CN201204783Y - Liquid cooling radiator - Google Patents

Liquid cooling radiator Download PDF

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Publication number
CN201204783Y
CN201204783Y CNU2008200928068U CN200820092806U CN201204783Y CN 201204783 Y CN201204783 Y CN 201204783Y CN U2008200928068 U CNU2008200928068 U CN U2008200928068U CN 200820092806 U CN200820092806 U CN 200820092806U CN 201204783 Y CN201204783 Y CN 201204783Y
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CN
China
Prior art keywords
runner
upper strata
lower floor
main body
heat radiation
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Expired - Lifetime
Application number
CNU2008200928068U
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Chinese (zh)
Inventor
李泉明
毕金成
蒋康涛
高文军
刘明涛
王建伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vertiv Tech Co Ltd
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Emerson Network Power Co Ltd
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Application filed by Emerson Network Power Co Ltd filed Critical Emerson Network Power Co Ltd
Priority to CNU2008200928068U priority Critical patent/CN201204783Y/en
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Publication of CN201204783Y publication Critical patent/CN201204783Y/en
Anticipated expiration legal-status Critical
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Abstract

The utility model relates a liquid-cooled radiator used for heat exchange with the power module installed thereon, comprising a radiating body with good thermal conductivity. The radiating body has at least two layers of flow paths which are arranged in layer and connected in series; the flow path includes a liquid inlet and a liquid outlet. The utility model implements the two-sided installation and application of the radiator because of the two layers of flow paths, reduces the volume of the cooling unit and the weight of the radiator comparing to the present radiator with a single layer of flow paths, increases the flow path of cooling fluid in the radiator for full heat exchange comparing to the present radiator with flow paths in parallel connection, increases the fluid speed in the flow path, improves the heat transfer coefficient between the fluid and the flow path wall for improving the heat transfer efficiency so as to achieve the objective of reducing the thermal resistance of the radiator.

Description

Liquid cooling heat radiator
Technical field
The utility model relates to radiator, more particularly, relates to a kind of liquid cooling heat radiator.
Background technology
At present, liquid cooling heat radiator adopts the individual layer runner more, as shown in Figure 1, comprises the heat radiation main body 1 (as metal derby) with good heat conductive performance, and the runner 2 of one deck can be set in the heat radiation main body.Inlet by runner is introduced cooling fluid (as various refrigerants such as water, ether), and cooling fluid flows runner 2 in, and carries out heat exchange, is installed in components and parts on the heat radiation main body with cooling, then via the liquid outlet outflow of runner 2.
Existing individual layer runner liquid cooling heat radiator is used for single face installation power module (as the IGBT module) more, though the application of employing in the two-sided installation of the two sides of radiator installation power module (as the IGBT module) also arranged, but because radiating efficiency is not high, and thermal resistance is very big during reverse side installation power device, often is difficult to satisfy the cooling requirement of the two-sided installation of high-power power model.So the radiator overwhelming majority of individual layer runner all is applied in the application scenario of single face installation power module.Individual layer runner liquid cooling heat radiator has following deficiency:
1, single face is installed, and sink-efficiency is not high;
2, the volume of cooling unit is big, wasting space;
3, the radiator total weight is heavy, the cooling cost height;
4, heat sink interface is many, has increased the risk of leaking.
For this reason, there is external individually producer that the thinking of two-sided installation power module is applied on the water-filled radiator scheme of frequency converter.This radiator comprises the two-layer runner that is arranged in parallel.Cooling fluid divides two-way to flow in upper and lower two-layer runner respectively after an inlet enters radiator, Cheng Yilu conflux again from a liquid outlet outflow radiator in the main heat dissipation region of outflow, though this heat dissipation design scheme is utilized the advantage of two-sided installation power module, shortcoming is also more obvious:
1, under same traffic, because runner is all in parallel, cooling fluid is distributed in each runner, makes that the flow velocity in the runner is lower, and thermal transmission coefficient is little, and thermal resistance is big.
