content
The purpose of this utility model provides a kind of compound baffling orifice plate type boiling heat transfer reinforced structure that can strengthen boiling heat transfer, significantly improve need heat transmission equipment wall critical heat flux density.
A kind of compound baffling orifice plate type boiling heat transfer reinforced structure, its special feature is: comprise heat-transfer surface and the baffling orifice plate that is attached on this heat-transfer surface, also post the porous top board in this baffling orifice plate outside, wherein the cross section of baffling orifice plate is that triangle is wavy and have some apertures thereon, and the porous top board is for dull and stereotyped and have some macropores thereon.
Wherein the wall thickness of baffling orifice plate and porous top board is 0.5-1mm.
Wherein on the baffling orifice plate per two peak-to-peak distances of adjacent wave at 0.1mm-3mm.
Wherein the area of aperture is 0.2-0.8mm
2, the area of macropore is 2-7mm
2
Wherein the voidage of baffling orifice plate is at 40%-80%, and the voidage of porous top board is at 40%-50%.
Wherein macropore is circular, and aperture is circle, rectangle or ellipse.
Wherein all be communicated with between all apertures by same elongated slot.
Wherein macropore is opened two porous top board places that crest is middle on adjacent baffling orifice plate substantially, and aperture is distributed on the rising edge and trailing edge of baffling orifice plate.
Wherein macropore and aperture all adopt even distribution.
Of the present utility model have a following beneficial effect: 1, made full use of the effect of surface tension of liquid in the conduit, helped increasing the wetability of heat exchange surface; 2, can be effective the large sparkle that forms of broken heat exchange surface, hinder at heat exchange surface and form steam film; 3, the interval of inside and outside closed channel design helps forming the circulation that liquid is supplied with and gas is discharged, and increases the ability that liquid washes away heat exchange surface; 4, the porous form of top board design, the gas column and the air film that can broken deflection plate aperture form improve the feed liquor amount of aperture; 5, the porous top board can constitute the stable nucleus of boiling, forms stable jet post, entrainments peripheral liquid, the mobile and heat transfer of enhanced heat exchange wall; 6, top board and outer closure conduit form " the composite holes nucleus of boiling " structure, and the design in outer closure conduit sealing matrix space helps the wetting and feed flow of nucleus of boiling bottom, reduces local dry spot and temperature overheating that wall causes owing to " jet post " appearance; 7, under baffling orifice plate and situation that heating surface closely contacts, can in the confined space, improve heat exchange area, strengthen exchange capability of heat.
Description of drawings
Accompanying drawing 1 is a shaft side figure of the present utility model;
Accompanying drawing 2 is a Facad structure schematic diagram of the present utility model;
Accompanying drawing 3 is the vertical view of Fig. 2;
Accompanying drawing 4 is a partial sectional view of the present utility model;
Accompanying drawing 5 is a principle schematic of the present utility model;
Accompanying drawing 6 is a principle schematic of the present utility model;
Accompanying drawing 7 is the structural representation of baffling orifice plate (2) in the utility model;
Accompanying drawing 8 is the structural representation of porous top board (3) in the utility model;
Accompanying drawing 9 is the structural representation of baffling orifice plate (2) in the utility model;
Accompanying drawing 10 is the structural representation of baffling orifice plate (2) in the utility model;
Accompanying drawing 11 is the structural representation of baffling orifice plate (2) in the utility model.
Embodiment
Shown in Fig. 1,2,3,7,8, the utility model is a kind of compound baffling orifice plate type boiling heat transfer reinforced structure, comprise heat-transfer surface 1 and the baffling orifice plate 2 that is attached on this heat-transfer surface 1, also post porous top board 3 in these baffling orifice plate 2 outsides, wherein the cross section of baffling orifice plate 2 is that triangle is wavy and have some apertures 6 thereon, and porous top board 3 is for dull and stereotyped and have some macropores 7 thereon.Wherein the wall thickness of baffling orifice plate 2 and porous top board 3 is 0.5-1mm, and per two peak-to-peak distances of adjacent wave are at 0.1mm-3mm on the baffling orifice plate 2.
