CN210743737U

CN210743737U - Transformer heat radiation structure

Info

Publication number: CN210743737U
Application number: CN201921882446.6U
Authority: CN
Inventors: 兰俊; 江仁寰; 祝玉香
Original assignee: Hon Kwang Electric Kunshan Co ltd
Current assignee: Hon Kwang Electric Kunshan Co ltd
Priority date: 2019-11-04
Filing date: 2019-11-04
Publication date: 2020-06-12
Anticipated expiration: 2029-11-04

Abstract

The utility model discloses a transformer heat radiation structure relates to the transformer field, including the transformer body, the both sides of transformer body all still are equipped with the heat dissipation cover, and the top of transformer body is fixed footstock and the base respectively with the bottom, all fixed connection heat-conducting plates between heat dissipation cover and footstock, the base, the side fixed connection delivery pump of footstock, the equal fixed connection conveyer pipe in both ends of delivery pump, conveyer pipe pass the heat-conducting plate and with heat dissipation cover fixed connection, a plurality of radiating grooves have been seted up on the heat dissipation cover, the fixed baffle that is equipped with of side of radiating groove, the utility model discloses a setting up the heat dissipation cover and can dispelling the heat to the transformer, the semiconductor refrigeration piece starts and intervenes the radiating work when transformer heat is too high to heat dissipation process with higher speed plays the guard action, can effectually practice thrift the energy consumption.

Description

Transformer heat radiation structure

Technical Field

The utility model relates to a transformer field specifically is a transformer heat radiation structure.

Background

Transformers are an essential component of power transmission systems and play a critical role in the proper operation of this power grid. The transformer can produce a large amount of heat in the operation process, and the heat is dissipated.

In chinese utility model patent document No. CN207199422U, a transformer heat dissipation structure is disclosed, in which transformer oil in a transformer oil tank is introduced into a heat dissipation coil for heat dissipation, and heat exchange is performed with cooling water in a heat dissipation water tank to reduce the temperature of the transformer oil and achieve the purpose of heat dissipation; the semiconductor refrigeration chip can reduce the temperature of cooling water in the radiating water tank so as to play a role in providing a refrigeration source; the defoaming box is arranged, the defoaming partition plate is arranged in the defoaming box, the through groove is formed in the defoaming partition plate, and the inclined filter screen is arranged in the defoaming partition plate, so that bubbles carried in transformer oil in the whole heat dissipation loop can be eliminated, and the influence on internal elements of the transformer is reduced; but need continuously start semiconductor refrigeration chip and just can cool down the heat dissipation to transformer oil, power consumption is great.

SUMMERY OF THE UTILITY MODEL

The utility model provides a transformer heat radiation structure has solved the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a transformer heat radiation structure, includes the transformer body, and the both sides of transformer body all still are equipped with the heat exchanger that looses, and the top and the bottom of transformer body are fixed respectively and are equipped with footstock and base, all fixed connection heat-conducting plates between heat exchanger and footstock, the base, the equal fixed connection conveyer pipe in both ends of footstock fixed connection delivery pump, the conveyer pipe pass the heat-conducting plate and with scattered heat exchanger fixed connection, a plurality of radiating grooves have been seted up on the heat exchanger that looses, the fixed baffle that is equipped with in side of radiating groove, radiating groove and baffle will dispel the heat the inside separation of dustcoat and form the water conservancy diversion passageway, the passageway intussuseption is filled with the coolant liquid.

As an optimal technical scheme of the utility model, the heat sink includes the semiconductor refrigeration piece, a plurality of heat dissipation fins of hot junction fixed connection of semiconductor refrigeration piece, a plurality of cooling plates of cold junction fixed connection of heat sink.

As an optimal technical scheme of the utility model, the cold junction fixed connection sealed cowling of semiconductor refrigeration piece, the inside of sealed cowling is arranged in to the cooling plate, the mounting hole has all been seted up at the both ends of sealed cowling, fixed connection honeycomb duct on the mounting hole, the bottom fixed connection of honeycomb duct and heat exchanger that looses.

As an optimized technical proposal of the utility model, the cooling plate is provided with intensive circulation holes.

As an optimized technical proposal of the utility model, the heat dissipation cover is made of copper material.

As an optimal technical scheme of the utility model, be equipped with temperature sensor in the heat exchanger that looses, the fixed controller that is equipped with on the transformer body, the equal electric connection of controller and temperature sensor, semiconductor refrigeration piece, delivery pump.

The utility model discloses have following useful part: the utility model discloses a set up the heat exchanger that looses and can dispel the heat to the transformer, semiconductor refrigeration piece starts and intervenes the heat dissipation work when the transformer heat is too high to heat dissipation process plays the guard action with higher speed, can effectual saving energy consumption.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation structure of a transformer.

Fig. 2 is a cross-sectional view of a heat dissipation cover in a heat dissipation structure of a transformer.

Fig. 3 is a schematic structural diagram of a cooling device in a transformer heat dissipation structure.

Fig. 4 is a schematic structural diagram of a cooling plate in a heat dissipation structure of a transformer.

In the figure: 1. a transformer body; 2. a top seat; 3. a heat conducting plate; 4. a heat dissipation cover; 5. a delivery pump; 6. a delivery pipe; 7. A cooling device; 8. a heat sink; 9. a partition plate; 10. a flow guide channel; 11. a semiconductor refrigeration sheet; 12. a sealing cover; 13. A heat dissipation fin plate; 14. mounting holes; 15. a cooling plate; 16. and (4) a flow hole.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

It should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.