2, the radiator inner flow passage is short, and fluid can't be realized sufficient heat exchange with the heat radiation main body, and heat exchange efficiency is not high.
3, can't guarantee that bilevel flow velocity is even.
The utility model content
The technical problems to be solved in the utility model is, low at the fluid velocity in the above-mentioned double-deck liquid cooling heat radiator runner of prior art, runner is short, the uneven defective of flow velocity, and a kind of uniform liquid cooling heat radiator of flow velocity, flow velocity that increases path that cooling fluid flows through to greatest extent in radiator, improve the runner inner fluid is provided.
The technical scheme that its technical problem that solves the utility model adopts is: construct a kind of liquid cooling heat radiator, comprise good heat conduction and heat radiation main body, be provided with two-layer runner hierarchal arrangement and that be connected in series at least in described heat radiation main body; Runner after being connected in series includes inlet and liquid outlet.
In liquid cooling heat radiator of the present utility model, described heat radiation main body is an integral type heat radiation main body, and described runner is included in upper strata runner and the lower floor's runner that layering is offered in the described heat radiation main body, and described upper strata runner and lower floor's runner are connected in series.
In liquid cooling heat radiator of the present utility model, described upper strata runner comprises that many connect the upper strata passage of described heat radiation main body both sides and the upper strata connectivity slot of offering in described heat radiation main body rear and front end mutual dislocation respectively, and adjacent at least one end of described upper strata passage is communicated with by described upper strata connectivity slot;
Described lower floor runner comprises that many connect lower floor's passage of described heat radiation main body rear and front end and lower floor's connectivity slot of offering in described heat radiation main body both sides mutual dislocation respectively, and adjacent at least one end of described lower floor passage is communicated with by described lower floor connectivity slot;
Described heat radiation main body offers the levels connectivity slot that is communicated with outermost described upper strata passage and lower floor's passage; And described inlet and liquid outlet are located at respectively on the described upper strata passage and lower floor's passage away from described levels connectivity slot.
In liquid cooling heat radiator of the present utility model, described liquid cooling heat radiator also comprises first end cap and second end cap that seals described upper strata connectivity slot and lower floor's connectivity slot respectively; Described first end cap or second end cap offer and described inlet and the corresponding perforate of liquid outlet.
In liquid cooling heat radiator of the present utility model, described heat radiation main body comprise piece together holistic upper strata heating panel, lower floor's heating panel and be located at described upper strata heating panel and lower floor's heating panel between heat conduction baffle.
In liquid cooling heat radiator of the present utility model, lower floor's runner that described runner is included in the inboard upper strata runner that forms of described upper strata heating panel and forms in described lower floor heating panel inboard; Described heat conduction baffle is provided with intercommunicating pore; Described heat conduction baffle separates described upper strata runner and lower floor's runner and is communicated with described upper strata runner and lower floor's runner by described intercommunicating pore series connection.
In liquid cooling heat radiator of the present utility model, described runner comprises the upper strata pipeline of imbedding heating panel inboard, described upper strata and lower floor's pipeline of imbedding described lower floor heating panel inboard.
In liquid cooling heat radiator of the present utility model, the interior conducting of described heat radiation main body that is connected in series in of described two-layer runner connects or is connected by the extension tube attached conducting that is connected across outside the described heat radiation main body.
In liquid cooling heat radiator of the present utility model, the described runner of each layer comprises a plurality of passages that are connected in parallel and/or are connected in series.
In liquid cooling heat radiator of the present utility model, the passage phase contraposition of the described runner of each layer or dislocation are arranged.
