CN111465269A - Two-layer double-sided water cooling structure and junction temperature adjusting method thereof - Google Patents
Two-layer double-sided water cooling structure and junction temperature adjusting method thereof Download PDFInfo
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- CN111465269A CN111465269A CN202010292464.XA CN202010292464A CN111465269A CN 111465269 A CN111465269 A CN 111465269A CN 202010292464 A CN202010292464 A CN 202010292464A CN 111465269 A CN111465269 A CN 111465269A
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- 238000001816 cooling Methods 0.000 title claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims description 12
- 230000017525 heat dissipation Effects 0.000 claims abstract description 42
- 239000007788 liquid Substances 0.000 claims abstract description 28
- 230000001105 regulatory effect Effects 0.000 claims abstract description 23
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 4
- 230000009467 reduction Effects 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 230000005484 gravity Effects 0.000 claims 1
- 230000008859 change Effects 0.000 abstract description 8
- 239000000110 cooling liquid Substances 0.000 description 6
- 230000033228 biological regulation Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 3
- 239000012809 cooling fluid Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241000283973 Oryctolagus cuniculus Species 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009123 feedback regulation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
Abstract
A two-layer double-sided water cooling structure comprises a chip body, an upper flow channel and a lower flow channel, wherein the upper flow channel and the lower flow channel are arranged on the upper surface and the lower surface of the chip body and are in tight contact with the chip body; one of the two communicated parts is provided with a flow regulating valve which dynamically regulates the flow of the flowing heat dissipation liquid; changing the distribution of the flow in the flow passage to further adjust the thermal resistance R between the lower shell and the lower flow passage1Thermal resistance R between the upper shell and the upper flow passage3And adjusting, namely neglecting the structural difference of the chip body, and systematically performing feedback adjustment according to the change of the delta T value until the optimal junction temperature is realized.
Description
Technical Field
The invention relates to the field of junction temperature regulation of inverters, in particular to a two-layer double-sided water cooling structure and a junction temperature regulation method based on the two-layer double-sided water cooling structure.
Background
With the increase of the power density of the vehicle-mounted inverter, in order to effectively reduce the junction temperature of the power device and obviously prolong the service life of the power device, enterprises such as British Rabbit and the like provide two heat dissipation channels on chip packaging. The heat generated by the chip is transmitted to the heat dissipation medium through the two heat dissipation channels (at the top surface and the bottom surface).
At present, enterprises such as Yingfei Ling, Toyota prius, Shanghai Dajun and the like adopt a double-sided water cooling scheme for heat dissipation, and the enterprises are composed of a plurality of heat dissipation plate modules although the structural forms are slightly different. The double-sided water cooling scheme has the following defects: because the thermal resistances from the chip to the upper and lower heat dissipation channels are different, the minimum junction temperature adjustment cannot be realized, and the heat dissipation performance cannot be fully utilized.
Disclosure of Invention
The present invention provides a two-layer double-sided water-cooling structure and a junction temperature adjusting method thereof to solve the problems of the prior art, and the present invention will be further described below.
A two-layer double-sided water cooling structure comprises a chip body, an upper flow channel and a lower flow channel, wherein the upper flow channel and the lower flow channel are arranged on the upper surface and the lower surface of the chip body and are in tight contact with the chip body;
one of the two communicated parts is provided with a flow regulating valve which dynamically regulates the flow of the flowing heat dissipation liquid; one of the upper flow channel and the lower flow channel is provided with an inflow port and an outflow port, wherein the inflow port and the outflow port are used for allowing the heat dissipation liquid to flow in;
the chip body includes the last casing that contacts closely with last runner, with the lower casing of the close contact of lower runner, press from both sides in go up the chip between casing and the lower casing and coat in between the chip and last casing, lower casing and last runner, the heat dissipation silicone grease that plays attached and radiating effect between the lower runner.
Preferably, the inflow port and the outflow port are directly communicated with the lower flow channel, and the heat dissipation liquid flows into the upper flow channel from the bottom to the top in the antigravity direction, so that steady flow is formed, noisy noise is avoided, and cavitation is reduced.
Preferably, the heat dissipation liquid is an ethylene glycol aqueous solution.