The area of aperture 6 is 0.2-0.8mm
2, the area of macropore 7 is 2-7mm
2, shown in Fig. 9,10,11, wherein macropore 7 is circular, aperture 6 is circle, rectangle or ellipse.Can also be between all apertures 6, all to be communicated with in addition by same elongated slot.
Macropore 7 is opened two porous top board 3 places that crest is middle on adjacent baffling orifice plate 2 substantially, and aperture 6 is distributed on the rising edge and trailing edge of baffling orifice plate 2, and macropore 7 and aperture 6 all adopt evenly distribution.
Using method of the present utility model and operation principle are as follows:
Shown in Fig. 4,5,6, the utility model proposes a kind of compound baffling orifice plate type boiling heat transfer reinforced structure, comprise baffling orifice plate 2 that is attached on the heat-transfer surface 1 and the porous top board 3 that is attached on the baffling orifice plate 2.This compound baffle arrangement is connected in by baffling orifice plate 2 on the heat-transfer surface 1 of heat exchange outer wall of high power electronic equipment, and concrete connected mode can adopt modes such as welding, stickup, also can adopt the outer wall attaching of external support structure and high power electronic equipment.
Because the effect of baffling orifice plate 2, make to have constituted inner sealing conduit 4 between the heat-transfer surface 1 of itself and heat exchange wall, and and 3 on porous top board constituted outer closure conduit 5, inside and outside closed channel 5 spaced apart forms.On the baffling orifice plate 2 of inside and outside closed channel 5, be evenly equipped with some apertures 6 continuously, its distribution density is 6/ meter of a 500-700 aperture, with porous top board 3 that baffling orifice plate 2 is connected on be evenly equipped with some macropores 7 continuously, its distribution density is 7/ meter of a 100-200 macropore, and macropore 7 is closed channel 5 tops outside.A macropore 7 can cover a plurality of apertures 6, and macropore 7 arranges continuously along the direction of outer closure conduit 5, thereby makes macropore 7 and aperture 6 form composite pore structural, and 3 on baffling orifice plate 2 and porous top board have formed compound channel structure.
The directly mode of welding is adopted in connection between baffling orifice plate 2 and the porous top board 3, also can adopt riveted joint, modes such as bolt or other securing member connection, and it is better that the mode of employing vacuum brazing realizes connecting effect.Macropore 7 centers on the porous top board 3 are consistent basically with outer conduit bottom centre line.
During use structure of the present utility model is invested electronic equipment outside wall surface (baffling orifice plate 2 is close to heat-transfer surface 1), be immersed in the dielectric fluid, inside and outside closed channel 5 all is full of dielectric fluid.When the electronic equipment outside wall surface is overheated, inner sealing conduit 4 will produce bubble, and become big gradually, be full of whole inner sealing conduit 4 spaces, at this moment, under aperture 6 effects of inner sealing conduit 4 outer walls, air pocket is crushed into minute bubbles, and discharge inner sealing conduit 4 spaces, and be stranded in the bubble in the inner sealing conduit 4 because interior pressure diminishes, in inner sealing conduit 4 spaces, formed local decompression, and under the capillary acting in conjunction that small closed channel had, constantly there is liquid to enter inner sealing conduit 4 by other apertures 6, the outside wall surface of wetting electronic equipment, thus effectively reduce wall surface temperature.
The minute bubbles of being discharged by inner sealing conduit 4 accumulate in outer closure conduit 5 in addition, the undercut of outer closure conduit 5 also can form the nucleus of boiling and produce bubble in addition, the minute bubbles of assembling form bigger bubble again, when bubble volume surpasses outer closure conduit 5 spatial dimensions, macropore 7 by outer closure conduit 5 tops is broken into less bubble, enter outside the appearance in the pond, thereby prevented that outer closure conduit 5 from forming steam film obstruction liquid and entering inner sealing conduit 4 by aperture 6.