Implement liquid cooling heat radiator of the present utility model, has following beneficial effect: by hierarchal arrangement and the two-layer runner that is connected in series, realized the two-sided installation application of radiator, compare the volume that dwindles cooling unit with the radiator of the individual layer runner of prior art, reduce heatsink weight, compare with the radiator of the runner in parallel of prior art, increase the path that cooling fluid flows through to greatest extent in radiator, so that cooling fluid and heat radiation main body can be carried out heat exchange fully; Improve the flow velocity of runner inner fluid, improve the thermal transmission coefficient between fluid and flow path wall, thereby improve heat transfer efficiency, reach the purpose that reduces heat radiator thermal resistance.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the structural representation of liquid cooling heat radiator of the individual layer runner of prior art;
Fig. 2 is the combination stereogram of first embodiment of the utility model liquid cooling heat radiator;
Fig. 3 is the decomposing schematic representation of first embodiment of the utility model liquid cooling heat radiator;
Fig. 4 is the decomposing schematic representation of another angle of first embodiment of the utility model liquid cooling heat radiator;
Fig. 5 is the cross-sectional schematic of heat radiation main body of first embodiment of the utility model liquid cooling heat radiator;
Fig. 6 is the decomposing schematic representation of second embodiment of the utility model liquid cooling heat radiator;
Fig. 7 is the decomposing schematic representation of another angle of second embodiment of the utility model liquid cooling heat radiator;
Fig. 8 is the schematic perspective view of upper strata heating panel of second embodiment of the utility model liquid cooling heat radiator;
Fig. 9 is the combination schematic diagram of the 3rd embodiment of liquid cooling heat radiator of the present utility model.
Embodiment
Shown in Fig. 2-5, in liquid cooling heat radiator first embodiment of the present utility model, it comprises integral type heat radiation main body 11, is installed in first end cap 12 and second end cap 13 and the feed tube 14 and the drain pipe 15 of heat radiation main body 11 both sides.
This heat radiation main body 11 can adopt the good material of heat conductivility to make, for example metal material such as aluminium, copper.At least be provided with two-layer runner hierarchal arrangement and that be connected in series in the heat radiation main body 11, the inlet 114 of the runner after being connected in series is connected with drain pipe 15 respectively at feed tube 14 with liquid outlet 115, for cooling fluid is introduced and derived to runner.
In the present embodiment, as shown in the figure, runner is included in upper strata runner 111 and the lower floor's runner 112 that layering is offered in the heat radiation main body 11, and offering of runner can form by modes such as boring, groove milling, punching presses.The structure of upper strata runner 111 and lower floor's runner 112 is basic identical.This upper strata runner 111 comprises many upper strata connectivity slots 1112 that connect the upper strata passage 1111 of heat radiation main body 11 both sides and offer in heat radiation main body 11 rear and front end mutual dislocation respectively.At least one end of adjacent upper strata passage 1111 is communicated with by upper strata connectivity slot 1112, as shown in Figure 5, each upper strata connectivity slot 1112 is communicated with an end of three upper strata passages 1111, and the upper strata connectivity slot 1112 of the rear and front end upper strata passage 1111 that staggers mutually, thereby form snakelike runner, make the cooling fluid that flows to carry out sufficient heat exchange with heat radiation main body 11 within it.
This lower floor's runner 112 comprises many lower floor's connectivity slots that connect lower floor's passage of heat radiation main body 11 rear and front ends and offer in heat radiation main body 11 both sides mutual dislocation respectively, adjacent at least one end of lower floor's passage is communicated with by lower floor's connectivity slot, its version is identical with upper strata runner 111, so do not give unnecessary details.
First end cap 12 and second end cap 13 are installed in the two ends of upper strata passage 1111, lower floor's passage respectively, thereby with the closed at both ends of passage.And on first end cap 12, offer the perforate that is connected with inlet and liquid outlet respectively.In order to prevent the leakage of the fluid in the passage, between connectivity slot and first end cap 12, second end cap 13, can also be provided with seal washer 16.