Example 1

Referring to fig. 1-4, a transformer heat dissipation structure includes a transformer body 1, heat dissipation covers 4 are disposed on both sides of the transformer body 1, a top seat 2 and a base are respectively fixed on the top and bottom of the transformer body 1, heat conduction plates 3 are fixedly connected between the heat dissipation covers 4 and the top seat 2, the heat conduction plates 3 are respectively fixed on the top and bottom of the transformer body 1, a delivery pump 5 is fixedly connected on the side of the top seat 2, delivery pipes 6 are fixedly connected on both ends of the delivery pump 5, the delivery pipes 6 pass through the heat conduction plates 3 and are fixedly connected with the heat dissipation covers 4, a plurality of heat dissipation grooves 8 are disposed on the heat dissipation covers 4, a partition plate 9 is fixedly disposed on the side of the heat dissipation grooves 8, the heat dissipation grooves 8 and the partition plate 9 separate the interior of the heat dissipation cover to form a diversion channel 10.

The cooling device 7 comprises a semiconductor refrigeration piece 11, a plurality of heat dissipation fins 13 of the hot end of the semiconductor refrigeration piece 11 are fixedly connected, a plurality of cooling plates 15 of the cold end of the cooling device 7 are fixedly connected, a seal cover 12 of the cold end of the semiconductor refrigeration piece 11 is fixedly connected, the cooling plates 15 are arranged inside the seal cover 12, mounting holes 14 are formed in two ends of the seal cover 12, a guide pipe is fixedly connected to the mounting holes 14 and is fixedly connected with the bottom end of the heat dissipation cover 4, dense circulation holes 16 are formed in the cooling plates 15, and the heat dissipation cover 4 is made of a copper material.

Example 2

Referring to fig. 1 to 4, the other contents of the present embodiment are the same as embodiment 1, except that: be equipped with temperature sensor in the heat exchanger 4, the fixed controller that is equipped with on the transformer body 1, the equal electric connection of controller and temperature sensor, semiconductor refrigeration piece 11, delivery pump 5.

The utility model discloses in the implementation process, the heat that the transformer during operation produced is passed through heat-conducting plate 3 and is transmitted for heat exchanger 4 that looses, dispel the heat by heat exchanger 4 that looses, when 4 high temperatures of heat exchanger that looses, temperature sensor gives the controller with the signal transmission, controller control delivery pump 5 and the work of semiconductor refrigeration piece 11, cooling plate 15 cooling will flow through the cooling liquid cooling of seal cover 12 and then realize the circulation cooling to the heat exchanger 4 in again, realize the rapid cooling protection.

The utility model discloses a set up heat exchanger 4 and can dispel the heat to the transformer, semiconductor refrigeration piece 11 starts and intervenes the heat dissipation work when the transformer heat is too high to the heat dissipation process plays the guard action with higher speed, can effectual saving energy consumption.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the technical solutions described in the foregoing embodiments. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A transformer heat radiation structure comprises a transformer body (1), and is characterized in that heat radiation covers (4) are arranged on two sides of the transformer body (1), a top seat (2) and a base are respectively fixedly arranged at the top end and the bottom end of the transformer body (1), heat conduction plates (3) are fixedly connected between the heat radiation covers (4) and the top seat (2) as well as between the heat radiation covers and the base, a delivery pump (5) is fixedly connected to the side edge of the top seat (2), delivery pipes (6) are fixedly connected to two ends of the delivery pump (5), the delivery pipes (6) penetrate through the heat conduction plates (3) and are fixedly connected with the heat radiation covers (4), a plurality of heat radiation grooves (8) are formed in the heat radiation covers (4), partition plates (9) are fixedly arranged on the side edges of the heat radiation grooves (8), the heat radiation grooves (8) and the partition plates (9) separate the interior of the heat radiation covers to form diversion channels (, the side of the base is fixedly connected with a cooling device (7).

2. The transformer heat dissipation structure according to claim 1, wherein the cooling device (7) comprises a semiconductor cooling plate (11), a hot end of the semiconductor cooling plate (11) is fixedly connected with a plurality of heat dissipation fins (13), and a cold end of the cooling device (7) is fixedly connected with a plurality of cooling plates (15).

3. The transformer heat dissipation structure according to claim 2, wherein the cold end of the semiconductor refrigeration sheet (11) is fixedly connected with a sealing cover (12), the cooling plate (15) is disposed inside the sealing cover (12), mounting holes (14) are formed in both ends of the sealing cover (12), and a flow guide pipe is fixedly connected to the mounting holes (14) and fixedly connected to the bottom end of the heat dissipation cover (4).

4. The transformer heat dissipation structure according to claim 3, wherein the cooling plate (15) is provided with dense flow holes (16).

5. The transformer heat dissipation structure according to claim 1 or 4, wherein the heat dissipation cover (4) is made of copper material.

6. The transformer heat dissipation structure according to claim 4, wherein a temperature sensor is arranged in the heat dissipation cover (4), a controller is fixedly arranged on the transformer body (1), and the controller is electrically connected with the temperature sensor, the semiconductor refrigeration sheet (11) and the delivery pump (5).