CN112775622A - High-precision processing technology for hole positions of porous plates - Google Patents
High-precision processing technology for hole positions of porous plates Download PDFInfo
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- CN112775622A CN112775622A CN202011542682.0A CN202011542682A CN112775622A CN 112775622 A CN112775622 A CN 112775622A CN 202011542682 A CN202011542682 A CN 202011542682A CN 112775622 A CN112775622 A CN 112775622A
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- 238000005516 engineering process Methods 0.000 title claims description 5
- 238000003754 machining Methods 0.000 claims abstract description 31
- 238000004080 punching Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims abstract description 8
- 238000009966 trimming Methods 0.000 claims description 12
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
The invention belongs to the technical field of machining, and relates to a high-precision hole site machining process for a porous plate, which comprises the steps of punching, linear cutting and multi-pass finishing, wherein the machining allowance left by the punching is 0.5-0.6 mm, the machining allowance left by the linear cutting is 40 mu m, the multi-pass finishing method comprises the steps of firstly performing first finishing on all holes in the plate, then performing second finishing on all holes, and repeating the steps until the last finishing is performed, the machining allowances left by the finishing are reduced in sequence, and the allowance left by the last finishing is 0 mu m. The process reduces the problem that the precision of the former hole is influenced by the finishing of the latter hole under the condition of dense holes, and effectively improves the precision of the whole hole position after finishing.
Description
Technical Field
The invention relates to the technical field of machining, in particular to a high-precision machining process for hole positions of a porous plate.
Background
For some sheets, the location of the holes is highly desirable, even to within 3 μm. Because the material is probably out of shape in the course of working, so need leave 0.5 ~ 0.6 mm's surplus earlier when designing, just bore a perforation that is less than the target bore diameter earlier, then constantly reduce the surplus through many refinements, generally need can reach the precision range through three refinements.
In the past, three times of fine modification are continuously carried out on each hole site, but the problem is brought to products with dense hole sites, because although the precision of the former hole site can reach the standard temporarily through the three times of fine modification, the material can be deformed again through the processing of the latter hole site, the precision of the former hole site is influenced, and the precision of the hole site can not be guaranteed. For a product of our, even if three fine trimming processes are performed on one hole, the precision can reach within 3 μm, but after all holes are made, the final offset can be increased to 20 μm, and the requirements of customers cannot be met.
Therefore, there is a need to design a new method to solve the above problems.
Disclosure of Invention
The invention aims to provide a high-precision processing technology for hole sites of porous plates, which can enable the hole sites of the porous plates to achieve higher precision.
The invention realizes the purpose through the following technical scheme: the utility model provides a porous plate hole site high accuracy processing technology, step is including punching a hole, wire-electrode cutting and multichannel truing, the machining allowance that the punching a hole was left is 0.5 ~ 0.6mm, the machining allowance that the wire-electrode cutting was left is 40 mu m, the method of multichannel truing is for carrying out first pass truing to all holes on the panel earlier, then carries out second pass truing to all holes again to this analogizes until last one truing, and the machining allowance that the truing was left reduces in proper order, and the allowance of last one truing is 0 mu m.
Specifically, the punching is done by CNC.
Specifically, the wire cutting and the multiple finishing are processed in a slow wire cutting mode.
Further, the multiple passes of finishing are three passes of finishing, the machining allowance left by the first pass of finishing is 10 μm, the machining allowance left by the second pass of finishing is 5 μm, and the machining allowance left by the third pass of finishing is 0 μm.
Further, the environment temperature of the slow wire cutting is 21 +/-2 ℃.
By adopting the technical scheme, the technical scheme of the invention has the beneficial effects that:
the process reduces the problem that the precision of the former hole is influenced by the finishing of the latter hole under the condition of dense holes by changing the sequence of three finishing, and effectively improves the precision of the whole hole site after finishing.
Detailed Description
The present invention will be described in further detail with reference to specific examples.
Example (b):
the invention relates to a high-precision machining process for hole sites of porous plates, which comprises the following steps: a porous plate hole site high-precision machining process comprises the following steps: and performing first fine finishing on all holes on the plate, performing second fine finishing on all the holes, and finally performing third fine finishing on all the holes, wherein the allowance left by the fine finishing is sequentially reduced from the first time to the third time, and the variation of the allowance is also sequentially reduced. The fine modification is to gradually increase the hole diameter, and the machining amount is the amount of change in the margin. By the way of gradually reducing the variable quantity, the deformation generated by the subsequent finishing is always smaller than that generated by the previous finishing. Therefore, after the first fine trimming is completed, although the offset of the hole position can be increased by a little, the offset can be uniformly reduced by the second fine trimming, the offset can be further uniformly reduced by the third fine trimming, and the problem that the precision obtained by the third fine trimming of the previous hole is damaged by the effect generated by the first fine trimming of the next hole is solved. The process reduces the problem that the precision of the former hole is influenced by the finishing of the latter hole under the condition of dense holes by changing the sequence of three finishing, and effectively improves the precision of the whole hole site after finishing.
The punching is done by CNC. Because this hole accuracy requirement is low, it can be formed with conventional CNC machining for cost savings.
The linear cutting and the three finishing are processed by adopting a slow wire cutting mode. The cutting speed of the slow wire is lower than 0.2mm/s, the cutting precision can reach 1 mu m level, the operation is stable and uniform, and the fine finishing processing quality is ensured.