For upper strata runner 111 and 112 series connection of lower floor's runner are communicated with, on heat radiation main body 11, offer levels connectivity slot 113, be communicated with outermost upper strata passage 1111 and lower floor's passage by levels connectivity slot 113; This moment, inlet 114 and liquid outlet 115 were located at respectively on the upper strata passage 1111 and lower floor's passage away from levels connectivity slot 113 1 sides.The both sides of heat radiation main body 11 can be used for the installation power module, carry out heat exchange and then cooling power module with cooling fluid.Understandable, the connection of upper strata runner 111 and lower floor's runner 112 also can be communicated with by external pipe.
Concrete, the cooling fluid that flows into from feed tube 14 soaked inlet 114 and flow in the upper strata runner 111, after the power model of upper strata passage 1111 and homonymy of upper strata runner 111 of flowing through carries out heat exchange, flow in lower floor's runner 112 through levels connectivity slot 113, after the power model of lower floor's passage of lower floor's runner 112 and homonymy of flowing through again carries out heat exchange, flow out through liquid outlet 115 and drain pipe 15, thereby increased the path that cooling fluid flows through in radiator to greatest extent, so that cooling fluid and radiator can carry out heat exchange fully; And cooling fluid flows in the runner of a series connection, and need not shunt, thereby has guaranteed the flow rate of fluid in the runner, improves the thermal transmission coefficient between fluid and the flow path wall, thereby improves heat transfer efficiency, reaches the purpose that reduces heat radiator thermal resistance.Compare with the radiator of existing single face installation power module, radiator volume of the present utility model has reduced about more than 40%, and total weight has reduced about 30%; Compare with the Double layer pipeline radiator of full runner in parallel, radiator of the present utility model has increased heat exchange area, has improved the flow velocity of runner inner fluid, has strengthened exchange capability of heat, and its thermal resistance has reduced about more than 30%.
Shown in Fig. 6-8, be second embodiment of liquid cooling heat radiator of the present utility model, this radiator comprises split type heat radiation main body and feed tube 22 and drain pipe 23.This heat radiation main body comprise piece together holistic upper strata heating panel 211, lower floor's heating panel 212 and be located at upper strata heating panel 211 and lower floor's heating panel 212 between heat conduction baffle 213.The amalgamation of upper strata heating panel 211, lower floor's heating panel 212 and heat conduction baffle 213 can realize by variety of ways such as welding, riveted joint, bolt are connected.
In the present embodiment, the runner of radiator is arranged on upper strata heating panel 211 and the lower floor's heating panel 212, comprise upper strata runner 24 that is opened in upper strata heating panel 211 inboards respectively and the lower floor's runner 25 that is opened in lower floor's heating panel 212 inboards, its forming method can comprise the whole bag of tricks such as groove milling, punching press, casting.As shown in Figure 8, upper strata runner 24 and lower floor's runner 25 all can be designed to snakelike, and form the passage 241 of a plurality of parallel connections in serpentine flow path, thereby are increased in the heat exchange between cooling fluid mobile in the runner and the heat radiation main body, improve heat exchange efficiency.Understandable, runner also can adopt the form of pipe laying to realize, promptly imbeds the pipeline that flows for fluid at upper strata heating panel 211 and lower floor's heating panel 212 inboards, carries out heat exchange by tube wall and heat radiation main body.
Heat conduction baffle 213 separates upper strata runner 24 and lower floor's runner 25, for upper strata runner 24 and lower floor's runner 25 are connected in series, on heat conduction baffle 213, offer intercommunicating pore 2131, the outlet of upper strata runner 24 import with lower floor runner 25 is communicated with, and the import of upper strata runner 24 is connected the introducing cooling fluid with feed tube 22, and the outlet of lower floor's runner 25 is connected with drain pipe 23 and draws cooling fluid, thereby forms the runner of series connection.
As shown in Figure 9, be the 3rd embodiment of liquid cooling heat radiator of the present utility model, the difference of itself and second embodiment is, the upper strata runner is different with the series connection mode of communicating of lower floor's runner, in the present embodiment, come conducting to connect upper strata runner and lower floor's runner by being connected across heat radiation main body 31 outer extension tube attached 32.