A junction temperature adjusting method of a two-layer double-sided water cooling structure comprises the following steps:
the inflow of the heat dissipation liquid of the upper flow channel is increased step by step in a one-way mode, the flow of the flow regulating valve is increased by a set degree, and the current value of delta T is compared with the previous value;
if the delta T value is reduced, the adjustment direction of the flow adjusting valve is towards the delta T value reduction direction, and then the flow adjusting valve continues to gradually increase along the flow increasing direction of the heat dissipation liquid of the upper flow passage until the delta T value is not reduced any more and shows a reverse increase, and the adjustment is stopped;
if the delta T value is increased, the inflow of the heat dissipation liquid of the upper flow channel is gradually reduced in a one-way mode at the moment until the delta T value is not reduced any more and is increased reversely, and the process is stopped;
and determining the optimal flow value of the flow regulating valve, wherein the optimal flow value is the flow value when the flow regulating valve stops regulating, the previous flow value and the minimum value of the delta T values corresponding to the three flow values which are the intermediate values of the two flow values.
Has the advantages that: compared with the prior art, the invention changes the distribution of the flow in the flow passage by adding the flow regulating valve so as to further carry out thermal resistance R between the lower shell and the lower flow passage1Thermal resistance R between the upper shell and the upper flow passage3And adjusting, namely neglecting the structural difference of the chip body, and systematically performing feedback adjustment according to the change of the delta T value until the optimal junction temperature is realized.
Drawings
FIG. 1: the invention has a structure schematic diagram;
in the figure: the device comprises an upper flow passage 1, a flow regulating valve 2, a lower flow passage 3, an inflow port 4, a lower shell 5, a chip 6, an upper shell 7, heat dissipation silicone grease 8 and an outflow port 9.
Detailed Description
A specific embodiment of the present invention will be described in detail with reference to the accompanying drawings.
A two-layer double-sided water cooling structure comprises a chip body, an upper flow channel 1 and a lower flow channel 3 which are arranged on the upper surface and the lower surface of the chip body and are in tight contact with the chip body, wherein the upper flow channel 1 and the lower flow channel 3 are communicated through two communicating parts, one of the two communicating parts is provided with a flow regulating valve 2, and the flow regulating valve 2 can dynamically regulate the flow of a flowing liquid water fluid; one of the upper flow channel 1 and the lower flow channel 3 is provided with two inflow ports 4 and two outflow ports 9 for water fluid to flow in, preferably, the inflow ports 4 and the outflow ports 9 are directly communicated with the lower flow channel 3, and the heat dissipation liquid flows into the upper flow channel 1 from the bottom to the top in the antigravity direction, so that steady flow is formed, noisy sound is avoided, and cavitation is reduced.
The cooling liquid for cooling flows into the double-layer double-sided water cooling structure through the inflow port 4, one path of cooling liquid enters the lower flow channel 3, the other path of cooling liquid enters the upper flow channel 1 through the flow regulating valve 2, the cooling liquid exchanges heat with the chip body in the upper flow channel 1 and the lower flow channel 3 to cool the chip body, and finally the cooling liquid flows out from the outflow port 9.
The chip body includes last casing 7 with the tight contact of runner 1, with lower casing 5 of the tight contact of lower runner 3, press from both sides in go up casing 7 and chip 6 between casing 5 down and coat in between the chip 6 and last casing 7, lower casing 5 and runner 1, the heat dissipation silicone grease 8 of playing attached and heat dissipation effect between the runner 3 down.
When the chip body works, a large amount of heat generated by the chip 6 respectively completes heat exchange with the heat dissipation liquid in the upper flow passage 1 and the lower flow passage 3 through the heat dissipation silicone grease 8, the upper shell 7 and the lower shell 5, and the double-layer double-sided cooling effect is achieved.
The total thermal resistance from the chip 6 to the heat dissipation liquid through the lower runner 3 is R1+R2The total thermal resistance from the chip to the heat dissipation liquid through the upper flow passage 1 is R3+R4(ii) a Wherein the content of the first and second substances,
R1is the thermal resistance between the lower shell 5 and the lower flow passage 3;
R2is the thermal resistance between the chip 6 and the lower case 5;
R3is the thermal resistance between the upper shell 7 and the upper flow passage 1;
R4is the thermal resistance between the chip 6 and the upper case 7;
the formula of the temperature difference formed between two ends of the object is as follows:
r × Q ═ Δ T (where R is thermal resistance, Q is calorific value, and Δ T is temperature difference);
due to the objective fact that the temperature difference delta T between the heat dissipation liquid and the upper flow channel 1 and the lower flow channel 3 caused by the heat taken away by the heat exchange is consistent, the following results are obtained:
Q1＝Q2；
ΔT＝(R1+R2)*Q1＝(R3+R4)*Q2q; wherein the content of the first and second substances,
Q1the heat dissipation capacity of the chip body through the lower runner 3 is shown;
Q2the heat dissipation capacity of the chip body through the upper flow passage 1 is realized;
further, the minimum value of Δ T is as follows from the cauchy inequality:
if and only if (R)1+R2)*Q1＝(R3+R4)*Q2It is true that it is clear that the final junction temperature regulation target to achieve a minimum Δ T needs to be met: r1+R2＝R3+R4。
Due to R2And R4Although the intrinsic physical parameters are formed after the fabrication process is completed and the possibility of adjustment is not available, the intrinsic physical parameters are adjusted by adjusting R in this embodiment1And R3A minimum junction temperature regulation is achieved, in practice, the thermal resistance R between the lower shell 5 and the lower flow channel 31And thermal resistance R between the upper casing 7 and the upper flow passage 13The thermal resistance changes along with the change of the flow of the heat dissipation liquid in the flow channel, the thermal resistance changes along with the change of the flow in a nonlinear way, the nonlinear change of the thermal resistance can not change the flow according to a functional relation so as to directly obtain the target thermal resistance value, moreover, the types of the actually installed chips are not consistent, or even if the types of the actually installed chips are consistent, the actual process can cause the thermal resistance value to be not bent and consistent in the period, R1、R3Cannot be visually displayed, so that the flow and R cannot be directly realized1、R3One-to-one correspondence.