The multi-pass finishing is three-pass finishing, the machining allowance left by the first finishing is 10 mu m, the machining allowance left by the second finishing is 5 mu m, and the machining allowance left by the third finishing is 0 mu m. Therefore, the processing amount of each fine finishing is only 5 mu m, the influence on the precision of peripheral hole positions is small, and the fine finishing deformation between the hole positions is in a controllable range.
The ambient temperature for slow wire cutting was 21 + -2 deg.C. The stable ambient temperature of product can avoid the product deformation that cutting friction themogenesis arouses, is favorable to improving the machining precision.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.
Claims (5)
1. The utility model provides a porous plate hole site high accuracy processing technology, the step is including punching a hole, wire-electrode cutting and multichannel truing, the machining allowance that the punching a hole was left is 0.5 ~ 0.6mm, the machining allowance that the wire-electrode cutting was left is 40 mu m, its characterized in that: the multi-pass fine trimming method comprises the steps of firstly performing first fine trimming on all holes on a plate, then performing second fine trimming on all the holes, and repeating the steps until the final fine trimming is performed, wherein the machining allowance left by the fine trimming is reduced in sequence, and the allowance of the final fine trimming is 0 mu m.
2. The porous plate hole site high-precision machining process of claim 1, characterized in that: the punching is done by CNC.
3. The porous plate hole site high-precision machining process of claim 1, characterized in that: the wire cutting and the multiple finishing are processed in a slow wire cutting mode.
4. The porous plate hole site high-precision machining process of claim 3, characterized in that: the multi-pass fine finishing is three-pass fine finishing, the machining allowance left by the first fine finishing is 10 mu m, the machining allowance left by the second fine finishing is 5 mu m, and the machining allowance left by the third fine finishing is 0 mu m.
5. The porous plate hole site high-precision machining process of claim 3, characterized in that: the environment temperature for the slow wire cutting is 21 +/-2 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011542682.0A CN112775622A (en) | 2020-12-24 | 2020-12-24 | High-precision processing technology for hole positions of porous plates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011542682.0A CN112775622A (en) | 2020-12-24 | 2020-12-24 | High-precision processing technology for hole positions of porous plates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112775622A true CN112775622A (en) | 2021-05-11 |
Family
ID=75751969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011542682.0A Pending CN112775622A (en) | 2020-12-24 | 2020-12-24 | High-precision processing technology for hole positions of porous plates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112775622A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000071152A (en) * | 1998-08-28 | 2000-03-07 | Ishikawajima Harima Heavy Ind Co Ltd | Finishing device for hole edge of disk |
| JP2002307216A (en) * | 2001-04-19 | 2002-10-23 | Toyoda Mach Works Ltd | Method of machining a plurality of holes, and boring device used for carrying out the method |
| JP2003220427A (en) * | 2002-01-25 | 2003-08-05 | Seiko Epson Corp | Die plate and simultaneous working method thereof |
| JP2004082267A (en) * | 2002-08-27 | 2004-03-18 | Hitachi Cable Ltd | Method for manufacturing component of trimming die, and trimming die |
| CN203105038U (en) * | 2013-02-04 | 2013-07-31 | 北方民族大学 | Composite baffling pore plate type boiling heat transfer reinforcement structure |
| CN104227062A (en) * | 2014-09-17 | 2014-12-24 | 东方电气(广州)重型机器有限公司 | Method for machining plurality of reverse stepped holes in plane |
| CN105522236A (en) * | 2015-11-12 | 2016-04-27 | 陕西一品达石化有限公司 | Electric spark wire cutting machining method for part with multiple types of holes |
| CN109500219A (en) * | 2018-12-18 | 2019-03-22 | 常州工利精机科技有限公司 | A kind of hole class blanking die and hole class blanking method |
-
2020
- 2020-12-24 CN CN202011542682.0A patent/CN112775622A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000071152A (en) * | 1998-08-28 | 2000-03-07 | Ishikawajima Harima Heavy Ind Co Ltd | Finishing device for hole edge of disk |
| JP2002307216A (en) * | 2001-04-19 | 2002-10-23 | Toyoda Mach Works Ltd | Method of machining a plurality of holes, and boring device used for carrying out the method |
| JP2003220427A (en) * | 2002-01-25 | 2003-08-05 | Seiko Epson Corp | Die plate and simultaneous working method thereof |
| JP2004082267A (en) * | 2002-08-27 | 2004-03-18 | Hitachi Cable Ltd | Method for manufacturing component of trimming die, and trimming die |
| CN203105038U (en) * | 2013-02-04 | 2013-07-31 | 北方民族大学 | Composite baffling pore plate type boiling heat transfer reinforcement structure |
| CN104227062A (en) * | 2014-09-17 | 2014-12-24 | 东方电气(广州)重型机器有限公司 | Method for machining plurality of reverse stepped holes in plane |
| CN105522236A (en) * | 2015-11-12 | 2016-04-27 | 陕西一品达石化有限公司 | Electric spark wire cutting machining method for part with multiple types of holes |
| CN109500219A (en) * | 2018-12-18 | 2019-03-22 | 常州工利精机科技有限公司 | A kind of hole class blanking die and hole class blanking method |
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