Minute bubbles after the fragmentation are being carried liquid secretly and are being formed the higher jet post of speed at macropore 7 places, make its local static pressure reduce, and cause the local differential static pressure in jet column bottom and outer closure conduit 5 spaces.Under the effect of local differential static pressure, liquid and bubble enter outer closure conduit 5 through the aperture 6 at inner sealing conduit 4 places, and then in inner sealing conduit 4, form the local differential static pressure of liquid, therefore, under the acting in conjunction of differential static pressure and inner sealing conduit 4 surface tension of liquids, other apertures 6 of liquid process add to the outside wall surface of inner sealing conduit 4 wall dry spot places, wetting electronic equipment, realize reducing the purpose of wall surface temperature.
Be noted that different with traditional heat exchange wall nucleus of boiling characteristics, these compound baffling orifice plate 2 formed nucleus of boiling are at porous top board 3 places, and not on heat exchange surface, have promptly formed a kind of " compound nucleus of boiling " away from heat exchange surface.By the concave structure that the three side sealing of outer closure conduit 5 closes, help realizing liquid collecting in the conduit, avoid the part at nucleus of boiling point place to dryout.
Structure of the present utility model is covered in whole electric equipment heat exchange outside wall surface, be immersed in the dielectric fluid in the outer bath, can realize fully wetting to electronic equipment heat exchange wall, at the high power electronic equipment work, when producing high heat, destroy the formation of wall steam film, effectively improve the critical heat flux density of wall.When electronic equipment outside wall surface amount of localized heat is too high, the bubble that produces is outside compound baffling orifice plate 2 is expelled in the bath, overheated wall orifice plate does not take place from all the other and enters in the liquid in the bath, the wetting electronic equipment outside wall surface of washing away under the effect of surface tension and static pressure, reduce wall surface temperature, suppress the wall local overheating, avoid the accident of generating electronic equipment paralysis.
For ease of processing, the thickness of slab of baffling orifice plate 2 and porous top board 3 is recommended 0.5-1mm.Baffling orifice plate 2 can adopt punch forming, and porous top board 3 can adopt compression moulding.Shown in Fig. 4,7,8, for guaranteeing that liquid can have stronger surface tension on baffling orifice plate 2, baffling orifice plate 2 base spacing L can not be too big, and recommending the L value is 0.1-3mm.Through hole on baffling orifice plate 2 and the porous top board 3 can adopt modes such as punching, boring, line cutting to realize that the aperture 6 equivalent aperture d of baffling orifice plate 2 are controlled at 0.5-1.0mm, and the macropore 7 equivalent aperture D of porous top board 3 are controlled at 1.5-3.0mm.When forming steam film in guaranteeing not outside closed channel 5, be the smooth discharge that promotes aperture 6 gases, control macropore 7 areas are equivalent to 6-9 times of aperture 6 areas.
Simultaneously, for strengthening the boiling heat transfer effect, the voidage scope of control baffling orifice plate 2 is 40%-80%, and the voidage of porous top board 3 is at 40%-50%.The voidage of orifice plate is defined as, the ratio of all perforated area sum totals and orifice plate entire area on the orifice plate.Concrete, in the present embodiment, d=1mm, D=3mm, baffling orifice plate 2 place's apertures 6 center distance are 1.2mm, porous top board place macropore 7 center distance are 4mm.Baffling orifice plate 2 voidages are 40%, and porous top board 3 voidages are 45%, L=3mm.
Claims (9)
1. compound baffling orifice plate type boiling heat transfer reinforced structure, it is characterized in that: comprise heat-transfer surface (1) and be attached to baffling orifice plate (2) on this heat-transfer surface (1), also post porous top board (3) in this baffling orifice plate (2) outside, wherein the cross section of baffling orifice plate (2) is that triangle is wavy and have some apertures (6) thereon, and porous top board (3) is for dull and stereotyped and have some macropores (7) thereon.