In this embodiment, the flow regulating valve 2 is arranged to control the flow of the cooling fluid flowing into the structure in a split manner, so that the amounts of the cooling fluid flowing into the upper runner 1 and the lower runner 3 are dynamically adjustable and change at the same time, and the temperature feedback regulation is performed on the junction temperature of the chip to realize the minimum junction temperature regulation, and the specific regulating method is as follows;
the inflow amount of the heat dissipation liquid of the upper flow passage 1 is increased in a unidirectional and gradual manner,the flow of the flow regulating valve 2 is increased by the set degree, the response of the amount of the heat dissipation liquid in the lower flow passage 3 is reduced on the premise that the total amount of the heat dissipation liquid flowing into the structure is not changed, and the increase of the flow of the heat dissipation liquid in the upper flow passage 1 directly causes R1The reduction in value, the reduction in the flow of the coolant in the lower flow channel 3 directly results in R3Increase in (2); comparing the current value of the delta T with the previous value, if the delta T value is reduced, indicating that the adjusting direction of the flow regulating valve 2 is towards the direction that the delta T value is reduced, and then continuously increasing along the increasing direction of the flow of the cooling liquid of the upper flow channel 1 step by step until the delta T value is not reduced any more and presents a moment of increasing reversely, and stopping;
if the inflow amount of the heat dissipation liquid of the upper flow channel 1 is increased unidirectionally and gradually, if the delta T value is increased, the inflow amount of the heat dissipation liquid of the upper flow channel 1 is decreased unidirectionally and gradually at the moment until the delta T value is not decreased any more and shows a reverse increase, and the operation is stopped;
the optimum flow rate value of the flow rate adjusting valve 2 is determined as the flow rate value when the flow rate adjusting valve 2 stops adjusting, the flow rate value before and the flow rate value corresponding to the minimum value in the delta T values corresponding to the three flow rate values of the middle value of the two flow rate values.
The invention changes the distribution of the flow in the flow passage by adding the flow regulating valve so as to further carry out the thermal resistance R between the lower shell and the lower flow passage1Thermal resistance R between the upper shell and the upper flow passage3And adjusting, namely neglecting the structural difference of the chip body, and systematically performing feedback adjustment according to the change of the delta T value until the optimal junction temperature is realized.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. A two-layer double-sided water cooling structure comprises a chip body, an upper runner (1) and a lower runner (3) which are arranged on the upper surface and the lower surface of the chip body and are in tight contact with the chip body, wherein the upper runner (1) and the lower runner (3) are communicated through two communicating parts; the method is characterized in that:
one of the two communicated parts is provided with a flow regulating valve (2), and the flow regulating valve (2) dynamically regulates the flow of the flowing heat dissipation liquid; one of the upper flow channel (1) and the lower flow channel (3) is provided with an inflow port (4) and an outflow port (9) for the inflow of the heat dissipation liquid;
the chip body include with last casing (7) of last runner (1) tight contact, with lower casing (5) of runner (3) tight contact down, press from both sides in go up chip (6) between casing (7) and lower casing (5) and coat in between chip (6) and last casing (7), lower casing (5) and last runner (1), down the heat dissipation silicone grease (8) that play attached and radiating effect between runner (3).
2. The method of claim 1, wherein: the inflow port (4) and the outflow port (9) are directly communicated with the lower flow channel (3), and the heat dissipation liquid flows into the upper flow channel (1) from bottom to top in the direction opposite to the gravity.