Understandable, among all above-mentioned embodiment, inlet and liquid outlet can be separately positioned on the both sides of heat radiation main body or be arranged on homonymy by transition conduit.In addition, under the situation of the scope that does not break away from the utility model claim, from instruction of the present utility model, can derive other embodiment, for example with the radiator of individual layer runner by mechanical method fixation or be not fixed together, form double-layer channel, utilize extension tube attached to be connected in series then.

Claims (10)

1, a kind of liquid cooling heat radiator comprises good heat conduction and heat radiation main body, it is characterized in that, is provided with two-layer runner hierarchal arrangement and that be connected in series in described heat radiation main body at least; Runner after being connected in series includes inlet and liquid outlet.
2, liquid cooling heat radiator according to claim 1, it is characterized in that, described heat radiation main body is an integral type heat radiation main body, and described runner is included in upper strata runner and the lower floor's runner that layering is offered in the described heat radiation main body, and described upper strata runner and lower floor's runner are connected in series.
3, liquid cooling heat radiator according to claim 2, it is characterized in that, described upper strata runner comprises that many connect the upper strata passage of described heat radiation main body both sides and the upper strata connectivity slot of offering in described heat radiation main body rear and front end mutual dislocation respectively, and adjacent at least one end of described upper strata passage is communicated with by described upper strata connectivity slot;
Described lower floor runner comprises that many connect lower floor's passage of described heat radiation main body rear and front end and lower floor's connectivity slot of offering in described heat radiation main body both sides mutual dislocation respectively, and adjacent at least one end of described lower floor passage is communicated with by described lower floor connectivity slot;
Described heat radiation main body offers the levels connectivity slot that is communicated with outermost described upper strata passage and lower floor's passage; And described inlet and liquid outlet are located at respectively on the described upper strata passage and lower floor's passage away from described levels connectivity slot.
4, liquid cooling heat radiator according to claim 3 is characterized in that, described liquid cooling heat radiator also comprises first end cap and second end cap that seals described upper strata connectivity slot and lower floor's connectivity slot respectively; Described first end cap or second end cap offer and described inlet and the corresponding perforate of liquid outlet.
5, liquid cooling heat radiator according to claim 1 is characterized in that, described heat radiation main body comprise piece together holistic upper strata heating panel, lower floor's heating panel and be located at described upper strata heating panel and lower floor's heating panel between heat conduction baffle.
6, liquid cooling heat radiator according to claim 5 is characterized in that, lower floor's runner that described runner is included in the inboard upper strata runner that forms of described upper strata heating panel and forms in described lower floor heating panel inboard; Described heat conduction baffle is provided with intercommunicating pore; Described heat conduction baffle separates described upper strata runner and lower floor's runner and is communicated with described upper strata runner and lower floor's runner by described intercommunicating pore series connection.
7, liquid cooling heat radiator according to claim 5 is characterized in that, described runner comprises the upper strata pipeline of imbedding heating panel inboard, described upper strata and lower floor's pipeline of imbedding described lower floor heating panel inboard.
8, liquid cooling heat radiator according to claim 1 is characterized in that, the interior conducting of described heat radiation main body that is connected in series in of described two-layer runner connects or connected by the extension tube attached conducting that is connected across outside the described heat radiation main body.
According to each described liquid cooling heat radiator of claim 1-8, it is characterized in that 9, the described runner of each layer comprises a plurality of passages that are connected in parallel and/or are connected in series.
10, liquid cooling heat radiator according to claim 9 is characterized in that, the passage phase contraposition of the described runner of each layer or dislocation are arranged.