2. compound baffling orifice plate type boiling heat transfer reinforced structure as claimed in claim 1, it is characterized in that: wherein the wall thickness of baffling orifice plate (2) and porous top board (3) is 0.5-1mm.
3. compound baffling orifice plate type boiling heat transfer reinforced structure as claimed in claim 1 is characterized in that: wherein baffling orifice plate (2) is gone up per two peak-to-peak distances of adjacent wave at 0.1mm-3mm.
4. compound baffling orifice plate type boiling heat transfer reinforced structure as claimed in claim 1, it is characterized in that: wherein the area of aperture (6) is 0.2-0.8mm
2, the area of macropore (7) is 2-7mm
2
5. compound baffling orifice plate type boiling heat transfer reinforced structure as claimed in claim 1, it is characterized in that: wherein the voidage of baffling orifice plate (2) is at 40%-80%, and the voidage of porous top board (3) is at 40%-50%.
6. as any described compound baffling orifice plate type boiling heat transfer reinforced structure in the claim 1 to 5, it is characterized in that: wherein macropore (7) is for circular, and aperture (6) is circle, rectangle or ellipse.
7. compound baffling orifice plate type boiling heat transfer reinforced structure as claimed in claim 6 is characterized in that: wherein all be communicated with by same elongated slot between all apertures (6).
8. as any described compound baffling orifice plate type boiling heat transfer reinforced structure in the claim 1 to 5, it is characterized in that: wherein macropore (7) is opened substantially at the middle porous top board (3) of last two crests of adjacent baffling orifice plate (2) and is located, and aperture (6) is distributed on the rising edge and trailing edge of baffling orifice plate (2).
9. compound baffling orifice plate type boiling heat transfer reinforced structure as claimed in claim 8 is characterized in that: wherein macropore (7) and aperture (6) all adopt evenly and distribute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320062040 CN203105038U (en) | 2013-02-04 | 2013-02-04 | Composite baffling pore plate type boiling heat transfer reinforcement structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320062040 CN203105038U (en) | 2013-02-04 | 2013-02-04 | Composite baffling pore plate type boiling heat transfer reinforcement structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203105038U true CN203105038U (en) | 2013-07-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320062040 Expired - Fee Related CN203105038U (en) | 2013-02-04 | 2013-02-04 | Composite baffling pore plate type boiling heat transfer reinforcement structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203105038U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878388A (en) * | 2018-06-21 | 2018-11-23 | 西安交通大学 | It is a kind of to strengthen the device and its manufacturing method that boiling surface bubble is rapidly separated |
| PL425053A1 (en) * | 2018-03-28 | 2019-10-07 | Politechnika Wrocławska | Method for production of a structure intensifying heat exchange during boiling and the structure intensifying heat exchange during boiling |
| CN112775622A (en) * | 2020-12-24 | 2021-05-11 | 昆山施宝得精密模具有限公司 | High-precision processing technology for hole positions of porous plates |
-
2013
- 2013-02-04 CN CN 201320062040 patent/CN203105038U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| PL425053A1 (en) * | 2018-03-28 | 2019-10-07 | Politechnika Wrocławska | Method for production of a structure intensifying heat exchange during boiling and the structure intensifying heat exchange during boiling |
| CN108878388A (en) * | 2018-06-21 | 2018-11-23 | 西安交通大学 | It is a kind of to strengthen the device and its manufacturing method that boiling surface bubble is rapidly separated |
| CN112775622A (en) * | 2020-12-24 | 2021-05-11 | 昆山施宝得精密模具有限公司 | High-precision processing technology for hole positions of porous plates |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130731 Termination date: 20150204 |
|
| EXPY | Termination of patent right or utility model |