3. A two-layer double-sided water cooling structure according to claim 1 or 2, wherein: the heat dissipation liquid is ethylene glycol aqueous solution.
4. A junction temperature adjusting method of a two-layer double-sided water cooling structure is characterized by comprising the following steps:
the inflow of the heat dissipation liquid of the upper flow passage (1) is increased step by step in a one-way mode, the flow of the flow regulating valve (2) is increased by a set degree, and the current value of delta T is compared with the previous value;
if the delta T value is reduced, the adjustment direction of the flow regulating valve (2) is carried out towards the direction of the delta T value reduction, and then the gradual increase is continuously carried out along the flow increasing direction of the heat dissipation liquid of the upper flow passage (1) until the delta T value is not reduced any more and shows the time of reverse increase, and the operation is stopped;
if the delta T value is increased, the inflow of the heat dissipation liquid of the upper flow channel (1) is gradually reduced in a one-way mode at the moment until the delta T value is not reduced any more and is increased reversely, and then the operation is stopped;
and determining the optimal flow value of the flow regulating valve (2), wherein the optimal flow value is the flow value when the flow regulating valve (2) stops regulating, the flow value before and the flow value corresponding to the minimum value in the delta T values corresponding to the three flow values of the middle value of the two flow values.
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| CN202010292464.XA CN111465269A (en) | 2020-04-14 | 2020-04-14 | Two-layer double-sided water cooling structure and junction temperature adjusting method thereof |
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| CN202010292464.XA CN111465269A (en) | 2020-04-14 | 2020-04-14 | Two-layer double-sided water cooling structure and junction temperature adjusting method thereof |
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|---|---|---|---|---|
| US5514906A (en) * | 1993-11-10 | 1996-05-07 | Fujitsu Limited | Apparatus for cooling semiconductor chips in multichip modules |
| TW200849510A (en) * | 2007-06-05 | 2008-12-16 | Advanced Semiconductor Eng | A heat dissipation module for chip package |
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| CN203859205U (en) * | 2014-05-21 | 2014-10-01 | 北京市亿能通电子有限公司 | Battery component with temperature regulation device |
| CN105222014A (en) * | 2015-10-12 | 2016-01-06 | 天津理工大学 | A kind of heat spreader structures determination method for parameter for high-power LED street lamp |
| CN109728381A (en) * | 2018-12-28 | 2019-05-07 | 广州小鹏汽车科技有限公司 | A kind of optimization method of liquid cooling plate and liquid cooling plate design |
| CN109962317A (en) * | 2019-03-27 | 2019-07-02 | 山东大学 | A kind of batteries of electric automobile mould group heat management and energy recycling system and method |
| CN110133465A (en) * | 2019-05-16 | 2019-08-16 | 上海金脉电子科技有限公司 | The calculation method and system of IGBT module junction temperature |
| CN110518814A (en) * | 2019-09-19 | 2019-11-29 | 江西精骏电控技术有限公司 | A kind of two-sided cooling structure for vehicle-mounted inverter |
-
2020
- 2020-04-14 CN CN202010292464.XA patent/CN111465269A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5514906A (en) * | 1993-11-10 | 1996-05-07 | Fujitsu Limited | Apparatus for cooling semiconductor chips in multichip modules |
| TW200849510A (en) * | 2007-06-05 | 2008-12-16 | Advanced Semiconductor Eng | A heat dissipation module for chip package |
| CN201204783Y (en) * | 2008-03-18 | 2009-03-04 | 艾默生网络能源有限公司 | Liquid cooling radiator |
| CN103488264A (en) * | 2012-06-12 | 2014-01-01 | 国际商业机器公司 | Computer-implemented method and system for optimizing heat transfer in 3-d chip-stack |
| CN203859205U (en) * | 2014-05-21 | 2014-10-01 | 北京市亿能通电子有限公司 | Battery component with temperature regulation device |
| CN105222014A (en) * | 2015-10-12 | 2016-01-06 | 天津理工大学 | A kind of heat spreader structures determination method for parameter for high-power LED street lamp |
| CN109728381A (en) * | 2018-12-28 | 2019-05-07 | 广州小鹏汽车科技有限公司 | A kind of optimization method of liquid cooling plate and liquid cooling plate design |
| CN109962317A (en) * | 2019-03-27 | 2019-07-02 | 山东大学 | A kind of batteries of electric automobile mould group heat management and energy recycling system and method |
| CN110133465A (en) * | 2019-05-16 | 2019-08-16 | 上海金脉电子科技有限公司 | The calculation method and system of IGBT module junction temperature |
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Application publication date: 20200728 |
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