CNU2008200928068U 2008-03-18 2008-03-18 Liquid cooling radiator Expired - Lifetime CN201204783Y (en)

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Cited By (24)

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Publication number Priority date Publication date Assignee Title
CN102508396A (en) * 2011-10-26 2012-06-20 中国科学院紫金山天文台 Forcible refrigeration device for astronomical telescope charge coupled device (CCD) camera
CN104716048A (en) * 2015-03-12 2015-06-17 中国计量学院 Pipe pressing type water cooling plate manufacturing technology
CN106535564A (en) * 2016-10-21 2017-03-22 华中科技大学 Liquid cooling type heat radiator
CN106847766A (en) * 2017-04-10 2017-06-13 株洲南车奇宏散热技术有限公司 A kind of T-shaped water-filled radiator and water-cooling method
CN106954365A (en) * 2015-10-27 2017-07-14 Abb技术有限公司 Cooling element and electronic equipment for electronic unit
CN107197610A (en) * 2017-06-20 2017-09-22 太仓陶氏电气有限公司 A kind of heat sink arrangement for being layered cooling
CN107732405A (en) * 2017-09-19 2018-02-23 电子科技大学 A kind of four layers of two-phase cold drawing in phased array antenna microchannel
CN107732355A (en) * 2017-08-21 2018-02-23 东莞市迈泰热传科技有限公司 A kind of liquid cooling plate of internal shunt
CN108074893A (en) * 2016-11-07 2018-05-25 比亚迪股份有限公司 Radiator and heat sink assembly
CN108281403A (en) * 2018-02-28 2018-07-13 爱美达(上海)热能系统有限公司 A kind of cellular flow passages liquid cooling plate for cooling down storage module
CN108633233A (en) * 2018-06-29 2018-10-09 苏州汇川技术有限公司 Liquid cooling heat radiator and power electronic equipment
CN108962851A (en) * 2018-08-29 2018-12-07 佛山市南海奔达模具有限公司 Radiator and the shell unit of its application, the casting mould for manufacturing radiator
CN109037851A (en) * 2018-09-20 2018-12-18 北京普莱德新能源电池科技有限公司 A kind of liquid cooling flow passage structure and battery pack
CN109193071A (en) * 2018-09-07 2019-01-11 浙江清优材料科技有限公司 A kind of liquid cooling plate of integrated heat-conducting layer
CN109302834A (en) * 2018-11-12 2019-02-01 北京中科绿能科技有限公司 A kind of liquid cooling circulation direct-current charging post system
CN109803516A (en) * 2017-11-17 2019-05-24 英业达科技有限公司 Heat dissipation row
CN109936964A (en) * 2017-12-18 2019-06-25 迪尔公司 Electric component with the cavity for coolant
CN111465269A (en) * 2020-04-14 2020-07-28 江西精骏电控技术有限公司 Two-layer double-sided water cooling structure and junction temperature adjusting method thereof
CN111477602A (en) * 2020-06-28 2020-07-31 四川大学 Reverse-flow temperature-equalizing heat sink and electronic chip
CN111739852A (en) * 2020-05-28 2020-10-02 佛山市国星光电股份有限公司 Heat dissipation substrate, power module, power device and heat dissipation substrate processing method
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CN113507817A (en) * 2021-06-04 2021-10-15 北京国科环宇科技股份有限公司 Heat dissipation plate, module and case
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CN102508396A (en) * 2011-10-26 2012-06-20 中国科学院紫金山天文台 Forcible refrigeration device for astronomical telescope charge coupled device (CCD) camera
CN104716048A (en) * 2015-03-12 2015-06-17 中国计量学院 Pipe pressing type water cooling plate manufacturing technology
US10251305B2 (en) 2015-10-27 2019-04-02 Abb Schweiz Ag Cooling element for electronic components and electronic device
CN106954365A (en) * 2015-10-27 2017-07-14 Abb技术有限公司 Cooling element and electronic equipment for electronic unit
CN106535564A (en) * 2016-10-21 2017-03-22 华中科技大学 Liquid cooling type heat radiator
CN106535564B (en) * 2016-10-21 2019-06-28 华中科技大学 A kind of liquid cooling heat radiator
CN108074893A (en) * 2016-11-07 2018-05-25 比亚迪股份有限公司 Radiator and heat sink assembly
CN106847766A (en) * 2017-04-10 2017-06-13 株洲南车奇宏散热技术有限公司 A kind of T-shaped water-filled radiator and water-cooling method
CN107197610A (en) * 2017-06-20 2017-09-22 太仓陶氏电气有限公司 A kind of heat sink arrangement for being layered cooling
CN107732355A (en) * 2017-08-21 2018-02-23 东莞市迈泰热传科技有限公司 A kind of liquid cooling plate of internal shunt
CN107732405A (en) * 2017-09-19 2018-02-23 电子科技大学 A kind of four layers of two-phase cold drawing in phased array antenna microchannel
CN109803516A (en) * 2017-11-17 2019-05-24 英业达科技有限公司 Heat dissipation row
CN109936964B (en) * 2017-12-18 2024-01-30 迪尔公司 Electrical assembly with cavity for coolant
CN109936964A (en) * 2017-12-18 2019-06-25 迪尔公司 Electric component with the cavity for coolant
CN108281403A (en) * 2018-02-28 2018-07-13 爱美达(上海)热能系统有限公司 A kind of cellular flow passages liquid cooling plate for cooling down storage module
CN108633233A (en) * 2018-06-29 2018-10-09 苏州汇川技术有限公司 Liquid cooling heat radiator and power electronic equipment
CN108633233B (en) * 2018-06-29 2024-04-30 苏州汇川技术有限公司 Liquid cooling radiator and power electronic equipment
CN108962851A (en) * 2018-08-29 2018-12-07 佛山市南海奔达模具有限公司 Radiator and the shell unit of its application, the casting mould for manufacturing radiator
CN109193071A (en) * 2018-09-07 2019-01-11 浙江清优材料科技有限公司 A kind of liquid cooling plate of integrated heat-conducting layer
CN109193071B (en) * 2018-09-07 2024-02-13 浙江清优材料科技有限公司 Liquid cooling plate integrated with heat conducting layer
CN109037851A (en) * 2018-09-20 2018-12-18 北京普莱德新能源电池科技有限公司 A kind of liquid cooling flow passage structure and battery pack
CN109302834A (en) * 2018-11-12 2019-02-01 北京中科绿能科技有限公司 A kind of liquid cooling circulation direct-current charging post system
CN111465269A (en) * 2020-04-14 2020-07-28 江西精骏电控技术有限公司 Two-layer double-sided water cooling structure and junction temperature adjusting method thereof
CN111739852A (en) * 2020-05-28 2020-10-02 佛山市国星光电股份有限公司 Heat dissipation substrate, power module, power device and heat dissipation substrate processing method
CN111739852B (en) * 2020-05-28 2022-02-15 佛山市国星光电股份有限公司 Heat dissipation substrate, power module, power device and heat dissipation substrate processing method
CN111477602B (en) * 2020-06-28 2020-10-02 四川大学 Reverse-flow temperature-equalizing heat sink and electronic chip
CN111477602A (en) * 2020-06-28 2020-07-31 四川大学 Reverse-flow temperature-equalizing heat sink and electronic chip
CN112654215A (en) * 2020-12-15 2021-04-13 中克骆瑞新能源科技有限公司 Cooling runner structure of motor controller
CN113507817A (en) * 2021-06-04 2021-10-15 北京国科环宇科技股份有限公司 Heat dissipation plate, module and case
SE2100174A1 (en) * 2021-11-18 2023-05-19 Saab Ab A Cooling module for cooling heat generating components of high frequency antenna arrays
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CN115443032A (en) * 2022-08-08 2022-12-06 中国电子科技集团公司第二十研究所 Liquid cooling plate

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